TWI402566B - Pad region having conductive wire pattern and method of monitoring the bonding error of a film - Google Patents

Description

Pad area with wire pattern and method for monitoring film attachment deviation

The invention provides a method for attaching deviation between a wire pattern of a pad region and a monitoring film, in particular to a wire pattern of a pad region which can be used as a reference for monitoring the adhesion of the film material and its monitoring and attaching deviation. method.

Generally, a liquid crystal display (LCD) process is to separately fabricate an array substrate and a color filter substrate, wherein the array substrate is formed by a plurality of semiconductor processes such as thin film deposition, lithography, and etching. In order to fabricate a thin film transistor array, the color filter substrate is formed on the substrate to form a color filter arranged in an array corresponding to the thin film transistor. After the array substrate and the color filter substrate are separately fabricated, they are bonded to each other and the lobes are cut.

Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a conventional LCD panel 10 including a color filter substrate 12 and an array substrate 14 , wherein the color filter substrate 12 is smaller than the array substrate 14 , thus The filter substrate 12 exposes a portion of the array substrate 14, and the portion of the array substrate 14 that is not covered by the color filter substrate 12 is generally referred to as a non-display area 16. A plurality of terminals are disposed in the non-display area 16 for electrically connecting the wires of the LCD panel 10 such as the scan lines or the signal lines to an external control circuit. Please refer to FIG. 2, which is a partial schematic view of a terminal portion 20 of a conventional LCD panel 10. Generally, the terminal portion 20 includes an opening portion 22 and a lead portion 24, wherein the main function of the opening portion 22 is to transmit an external control signal to the internal wires of the LCD panel 10. Therefore, after the fabrication of the LCD panel 10 is completed, a film material such as a printed wiring board (PWB) is usually attached to the non-display area 16 and electrically connected to the opening portion 22 by a wire pattern on the film material. To pass external signals. As shown in FIG. 3, when a film (not shown) is attached to the non-display area 16, the conductive pattern 26 of the film surface should be aligned to cover the central portion of the terminal portion 20 such that the conductive pattern 26 is spaced from the opening portion. The distances d1 and d2 on both sides of 22 are equal.

However, in the process of attaching the film, it is inevitable that the position of the attachment will be deviated due to factors such as the alignment of the machine. As shown in Fig. 4, the deviation of the film is caused by the deviation of the film. The conductive pattern 26 is shifted to the right such that the left side distance d1 of the conductive pattern 26 and the opening portion 22 is larger than the right side distance d2 of the conductive pattern 26 and the opening portion 22. As can be seen from the above, since the current technique of attaching a film material cannot effectively avoid the problem of adhesion deviation, it is necessary to monitor and measure the adhesion deviation of the film on the production line. There are three main methods for detecting the adhesion of film materials. One is to use a measuring instrument including a charge coupled device (CCD) sensor for measurement. The inspector must use a CCD sensor to search. Whether or not the film attachment deviation occurs in the non-display area 16, and then the offset of the film is calculated by the scale of the CCD sensor itself. However, the disadvantages of this measurement method include that the LCD panel 10 must be specially transferred to the machine with the measuring instrument for measurement, and the inspector must use the CCD sensor to search for the position of the measuring target, possibly searching. Not enough and time consuming. Furthermore, the measuring instrument must also have certain specifications, such as a built-in measurement program and a measurement scale. In addition, such measurement methods may also have doubts about accuracy.

The second conventional method for measuring the deviation of the film material is that the inspector directly measures the adhesion deviation value of the terminal portion 20 and the post-adhesive film-conducting pattern 26 by the measuring tool, and measures the conductive pattern 26 and the opening. The left side distance d1 and the right side distance d2 of the portion 22 indicate whether or not the film attachment deviation occurs, and how much distance is shifted to the right or left. However, the disadvantages of this type of measurement include that the measurement procedure is time consuming and insufficiently accurate.

On the other hand, the third conventional method of measuring the adhesion of the film is to use the offset measurement mark to measure the deviation of the distance of the film. First, the offset measurement mark 30 is formed on the array substrate 14 by exposure imaging. As shown in FIG. 5, the offset measurement mark 30 includes three sub-marks 30a, 30b, and 30c, respectively, with a top angle facing upward. A triangular pattern is formed and an offset measurement mark 32 having an inverse triangular pattern is formed on the film. When the film material is attached to the terminal portion 20 without deviation (such as the relative relationship between the left terminal portion 20 and the conductive pattern 26 in FIG. 5), the apex angle below the offset measurement mark 32 on the film material is Just right at the center of the offset measurement mark 30, that is, aligned with the apex angle of the intermediate mark 30b. Please refer to Figure 6 and Figure 6 shows the situation when the film is attached with a deviation. As shown on the left side of Figure 6, the attached film is offset to the right by some distance. The offset measurement mark 32 corresponds to the top of the secondary mark 30c, so that the film is shifted to the right by 3 micrometers (um). However, the method of measuring the offset of the film by this method still has its disadvantages: due to the limitation of the imaging capability of the exposure machine, a pattern of less than 3 micrometers cannot be formed, and the sharp corner portion of the triangular pattern cannot be completely The imaging may be close to the fillet pattern, affecting the accuracy of the measurement offset.

Therefore, how to judge whether the film adhesion deviation and the measurement film adhesion deviation value occur in a simple and efficient manner is still an important issue in the LCD panel industry.

The main object of the present invention is to provide a special wire pattern of a pad area and a method for monitoring the adhesion deviation of the film material by using the wire pattern, so as to improve the efficiency and correctness of measuring the deviation of the film material, and solving the conventional problem. The measurement method of the film attachment deviation is inefficient due to the time consuming of the program and the problem of the accuracy cannot be grasped.

According to the patent application scope of the present invention, a wire pattern in a pad region is provided, which includes a plurality of terminal portions arranged along a first direction and arranged side by side in a pad region, each of the terminal portions respectively including a The opening portion and a lead portion. Each of the openings has at least one side of the opening, and each of the lead portions is connected to a corresponding side of the opening. The relative positions of the lead portions and the corresponding opening portions vary depending on the arrangement positions of the terminal portions in the pad region.

In accordance with the scope of the present invention, a method of monitoring the adhesion of a film is disclosed. A film is first provided having a plurality of conductive patterns on its surface, followed by a surface to which the surface of the film is to be attached, comprising a plurality of fiducial marks and a plurality of displacement marks. The fiducial marks are arranged along a first direction and are juxtaposed to each other in the target area, and each of the fiducial marks respectively corresponds to a conductive pattern. Each of the displacement marks is respectively connected to a reference mark, wherein a relative position of each of the displacement marks and the corresponding one of the reference marks varies according to a position of the reference mark in the target area. Then, the film is attached to the target area, and the relative position of the conductive pattern and the displacement mark and the position of the corresponding reference mark in the target area are observed to determine whether the film has a deviation.

Please refer to FIG. 7. FIG. 7 is a schematic view showing the application of the wire pattern of the pad region of the present invention to an LCD panel 50. The LCD panel 50 includes an array substrate 52 and a color filter substrate 54. The area of the array substrate 52 not covered by the color filter substrate 54 is defined as a non-display area 56, and the non-display area 56 is provided with a plurality of pads. A region 58 (only the pad region on the signal line side is shown in Fig. 7) for arranging the terminal portion to electrically connect with an external circuit to drive the LCD panel 50.

Please refer to FIG. 8. FIG. 8 is an enlarged schematic view of a conductor pattern 60 in a pad region 58 of the present invention. The wire pattern 60 includes a plurality of terminal portions 62 which are parallel to each other in the Y direction shown in the drawing, and are arranged side by side along the X direction shown in the drawing. Each of the terminal portions 62 includes an opening portion 64 and a lead portion 66. The opening portion 64 is configured to transmit a signal electrically connected to a conductive pattern of a subsequent film attached to the surface of the array substrate 52. The lead portion 66 provides the function of position recognition when the LCD panel 50 performs the edging process. Further, before the edging process, the lead portion 66 can be electrically connected to a static elimination device, such as a ring short circuit. Short ring to prevent electrostatic damage. Therefore, the terminal portion 62 including the opening portion 64 and the lead portion 66 preferably comprises a conductive material such as a metal material, and includes a plurality of contact hole structures 68 in the opening portion 64 for electrically connecting different conductive material layers on the array substrate 52. . In addition, each of the openings 64 has the same width S1, and each of the lead portions 66 has the same width S2, and each of the openings 64 includes an opening side 64a, and each of the lead portions 66 respectively corresponds to The opening portion 64 is connected to the opening side edge 64a. However, the relative positions of the lead portions 66 of the present invention and the corresponding opening portion 64 vary depending on the arrangement position of the terminal portion 62 in the pad region 58.

In order to further explain the change in the relative position of the terminal portion 62 and the opening portion 64, the lead portions 66 at different positions in the pad region 58 are indicated by different codes. If a reference line C is defined parallel to the Y direction in the pad region 58, wherein the reference line C is preferably the center line of the pad region 58, the lead portion 66 of the terminal portion 62 located on the left side of the reference line C is defined by the reference line C. The outer side is sequentially represented by codes L1, L2, L3, L4, L5, and L6, and the lead portion 66 of the terminal portion 62 located on the right side of the reference line C is sequentially coded from the reference line C to the outer side by codes R1, R2, R3, and R4. , R5, R6 said. As can be seen from Fig. 8, with respect to each of the openings 64, the lead portions R1, R2, R3, R4, R5, and R6 from the reference line C to the outside of the pad region 58 are sequentially shifted from the reference line C to the right side. One unit length. Similarly, the lead portions L1, L2, L3, L4, L5, and L6 from the reference line C to the outside of the pad region 58 are sequentially shifted to the left side by one unit length from the corresponding opening portion 64 until the opening portion 64 Left edge.

Please refer to FIG. 9. FIG. 9 is an enlarged schematic view of a portion of the pad region 58. FIG. 9 only shows the terminal portion 62 on the right side of the reference line C, and the contact hole structure 68 in FIG. 8 is omitted. Each of the openings 64 defines an opening center line C _o parallel to the Y direction shown in Fig. 8 (only the center line C _o of the opening portion 64 corresponding to the lead portions R2 and R4 is drawn in Fig. 9). The intersection of the center line C _o of the opening and the side 64a of the opening is the point O in the side 64a of each opening, and a lead line center line C _L is defined in each lead portion 66 parallel to the eighth. FIG Y direction, the lead portion is in the center line C _L of each corresponding side of the opening portion 64a having a point O are relative position difference value D, and the relative position difference of the right side of each lead portion of the reference line C 66 Dn is different, and is sequentially incremented from the reference line C to the outer side (ie, the right side) of the pad region 58, wherein "n" represents the nth lead portion 66 on the right side of the reference line C, that is, the lead portions R1, R2 The relative position difference of R3, R4, R5, and R6 is D1, D2, D3, D4, D5, and D6, which have the following relationship: D1 < D2 < D3 < D4 < D5 < D6. In other words, if the present embodiment has a unit length of 1 μm, the lead portion R1 is shifted to the right by 1 μm from the point O in the opening side 64a, and the lead portion R2 is closer to the opening side 64a. The midpoint O is shifted to the right by 2 μm, and the lead portion R3 is shifted to the right by 3 μm from the point O in the opening side 64a until the right side edge of the lead portion R6 reaches the right edge of the opening portion 64. Similarly, the relative position difference between the lead portions 66 on the left side of the reference line C and the opening portion 64 also increases from the reference line C to the left side, and will not be described again. Therefore, the lead portions 66 in the pad region 58 are arranged symmetrically with respect to each other with the reference line C as a symmetrical center line. However, in other embodiments, the relative position difference between each of the lead portions 66 and the opening portion 64 may also be designed to decrease toward the outside from the reference line C. Therefore, within the pad region 58, any two adjacent terminal portions 62 on either side of the reference line C have different relative positional differences.

Referring to Fig. 10, Fig. 10 is a view showing a state in which a film having a conductive pattern is attached to the pad region 58 without occurrence of adhesion deviation. As shown, a film 72 comprising a plurality of conductive patterns 74 is provided which is attached to the pad region 58 shown in FIG. 8, wherein the film 72 can be a printed circuit board having thereon The drive wafer is electrically connected to the terminal portion 62 by a conductive pattern 74 by a drive wafer (not shown) of a tape carrier package (TCP). After the film 72 is attached, the conductive patterns 74 on the surface thereof correspond to the one terminal portion 62, respectively, and the lead portions 66 do not fall in the center of the corresponding conductive pattern 74 without the occurrence of the adhesion deviation. The left and right bisector conductive patterns 74 are instead biased toward one side of the conductive pattern 74. For example, the lead portion R1 disposed on the right side of the reference line C is biased to the right side of the conductive pattern 74. Further, the outermost lead portion 66 is spaced from the center of the conductive pattern 74 by a greater distance.

On the other hand, if the film 72 has a misalignment, there must be a lead portion 66 in the pad region 58 that is close to or just falls in the center of the conductive pattern 74. Please refer to Fig. 11, which shows the case where the film 72 is attached with deviation. As shown in the figure, after the film 72 is attached, the lead portion R2 just falls in the center of its corresponding conductive pattern 74 and bisects the conductive pattern 74, which is different from the position shown in Fig. 10, so that the film 72 can be judged. Has a sticking deviation. Furthermore, since the lead portion R2 falls in the center of the corresponding conductive pattern 74, and the lead portion R2 is shifted to the right by 2 micrometers or 2 unit lengths from the opening portion 64, the attached film can be known. The material 72 is offset to the right by 2 microns. That is, when the inspector finds that a lead portion Rn or Ln just falls in the center of the conductive pattern 74, it can be easily judged that the film 72 is shifted to the right or left by n micrometers or n unit lengths. Moreover, in order to enable the inspector to quickly calculate that the lead portion 66 falling in the center of the conductive pattern 74 is the first lead portion 66 on the left or right side of the pad region 58, that is, the value of n is found, so the pad region The conductor pattern 60 in 58 may further include a reference line mark 70 indicating the position of the reference line C, so that the inspector can determine the value of n from the reference line mark 70, and the lead portion 66 is to the right of the reference line C or On the left side, it is easy to calculate how many unit lengths the film 72 is shifted toward.

It can be seen from the above that the present invention provides a special design of the wire pattern of the pad region, and also provides a method for effectively monitoring whether the film is displaced and determining the offset by using the wire pattern. The mental system uses the opening portion and the lead portion as the reference mark and the displacement mark, respectively, and the relative position of the displacement mark and the reference mark changes according to different positions of the reference mark in the pad area, and is further marked by displacement and attached. The relative positional relationship of the conductive patterns determines whether the film has a problem of adhesion deviation. The method steps of monitoring the adhesion of the film of the present invention are briefly described as follows: Step 100: providing a film having a plurality of conductive patterns on the surface; Step 102: providing a surface to which the surface of the film is to be attached, that is, the foregoing a pad area, wherein the pad area includes a plurality of terminal portions arranged side by side in parallel, each terminal portion respectively including an opening portion serving as a reference mark and a lead portion serving as a displacement mark, each reference mark corresponding to a displacement Marking, and the relative position of each displacement mark and the corresponding reference mark varies with the position of the reference mark in the pad area; step 104: attaching the film to the target area; and step 106: observing the film The relative position of the upper conductive pattern and the displacement mark and the position of the corresponding reference mark in the target area to determine whether the film has a deviation.

In addition, the method for determining whether the film is attached to the deviation in step 106 includes: Step 202: Observing the relative position of the conductive pattern and the displacement mark, if any displacement mark (such as the lead portion R2 shown in FIG. 11) ) locating the conductive pattern just at the center of the corresponding conductive pattern, determining that the film has an attachment deviation; Step 204: observing the displacement mark described in step 202 (such as the lead portion R2 shown in FIG. 11) Is the nth displacement mark located on the center line of the target area or on the right or left side of a reference line; and step 206: determining that the film is shifted to the right or to the left by n unit lengths.

It can be seen from the above that according to the method for monitoring the adhesion of the film material according to the present invention, if the inspector needs to monitor whether the film has a deviation in adhesion, it is only necessary to observe the pad area from an optical microscope (OM). According to the method step of monitoring the adhesion of the film, the film can be easily judged whether the film is attached with deviation and how much distance the film is deviated to the left or right. Compared with the prior art, the present invention does not need to use a measuring instrument such as a CCD with a built-in measuring program and a scale as in the prior art, and is not limited by the size of the exposure, and does not need to spend time searching for possible The occurrence of the offset measurement can also avoid the problem of insufficient measurement accuracy. According to the spirit of the present invention, the inspector only needs to observe the relative position of the conductive pattern on the terminal portion and the film by using an optical microscope, and can easily and quickly determine how much distance the attached film is deviated. In addition, the wire pattern of the pad region prepared by using the spirit of the present invention does not need to add additional cost, and only needs to slightly modify the design of the relative position of the opening portion and the lead portion in the original wire pattern, which can be regarded as the monitoring method in the present invention. The reference mark and the displacement mark are used. It should be noted that the method for designing the wiring pattern of the pad area of the present invention and monitoring the deviation of the film material is not limited to the monitoring of the wire pattern design and the film attachment error on the LCD panel, and may also be applied to other monitoring overlaps. Whether the pattern is displaced or biased.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10. . . LCD panel

12. . . Color filter substrate

14. . . Array substrate

16. . . Non-display area

20. . . Terminal part

twenty two. . . Opening

twenty four. . . Lead portion

26. . . Conduction pattern

30, 32. . . Offset measurement marker

30a, 30b, 30c. . . Secondary mark

50. . . LCD panel

52. . . Array substrate

54. . . Color filter substrate

56. . . Non-display area

58. . . Mat area

60. . . Wire pattern

62. . . Terminal part

64. . . Opening

64a. . . Side of the opening

66. . . Lead portion

68. . . Contact hole structure

70. . . Baseline mark

72. . . Membrane

74. . . Conduction pattern

100～106, 202～206. . . The process of monitoring the adhesion method of the film material of the invention

Figure 1 is a schematic diagram of a conventional LCD panel.

Fig. 2 is a partial schematic view showing a terminal portion of an LCD panel shown in Fig. 1.

Fig. 3 is a schematic view showing the film member attached to the terminal portion shown in Fig. 2.

Fig. 4 is a schematic view showing the adhesion of the film.

5 to 6 are schematic views of a conventional method for monitoring the adhesion of a film using a measurement offset mark.

Figure 7 is a schematic view showing the application of the wire pattern of the pad region of the present invention to an LCD panel.

Figure 8 is an enlarged schematic view showing the pattern of the wires in one of the pads of the LCD panel shown in Figure 7.

Figure 9 is an enlarged schematic view of a portion of the pad region shown in Figure 8.

10 to 11 are schematic views showing a method of monitoring the adhesion of the film material according to the present invention.

Fig. 12 is a flow chart showing the method of monitoring the adhesion of the film material according to the present invention.

58. . . Mat area

60. . . Wire pattern

62. . . Terminal part

64. . . Opening

64a. . . Side of the opening

66. . . Lead portion

68. . . Contact hole structure

Claims (18)

A pad area having a wire pattern, comprising a plurality of terminal portions arranged along a first direction and adjacent to each other in a pad region, each of the terminal portions respectively comprising: an opening portion having At least one opening side; and a lead portion connected to the side of the opening; wherein the relative position of each of the lead portions and the corresponding opening portion is associated with the terminal portion in the pad region Changing in position, and the pad region has a reference line parallel to the first direction, and each of the lead portions has a center line parallel to the first direction, and the center line of each of the lead portions corresponds thereto a point in the side of the opening has a relative position difference, and in the pad area, the relative position differences of the two adjacent ones of the one side of the reference line are different, and the relative position difference is The relative position difference is incremented or decremented outward by the reference line. The pad region having a wire pattern as described in claim 1, wherein the reference line is a center line of the pad region. The pad region having a wire pattern as described in claim 2, wherein the lead portions are symmetrically centered with the center line, and are arranged symmetrically left and right. The pad region having the wire pattern as described in claim 1 further includes a reference mark, and the position of the reference line is marked in the pad region. The pad region having a wire pattern as described in claim 1, wherein the wire pattern is disposed on a substrate. The pad region having a wire pattern as described in claim 5, wherein the substrate is an array substrate of a display panel. The pad region having a wire pattern as described in claim 1, wherein the terminal portions comprise a metal material. A method for monitoring a film attachment deviation, comprising: providing a film having a plurality of conductive patterns on a surface thereof; providing a surface to which a surface of the film is to be attached, the target area being a display panel One of the pad regions includes a plurality of terminal portions for transmitting signals, and the terminal portions include: a plurality of reference marks respectively corresponding to a conductive pattern, the reference marks are arranged along a first direction and are juxtaposed to each other And a plurality of displacement marks respectively connected to the reference mark, wherein a relative position of each of the displacement marks and the corresponding reference mark varies according to a position of the reference mark in the target area; The reference mark and the displacement mark of each of the terminal portions respectively serve as an opening portion and a lead portion of the terminal portion; attaching the film to the target region; and observing the conductive patterns and the displacement marks Relative position and its corresponding The position of the reference mark in the target area is determined to determine whether the film has a deviation. The method of claim 8, wherein the target area comprises a reference line, and the relative positions of the displacement marks and the corresponding reference marks in the target area on either side of the reference line are not the same. The method of claim 9, wherein each of the displacement marks is offset from the reference line by a unit length from the reference line to the outside. The method of claim 10, wherein the method for determining whether the film is attached to the deviation comprises observing a relative position of the conductive pattern and the displacement marks, if any of the displacement marks is located at the phase When the conductive pattern is equally divided corresponding to the center of the conductive pattern, it is judged that the film has an attachment deviation. The method of claim 11, wherein the method for determining whether the film is attached to the deviation further comprises: dividing the conductive pattern when the displacement mark is observed to be located at the center of the corresponding conductive pattern Afterwards, it is observed that the displacement mark is located to the right or the left side of the reference line; the displacement mark is observed to be the nth displacement mark from the reference line to the outside; and the deviation of the film is determined to be rightward or Deviated to the left by n unit lengths. The method of claim 9, wherein the reference line is a centerline of the target area. The method of claim 13, wherein the displacement marks and the reference marks are symmetrically centered on the center line, and are arranged symmetrically left and right. The method of claim 9, wherein the target area further comprises a reference mark indicating the position of the reference line. The method of claim 8, wherein each of the displacement marks and each of the reference marks have a center line parallel to the first direction, and the center line of each of the displacement marks corresponds to the reference mark The center line has a relative position difference, and in the target area, the relative position difference of any two adjacent ones of the reference lines on the side of the reference line is different. The method of claim 16, wherein the relative position difference is increased or decreased outwardly along a centerline of the target area. The method of claim 8, wherein the fiducial markers and the displacement markers comprise a metallic material.