TWI401420B - A device for measuring the multi - axis error of the pick - and - place mechanism - Google Patents

A device for measuring the multi - axis error of the pick - and - place mechanism Download PDF

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TWI401420B
TWI401420B TW98114921A TW98114921A TWI401420B TW I401420 B TWI401420 B TW I401420B TW 98114921 A TW98114921 A TW 98114921A TW 98114921 A TW98114921 A TW 98114921A TW I401420 B TWI401420 B TW I401420B
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TW201040502A (en
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Univ Nat Formosa
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一種應用分光束檢測取放機構多軸誤差之裝置Device for detecting multi-axis error of pick-and-place mechanism by using split beam

本發明係關於一種應用分光束檢測取放機構多軸誤差之裝置,係採用光學非接觸式檢測模式,以達成得到取放機構誤差之高精確度的要求為創新技術。The invention relates to a device for applying multi-axis error of a split beam detecting pick-and-place mechanism, which adopts an optical non-contact detecting mode to achieve the high precision requirement of obtaining the error of the pick-and-place mechanism as an innovative technology.

按,一般所使用的晶圓封裝機為例,其精度大約在10μm左右,若要提高取放機構的動作速度或是提昇取放機構之精度時,取放機構就會產生極大的影響,其可能是取放機構之鋼性不足,若要提高其鋼性卻會造成取放機構太重的可能,而在進行夾(吸)取或放置時的動作也會有精度不足的情形發生,且目前所運用的量測儀器價格昂貴精確度也不太夠。For example, the wafer packaging machine generally used has an accuracy of about 10 μm. If the speed of the pick-and-place mechanism is to be increased or the precision of the pick-and-place mechanism is improved, the pick-and-place mechanism has a great influence. It may be that the steel of the pick-and-place mechanism is insufficient. If the steel is to be improved, the pick-and-place mechanism may be too heavy, and the movement when the clip is taken or placed may also have insufficient precision. The measuring instruments currently used are not expensive enough.

此外,若是利用接觸性量測可能會因為取放機構在進行夾(吸)取與放置的動作時,碰觸到物件而產生的反作用力,而使得量測結果不準確。In addition, if the contact measurement is used, the reaction force generated by the pick-and-place mechanism touching the object during the pick-and-place action may cause the measurement result to be inaccurate.

就目前業界普遍是運用高速攝影機來進行量測取放機構之誤差,但此高速攝影機所存在的問題如下:At present, the industry generally uses high-speed cameras to measure the error of the pick-and-place mechanism, but the problems of this high-speed camera are as follows:

(1)精度不足:當利用高速攝影機在進行量測時,因攝影機是架在機台外部進行拍攝,但當機台在運作時都會產生振動,故攝影機分不清楚是取放機構相對於地面的振動,還是取放機構相對於物件的振動;(1) Insufficient accuracy: When using a high-speed camera for measurement, the camera is shot outside the machine, but when the machine is operating, vibration will occur, so the camera is unclear when the pick-and-place mechanism is relative to the ground. The vibration, or the vibration of the pick-and-place mechanism relative to the object;

(2)量測數據少:高速攝影機每秒所能擷取的資料數據太少,其精確度差;(2) Less measurement data: the high-speed camera can draw too little data per second, and its accuracy is poor;

(3)高成本:高速攝影機的價格偏高,價格普遍在一百萬以上;(3) High cost: the price of high-speed cameras is high, and the price is generally more than one million;

(4)量測訊號不足:高速攝影機所拍攝到的影像是Z軸與Y軸的誤差,而原本的需求是要量測X軸、Y軸、Z軸、θx 與θy 的誤差。(4) Insufficient measurement signal: The image captured by the high-speed camera is the error of the Z-axis and the Y-axis, and the original requirement is to measure the error of the X-axis, the Y-axis, the Z-axis, θ x and θ y .

緣此,本案發明人有鑒於上述取放機構之技術,仍有無法解決的問題深入探討,乃亟思加以改良創新,並經多年苦心孤詣潛心研究後,終於成功研發完成一種應用分光束檢測取放機構多軸誤差之裝置,利用感測器與光源來進行的非接觸性量測,就不用擔心會產生反作用力的問題而使的量測結果更為準確。Therefore, in view of the above-mentioned technology of the pick-and-place mechanism, the inventor of the present case has in-depth discussion on the problems that cannot be solved. It is the improvement and innovation of the thinking, and after years of painstaking research, he finally succeeded in research and development to complete an application of sub-beam detection and handling. The multi-axis error device of the mechanism uses the non-contact measurement of the sensor and the light source, so that the measurement result is more accurate without worrying about the reaction force.

本發明之目的即在於提供一種應用分光束檢測取放機構多軸誤差之裝置,係針對適用晶圓封裝機、機器手臂等夾(吸)取機構,可同時量測取放機構或搬運手臂機構其多個自由度的誤差。The object of the present invention is to provide a device for detecting multi-axis error of a pick-and-place mechanism by using a split beam, which is suitable for a pinch (suction) mechanism of a wafer packaging machine, a robot arm, etc., and can simultaneously measure a pick-and-place mechanism or a transport arm mechanism. Its multiple degrees of freedom error.

本發明之次一目的係在於提供一種低成本、高精確度、體積小、攜帶方便的應用分光束檢測取放機構多軸誤差之裝置。A second object of the present invention is to provide a low-cost, high-accuracy, small-volume, and portable device for detecting multi-axis errors of a sub-beam detection pick-and-place mechanism.

本發明之另一目的係在於提供一種架設簡易以及檢測迅速的應用分光束檢測取放機構多軸誤差之裝置。Another object of the present invention is to provide a device for arranging a simple and fast detection multi-axis error of a sub-beam detecting pick-and-place mechanism.

本發明之又一目的係在於提供一種應用分光束檢測取放機構多軸誤差之裝置,其具有高頻擷取數據資料的感測器,以有效的改善量測精度不足的問題。Another object of the present invention is to provide a device for detecting multi-axis error of a pick-and-place mechanism by using a split beam, which has a sensor for capturing data data at a high frequency, so as to effectively improve the problem of insufficient measurement accuracy.

可達成上述發明目的之一種應用分光束檢測取放機構多軸誤差之裝置,包括有:A device for detecting a multi-axis error of a pick-and-place mechanism by using a beam splitter, which includes the following objects, including:

含有一光源分光單元,係含有將一光源之光束分光成為反射光束與穿透光束;The invention comprises a light source splitting unit, which comprises splitting a light beam of a light source into a reflected light beam and a penetrating light beam;

第一感測單元,係使用二個獨立之感測器以供分光鏡發出之光束投射於其上,其中該第一感測單元進一步配設有第一感測器與第二感測器,該第一感測器接收分光鏡發出的反射光,該第二感測器接收分光鏡發出的穿透光;The first sensing unit is configured to use two independent sensors for the beam emitted by the beam splitter to be projected thereon, wherein the first sensing unit is further provided with a first sensor and a second sensor. The first sensor receives the reflected light emitted by the beam splitter, and the second sensor receives the transmitted light emitted by the beam splitter;

第二感測單元,係使用二個獨立之感測器以供分光鏡發出之光束投射於其上,該第二感測單元進一步配設有第三感測器與第四感測器,該第三感測器接收分光鏡發出的反射光,該第四感測器接收分光鏡發出的穿透光。The second sensing unit uses two independent sensors for the light beam emitted by the beam splitter to be projected thereon, and the second sensing unit is further provided with a third sensor and a fourth sensor, The third sensor receives the reflected light from the beam splitter, and the fourth sensor receives the transmitted light from the beam splitter.

一訊號處理單元,係與第一感測單元與該第二感測單元耦接,該訊號處理單元接收該感測器之輸出訊號,並進行運算處理與分析檢測,以將其轉換成系統處理訊號。a signal processing unit is coupled to the first sensing unit and the second sensing unit, and the signal processing unit receives the output signal of the sensor, and performs arithmetic processing and analysis detection to convert the system into a system processing. Signal.

上述所量測到的處理訊號,使用者能依照需求,再利用快速傅利葉轉換(Fast Fourier Transform,FFT)計算過後,就能得到取放機構之振動頻率。The above-mentioned measured processing signals can be obtained by the user using the Fast Fourier Transform (FFT) calculation according to the requirements, and then the vibration frequency of the pick-and-place mechanism can be obtained.

請參閱圖一至圖三,本發明所提供之一種應用分光束檢測取放機構多軸誤差之裝置,主要包括有:一光源分光單元(2)、一第一感測單元以及一第二感測單元所構成。當取放機構(1)應用於積體電路或晶圓時,取放機構(1)的相關軸進一步包括第一軸位置(11)或第二軸位置(12)。當取放機構(1)應用於程序控制完成特定操作的機械電子自動裝置(如:多關節機械手)時,取放機構(1)的相關軸進一步包括第一軸位置、第二軸位置、第三軸位置、或更多軸位置(如:第四軸位置、或第四軸位置與第五軸位置、或第四軸位置與第五軸位置以及第六軸位置),此為熟習此項技藝者能知悉,但並非用以限制;Referring to FIG. 1 to FIG. 3 , the present invention provides a device for detecting multi-axis error of a pick-and-place mechanism by using a split beam, which mainly includes: a light source splitting unit (2), a first sensing unit and a second sensing. The unit is composed of. When the pick-and-place mechanism (1) is applied to an integrated circuit or wafer, the associated axis of the pick-and-place mechanism (1) further includes a first axis position (11) or a second axis position (12). When the pick-and-place mechanism (1) is applied to a mechatronic device (such as a multi-joint robot) that performs a specific operation, the relevant axis of the pick-and-place mechanism (1) further includes a first axis position, a second axis position, a third axis position, or more axis positions (eg, a fourth axis position, or a fourth axis position and a fifth axis position, or a fourth axis position and a fifth axis position and a sixth axis position), which is familiar to the The craftsperson can know, but not for restrictions;

本發明下列均以應用於積體電路或晶圓的二軸取放機構(如:晶圓封裝機構)做為說明,但並非用以限制:The following is a description of the two-axis pick-and-place mechanism (such as a wafer packaging mechanism) applied to an integrated circuit or a wafer, but is not intended to limit:

該光源分光單元(2),係含有將一光源(21)之光束(211)射入分光鏡(22)後,分光成為反射光束(221)與穿透光束(222);其中該光源(21)為準直光源或聚焦光源其中之一種;且該光源(21)另可採用可見光、紅外光、紫外光、X射線、不可見光,皆可應用於絕對距離量測之功效;The light source splitting unit (2) comprises a beam (211) of a light source (21) incident on the beam splitter (22), and splits into a reflected beam (221) and a transmitted beam (222); wherein the light source (21) It is one of a collimated light source or a focusing light source; and the light source (21) can also be used for the effects of absolute distance measurement by using visible light, infrared light, ultraviolet light, X-ray, and invisible light;

該第一感測單元係使用二個獨立之感測器以供分光鏡(22)發出之光束投射於其上,其中該第一感測單元進一步配設有第一感測器(31)與第二感測器(32);該第一感測器(31),為接收分光鏡(22)發出的反射光(221),亦將反射光(221)光束入射位置轉換成輸出訊號;該第二感測器(32),為接收分光鏡(22)發出的穿透光(222),亦將穿透光(222)光束入射位置轉換成輸出訊號;The first sensing unit uses two independent sensors for the light beam emitted by the beam splitter (22) to be projected thereon, wherein the first sensing unit is further provided with a first sensor (31) and a second sensor (32); the first sensor (31) is a reflected light (221) emitted by the receiving beam splitter (22), and also converts the incident position of the reflected light (221) into an output signal; The second sensor (32) is configured to receive the transmitted light (222) emitted by the beam splitter (22), and also converts the incident position of the transmitted light (222) into an output signal;

該第二感測單元係使用二個獨立之感測器以供分光鏡(22)發出之光束投射於其上,該第二感測單元進一步配設有第三感測器(41)與第四感測器(42);該第三感測器(41),為接收分光鏡(22)發出的反射光(221),亦將反射光(221)光束入射位置轉換成輸出訊號;該第四感測器(42),為接收分光鏡(22)發出的穿透光(222),亦將穿透光(222)光束入射位置轉換成輸出訊號。The second sensing unit uses two independent sensors for the light beam emitted by the beam splitter (22) to be projected thereon, and the second sensing unit is further provided with a third sensor (41) and a fourth sensor (42); the third sensor (41) is a reflected light (221) emitted by the receiving beam splitter (22), and also converts the incident position of the reflected light (221) into an output signal; The fourth sensor (42) is a transmitted light (222) emitted by the receiving beam splitter (22), and also converts the incident position of the transmitted light (222) into an output signal.

請參閱圖二本發明之一種應用單光源檢測取放機構定位及角度誤差之裝置,更包括有:一光源分光單元(2)、一透鏡(5)、一第一感測單元、一第二感測單元以及一訊號處理單元(圖中未顯示)所構成;其中該透鏡(5)係配置在該光源(21)前且在該光束(211)的光路上,以將該光束(211)修正為準直光,並照射到該分光鏡(22)上;Referring to FIG. 2, a device for detecting positioning and angular error of a single light source by using a single light source, further comprising: a light source splitting unit (2), a lens (5), a first sensing unit, and a second a sensing unit and a signal processing unit (not shown); wherein the lens (5) is disposed in front of the light source (21) and on the optical path of the light beam (211) to the light beam (211) Corrected to collimate light and illuminate the beam splitter (22);

而該訊號處理單元係與第一感測單元與該第二感測單元耦接,該訊號處理單元接收該感測器之輸出訊號,並進行運算處理與分析檢測,以將其轉換成系統處理訊號。The signal processing unit is coupled to the first sensing unit and the second sensing unit, and the signal processing unit receives the output signal of the sensor, and performs arithmetic processing and analysis and detection to convert the system into processing. Signal.

接續,將說明本發明應用於取放機構(1)時,其取放機構(1)具有第一軸(11)(即為物件夾(吸)取端)以及第二軸(12)(即為物件放置端),其中該第一感測單元係配置在接收一分光光束的第一軸(11)位置上,而該第二感測單元係配置在接收一分光光束的第二軸(12)位置上、當上述量測原理為取放機構(1)進行夾(吸)取或放置的動作,會因X軸定位誤差影響而產生左右方向的微小位移,會因Y軸定位誤差影響而產生前後方向的微小位移,會因Z軸移動距離的影響而產生上下方向的微小位移,會因θx 與θy 角度誤差的影響而產生沿X軸與Y軸的微小轉動;Next, when the present invention is applied to the pick-and-place mechanism (1), the pick-and-place mechanism (1) has a first shaft (11) (ie, an object clip (suction) take-up end) and a second shaft (12) (ie, An object placement end), wherein the first sensing unit is disposed at a position of a first axis (11) that receives a beam splitting beam, and the second sensing unit is configured to receive a second axis of a beam splitting beam (12) At the position, when the above measurement principle is that the pick-and-place mechanism (1) performs the action of clamping (sucking) or placing, a slight displacement in the left-right direction may occur due to the influence of the X-axis positioning error, which may be affected by the Y-axis positioning error. The slight displacement in the front-rear direction causes a slight displacement in the up-and-down direction due to the influence of the Z-axis moving distance, and a slight rotation along the X-axis and the Y-axis occurs due to the influence of the angular error of θ x and θ y ;

進而當光源(21)移動的時候,設置於第一軸(11)位置的第一感測器(31)與第二感測器(32)會接收到分光後的反射光(221)與穿透光(222),同時由第一感測器(31)檢測到取放機構(1)於第一軸(11)之Z軸移動距離與θx 角度誤差;而該第二感測器(32)則檢測到取放機構(1)於第一軸(11)的X軸定位誤差、Y軸定位誤差、或X軸定位誤差與Y軸定位誤差;Further, when the light source (21) moves, the first sensor (31) and the second sensor (32) disposed at the position of the first axis (11) receive the reflected light (221) and the light after the splitting. Transmitting (222), while the first sensor (31) detects the Z-axis moving distance of the pick-and-place mechanism (1) on the first axis (11) and the θ x angle error; and the second sensor ( 32) detecting an X-axis positioning error, a Y-axis positioning error, or an X-axis positioning error and a Y-axis positioning error of the pick-and-place mechanism (1) on the first axis (11);

若當該取放機構(1)在第二軸(12)位置進行夾(吸)取或放置時,設置於第二軸(12)位置的第三感測器(41)與第四感測器(42)會接收到分光後的反射光(221)與穿透光(222),同時由第三感測器(41)檢測到取放機構(1)於第二軸(12)之Z軸移動距離與θx 角度誤差;而該第四感測器(42)則檢測到取放機構(1)於第二軸(12)的X軸定位誤差、Y軸定位誤差、或X軸定位誤差與Y軸定位誤差;其後再由訊號處理單元接收該第一感測器(31)與第二感測器(32)、或第三感測器(41)與第四感測器(42)之輸出訊號後,並進行運算處理,以將其感測器的輸出訊號轉換成系統處理訊號,供使用者讀取或判讀。If the pick-and-place mechanism (1) is clamped or placed at the position of the second shaft (12), the third sensor (41) and the fourth sensor disposed at the position of the second shaft (12) The device (42) receives the reflected light (221) and the transmitted light (222) after the splitting, and the third sensor (41) detects the pick-and-place mechanism (1) on the second axis (12). The axis movement distance is in error with the θ x angle; and the fourth sensor (42) detects the X-axis positioning error, the Y-axis positioning error, or the X-axis positioning of the pick-and-place mechanism (1) on the second axis (12) Error and Y-axis positioning error; thereafter, the first sensor (31) and the second sensor (32), or the third sensor (41) and the fourth sensor are received by the signal processing unit ( After the output signal of 42), the arithmetic processing is performed to convert the output signal of the sensor into a system processing signal for the user to read or interpret.

本發明能經由下列公式推導X軸、Y軸、Z軸、θx 以及θy 的誤差:The present invention can derive errors in the X-axis, the Y-axis, the Z-axis, θ x , and θ y via the following formula:

設第二感測器(32)的兩軸為VAx 、VAy ,第一感測器(31)的兩軸為VBz 、VBy ,其VAx 所量測到的訊號為X軸定位誤差與θy 的角度誤差,VAy 所量測到的訊號為Y軸定位誤差與θx 角度誤差,VBz 所量測到的訊號為Z軸移動距離、X軸定位誤差與θy 角度誤差,VBy 所量測到的訊號為Y軸定位誤差與θx 角度誤差,由於本發明為光源(21)與分光鏡(22)同時移動,因此VBy 會多量測到Z軸移動之距離,由於夾(吸)取端與放置端為對稱,因此以下推導過程夾(吸)取端與放置端都適用,接著列成以下式子進行推導,It is assumed that the two axes of the second sensor (32) are V Ax and V Ay , and the two axes of the first sensor ( 31 ) are V Bz and V By , and the signals measured by V Ax are X-axis positioning. The error between the error and θ y , the signal measured by V Ay is the Y-axis positioning error and the θ x angle error, and the signal measured by V Bz is the Z-axis moving distance, the X-axis positioning error and the θ y angle error. The signal measured by V By is the Y-axis positioning error and the θ x angle error. Since the present invention moves the light source (21) and the beam splitter (22) simultaneously, V By will measure the Z-axis moving distance. Since the clip (suction) take-up end and the placement end are symmetrical, the following derivation process clamp (suction) take-up end and the placement end are applicable, and then are deduced by the following formula.

VAx =X+θy 、VAy =Y+θx 、VBz =X+θy 、VBy =Z+θx ,其中θx 與θy 會因為感測器與分光鏡(22)的距離差異而乘上一個係數,因此在此將此四式列成:V Ax =X+θ y , V Ay =Y+θ x , V Bz =X+θ y , V By =Z+θ x , where θ x and θ y are multiplied by a factor due to the difference in distance between the sensor and the beam splitter (22), So here are the four formulas:

VAx =X+eθy  (1)V Ax =X+eθ y (1)

VAy =Y+eθx  (2)V Ay =Y+eθ x (2)

VBz =X+fθy  (3)V Bz =X+fθ y (3)

VBy =Z+fθx  (4)V By =Z+fθ x (4)

利用式(1)X=VAx -eθy 代入式(3)得VBz =VAx -eθy +fθy 整理後得:Substituting equation (1) X=V Ax -eθ y into equation (3) gives V Bz =V Ax -eθ y +fθ y after finishing:

θy =(VAx -VBz )/(e+f) (5)θ y =(V Ax -V Bz )/(e+f) (5)

將式(5)代入式(1)整理後得:Substituting equation (5) into equation (1) is obtained:

X=VAx -e(VAx -VBz )/(e+f) (6)X=V Ax -e(V Ax -V Bz )/(e+f) (6)

利用式(2)Y=VAy -fθx 代入式(4)得VBy =VAy -eθx +hθy 整理後得:Using equation (2) Y=V Ay -fθ x into equation (4), V By =V Ay -eθ x +hθ y is obtained:

將式(7)代入式(2)整理後得:Substituting equation (7) into equation (2) is obtained:

將式(5)與(6)推得的X與θ y 代入VBz =X+fθy +Z就可以得到Z軸移動距離:The Z-axis moving distance can be obtained by substituting X and θ y derived by equations (5) and (6) into V Bz =X+fθ y +Z:

VBz =X十fθy 十Z (9)V Bz = X ten fθ y ten Z (9)

將式(5)與式(6)代入式(9)整理後得:Substituting equations (5) and (6) into equation (9) results in:

其中,當取放機構(1)進行夾(吸)取或放置時產生X軸定位誤差,光源(21)入射至感測器所產生的誤差會使聚焦在感測器的光點會如圖四所示。再者,該取機構進行夾(吸)取或放置時產生Y軸定位誤差,光源(21)入射至感測器所產生的誤差會使聚焦在感測器的光點會如圖五所示。Wherein, when the pick-and-place mechanism (1) is clamped (sucked) or placed, an X-axis positioning error is generated, and an error generated by the light source (21) incident on the sensor causes the spot focused on the sensor to be as shown in the figure. Four is shown. Moreover, the Y-axis positioning error is generated when the pick-up mechanism is clamped or placed, and the error caused by the light source (21) incident on the sensor causes the spot focused on the sensor to be as shown in FIG. .

因此,將訊號處理單元進行運算處理,使用者能依照需求,將其轉換成的處理訊號利用快速傅利葉轉換(Fast Fourier Transform,FFT)計算過後,就能得到取放機構(1)之振動頻率。如此一來,本發明可有效達成確具有低成本、高精確度、體積小、攜帶方便、架設簡易及檢測迅速等之實質效益。Therefore, the signal processing unit performs arithmetic processing, and the user can convert the processed signal into a Fast Fourier Transform (FFT) according to the demand, and then the vibration frequency of the pick-and-place mechanism (1) can be obtained. In this way, the invention can effectively achieve the substantial benefits such as low cost, high precision, small size, convenient carrying, simple erection and rapid detection.

經由上述,本發明所設計之一種應用單光源檢測取放機構(1)定位及角度誤差之裝置,於上列詳細說明係針對一可行實施例為具體之代表,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明之技藝精神所為之等效實施或變更,均應包含於本發明所訴求專利之範圍中。Through the above, a device designed to detect the positioning and angular error of the pick-and-place mechanism (1) by using a single light source is specifically represented in the above detailed description, but the embodiment is not intended to be limited. The equivalents of the invention are intended to be included within the scope of the invention as claimed.

綜上所述,本發明所設計一種應用單光源檢測取放機構定位及角度誤差之裝置,不但在目前工業型態上確屬創新,其整體結構特徵及技術應用為完全創新,未見同類物品,為具創新且具有產業充分利用的價值,實已符合發明專利之要件,爰依法提出申請,懇請 貴局核准本發明專利,讓本發明得以早日嘉惠廣大之社會大眾。In summary, the present invention designs a device for detecting the positioning and angular error of the pick-and-place mechanism by using a single light source, which is not only innovative in the current industrial type, but also has a complete innovation in the overall structural features and technical applications, and no similar items are found. In order to be innovative and have the full value of the industry, it has already met the requirements of the invention patent. If you file an application according to law, you are requested to approve the invention patent, so that the invention can be used to benefit the broad masses of the society at an early date.

1...取放機構1. . . Pick and place mechanism

11...第一軸11. . . First axis

12...第二軸12. . . Second axis

2...光源單元2. . . Light source unit

21...光源twenty one. . . light source

211...光束211. . . beam

22...分光鏡twenty two. . . Beam splitter

221...反射光221. . . reflected light

222...穿透光222. . . Penetrating light

31...第一感測器31. . . First sensor

32...第二感測器32. . . Second sensor

41...第三感測器41. . . Third sensor

42...第四感測器42. . . Fourth sensor

5...透鏡5. . . lens

圖一係本發明之一種應用分光束檢測取放機構多軸誤差之裝置其量測光路構造圖;1 is a structural diagram of a measuring optical path of a device for detecting a multi-axis error of a split-beam detecting and pick-and-place mechanism according to the present invention;

圖二係本發明量測光路增加準直透鏡之量測示意圖;2 is a schematic diagram showing the measurement of the collimating lens of the measuring optical path of the present invention;

圖三係本發明量測光路前側構造之量測示意圖;Figure 3 is a schematic diagram showing the measurement of the front side structure of the measuring optical path of the present invention;

圖四係本發明感測器其X軸定位誤差之示意圖;以及Figure 4 is a schematic diagram of the X-axis positioning error of the sensor of the present invention;

圖五係本發明感測器其Y軸之定位誤之示意圖。Figure 5 is a schematic diagram of the positioning error of the Y-axis of the sensor of the present invention.

1...取放機構1. . . Pick and place mechanism

11...第一軸11. . . First axis

12...第二軸12. . . Second axis

2...光源2. . . light source

21...光束twenty one. . . beam

22...分光鏡twenty two. . . Beam splitter

3...第一感測單元3. . . First sensing unit

4...第二感測單元4. . . Second sensing unit

Claims (8)

一種應用分光束檢測取放機構多軸誤差之裝置,包括:一光源分光單元,係將一光源之光束射入分光鏡後,分光成為二光束;第一感測單元,配置在接收至少一分光光束的第一軸或第二軸位置上,係使用二個獨立之感測器以供分光鏡發出之光束投射於其上,且其後方,用以將各自感測器輸出之輸出訊號進行運算處理之裝置;第二感測單元,配置在接收至少一分光光束的第二軸或第一軸位置上,係使用二個獨立之感測器以供分光鏡發出之光束投射於其上一訊號處理單元,係與第一感測單元與該第二感測單元耦接,該訊號處理單元接收該感測器之輸出訊號,並進行運算處理與分析檢測,以將其轉換成系統處理訊號。 The utility model relates to a device for detecting multi-axis error of a pick-and-place mechanism by using a partial beam, comprising: a light source splitting unit, which is configured to split a light beam of a light source into a beam splitter and split the light into two light beams; the first sensing unit is configured to receive at least one split light. At the first or second axis position of the beam, two separate sensors are used for the beam emitted by the beam splitter to be projected thereon, and behind it, the output signals of the respective sensor outputs are operated. a device for processing; a second sensing unit configured to receive at least one beam of light at a second axis or a first axis position, using two separate sensors for the beam emitted by the beam splitter to be projected onto the signal The processing unit is coupled to the first sensing unit and the second sensing unit. The signal processing unit receives the output signal of the sensor, and performs arithmetic processing and analysis detection to convert the signal into a system processing signal. 如申請專利範圍第1 項所述之一種應用分光束檢測取放機構多軸誤差之裝置,其中該第一感測單元進一步配設有第一感測器與第二感測器,該第一感測器接收光源分光單元之分光鏡發出的反射光。The device of claim 1 , wherein the first sensing unit is further provided with a first sensor and a second sensor, the first The sensor receives the reflected light from the beam splitter of the light source splitting unit. 如申請專利範圍第1 項所述之一種應用分光束檢測取放機構多軸誤差之裝置,其中該第一感測單元進一步配設有第一感測器與第二感測器,該第二感測器其感接收光源分光單元之分光鏡發出的穿透光。The device of claim 1 , wherein the first sensing unit is further provided with a first sensor and a second sensor, the second The sensor senses the transmitted light emitted by the beam splitter of the light source splitting unit. 如申請專利範圍第1 項所述之一種應用分光束檢測取放機構多軸誤差之裝置,其中該第二感測單元進一步配設有第三感測器與第四感測器,該第三感測器接收光源分光單元之分光鏡發出的反射光。The device of claim 1 , wherein the second sensing unit is further provided with a third sensor and a fourth sensor, the third The sensor receives the reflected light from the beam splitter of the light source splitting unit. 如申請專利範圍第1 項所述之一種應用分光束檢測取放機構多軸誤差之裝置,其中該第二感測單元進一步配設有第三感測器與第四感測器,該第四感測器接收光源分光單元之分光鏡發出的穿透光。The device of claim 1 , wherein the second sensing unit is further provided with a third sensor and a fourth sensor, the fourth The sensor receives the transmitted light from the beam splitter of the light source splitting unit. 如申請專利範圍第1、24 項所述之一種應用分光束檢測取放機構多軸誤差之裝置,其中該第一感測器或第三感測器係可感測Z軸移動距離與θ x 角度誤差。A device for detecting a multi-axis error of a pick-and-place mechanism by using a split beam as described in claim 1, 2 or 4 , wherein the first sensor or the third sensor senses a Z-axis moving distance and θ x angle error. 如申請專利範圍第1、35 項所述之一種應用分光束檢測取放機構多軸誤差之裝置,其中該第二感測器或第四感測器係可感測X軸定位誤差與Y軸定位誤差。A device for detecting a multi-axis error of a pick-and-place mechanism by using a split beam as described in claim 1, 3 or 5 , wherein the second sensor or the fourth sensor senses an X-axis positioning error and Y-axis positioning error. 如申請專利範圍第1 項所述之一種應用分光束檢測取放機構多軸誤差之裝置,其中更包括有一透鏡,該透鏡係配置在該光源前且在該光束的光路上,以將該光束修正為準直光,並照射到光源分光單元之分光鏡。An application of the items 1 The fraction of the light beam detecting means a multi-axis error mechanism to take place, which further comprises a lens, the lens system disposed in front of the light source and the optical path of the beam to the beam Corrected to collimated light and illuminated to the beam splitter of the source splitting unit.
TW98114921A 2009-05-05 2009-05-05 A device for measuring the multi - axis error of the pick - and - place mechanism TWI401420B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200540404A (en) * 2004-06-10 2005-12-16 Nat Huwei Inst Technology Miniature arbor revolving precision measurement device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200540404A (en) * 2004-06-10 2005-12-16 Nat Huwei Inst Technology Miniature arbor revolving precision measurement device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
匡萃方,同時測量物體六自由度的方法,激光技術,第29卷第5期,2005年10月 *

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