TWI398617B - Heat sink - Google Patents
Heat sink Download PDFInfo
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- TWI398617B TWI398617B TW98119508A TW98119508A TWI398617B TW I398617 B TWI398617 B TW I398617B TW 98119508 A TW98119508 A TW 98119508A TW 98119508 A TW98119508 A TW 98119508A TW I398617 B TWI398617 B TW I398617B
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- fin
- fins
- fin set
- heat sink
- heat pipe
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明涉及一種散熱器。 The invention relates to a heat sink.
隨著電腦的中央處理器功率的不斷提高,中央處理器的散熱需求也越來越高,這就使得散熱器變得越來越大以滿足散熱需求。散熱器體積太大不利於散熱器的包裝和運輸,造成包裝和運輸成本的提高。 As the power of the central processing unit of the computer continues to increase, the heat dissipation requirements of the central processing unit are also increasing, which makes the heat sink larger and larger to meet the heat dissipation requirement. The large size of the radiator is not conducive to the packaging and transportation of the radiator, resulting in an increase in packaging and transportation costs.
鑒於以上內容,有必要提供一種可滿足散熱需求並可降低包裝和運輸成本的散熱器。 In view of the above, it is necessary to provide a heat sink that can meet the heat dissipation requirements and can reduce packaging and transportation costs.
一種散熱器,包括一基座、一連接於該基座的熱管以及一裝設於該熱管的第一鰭片組,該第一鰭片組包括複數第一鰭片,該散熱器還包括一活動裝設於該熱管的第二鰭片組,該第二鰭片組包括複數第二鰭片,該等第一鰭片及該等第二鰭片相互交錯疊置,該第二鰭片組可由一第一位置移動至一第二位置,當該第二鰭片組位於該第一位置時,該第二鰭片組縮回該第一鰭片組,當該第二鰭片組位於該第二位置時,該第二鰭片組由該第一鰭片組中伸出。 A heat sink includes a base, a heat pipe connected to the base, and a first fin set mounted on the heat pipe, the first fin set includes a plurality of first fins, and the heat sink further includes a The second fin set is disposed on the second fin set of the heat pipe, the second fin set includes a plurality of second fins, and the first fins and the second fins are alternately stacked with each other, the second fin set Moving from a first position to a second position, when the second fin set is in the first position, the second fin set retracts the first fin set, when the second fin set is located In the second position, the second set of fins protrudes from the first set of fins.
本發明散熱器的第二鰭片組縮回第一鰭片組時,可使散熱器體積縮小以便包裝和運輸。當第二鰭片組由第一鰭片組中伸出時,可令散熱器體積擴大以在使用中滿足散熱需求。 When the second fin set of the heat sink of the present invention is retracted into the first fin set, the heat sink can be reduced in size for packaging and transportation. When the second fin set is extended from the first fin set, the heat sink can be expanded in size to meet the heat dissipation requirement in use.
10‧‧‧散熱器 10‧‧‧ radiator
20‧‧‧基座 20‧‧‧ Pedestal
40‧‧‧熱管 40‧‧‧heat pipe
60‧‧‧第一鰭片組 60‧‧‧First fin set
80‧‧‧第二鰭片組 80‧‧‧second fin set
41‧‧‧第一桿 41‧‧‧first shot
42‧‧‧第二桿 42‧‧‧second shot
61‧‧‧第一鰭片 61‧‧‧First fin
82‧‧‧第二鰭片 82‧‧‧second fin
84‧‧‧操作部 84‧‧‧Operation Department
圖1為本發明散熱器的較佳實施方式的立體圖。 1 is a perspective view of a preferred embodiment of a heat sink of the present invention.
圖2為圖1的主視圖。 Figure 2 is a front elevational view of Figure 1.
圖3為圖1中的散熱器的使用狀態圖。 Fig. 3 is a view showing a state of use of the heat sink of Fig. 1.
請參閱圖1至3,本發明散熱器10的較佳實施方式包括一基座20、一熱管40、一第一鰭片組60以及兩第二鰭片組80。 Referring to FIGS. 1 to 3 , a preferred embodiment of the heat sink 10 of the present invention includes a base 20 , a heat pipe 40 , a first fin set 60 , and two second fin sets 80 .
基座20用於接觸一發熱元件,如一中央處理器,以吸收該發熱元件所發出的熱量。 The susceptor 20 is for contacting a heat generating component, such as a central processing unit, to absorb heat generated by the heat generating component.
熱管40呈“U”形,包括一水平的第一桿41以及兩第二桿42。第一桿41插設於基座20,且兩端露出。兩第二桿42分別由連接桿41的該兩端豎直向上延伸出。每一第二桿42的截面為圓形。 The heat pipe 40 has a "U" shape and includes a horizontal first rod 41 and two second rods 42. The first rod 41 is inserted into the base 20 and exposed at both ends. The two second rods 42 are vertically extended upward from the ends of the connecting rod 41, respectively. Each of the second rods 42 has a circular cross section.
第一鰭片組60包括複數相互平行的第一鰭片61。每一第一鰭片61的相對兩端處對應於熱管40的兩第二桿42分別開設一通孔(未標號)。每一第二桿42穿過每一第一鰭片61的相應通孔,使得第一鰭片組60的第一鰭片61串設於熱管40的兩第二桿42。 The first fin set 60 includes a plurality of first fins 61 that are parallel to each other. A pair of through holes (not labeled) are respectively defined in the two second rods 42 corresponding to the heat pipes 40 at opposite ends of each of the first fins 61. Each of the second rods 42 passes through a corresponding through hole of each of the first fins 61 such that the first fins 61 of the first fin set 60 are serially disposed on the two second rods 42 of the heat pipe 40.
兩第二鰭片組80分別可轉動地裝設於熱管40的兩第二桿42。每一第二鰭片組80包括複數相互平行的第二鰭片82。每一第二鰭片82的一端處開設一可令相應第二桿42穿過的圓形軸孔(未標號)。每一第二鰭片組80的第二鰭片82透過其軸孔串設於相應第二桿42。每一第二鰭片組80的第二鰭片82分別位於第一鰭片組60的兩相鄰的第一鰭片61之間,使得第一鰭片61與第二鰭片82相互交錯疊置。第二鰭片組80於第二鰭片82的側緣還設有一操作部84。 The two second fin sets 80 are rotatably mounted on the two second rods 42 of the heat pipe 40, respectively. Each of the second fin sets 80 includes a plurality of second fins 82 that are parallel to each other. A circular shaft hole (not labeled) through which the corresponding second rod 42 passes is formed at one end of each of the second fins 82. The second fins 82 of each of the second fin sets 80 are serially disposed on the corresponding second rods 42 through their shaft holes. The second fins 82 of each second fin set 80 are respectively located between two adjacent first fins 61 of the first fin set 60 such that the first fins 61 and the second fins 82 are interdigitated Set. The second fin set 80 is further provided with an operating portion 84 on the side edge of the second fin 82.
操作每一第二鰭片組80的操作部84,可帶動相應第二鰭片組80以熱管40的相應第二桿42為軸進行轉動。包裝和運輸本發明散熱器10時,可將兩第二鰭片組80轉動並縮回第一鰭片組60中,以縮小散熱器10的體積(如圖1及圖2所示)。當需要使用本發明散熱器10來為該發熱元件散熱時,可將兩第二鰭片組80由第一鰭片組60中旋出,以擴大散熱器10的體積(如圖3所示)。 The operation portion 84 of each second fin group 80 is operated to drive the corresponding second fin group 80 to rotate with the corresponding second rod 42 of the heat pipe 40 as an axis. When packaging and transporting the heat sink 10 of the present invention, the two second fin sets 80 can be rotated and retracted into the first fin set 60 to reduce the volume of the heat sink 10 (as shown in Figures 1 and 2). When the heat sink 10 of the present invention is required to dissipate heat for the heat generating component, the two second fin sets 80 can be unscrewed from the first fin set 60 to enlarge the volume of the heat sink 10 (as shown in FIG. 3). .
在其他實施方式中可省去一第二鰭片組80。 In other embodiments, a second set of fins 80 can be omitted.
在其他實施方式中,可將每一第二鰭片82的圓形軸孔改為長形的導引孔,並將熱管40的每一第二桿42的截面由圓形改為矩形。這樣,便可使得每一第二鰭片組80在其導引孔的導引下相對於相應第二桿42滑動,從而使得每一第二鰭片組80可滑入及滑出第一鰭片組60。 In other embodiments, the circular shaft hole of each second fin 82 can be changed to an elongated guide hole, and the cross section of each second rod 42 of the heat pipe 40 can be changed from a circular shape to a rectangular shape. In this way, each second fin group 80 can be slid relative to the corresponding second rod 42 under the guidance of its guiding hole, so that each second fin group 80 can slide in and out of the first fin. Slice group 60.
綜上所述,本發明散熱器10的第二鰭片組80活動裝設於熱管40並可由一第一位置移動至一第二位置。當第二鰭片組80位於該第一位置時,第二鰭片組80縮回第一鰭片組60,可使散熱器10的體積縮小。當第二鰭片組80位於該第二位置時,第二鰭片組80伸出第一鰭片組60,可令散熱器10的體積擴大。 In summary, the second fin set 80 of the heat sink 10 of the present invention is movably mounted on the heat pipe 40 and can be moved from a first position to a second position. When the second fin set 80 is in the first position, the second fin set 80 is retracted to the first fin set 60, and the volume of the heat sink 10 can be reduced. When the second fin set 80 is in the second position, the second fin set 80 extends out of the first fin set 60, and the volume of the heat sink 10 can be enlarged.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化 ,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the invention All should be covered by the following patent application.
10‧‧‧散熱器 10‧‧‧ radiator
20‧‧‧基座 20‧‧‧ Pedestal
40‧‧‧熱管 40‧‧‧heat pipe
60‧‧‧第一鰭片組 60‧‧‧First fin set
80‧‧‧第二鰭片組 80‧‧‧second fin set
42‧‧‧第二桿 42‧‧‧second shot
61‧‧‧第一鰭片 61‧‧‧First fin
82‧‧‧第二鰭片 82‧‧‧second fin
84‧‧‧操作部 84‧‧‧Operation Department
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98119508A TWI398617B (en) | 2009-06-11 | 2009-06-11 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98119508A TWI398617B (en) | 2009-06-11 | 2009-06-11 | Heat sink |
Publications (2)
Publication Number | Publication Date |
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TW201043903A TW201043903A (en) | 2010-12-16 |
TWI398617B true TWI398617B (en) | 2013-06-11 |
Family
ID=45001124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW98119508A TWI398617B (en) | 2009-06-11 | 2009-06-11 | Heat sink |
Country Status (1)
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TW (1) | TWI398617B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10779439B2 (en) | 2018-05-24 | 2020-09-15 | Quanta Computer Inc. | Remote heat exchanger |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM270640U (en) * | 2004-12-21 | 2005-07-11 | Foxconn Tech Co Ltd | Heat dissipation device |
JP2008004710A (en) * | 2006-06-21 | 2008-01-10 | Kiko Kagi Kofun Yugenkoshi | Heat sink structure having clip |
TW200812468A (en) * | 2006-08-24 | 2008-03-01 | Li Hong Science & Technology Co Ltd | Heat sink assembly |
CN101146427A (en) * | 2006-09-15 | 2008-03-19 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
US7537046B2 (en) * | 2007-04-02 | 2009-05-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
-
2009
- 2009-06-11 TW TW98119508A patent/TWI398617B/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM270640U (en) * | 2004-12-21 | 2005-07-11 | Foxconn Tech Co Ltd | Heat dissipation device |
JP2008004710A (en) * | 2006-06-21 | 2008-01-10 | Kiko Kagi Kofun Yugenkoshi | Heat sink structure having clip |
TW200812468A (en) * | 2006-08-24 | 2008-03-01 | Li Hong Science & Technology Co Ltd | Heat sink assembly |
CN101146427A (en) * | 2006-09-15 | 2008-03-19 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
US7537046B2 (en) * | 2007-04-02 | 2009-05-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
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TW201043903A (en) | 2010-12-16 |
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