TWI396476B - Light module, composited circuit board device used therein, and assembling method thereof - Google Patents

Light module, composited circuit board device used therein, and assembling method thereof Download PDF

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Publication number
TWI396476B
TWI396476B TW099123747A TW99123747A TWI396476B TW I396476 B TWI396476 B TW I396476B TW 099123747 A TW099123747 A TW 099123747A TW 99123747 A TW99123747 A TW 99123747A TW I396476 B TWI396476 B TW I396476B
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Taiwan
Prior art keywords
circuit board
opening
opening portion
connecting portion
light
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TW099123747A
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Chinese (zh)
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TW201206255A (en
Inventor
Shin Chang Jiang
Chieh Jen Cheng
Chien Ting Liao
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Au Optronics Corp
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Priority to TW099123747A priority Critical patent/TWI396476B/en
Priority to US13/151,356 priority patent/US8734000B2/en
Publication of TW201206255A publication Critical patent/TW201206255A/en
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Publication of TWI396476B publication Critical patent/TWI396476B/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/056Folded around rigid support or component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing

Description

發光模組、其使用之複合式電路板裝置及其組裝方法Light-emitting module, composite circuit board device therefor and assembly method thereof

本發明係關於一種發光模組及其組裝方法;具體而言,本發明係關於一種增加可靠度的發光模組及其組裝方法。The present invention relates to a lighting module and an assembling method thereof; in particular, the present invention relates to a lighting module with increased reliability and an assembling method thereof.

以往傳統的陰極射線管顯示裝置,在現今追求短小輕薄之電子設備的趨勢下,逐漸被具備體積較小、耗電量較少等優勢的平面顯示裝置所取代。因此,平面顯示裝置已成為目前顯示裝置市場的主流商品。Conventional cathode ray tube display devices have been gradually replaced by flat display devices having advantages such as small size and low power consumption in the current trend of pursuing short and thin electronic devices. Therefore, flat display devices have become mainstream products in the current display device market.

平面顯示裝置的種類繁多,其中運用液晶顯示技術的液晶顯示裝置是目前較為受歡迎的商品,其市場應用也十分廣泛,像是電腦顯示裝置、液晶電視等也日漸普及中。由於液晶顯示裝置為非自發光型顯示裝置,因此需要背光源(backlight unit)提供所需之光線,方能達到顯示的功能。近年來,隨著環保意識的提昇及其他技術上的考量,背光源中所使用的發光元件已逐漸轉換成發光二極體(light emitting diode,LED)。發光二極體通常係設置於印刷電路板以形成發光二極體燈條(LED light bar)於背光源中,而發光二極體燈條通常會透過具有可撓特性之印刷電路板與外部電路電性連接,進而來控制背光源的點亮機制。There are many types of flat display devices, and liquid crystal display devices using liquid crystal display technology are currently popular products, and their market applications are also very wide, such as computer display devices, LCD TVs, etc. are also becoming increasingly popular. Since the liquid crystal display device is a non-self-illuminating type display device, a backlight unit is required to provide the required light to achieve the display function. In recent years, with the improvement of environmental awareness and other technical considerations, the light-emitting elements used in backlights have gradually been converted into light emitting diodes (LEDs). The light emitting diode is usually disposed on a printed circuit board to form a LED light bar in the backlight, and the LED light bar usually transmits the printed circuit board and the external circuit with flexible characteristics. Electrically connected to control the lighting mechanism of the backlight.

圖1A所示為液晶顯示裝置之背光模組示意圖,背光模組包含以發光二極體燈條與可撓特性之印刷電路板所組成的發光模組60、容納發光二極體燈條之燈罩70、光學膜片80與底框40。如圖1B所示之傳統發光模組,包含第一電路板10、第二電路板20以及發光源30;其中發光源30設置於第一電路板10,並且電性連接於第一電路板10。具有可撓特性之第二電路板20也與第一電路板10相互電性連接,因此,外部電路可以經由第二電路板20傳輸控制電路訊號到位於第一電路板10之發光源30,進而操控發光源30的點亮時機與機制。在圖1B所示之傳統發光模組,當第一電路板10與第二電路板20電性連接後,具有可撓特性之第二電路板20會經由於第一電路板10上方形成彎折而繞到第一電路板10之後方,之後第二電路板20之一端再經由第一電路板10下方而將繞回第一電路板10之前方。因此,藉由第二電路板20可繞著第一電路板10之特性來達到兩電路板相互固定的作用。在如圖1C所示之傳統的發光模組中,除了藉由第二電路板20纏繞第一電路板10來達到固定作用之外,還會使用膠帶50來增加兩電路板之間的固定效果,其中膠帶50具有水平以及垂直方向的固定作用。FIG. 1A is a schematic diagram of a backlight module of a liquid crystal display device. The backlight module includes a light-emitting module 60 composed of a light-emitting diode light strip and a flexible printed circuit board, and a light cover for accommodating the light-emitting diode light strip. 70. Optical film 80 and bottom frame 40. The conventional light-emitting module shown in FIG. 1B includes a first circuit board 10, a second circuit board 20, and a light source 30. The light source 30 is disposed on the first circuit board 10 and electrically connected to the first circuit board 10. . The second circuit board 20 having the flexible characteristic is also electrically connected to the first circuit board 10. Therefore, the external circuit can transmit the control circuit signal to the light source 30 located on the first circuit board 10 via the second circuit board 20, thereby further The lighting timing and mechanism of the illumination source 30 are manipulated. In the conventional light-emitting module shown in FIG. 1B, after the first circuit board 10 and the second circuit board 20 are electrically connected, the second circuit board 20 having the flexible characteristics is bent over the first circuit board 10. After being wound around the first circuit board 10, one end of the second circuit board 20 is then wound back to the front of the first circuit board 10 via the lower side of the first circuit board 10. Therefore, the function of fixing the two circuit boards to each other can be achieved by the second circuit board 20 around the characteristics of the first circuit board 10. In the conventional light-emitting module shown in FIG. 1C, in addition to the first circuit board 10 being wound by the second circuit board 20 to achieve a fixing function, the tape 50 is also used to increase the fixing effect between the two circuit boards. Where the tape 50 has a fixing effect in the horizontal and vertical directions.

然而,在後續組裝將具有發光源30之第一電路板10放置於燈罩70時,受到組裝動作或是燈罩70的影響會破壞纏繞於第一電路板10上方之第二電路板20,進而影響第二電路板20與外部電路或是與第一電路板100的電性連接作用。因此發生發光源30無法順利點亮的現象而降低發光模組的可靠度。However, when the first circuit board 10 having the light source 30 is placed on the lamp cover 70 in a subsequent assembly, the assembly operation or the lamp cover 70 may damage the second circuit board 20 wound around the first circuit board 10, thereby affecting The second circuit board 20 is electrically connected to the external circuit or to the first circuit board 100. Therefore, the phenomenon that the light source 30 cannot be smoothly illuminated occurs, and the reliability of the light emitting module is lowered.

本發明之目的在於提供一種發光模組及其組裝方法,可降低發光模組發生無法順利點亮的可能性。The object of the present invention is to provide a light-emitting module and an assembly method thereof, which can reduce the possibility that the light-emitting module cannot be smoothly illuminated.

本發明之另一目的在於提供一種發光模組及其組裝方法,具有提高產品良率的效果。Another object of the present invention is to provide a light-emitting module and an assembly method thereof, which have the effect of improving product yield.

本發明之發光模組包含第一電路板、第二電路板以及發光源。第一電路板包含第一開口部、第二開口部、第一連接部以及表面,其中發光源設置於第一電路板之表面,並且電性連接位於表面之第一連接部。第二電路板具有第一彎折部、第二彎折部與第二連接部,其中第二連接部電性連接第一電路板之第一連接部,使外部電路可以透過第二電路板之第二連接部電性連接於發光源,藉此控制發光源的點亮時機與機制。The light emitting module of the present invention comprises a first circuit board, a second circuit board and a light source. The first circuit board includes a first opening portion, a second opening portion, a first connecting portion and a surface, wherein the light source is disposed on a surface of the first circuit board and electrically connected to the first connecting portion of the surface. The second circuit board has a first bent portion, a second bent portion and a second connecting portion, wherein the second connecting portion is electrically connected to the first connecting portion of the first circuit board, so that the external circuit can pass through the second circuit board The second connecting portion is electrically connected to the light source, thereby controlling the lighting timing and mechanism of the light source.

本發明之發光模組的第二電路板具有可撓特性,可使第二電路板穿越第一電路板之第一開口部,並且反折位於第一開口部兩側之第二電路板以形成第一彎折部於第二電路板,其中第一彎折部容置於第一電路板之第一開口部。經由第二電路板之一端穿過第一開口部以形成第一彎折部,使穿越第一開口之部份的第二電路板能夠接觸到第一電路板或是與第一電路板之表面相互平行。在本發明之發光模組中,具有可撓特性之第二電路板穿越第二開口部以形成第二彎折部,其中第二彎折部容納於第一電路板之第二開口部,並且第一彎折部位於第二彎折部與第二連接部之間。經由第二電路板穿越第二開口部以形成第二彎折部,使穿越第二開口部之部份的第二電路板能夠穿出第一電路板之表面。因此,藉由第二電路板穿過第一電路板之第一開口部與第二開口部以形成第一彎折部,而使第一電路板與第二電路板相互固定。The second circuit board of the light emitting module of the present invention has a flexible property, so that the second circuit board can pass through the first opening portion of the first circuit board, and the second circuit board located on both sides of the first opening portion is folded back to form The first bent portion is on the second circuit board, wherein the first bent portion is received in the first opening portion of the first circuit board. Passing through the first opening portion through one end of the second circuit board to form a first bent portion, so that the second circuit board passing through the portion of the first opening can contact the first circuit board or the surface of the first circuit board Parallel to each other. In the light emitting module of the present invention, the second circuit board having the flexible property passes through the second opening portion to form the second bent portion, wherein the second bent portion is received in the second opening portion of the first circuit board, and The first bent portion is located between the second bent portion and the second connecting portion. The second circuit board passes through the second opening portion to form a second bending portion, so that the second circuit board that passes through the portion of the second opening portion can pass through the surface of the first circuit board. Therefore, the first circuit board and the second circuit board are fixed to each other by the second circuit board passing through the first opening portion and the second opening portion of the first circuit board to form the first bent portion.

發光模組組裝方法包含下列步驟:首先提供具有位於表面之第一連接部、第一開口部與第二開口部的第一電路板,以及提供具有第二連接部的第二電路板。接著設置發光源於第一電路板之表面,並且電性連接於第一連接部。然後電性連接第二電路板之第二連接部與第一電路板之第一連接部,使外部電路可以藉由第二電路板之第二連接部與位於第一電路板之發光源電性連接,而操控發光源的點亮機制。之後,將連接第一電路板的第二電路板之一端穿過第一電路板之第一開口部,並且彎折第二電路板以形成第一彎折部,其中第一彎折部容置於第一開口部,並且將穿過第一開口部的第二電路板之一端平行或是接觸於第一電路板。最後,再將連接第一電路板的第二電路板之一端穿過第一電路板之第二開口部,使其穿過第二開口部的第二電路板之一端能夠穿出第一電路板之表面。The lighting module assembly method includes the steps of first providing a first circuit board having a first connection portion, a first opening portion and a second opening portion on a surface, and providing a second circuit board having a second connection portion. Then, the illuminating source is disposed on the surface of the first circuit board, and is electrically connected to the first connecting portion. And electrically connecting the second connecting portion of the second circuit board and the first connecting portion of the first circuit board, so that the external circuit can be electrically connected to the light source of the first circuit board by the second connecting portion of the second circuit board Connect and manipulate the lighting mechanism of the light source. Thereafter, one end of the second circuit board connected to the first circuit board is passed through the first opening portion of the first circuit board, and the second circuit board is bent to form a first bending portion, wherein the first bending portion is received And forming a first opening portion and paralleling or contacting one end of the second circuit board passing through the first opening portion with the first circuit board. Finally, one end of the second circuit board connected to the first circuit board is passed through the second opening portion of the first circuit board so that one end of the second circuit board passing through the second opening portion can pass through the first circuit board The surface.

由於在第二電路板穿越第一電路板之第一開口部與第二開口部的步驟時,第一電路板可與第二電路板相互固定而不需要黏合膠帶的使用,並且第二電路板並非纏繞第一電路板之外部可減少後續發光模組容置於燈罩之組裝步驟所引發第二電路板之破壞問題,而增加外部電路經由第二電路板控制發光源點亮步驟的成功度,以達到增加發光模組可靠度的效果。Since the step of the second circuit board traversing the first opening portion and the second opening portion of the first circuit board, the first circuit board can be fixed to the second circuit board without using the adhesive tape, and the second circuit board Not winding the outside of the first circuit board can reduce the damage of the second circuit board caused by the assembly step of the subsequent light-emitting module being accommodated in the lamp cover, and increasing the success degree of the external circuit controlling the illumination source lighting step via the second circuit board, In order to achieve the effect of increasing the reliability of the lighting module.

本發明係提供一種發光模組及其組裝方法。本發明之發光模組包含第一電路板、第二電路板以及發光源。發光模組組裝方法步驟包含藉由第二電路板形成第一彎折部,使其能穿過第一電路板之第一開口部與第二開口部,以完成發光模組組裝動作。The invention provides a light emitting module and an assembling method thereof. The light emitting module of the present invention comprises a first circuit board, a second circuit board and a light source. The step of assembling the light module comprises forming a first bent portion by the second circuit board so as to pass through the first opening portion and the second opening portion of the first circuit board to complete the assembly operation of the light emitting module.

本發明之發光模組包含第一電路板、第二電路板以及發光源。在本發明之實施例中,第一電路板100之一端具有第一開口部110、第二開口部130、第一連接部150以及表面170,如圖2A所示,第一連接部150設置於第一電路板100之表面170,第一開口部110與第二開口部130則分別位於第一連接部150之兩側。在本實施例中,第一電路板100較佳為一硬質印刷電路板,而第一電路板100之第一連接部150為一具有導電特性的材質,以作為電性連接所使用,常見的材質為銅、鋁。如圖2A所示的實施例中,第一開口部110與第二開口部130為延第一電路板100之長度方向延伸的狹長型封閉式開口,其中封閉式開口是指在第一電路板100上形成完整的狹長型開口孔洞,並且此狹長型開口孔洞之邊緣呈現封閉曲線狀態。在圖2A所示,發光源300設置在第一電路板100之表面170,並且與第一連接部150透過第一電路板100內部之線路(未繪示)電性連接,以藉此來控制發光源300的點亮機制。在本發明之實施例中,發光源300為發光二極體,可藉由電路驅動來控制其發光的機制,並且具有節能、省空間的優點。在本案圖示中僅一個發光二極體做為例示,但熟習此項技藝者皆了解發光二極體可以是多個。The light emitting module of the present invention comprises a first circuit board, a second circuit board and a light source. In an embodiment of the present invention, one end of the first circuit board 100 has a first opening portion 110, a second opening portion 130, a first connecting portion 150, and a surface 170. As shown in FIG. 2A, the first connecting portion 150 is disposed on the first connecting portion 150. The surface 170 of the first circuit board 100, the first opening portion 110 and the second opening portion 130 are respectively located at two sides of the first connecting portion 150. In this embodiment, the first circuit board 100 is preferably a rigid printed circuit board, and the first connecting portion 150 of the first circuit board 100 is made of a conductive material for use as an electrical connection. The material is copper and aluminum. In the embodiment shown in FIG. 2A, the first opening portion 110 and the second opening portion 130 are elongated closed openings extending in the longitudinal direction of the first circuit board 100, wherein the closed opening refers to the first circuit board. A complete elongated opening hole is formed in 100, and the edge of the elongated opening hole exhibits a closed curve state. As shown in FIG. 2A, the illumination source 300 is disposed on the surface 170 of the first circuit board 100, and is electrically connected to a line (not shown) of the first connection portion 150 through the first circuit board 100 to thereby control. The lighting mechanism of the light source 300. In the embodiment of the present invention, the light source 300 is a light emitting diode, which can be controlled by circuit driving to control its light emission, and has the advantages of energy saving and space saving. In the illustration of the present invention, only one light-emitting diode is exemplified, but those skilled in the art will understand that the light-emitting diodes may be plural.

在本實施例中,第二電路板200之末端處具有第二連接部250,如圖2C所示,用以電性連接第一電路板100之用,因此第二連接部250為具有導電特性的材質,常見的材質為銅、鋁。圖2C所示的實施例中,第一電路板100之第一連接部150與第二電路板200之第二連接部250相互電性連接,使第二電路板200能傳輸外部電路的控制訊號至第一電路板100,藉以控制發光源300之點亮機制。在本實施例中,第一連接部150與第二連接部250可以利用熱壓、焊料接合或是焊接技術來達到電性連接的效果。In this embodiment, the second connecting portion 250 has a second connecting portion 250, as shown in FIG. 2C, for electrically connecting the first circuit board 100, so that the second connecting portion 250 has conductive characteristics. The material is common in copper and aluminum. In the embodiment shown in FIG. 2C, the first connecting portion 150 of the first circuit board 100 and the second connecting portion 250 of the second circuit board 200 are electrically connected to each other, so that the second circuit board 200 can transmit the control signal of the external circuit. To the first circuit board 100, the lighting mechanism of the light source 300 is controlled. In this embodiment, the first connecting portion 150 and the second connecting portion 250 can achieve the effect of electrical connection by using hot pressing, solder bonding or soldering technology.

接著,請參考圖2B所示,與第一電路板100連接後的第二電路板200藉由使第二電路板200之一端穿越第一電路板100之第一開口部110而形成第一彎折部210,並且將第二電路板200之第一彎折部210容納於第一電路板100之第一開口部110。由此可知,第二電路板200之寬度較佳係略小於第一開口部110之寬度。在本實施例中,第二電路板200為一具有可撓特性之軟質印刷電路板,使第二電路板200可藉由彎折位於第一開口部110兩側部分之動作,以形成第一彎折部210於第二電路板200。Next, referring to FIG. 2B, the second circuit board 200 connected to the first circuit board 100 forms a first bend by causing one end of the second circuit board 200 to pass through the first opening portion 110 of the first circuit board 100. The folded portion 210 and the first bent portion 210 of the second circuit board 200 are received in the first opening portion 110 of the first circuit board 100. Therefore, the width of the second circuit board 200 is preferably slightly smaller than the width of the first opening portion 110. In this embodiment, the second circuit board 200 is a flexible printed circuit board having flexible characteristics, so that the second circuit board 200 can be bent by bending the two portions of the first opening portion 110 to form a first The bent portion 210 is on the second circuit board 200.

在圖2C所示之實施例中,第一開口部110位於第一電路板100之第一連接部150的上方,而第二開口部130位於第一電路板100之第一連接部150的下方。當第二電路板200之一端經由穿過第一開口部110以形成第一彎折部210時,第一彎折部210會容納於第一開口部110,並且使第二電路板200經由彎折動作而接觸到第一電路板100之背面(相對於表面170之另一表面)或是相互平行於第一電路板100。在本實施例中,第二電路板200具有第二彎折部230,其中第一彎折部210位於第二連接部250與第二彎折部230之間。如圖2C所示,將位於第二電路板200之第二彎折部230之後的部分穿越第二開口部130而形成第二彎折部230,並使第二電路板200之第二彎折部230之後的部分從第一電路板100之表面170穿出。In the embodiment shown in FIG. 2C , the first opening portion 110 is located above the first connecting portion 150 of the first circuit board 100 , and the second opening portion 130 is located below the first connecting portion 150 of the first circuit board 100 . . When one end of the second circuit board 200 passes through the first opening portion 110 to form the first bent portion 210, the first bent portion 210 is accommodated in the first opening portion 110, and the second circuit board 200 is bent The folding operation contacts the back surface of the first circuit board 100 (relative to the other surface of the surface 170) or is parallel to the first circuit board 100. In the embodiment, the second circuit board 200 has a second bent portion 230 , wherein the first bent portion 210 is located between the second connecting portion 250 and the second bent portion 230 . As shown in FIG. 2C, the portion located after the second bent portion 230 of the second circuit board 200 passes through the second opening portion 130 to form the second bent portion 230, and the second bent portion of the second circuit board 200 is bent. A portion subsequent to the portion 230 passes through the surface 170 of the first circuit board 100.

在圖2D所示之另一實施例中,經由使第二電路板200之一端能夠分別穿越第一電路板100之第二開口部130與第一開口部110而形成第一彎折部210與第二彎折部230。在本實施例中,第二電路板200穿過位於第一連接部150下方的第二開口部130後,位於第二電路板200之第一彎折部210之後的一端會在第一連接部150的上方。In another embodiment shown in FIG. 2D, the first bent portion 210 is formed by enabling one end of the second circuit board 200 to pass through the second opening portion 130 of the first circuit board 100 and the first opening portion 110, respectively. The second bent portion 230. In this embodiment, after the second circuit board 200 passes through the second opening portion 130 located under the first connecting portion 150, the end located behind the first bent portion 210 of the second circuit board 200 is at the first connecting portion. Above the 150.

在圖3A所示之另一實施例中,第一電路板100之第一開口部110為封閉式開口;第二開口部130為開放式開口,其中該開放式開口是指在第一電路板100上形成開口孔洞,此開口孔洞為第一電路板100之邊緣向內延伸而形成之缺口,使開口孔洞之邊緣呈現開放狀態,而非封閉區線之狀態。在本實施例中,第二開口部130為從第一電路板100之底邊向內延伸的開放式開口。當第二開口部130為開放式開口時,在第二電路板200穿過第一開口部110後,第二電路板200之一端可以經由第一電路板100下方繞進第二開口部130之開放式開口空間,將第二電路板200之部分可以容納於第二開口部130之開放式開口空間,不需特意進行穿越孔洞之動作,藉以增加組裝效率。在圖3B所示之另一實施例中,第一電路板100之第一開口部110為開放式開口;第二開口部130為封閉式開口。在本實施例中,第一開口部110為從第一電路板100之頂端向內延伸之開放式開口。當第一開口部110為開放式開口時,第二電路板200可從第一電路板100上方繞進第一開口部110之開放式開口空間來形成第一彎折部210,之後再將第二電路板200穿過封閉的第二開口部130,如此既可減少組裝所花費的時間,又可達到固定第二電路板200的功效。In another embodiment shown in FIG. 3A, the first opening portion 110 of the first circuit board 100 is a closed opening; the second opening portion 130 is an open opening, wherein the open opening refers to the first circuit board. An opening hole is formed in the opening hole, and the opening hole is a notch formed by the inward extension of the edge of the first circuit board 100, so that the edge of the opening hole is open, not in the state of the closed area line. In the present embodiment, the second opening portion 130 is an open opening extending inward from the bottom edge of the first circuit board 100. When the second opening portion 130 is an open opening, after the second circuit board 200 passes through the first opening portion 110, one end of the second circuit board 200 can be wound into the second opening portion 130 via the lower portion of the first circuit board 100. The open-type open space allows a portion of the second circuit board 200 to be accommodated in the open-ended opening space of the second opening portion 130 without intentional movement through the holes, thereby increasing assembly efficiency. In another embodiment shown in FIG. 3B, the first opening portion 110 of the first circuit board 100 is an open opening; the second opening portion 130 is a closed opening. In the present embodiment, the first opening portion 110 is an open opening extending inward from the top end of the first circuit board 100. When the first opening portion 110 is an open opening, the second circuit board 200 can be wound from the first circuit board 100 into the open opening space of the first opening portion 110 to form the first bending portion 210, and then the first opening portion 210 The two circuit boards 200 pass through the closed second opening portion 130, which can reduce the time taken for assembly and achieve the effect of fixing the second circuit board 200.

在圖4A所示的另一實施例中,第一電路板100之第一開口部110為封閉式開口;第二開口部130為開放式開口。在本實施例中,第二開口部130為從第一電路板100之底邊與相鄰之側邊向內延伸之開放式開口。當第二開口部130為開放式開口時,第二電路板200之一端可以經由第二開口部130之側邊或底邊繞進開放式開口之空間,使第二電路板200之部份能夠容納於第二開口部130之空間,減少特意進行穿過封閉式開口之組裝時間。同時,由於第二開口部130為從第一電路板100之底邊與相鄰側邊向內延伸之開口,因此第二電路板200之一端可以不受第二開口部130寬度影響而局限第二電路板200只能容置在特定寬度內的開口,增加在後續第二電路板200與外部電路相互連接位置的可調度與方便性。如圖4B所示的另一實施例中,第一電路板100之第一開口部110為開放式開口;第二開口部130為封閉式開口。在本實施例中,第一開口部110為從第一電路板100之頂端與相鄰之側邊向內延伸之開放式開口。當第一開口部110為開放式開口時,第二電路板200之一端可以經由第一開口部110之側邊或是頂邊繞進開放式開口之空間,使第一彎折部210能夠容納於第一開口部110之空間,藉以減少組裝時間來增加效率。In another embodiment shown in FIG. 4A, the first opening portion 110 of the first circuit board 100 is a closed opening; the second opening portion 130 is an open opening. In the present embodiment, the second opening portion 130 is an open opening extending inward from the bottom edge of the first circuit board 100 and the adjacent side edges. When the second opening portion 130 is an open opening, one end of the second circuit board 200 can be wound into the space of the open opening via the side or the bottom side of the second opening portion 130, so that part of the second circuit board 200 can be The space accommodated in the second opening portion 130 reduces the assembly time that is intentionally made to pass through the closed opening. Meanwhile, since the second opening portion 130 is an opening extending inward from the bottom edge of the first circuit board 100 and the adjacent side edges, one end of the second circuit board 200 may be limited by the width of the second opening portion 130. The two circuit boards 200 can only accommodate openings within a certain width, increasing the schedulability and convenience of the subsequent connection position of the second circuit board 200 to the external circuit. In another embodiment, as shown in FIG. 4B, the first opening portion 110 of the first circuit board 100 is an open opening; the second opening portion 130 is a closed opening. In the present embodiment, the first opening portion 110 is an open opening extending inward from the top end of the first circuit board 100 and the adjacent side edges. When the first opening portion 110 is an open opening, one end of the second circuit board 200 can be wound into the space of the open opening via the side or the top edge of the first opening portion 110, so that the first bending portion 210 can accommodate In the space of the first opening portion 110, the assembly time is reduced to increase the efficiency.

圖5所示為本發明發光模組裝置之組裝方法實施例流程圖。步驟510係提供具有第一連接部、第一開口部與第二開口部的第一電路板,其中第一連接部位於第一電路板之表面。在本實施例中,第一電路板100為一硬質印刷電路板,而第一電路板100之第一連接部150為一具有導電特性的材質,以作為電性連接所使用,常見的材質為銅、鋁,並且第一連接部150設置於第一電路板100之表面170。此步驟可利用開孔槽技術在第一電路板100上分別形成貫穿第一電路板100之第一開口部110與第二開口部130。步驟530係提供具有第二連接部的第二電路板。在本實施例中,第二電路板200為一軟質印刷電路板,例如可撓性印刷電路板,第二連接部250具有導電特性之材質,常見的材質為銅、鋁。FIG. 5 is a flow chart showing an embodiment of an assembly method of a light-emitting module device according to the present invention. Step 510 provides a first circuit board having a first connection portion, a first opening portion, and a second opening portion, wherein the first connection portion is located on a surface of the first circuit board. In this embodiment, the first circuit board 100 is a rigid printed circuit board, and the first connecting portion 150 of the first circuit board 100 is made of a conductive material for use as an electrical connection. A common material is Copper, aluminum, and the first connection portion 150 is disposed on the surface 170 of the first circuit board 100. In this step, the first opening portion 110 and the second opening portion 130 penetrating the first circuit board 100 are respectively formed on the first circuit board 100 by using the hole slot technology. Step 530 provides a second circuit board having a second connection. In this embodiment, the second circuit board 200 is a flexible printed circuit board, such as a flexible printed circuit board, and the second connecting portion 250 has a conductive property. The common material is copper or aluminum.

在圖5所示之實施例,步驟550係設置發光源於第一電路板之表面,並且電性連接於第一連接部。此步驟說明將發光源300設置於第一電路板100之表面170,以使發光源300與第一連接部150電性連接。因此,外部電路可以藉由第一電路板100之第一連接部150來控制發光源300的點亮機制。步驟570係電性連接第二電路板之第二連接部與第一電路板之第一連接部,此步驟可利用熱壓、焊料接合或是焊接技術將第一連接部150與第二連接部250連接而達到電性連接之效果,使外部電路藉此電性連接而控制位於第一電路板100之發光源300的點亮機制。In the embodiment shown in FIG. 5, step 550 is to provide illumination from the surface of the first circuit board and electrically connected to the first connection portion. This step illustrates that the illumination source 300 is disposed on the surface 170 of the first circuit board 100 to electrically connect the illumination source 300 with the first connection portion 150. Therefore, the external circuit can control the lighting mechanism of the illumination source 300 by the first connection portion 150 of the first circuit board 100. Step 570 is electrically connected to the second connecting portion of the second circuit board and the first connecting portion of the first circuit board. This step may use the hot pressing, solder bonding or soldering technology to connect the first connecting portion 150 and the second connecting portion. 250 is connected to achieve the effect of electrical connection, so that the external circuit is electrically connected to control the lighting mechanism of the illumination source 300 located on the first circuit board 100.

圖5所示之實施例中,步驟580係將連接第一電路板後的第二電路板之一端穿過第一電路板之第一開口部,並且彎折第二電路板以形成第一彎折部,其中第一彎折部容納於第一開口部。在此步驟將連接第一電路板100後的第二電路板200之一端穿過第一電路板100之第一開口部110,並且進行彎折動作以形成第一彎折部210,使第一彎折部210之後的第二電路板200接觸第一電路板100之背面,此背面係相對於發光源300所在的表面170。In the embodiment shown in FIG. 5, step 580 is to pass one end of the second circuit board connected to the first circuit board through the first opening of the first circuit board, and bend the second circuit board to form the first bend. a folded portion, wherein the first bent portion is received in the first opening portion. In this step, one end of the second circuit board 200 connected to the first circuit board 100 is passed through the first opening portion 110 of the first circuit board 100, and a bending action is performed to form the first bending portion 210, so that the first The second circuit board 200 after the bent portion 210 contacts the back surface of the first circuit board 100, which is opposite to the surface 170 where the light source 300 is located.

步驟590係將穿過第一開口部後的第二電路板之一端穿過第一電路板之第二開口部,並且彎折第二電路板以形成第二彎折部,其中第一彎折部位於第二連接部與第二彎折部之間,並且第二彎折部容納於第一電路板之第二開口部。此步驟說明將具有可撓特性之第二電路板200之一端穿過第一電路板100之第二開口部130,以使後續的第二電路板200由發光源300所在的表面170穿出。因此,藉由操作步驟580與步驟590使第二電路板200穿過第一電路板100之第一開口部110與第二開口部130來完成相互固定的組裝動作,減少在後續組裝過程所造成第二電路板200之損害,進而增加發光源300點亮的可靠度。Step 590: passing one end of the second circuit board passing through the first opening portion through the second opening portion of the first circuit board, and bending the second circuit board to form a second bending portion, wherein the first bending portion The portion is located between the second connecting portion and the second bent portion, and the second bent portion is received in the second opening portion of the first circuit board. This step illustrates passing one end of the second circuit board 200 having the flexible characteristics through the second opening portion 130 of the first circuit board 100 such that the subsequent second circuit board 200 is passed through the surface 170 where the illumination source 300 is located. Therefore, the second circuit board 200 is passed through the first opening portion 110 and the second opening portion 130 of the first circuit board 100 by the operation steps 580 and 590 to complete the mutually fixed assembly operation, thereby reducing the subsequent assembly process. The damage of the second circuit board 200, in turn, increases the reliability of illumination of the illumination source 300.

本發明已由上述相關實施例加以描述,然而上述實施例僅為實施本發明之範例。必需指出的是,已揭露之實施例並未限制本發明之範圍。相反地,包含於申請專利範圍之精神及範圍之修改及均等設置均包含於本發明之範圍內。The present invention has been described by the above-described related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, modifications and equivalents of the spirit and scope of the invention are included in the scope of the invention.

10...第一電路板10. . . First board

20...第二電路板20. . . Second circuit board

30...發光源30. . . Light source

40...底框40. . . Bottom frame

50...膠帶50. . . tape

60...發光模組60. . . Light module

70...燈罩70. . . lampshade

80...光學膜片80. . . Optical diaphragm

100...第一電路板100. . . First board

110...第一開口部110. . . First opening

130...第二開口部130. . . Second opening

150...第一連接部150. . . First connection

170...表面170. . . surface

200...第二電路板200. . . Second circuit board

210...第一彎折部210. . . First bend

230...第二彎折部230. . . Second bend

250...第二連接部250. . . Second connection

300...發光源300. . . Light source

圖1A為習之背光模組之示意圖;1A is a schematic view of a conventional backlight module;

圖1B為習之發光模組之示意圖;1B is a schematic view of a conventional light emitting module;

圖1C為習之發光模組組裝裝置之示意圖;1C is a schematic view of a light-emitting module assembly device of the prior art;

圖2A為本發明之發光模組之第一電路板的實施例示意圖;2A is a schematic view showing an embodiment of a first circuit board of a light emitting module of the present invention;

圖2B為本發明之發光模組的實施例示意圖;2B is a schematic view of an embodiment of a light emitting module of the present invention;

圖2C為本發明之發光模組的實施例之側視圖;2C is a side view of an embodiment of a light emitting module of the present invention;

圖2D為本發明之發光模組的另一實施例之側視圖;2D is a side view of another embodiment of the light emitting module of the present invention;

圖3A為本發明之發光模組之第一電路板的另一實施例示意圖;3A is a schematic view showing another embodiment of a first circuit board of a light emitting module of the present invention;

圖3B為本發明之發光模組之第一電路板的另一實施例示意圖;3B is a schematic view showing another embodiment of a first circuit board of the light emitting module of the present invention;

圖4A為本發明之發光模組之第一電路板的另一實施例示意圖;4A is a schematic view showing another embodiment of a first circuit board of a light emitting module of the present invention;

圖4B為本發明之發光模組之第一電路板的另一實施例示意圖;及4B is a schematic diagram of another embodiment of a first circuit board of the light emitting module of the present invention; and

圖5為本發明之發光模組組裝方法之實施例流程圖。FIG. 5 is a flow chart of an embodiment of a method for assembling a light emitting module according to the present invention.

100...第一電路板100. . . First board

110...第一開口部110. . . First opening

130...第二開口部130. . . Second opening

150...第一連接部150. . . First connection

170...表面170. . . surface

200...第二電路板200. . . Second circuit board

210...第一彎折部210. . . First bend

230...第二彎折部230. . . Second bend

250...第二連接部250. . . Second connection

Claims (15)

一種複合式電路板裝置,包含:一第一電路板,包含一第一開口部、一第二開口部以及一第一連接部,其中該第一開口部與該第二開口部分別貫穿該第一電路板,該第一連接部設置於該第一電路板之一表面;以及一第二電路板,具有一第一彎折部及一第二連接部,其中該第二電路板穿過該第一電路板之該第一開口部與該第二開口部,而該第一彎折部容納於該第一開口部,該第一電路板之該第一連接部位於該第一開口部與第二開口部之間,並且該第二連接部電連接於該第一電路板之該第一連接部。 A composite circuit board device includes: a first circuit board including a first opening portion, a second opening portion, and a first connecting portion, wherein the first opening portion and the second opening portion respectively penetrate the first opening portion a circuit board, the first connecting portion is disposed on a surface of the first circuit board; and a second circuit board having a first bent portion and a second connecting portion, wherein the second circuit board passes through the The first opening portion of the first circuit board and the second opening portion are received by the first opening portion, and the first connecting portion of the first circuit board is located at the first opening portion The second opening is electrically connected to the first connecting portion of the first circuit board. 如請求項第1項所述之複合式電路板裝置,其中該第一開口部與該第二開口部皆為為封閉式開口。 The composite circuit board device of claim 1, wherein the first opening portion and the second opening portion are closed openings. 如請求項第1項所述之複合式電路板裝置,其中該第一開口部為一封閉式開口;該第二開口部為一開放式開口。 The composite circuit board device of claim 1, wherein the first opening is a closed opening; the second opening is an open opening. 如請求項第1項所述之複合式電路板裝置,其中該第一開口部為一開放式開口;該第二開口部為一封閉式開口。 The composite circuit board device of claim 1, wherein the first opening is an open opening; the second opening is a closed opening. 如請求項第1項所述之複合式電路板裝置,其中該第二電路板進一步包含一第二彎折部,容納於該第二開口部,並且該第一彎折部位於該第二連接部與該第二彎折部中間。 The composite circuit board device of claim 1, wherein the second circuit board further comprises a second bent portion received in the second opening portion, and the first bent portion is located in the second connection The portion is intermediate the second bent portion. 一種發光模組,包含:一第一電路板,包含一第一開口部、一第二開口部及一第一連接部,其中該第一開口部與該第二開口部分別貫穿該第一電路板;一第二電路板,具有一第一彎折部,其中該第二電路板穿 過該第一電路板之該第一開口部與該第二開口部,並且該第一彎折部容納於該第一開口部;以及一發光源,設置於該第一電路板;其中,該第一電路之該第一連接部位於該第一開口部與該第二開口部之間,該第一連接部與該發光源分別設置於該電路板之一表面,並且該發光源與該第一連接部電性連接。 A light-emitting module includes: a first circuit board, a first opening portion, a second opening portion, and a first connecting portion, wherein the first opening portion and the second opening portion respectively penetrate the first circuit a second circuit board having a first bent portion, wherein the second circuit board is worn The first opening portion and the second opening portion of the first circuit board, and the first bending portion is received in the first opening portion; and a light source is disposed on the first circuit board; wherein The first connecting portion of the first circuit is located between the first opening portion and the second opening portion, the first connecting portion and the light source are respectively disposed on a surface of the circuit board, and the light source and the first A connecting portion is electrically connected. 如請求項第6項所述之發光模組,其中該第一開口部與該第二開口部皆為為封閉式開口。 The light-emitting module of claim 6, wherein the first opening portion and the second opening portion are closed openings. 如請求項第6項所述之發光模組,其中該第一開口部為一封閉式開口;該第二開口部為一開放式開口。 The illuminating module of claim 6, wherein the first opening is a closed opening; the second opening is an open opening. 如請求項第6項所述之發光模組,其中該第一開口部為一開放式開口;該第二開口部為一封閉式開口。 The illuminating module of claim 6, wherein the first opening is an open opening; the second opening is a closed opening. 如請求項第6項所述之發光模組,其中該第二電路板進一步包含一第二連接部,其中該第二連接部電連接於該第一電路板之該第一連接部。 The illuminating module of claim 6, wherein the second circuit board further comprises a second connecting portion, wherein the second connecting portion is electrically connected to the first connecting portion of the first circuit board. 如請求項第10項所述之發光模組,其中該第二電路板進一步包含一第二彎折部,並且該第一彎折部位於該第二連接部與該第二彎折部中間。 The illuminating module of claim 10, wherein the second circuit board further comprises a second bent portion, and the first bent portion is located between the second connecting portion and the second bent portion. 一種發光模組組裝方法,包含下列步驟:提供一第一電路板,其具有一第一連接部、一第一開口部與一第二開口部,其中該第一連接部位於該第一電路板之一表面,該第一電路板之該第一連接部位於該第一開口部與該第二開口部之間;提供一第二電路板,其具有一第二連接部; 設置一發光源於該第一電路板之該表面,並且電性連接於該第一連接部;電性連接該第二電路板之該第二連接部與該第一電路板之該第一連接部;將連接該第一電路板之該第二電路板之一端穿過該第一電路板之該第一開口部,並且彎折該第二電路板以形成一第一彎折部,其中該第一彎折部容納於該第一開口部;以及將穿過該第一開口部後之該第二電路板之該端穿過該第一電路板之該第二開口部,並且彎折該第二電路板以形成一第二彎折部,其中該第二彎折部容納於該第二開口部,並且該第一彎折部位於該第二連接部與該第二彎折部之間。 A method for assembling a light emitting module, comprising the steps of: providing a first circuit board having a first connecting portion, a first opening portion and a second opening portion, wherein the first connecting portion is located on the first circuit board a first surface of the first circuit board between the first opening portion and the second opening portion; a second circuit board having a second connecting portion; Providing a light source from the surface of the first circuit board and electrically connected to the first connecting portion; electrically connecting the second connecting portion of the second circuit board to the first connection of the first circuit board Passing one end of the second circuit board connected to the first circuit board through the first opening portion of the first circuit board, and bending the second circuit board to form a first bending portion, wherein the The first bent portion is received in the first opening portion; and the end of the second circuit board passing through the first opening portion is passed through the second opening portion of the first circuit board, and the a second circuit board to form a second bent portion, wherein the second bent portion is received in the second opening portion, and the first bent portion is located between the second connecting portion and the second bent portion . 如請求項第12項所述之發光模組組裝方法,其中該第一開口部與該第二開口部皆為封閉式開口。 The method of assembling a light-emitting module according to claim 12, wherein the first opening portion and the second opening portion are closed openings. 如請求項第12項所述之發光模組組裝方法,其中該第一開口部為一封閉式開口,該第二開口部為一開放式開口。 The method of assembling a light-emitting module according to claim 12, wherein the first opening is a closed opening, and the second opening is an open opening. 如請求項第12項所述之發光模組組裝方法,其中該第一開口部為一開放式開口,該第二開口部為一封閉式開口。 The method of assembling a light-emitting module according to claim 12, wherein the first opening is an open opening, and the second opening is a closed opening.
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