TWI396303B - Fabrication methods for fluorescent powders on substrate and white light led devices - Google Patents
Fabrication methods for fluorescent powders on substrate and white light led devices Download PDFInfo
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Description
本發明係有關於一種具螢光粉基板的製造方法,特別有關於一種應用於白光發光元件的螢光粉陶瓷玻璃基板的製造方法。The present invention relates to a method for producing a phosphor powder substrate, and more particularly to a method for producing a phosphor powder ceramic glass substrate applied to a white light emitting device.
傳統固態半導體白光光源主要有以下三種方式,第一種白光光源是以紅、藍、綠三色發光二極體晶粒組成白光發光模組,其具有高發光效率、高演色性優點,但同時也因不同的顏色晶粒,需配合不同的磊晶材料,連帶使得電壓特性也隨之不同。因此,導致製造成本偏高,控制線路設計複雜,且混光調整不易。The conventional solid-state semiconductor white light source mainly has the following three methods. The first white light source is a white light-emitting module composed of red, blue and green light-emitting diode crystal grains, which has the advantages of high luminous efficiency and high color rendering, but at the same time Also due to different color crystal grains, it is necessary to match different epitaxial materials, and the voltage characteristics are also different. Therefore, the manufacturing cost is high, the control circuit design is complicated, and the light mixing adjustment is not easy.
第二種白光光源是以藍光發光二極體,並激發黃色釔鋁石榴石(YAG)螢光粉產生白光。此種方式為目前市場主流趨勢,在藍光發光二極體晶片的外圍,填充混有黃光YAG螢光粉的光學膠,此藍光發光二極體晶片所發出藍光之波長約為400~530nm,利用藍光發光二極體晶片所發出的光線激發黃光螢光粉產生黃色光。但同時也會有部份的藍色光發射出來,此部份藍色光配合上螢光粉所發出的黃色光,即形成藍黃混合之二波長的白光。然而,此種利用藍光發光二極體晶片與黃光螢光粉組合而成之白光發光二極體,有下列數種缺點:第一、由於藍光佔發光光譜之大部分,因此會有色溫偏高與點膠所造成發光不均勻的現象。第二、因藍光發光二極體發光波長會隨溫度提升而改 變,進而造成白光源顏色控制不易,甚至導致散熱不易的問題。第三、因發光紅色光譜較弱,造成演色性較差的現象。The second white light source is a blue light emitting diode that excites yellow yttrium aluminum garnet (YAG) phosphor to produce white light. This method is the mainstream trend in the current market. On the periphery of the blue light-emitting diode chip, an optical glue mixed with yellow YAG phosphor powder is filled, and the blue light emitted by the blue light-emitting diode chip has a wavelength of about 400 to 530 nm. The yellow light is generated by the light emitted by the blue light emitting diode chip to generate yellow light. At the same time, part of the blue light is emitted. This part of the blue light is combined with the yellow light emitted by the phosphor powder, which forms a white light of two wavelengths mixed with blue and yellow. However, such a white light-emitting diode combined with a blue light-emitting diode chip and a yellow light-emitting phosphor has the following disadvantages: First, since blue light accounts for most of the light-emitting spectrum, color temperature is high and The phenomenon of uneven illumination caused by dispensing. Second, the wavelength of the blue light emitting diode will change with the temperature increase. The change causes the color control of the white light source to be difficult, and even causes the problem of heat dissipation to be difficult. Third, due to the weak red spectrum of the luminescence, the color rendering is poor.
第三種白光光源是以紫外光發光二極體激發透明光學膠中含均勻混有一定比例之藍色、綠色、紅色螢光粉,激發後可得到三波長之白光。此三波長白光發光二極體具有高演色性之優點,但卻有發光效率不足、透明光學膠易老化的缺點。The third type of white light source is a blue, green, and red phosphor powder uniformly mixed with a certain proportion of the transparent optical glue excited by the ultraviolet light emitting diode, and three wavelengths of white light can be obtained after excitation. The three-wavelength white light emitting diode has the advantages of high color rendering, but has the disadvantages of insufficient luminous efficiency and easy aging of the transparent optical adhesive.
再者,針對白光LED封裝技術方面,在發展高功率以及大面積LED照明模組時,其散熱問題將嚴重影響到元件壽命之外,現行LED封裝上常用的點膠、封灌、模壓工藝方式,因所採用的環氧樹脂易在使用過程中變稠,導致較難控制氣泡、缺料、黑點以及螢光膠中螢光粉沉澱等缺陷,進而使得發光均勻度無法保持一致,且易造成產品的發光色差。Furthermore, in terms of white LED packaging technology, when developing high-power and large-area LED lighting modules, the heat dissipation problem will seriously affect the component life. The commonly used dispensing, sealing and molding processes on current LED packages Because the epoxy resin used is easy to thicken during use, it is difficult to control defects such as bubbles, lack of materials, black spots, and phosphor powder precipitation in the fluorescent glue, so that the uniformity of illumination cannot be consistent, and easy Causes the chromatic aberration of the product.
本發明實施例提出一種藉由結合陶瓷玻璃熔劑與螢光粉材料,並可施用於玻璃、陶瓷基板上,進而製得一種應用於白光LED光源發光組件的製造方法。The embodiment of the invention provides a method for manufacturing a light-emitting component for a white LED light source by combining a ceramic glass flux and a phosphor powder material, and applying the same to a glass or ceramic substrate.
本發明之實施例提供一種具螢光粉的基板的製造方法,包括:提供一螢光粉和一助熔劑,並使其均勻混合;覆燒混合後的該螢光粉和該助熔劑使其成為半熔狀的一玻璃體;將該玻璃體研磨成一螢光玻璃粉體,並塗佈該螢光玻璃粉體於一基板上;以及加熱該螢光玻璃粉體使其成一 螢光膜於該基板上。An embodiment of the present invention provides a method for manufacturing a substrate with phosphor powder, comprising: providing a phosphor powder and a flux, and uniformly mixing the same; and coating the mixed phosphor powder and the flux to become a semi-molten one glass body; the glass body is ground into a fluorescent glass powder, and the fluorescent glass powder is coated on a substrate; and the fluorescent glass powder is heated to form a glass body A fluorescent film is on the substrate.
本發明之實施例另提供一種白光LED光源元件的製造方法,包括:提供一螢光粉和一助熔劑,並使其均勻混合;覆燒混合後的該螢光粉和該助熔劑使其成為半熔狀的一玻璃體;將該玻璃體研磨成一螢光玻璃粉體,並塗佈該螢光玻璃粉體於一基板上;加熱該螢光玻璃粉體使其成一螢光膜於該基板上;切割具螢光膜的該基板成預定尺寸並與一LED晶片組合。The embodiment of the invention further provides a method for manufacturing a white LED light source component, comprising: providing a phosphor powder and a flux, and uniformly mixing the same; and coating the mixed phosphor powder and the flux to make it a half a molten glass body; the glass body is ground into a fluorescent glass powder, and the fluorescent glass powder is coated on a substrate; the fluorescent glass powder is heated to form a fluorescent film on the substrate; cutting The substrate having a fluorescent film is of a predetermined size and combined with an LED wafer.
為使本發明能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下:In order to make the invention more apparent, the following detailed description of the embodiments and the accompanying drawings are as follows:
以下以各實施例詳細說明並伴隨著圖式說明之範例,做為本發明之參考依據。在圖式或說明書描述中,相似或相同之部分皆使用相同之圖號。且在圖式中,實施例之形狀或是厚度可擴大,並以簡化或是方便標示。再者,圖式中各元件之部分將以分別描述說明之,值得注意的是,圖中未繪示或描述之元件,為所屬技術領域中具有通常知識者所知的形式,另外,特定之實施例僅為揭示本發明使用之特定方式,其並非用以限定本發明。The following is a detailed description of the embodiments and examples accompanying the drawings, which are the basis of the present invention. In the drawings or the description of the specification, the same drawing numbers are used for similar or identical parts. In the drawings, the shape or thickness of the embodiment may be expanded and simplified or conveniently indicated. In addition, the components of the drawings will be described separately, and it is noted that the components not shown or described in the drawings are known to those of ordinary skill in the art, and in particular, The examples are merely illustrative of specific ways of using the invention and are not intended to limit the invention.
本發明之一實施例提供一種可製得白光LED光源螢光粉陶瓷基板元件之製造方法。更明確地說,利用陶瓷玻璃熔劑搭配上各種螢光粉燒製在玻璃或陶瓷基板上,以製作 成為高功率白光LED發光組件。One embodiment of the present invention provides a method of fabricating a white light LED light source phosphor powder ceramic substrate component. More specifically, using ceramic glass flux with various phosphor powders on glass or ceramic substrates to make Become a high-power white LED lighting component.
第1圖係顯示根據本發明之一實施例的製造白光LED光源元件的流程示意圖。請參閱第1圖,首先分別提供一螢光粉(步驟S10b)和一助熔劑(步驟S10b),並使其一定比例均勻混合。接著,覆燒混合後的該螢光粉和該助熔劑(步驟S20),並使其淬冷,使其成為半熔狀的一玻璃體(步驟S30)。將該玻璃體研磨成一螢光玻璃粉體(步驟S40),並塗佈該螢光玻璃粉體於一基板上(步驟S50)。加熱該螢光玻璃粉體使其成一螢光膜於該基板上(步驟S60)。裁切具螢光膜的該基板成預定尺寸並與一藍光LED晶片封裝組合成一白光LED光源元件(步驟S70)。1 is a flow chart showing the manufacture of a white LED light source element in accordance with an embodiment of the present invention. Referring to Fig. 1, first, a phosphor (step S10b) and a flux (step S10b) are separately provided and uniformly mixed in a certain ratio. Next, the mixed phosphor powder and the flux are baked (step S20), and quenched to form a semi-molten one glass body (step S30). The glass body is ground into a phosphorescent glass powder (step S40), and the phosphor glass powder is applied onto a substrate (step S50). The phosphor glass powder is heated to form a fluorescent film on the substrate (step S60). The substrate having the fluorescent film is cut into a predetermined size and combined with a blue LED chip package to form a white LED light source element (step S70).
本發明之一實施例提供一種具螢光粉陶瓷基板的製造方法,該螢光粉陶瓷基板可做為白光LED光源元件之光學轉換器。根據本發明之一實施例,利用陶瓷玻璃熔劑配合螢光粉材料,經過適當比例混合之後,將混合物進行熱處理成為均一之熔融狀態玻璃物、此熔融狀物質經水淬後,成為一種均一狀態玻璃,將此玻璃經過研磨、烘乾、粉碎、過篩程序後,即得螢光玻璃顏料。An embodiment of the present invention provides a method for fabricating a phosphor powder ceramic substrate, which can be used as an optical converter for a white LED light source component. According to an embodiment of the present invention, the ceramic frit is mixed with the phosphor material, and after being mixed in an appropriate ratio, the mixture is heat-treated into a uniform molten glass, and the molten material is water quenched to become a uniform state glass. After the glass is ground, dried, pulverized, and sieved, a fluorescent glass pigment is obtained.
將此螢光玻璃顏料塗佈於一基板上,例如以塗佈法、網印法、轉印法、噴墨法形成於陶瓷或玻璃基板上,以達成一均勻的螢光塗佈層,經過加熱處理讓塗佈層與基板能夠充分結合,可得到所欲之螢光粉陶瓷基板,將此基板按白光LED封裝所需尺寸需求進行裁切之後,並組裝,即可應用於白光LED光源封裝時之發光組件。The fluorescent glass pigment is coated on a substrate, for example, by a coating method, a screen printing method, a transfer method, or an inkjet method, on a ceramic or glass substrate to achieve a uniform fluorescent coating layer. The heat treatment allows the coating layer and the substrate to be sufficiently combined to obtain a desired phosphor powder ceramic substrate, and the substrate is cut according to the required size requirements of the white LED package, and assembled, and can be applied to the white LED light source package. Time lighting component.
根據本發明之一實施例,所述的陶瓷玻璃熔劑,其主要特徵在於無鉛無鎘,並且與螢光粉在熱處理時不發生反應之組成配方,組成範圍(氧化物重量百分比)例如為SiO2 :30~65%;Al2 O3 :0.1~12%;K2 O+Na2 O:4~10%;ZnO:0.1~30%;B2 O3 :6~20%;ZrO2 :0.1~7%;Li2 O:3~11%;La2 O3 :0.1~5%;BaO:0.1~5%;CaO:0.1~8%;TiO2 :0.1~5%,依實際配方組成將原料進行配料混合、熔解、淬冷、研磨、過篩、乾燥、粉碎等工序之後即可得到陶瓷玻璃熔劑粉體。According to an embodiment of the present invention, the ceramic frit flux is mainly characterized by lead-free and cadmium-free, and a composition formula which does not react with the phosphor powder during heat treatment, and the composition range (weight percentage of oxide) is, for example, SiO 2 . : 30~65%; Al 2 O 3 : 0.1~12%; K 2 O+Na 2 O: 4~10%; ZnO: 0.1~30%; B 2 O 3 : 6~20%; ZrO 2 : 0.1 ~7%; Li 2 O: 3~11%; La 2 O 3 : 0.1~5%; BaO: 0.1~5%; CaO: 0.1~8%; TiO 2 : 0.1~5%, according to the actual formula The ceramic glass flux powder can be obtained after the raw materials are mixed, melted, quenched, ground, sieved, dried, pulverized, and the like.
再者,所述的螢光粉材料為在波長範圍254~500nm可發生吸收及放射波譜之螢光材料,其至少包括黃色釔鋁石榴石(Yttrium Aluminum Garnet,簡稱YAG),黃色鋱鋁石榴石(Terbium Aluminum Garnet,簡稱TAG),黃色矽酸鹽(Silicate),例如具Sr2 SiO4 或Sr3 SiO5 晶相之組合物,硫化物(Sulfate),氮化物(Nitrate),或上述材料之任意組合。更明確地說,在紫外光(UV)或紫光、藍光範圍可被激發進而放出螢光之螢光粉皆可應用於本發明之實施例中。並根據白光LED調光目的,進行搭配組合其使用比例之材料。Furthermore, the phosphor material is a fluorescent material which can absorb and emit radiation in a wavelength range of 254 to 500 nm, and includes at least yellow yttrium aluminum garnet (YAG) and yellow yttrium aluminum garnet. (Terbium Aluminum Garnet, TAG for short), yellow silicate (Silicate), for example, a composition having a crystalline phase of Sr 2 SiO 4 or Sr 3 SiO 5 , a sulfide (Sulfate), a nitride (Nitrate), or the like random combination. More specifically, phosphors which can be excited in the ultraviolet (UV) or violet, blue, and fluorescent light can be applied to embodiments of the present invention. According to the purpose of white light LED dimming, the materials used in combination with the proportion of use are combined.
根據本發明另一實施例,所述的陶瓷玻璃熔劑粉體與螢光粉經適當比例調配後進行混合,不限於採取何種混合方式,過程之中應避免任何形式鐵的汙染。完成混合後的混合物置入耐火匣缽之中,視玻璃陶瓷色料的組成條件,例如在700℃~1000℃的溫度範圍進行熱處理。熱處理時間為4~10分鐘,經過熱處理後,混合物變成半熔融狀態均質之玻璃相,此時急速投入冷水之中進行淬冷。According to another embodiment of the present invention, the ceramic glass frit powder and the phosphor powder are mixed after being appropriately proportioned, and are not limited to the mixing mode, and any form of iron contamination should be avoided in the process. The mixture after completion of the mixing is placed in a refractory crucible, and heat treatment is performed depending on the composition conditions of the glass ceramic colorant, for example, at a temperature ranging from 700 ° C to 1000 ° C. The heat treatment time is 4 to 10 minutes. After the heat treatment, the mixture becomes a semi-molten homogeneous glass phase, and at this time, it is rapidly poured into cold water for quenching.
接著,經去除水分後,以濕法球磨方式將淬冷後的固態材料研磨至細度可通過400目標準篩網之粒度大小的粉末,經烘乾粉碎後,即得所欲之螢光玻璃顏料。Then, after removing the water, the quenched solid material is ground by a wet ball milling method to a fineness of a 400-mesh standard sieve, and after drying and pulverizing, the desired fluorescent glass is obtained. pigment.
上述之螢光顏料利用塗佈、網印、轉印、噴墨等方式,形成在Al2 O3 、AlN或玻璃、藍寶石基板上,構成一均勻的螢光塗佈層,並將塗上塗佈層之整塊基板置入電爐中,其溫度視陶瓷玻璃熔劑之組成所測出之軟化點溫度而定,例如在550℃~1000℃的溫度範圍進行加熱燒成。The above-mentioned fluorescent pigment is formed on Al 2 O 3 , AlN or a glass or sapphire substrate by coating, screen printing, transfer, inkjet or the like to form a uniform fluorescent coating layer, and is coated. The entire substrate of the cloth layer is placed in an electric furnace, and the temperature thereof is determined by the softening point temperature measured by the composition of the ceramic glass flux, for example, by heating at a temperature ranging from 550 ° C to 1000 ° C.
上述燒成完成之螢光粉陶瓷基板,按白光LED封裝所需尺寸需求進行裁切並封裝後,即可應用於白光LED光源封裝時之發光組件。The fired ceramic substrate after the firing is cut and packaged according to the required size requirements of the white LED package, and then can be applied to the light-emitting component of the white LED light source package.
第2圖係顯示本發明實施例之白光LED光源封裝體的剖面示意圖。如先前所述,將具螢光膜120的基板100成所欲的尺寸,並與一藍光LED晶片200封裝組合成一白光LED光源元件。由藍光LED晶片200所發的藍光BL,經具螢光膜120的基板100轉化成白光WL。以下列舉兩個具體實施例,說明本發明之白光LED光源封裝體的製造方法。2 is a cross-sectional view showing a white LED light source package according to an embodiment of the present invention. As previously described, the substrate 100 with the phosphor film 120 is sized and combined with a blue LED chip 200 package to form a white LED source element. The blue light BL emitted from the blue LED chip 200 is converted into white light WL through the substrate 100 having the fluorescent film 120. Two specific embodiments will be exemplified below to explain a method of manufacturing the white LED light source package of the present invention.
具體實施例一Specific embodiment 1
取800℃陶瓷低溫熔劑粉末60克,其組成為SiO2 :50~65%;Al2 O3 :8~12%;Na2 O:2~5%;K2 O:2~5%;B2 O3 :6~10%;ZrO2 :4~7%;Li2 O:4~8%;La2 O3 :2~5%;BaO:2~5%,與40克的YAG螢光粉,在充份混合均勻後,置於 莫來石坩堝中於950℃進行加熱,持溫八分鐘後,將熔製成半熔融狀態之均勻混合物到入冷水之中淬冷。在淬冷後,取出此半熔融狀態混合物並將其研磨到可通過400目篩網之粒度大小,研磨完成後之漿料進行烘乾粉碎後備用。Take 60g ceramic low-temperature flux powder, the composition is SiO 2 : 50~65%; Al 2 O 3 : 8~12%; Na 2 O: 2~5%; K 2 O: 2~5%; B 2 O 3 : 6~10%; ZrO 2 : 4~7%; Li 2 O: 4~8%; La 2 O 3 : 2~5%; BaO: 2~5%, and 40g YAG fluorescence The powder, after being uniformly mixed uniformly, was placed in a mullite crucible and heated at 950 ° C. After holding the temperature for eight minutes, the mixture was melted into a semi-molten homogeneous mixture and quenched into cold water. After quenching, the semi-molten state mixture is taken out and ground to a particle size which can pass through a 400 mesh screen, and the slurry after completion of the grinding is dried and pulverized for use.
取上述完成之粉末100克,並加入60克印油(例如Hereaus,Silk Screen Oil HT-590015)進行調合,為了使分散可以均勻一致,可使用攪拌器或是三軸滾筒。混合好之油膏以51T全透墨網版印製到氧化鋁基板上,氧化鋁基板的厚度範圍例如是0.1~0.3mm。接著,將印製後的氧化鋁基板放置到高溫爐中,升溫至830℃後並持溫五分鐘後停止加熱,於室溫條件下自然冷卻。待冷卻後,取去出燒製完成具有螢光粉表面之氧化鋁基板並切割成2900μm×2900μm的大小,以銀膠貼合於集成四個1.225W藍光LED晶片的模組上(藍光波長範圍400~530nm),即可得到各別產品間相互發光亮度均勻、散熱良好之大功率白光LED光源。100 g of the above-mentioned finished powder was taken, and 60 g of ink (for example, Hereaus, Silk Screen Oil HT-590015) was added for blending. In order to make the dispersion uniform, a stirrer or a triaxial drum may be used. The mixed grease is printed on the alumina substrate in a 51T full ink screen, and the thickness of the alumina substrate is, for example, 0.1 to 0.3 mm. Next, the printed alumina substrate was placed in a high-temperature furnace, and after raising the temperature to 830 ° C and holding the temperature for five minutes, the heating was stopped, and the mixture was naturally cooled at room temperature. After cooling, the alumina substrate with the surface of the phosphor powder is removed and cut into a size of 2900 μm × 2900 μm, and silver paste is attached to the module integrating the four 1.225 W blue LED chips (blue wavelength range) 400~530nm), you can get high-power white LED light source with uniform brightness and good heat dissipation between different products.
具體實施例二Specific embodiment 2
取600℃陶瓷低溫熔劑粉末70克,其組成為SiO2 :30~40%;Al2 O3 :0.1~12%;K2 O:2~5;Na2 O:2~5%;ZnO:25~30%;B2 O3 :15~20%;ZrO2 :2~5%;Li2 O:8~11%;CaO:5~8%;TiO2 :2~5%,與30克的Silicate螢光粉(例如LWB,Fluoroscent Powder,Type:LP-F560-20),充份混合均勻後,置於莫來石坩堝中於750℃進行加熱,持溫時間 五分鐘後將熔製成半熔融狀態之均勻混合物倒入冷水之中淬冷,淬冷後取出此半熔融狀態混合物並將其研磨到可通過400目篩網之粒度大小,研磨完成後之漿料進行烘乾粉碎後備用。Take 600g ceramic low-temperature flux powder 70g, its composition is SiO 2 : 30~40%; Al 2 O 3 : 0.1~12%; K 2 O: 2~5; Na 2 O: 2~5%; ZnO: 25~30%; B 2 O 3 : 15~20%; ZrO 2 : 2~5%; Li 2 O: 8~11%; CaO: 5~8%; TiO 2 : 2~5%, with 30g Silicate fluorescent powder (such as LWB, Fluoroscent Powder, Type: LP-F560-20), fully mixed, placed in mullite, heated at 750 ° C, heated for five minutes, will be melted The homogeneous mixture in a semi-molten state is poured into cold water and quenched. After quenching, the semi-molten state mixture is taken out and ground to a particle size which can pass through a 400 mesh screen. After the grinding is completed, the slurry is dried and pulverized for use. .
取上述完成之粉末100克,並加入65克印油(例如Hereaus,Silk Screen Oil HT-590015)進行調合,為了使分散可以均勻一致,可使用攪拌器或是三軸滾筒。混合好之油膏以100T全透墨網版印製到厚度為0.2~1.0mm的玻璃基板上。印製完成後之玻璃基板將其放置到高溫爐中,升溫至610℃後恆溫五分鐘並停止加熱,於室溫條件下自然冷卻。冷卻後,取去出燒製完成具有螢光粉表面之玻璃基板並切割成1000μm×1000μm的大小,以銀膠貼合於藍光LED晶片上(藍光波長範圍400~530nm),即可得到各別產品間相互發光亮度均勻、散熱良好之白光LED光源。100 g of the above-mentioned finished powder was taken, and 65 g of ink (for example, Hereaus, Silk Screen Oil HT-590015) was added for blending. In order to make the dispersion uniform, a stirrer or a triaxial drum may be used. The mixed paste is printed on a glass substrate having a thickness of 0.2 to 1.0 mm using a 100T full ink screen. After the printing, the glass substrate was placed in a high-temperature furnace, heated to 610 ° C, and then kept at a constant temperature for five minutes, and the heating was stopped, and the mixture was naturally cooled at room temperature. After cooling, the glass substrate having the surface of the phosphor powder is fired and cut into a size of 1000 μm×1000 μm, and the silver paste is attached to the blue LED chip (blue light wavelength range 400~530 nm), and each can be obtained. A white LED light source with uniform brightness and good heat dissipation between products.
本發明雖以較佳實施例揭露如上,然其並非用以限定本發明的範圍,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can make a few changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
S10a-S70‧‧‧白光LED光源元件製造方法的步驟Steps for manufacturing S10a-S70‧‧‧ white LED light source components
100‧‧‧基板100‧‧‧Substrate
120‧‧‧螢光膜120‧‧‧Flame film
200‧‧‧藍光LED晶片200‧‧‧Blue LED chip
BL‧‧‧藍光BL‧‧‧Blue
WL‧‧‧白光WL‧‧‧White light
第1圖係顯示根據本發明之一實施例的製造白光LED光源元件的流程示意圖。1 is a flow chart showing the manufacture of a white LED light source element in accordance with an embodiment of the present invention.
第2圖係顯示本發明實施例之白光LED光源封裝體的剖面示意圖。2 is a cross-sectional view showing a white LED light source package according to an embodiment of the present invention.
S10a-S70‧‧‧白光LED光源元件製造方法的步驟Steps for manufacturing S10a-S70‧‧‧ white LED light source components
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