TWI392640B - Lid member for mems device and method for forming same - Google Patents

Description

Covering member of MEMS device and its manufacturing method

The invention relates to a package structure and a manufacturing method thereof, in particular to a covering member of a microelectromechanical device and a manufacturing method thereof.

At present, microelectromechanical devices such as microphones are widely used in mobile communication devices, audio devices, etc., and in order to prevent the microelectromechanical device from affecting the functions of other components, it is necessary to cover the microelectromechanical device with a cover member. In order to solve the above-mentioned defects, the industry is accustomed to use the metal material as the inner layer of the covering member to achieve the shielding effect; please refer to FIG. 1 , which is a cover member 1 for covering a micro electro mechanical device, which is attached to a board. A core layer 10 having at least one opening 100 is bonded to the body 11 by an adhesive layer 12, and a metal layer 13 is formed on the hole wall of the opening 100 and the plate body 11 exposed to the opening 100 to constitute the covering member 1.

However, since the inner wall of the covering member 1 is made of a metal material, the problem of conductive electromagnetic interference (EMI) or radio frequency interference (RFI) is often caused; in addition, the metal layer 13 is only used as a metal layer 13 The shielding of electromagnetic interference is not provided with other electrical functions, which will limit the development of the micro-electromechanical device toward a light, thin, short, and small form.

Therefore, how to make a good electromagnetic compatibility (EMC) between the microelectromechanical device and the covering member to achieve a shielding effect against electromagnetic interference, and to enable the metal layer of the covering member to have other uses, The problem that is currently being solved.

In view of the above-mentioned various deficiencies of the prior art, the main object of the present invention is to provide a covering member of a microelectromechanical device capable of improving the shielding effect and a method of manufacturing the same.

To achieve the above and other objects, the present invention discloses a covering member for a microelectromechanical device, comprising: a core plate having opposite first and second surfaces and having a plurality of through holes penetrating the first and second surfaces And a first plating metal layer disposed on the first and second surfaces of the core plate and the surface of the through hole; and an adhesive layer, the first plating metal disposed on the second surface of the core plate a layer having a metal layer on a surface thereof, and the metal layer is disposed on the adhesive layer to seal the one end of the opening and expose the metal layer of the plate And a second plating metal layer disposed on the first plating metal layer on the first surface of the core plate and the metal layer exposed in the opening, and the second plating metal layer located in the opening Electrically connecting the first plated metal layer on the second surface of the core plate.

The invention provides a method for manufacturing a covering member of a microelectromechanical device, comprising: providing a core plate having a first surface and a second surface; and forming a plurality of through the first and second surfaces in the core plate Forming a seed layer on the first and second surfaces of the core plate and the hole walls of the through holes; forming a first plated metal layer on the seed layer; and forming a first plating metal layer on the second surface of the core plate The first plated metal layer forms an adhesive layer; the core plate, the first plated metal layer and the adhesive layer are formed to form at least one opening; and a plate body having a metal layer is bonded to the adhesive layer to seal one end of the opening And bonding the metal layer to the adhesive layer to expose the metal layer in the opening; and forming a second plating metal layer on the exposed first plating metal layer and the metal layer in the opening The second plated metal layer in the opening is electrically connected to the first plated metal layer on the second surface of the core plate.

According to the covering member of the microelectromechanical device and the method of manufacturing the same, the core plate has an initial metal layer on the first and second surfaces.

The covering member of the MEMS device and the method for manufacturing the same, comprising a surface treatment layer disposed on the second plating metal layer, and the material forming the surface treatment layer is selected from the group consisting of electroless nickel/gold, nickel immersion One of a group consisting of ENIG, ENEPIG, Immersion Tin, and Organic Soldering Agent (OSP).

According to still another aspect of the present invention, a plate body and a second plated metal layer extending through the opening are formed to form a sound hole.

It can be seen that the covering member of the MEMS device of the present invention and the method for manufacturing the same are formed by forming a plurality of through holes and forming at least one through opening to form a large opening in the thin substrate, and the exposed first plating metal A second electroplated metal layer is formed on the metal layer in the layer and the opening to provide good electromagnetic matching (EMC) between the microelectromechanical device and the covering member to achieve a shielding effect against electromagnetic interference. Furthermore, the second plated metal layer of the cover member is electrically connected to the first plated metal layer of the other regions and thus has a grounding or other electrical function.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

Please refer to FIGS. 2A to 2I for the manufacturing method of the covering member of the microelectromechanical device disclosed in the present invention.

As shown in FIG. 2A, first, a core plate 20 having a first surface 20a and a second surface 20b opposite thereto is provided, and the first and second surfaces 20a, 20b of the core plate 20 have an initial metal layer 21.

As shown in FIG. 2B, a plurality of through holes 200 penetrating the initial metal layer 21, the first and second surfaces 20a, 20b are formed in the core plate 20 by mechanical drilling.

As shown in FIG. 2C, a seed layer 23 is formed on the initial metal layer 21 on the first and second surfaces 20a, 20b of the core plate 20 and the hole walls of the through holes 200.

As shown in FIG. 2D, the seed layer 23 is used as a current conduction path during electroplating to form a first plated metal layer 22a on the seed layer 23; and optionally, the through hole 200 is provided. The plug hole material 200a is filled.

As shown in FIGS. 2E and 2F, an adhesive layer 25 is formed on the first plated metal layer 22a above the second surface 20b of the core plate 20, and then mechanically milled, the core plate 20, and the first plating. At least one opening 201 is formed in the metal layer 22a and the adhesive layer 25.

Or, as shown in FIG. 2E, at least one first opening 201 ′ is formed in the core plate 20 and the first plating metal layer 22 a , and at least one second opening is formed in the adhesive layer 25 . 250, the second opening 250 of the adhesive layer 25 is corresponding to the first opening 201' to bond the adhesive layer 25 to the first plating metal layer 22a to form the opening 201.

The through holes 200 and the openings 201 are also formed by mechanical holes, thereby accelerating the process, increasing the production speed and reducing the complexity of the process.

As shown in FIG. 2G, a plate 26 having a metal layer 260 is bonded to the adhesive layer 25 to seal one end of the opening 201, and the metal layer 260 is bonded to the adhesive layer 25 to make the metal. Layer 260 is exposed in the opening 201.

As shown in FIG. 2H, a second plating metal layer 22b is formed on the exposed first plating metal layer 22a and the metal layer 260 in the opening 201, and the second plating metal is located in the opening 201 of the core board 20. The layer 22b is electrically connected to the first plated metal layer 22a above the second surface 20b of the core plate 20.

The hole wall of the opening 201 of the present invention does not need to form a metal material, so that the electromagnetic compatibility between the microelectromechanical device and the covering member is good, so as to achieve a shielding effect against electromagnetic interference; furthermore, the covering member can be made The second plated metal layer 22b is in electrical communication with the first plated metal layer 22a of other regions and has a grounding or other electrical function.

As shown in FIG. 2I, a surface treatment layer 27 is formed on the second plating metal layer 22b, and the material forming the surface treatment layer 27 is selected from the group consisting of electroless nickel/gold, nickel immersion gold (ENIG), and nickel. One of a group consisting of ENEPIG, Immersion Tin, and Organic Soldering Agent (OSP).

According to the above, the sound hole 28 penetrating the plate body 26 and the second plating metal layer 22b may also be formed in the opening 201.

The present invention provides a cover member for a microelectromechanical device, comprising: a core plate 20 having an opposite first surface 20a and a second surface 20b, and having a first and second surface 20a extending through the core plate 20; a plurality of through holes 200 of 20b and at least one opening 201; a first plated metal layer 22a is disposed on the first and second surfaces 20a, 20b of the core plate 20 and a surface of the through hole 200; and an adhesive layer 25 is provided On the first plated metal layer 22a on the second surface 20b of the core plate 20, the plate body 26 has a metal layer 260 on one surface thereof, and the metal layer 260 is disposed on the adhesive layer 25 to The plate body 26 seals one end of the opening 201 and exposes the metal layer 260 of the plate body 26 in the opening 201; and the second plated metal layer 22b is disposed on the first surface 20a of the core plate 20. The first plating metal layer 22a is on the metal layer 260 exposed in the opening 201, and the second plating metal layer 22b located in the opening 201 is electrically connected to the second surface 20b of the core board 20. A plated metal layer 22a.

The first and second surfaces 20a, 20b of the core panel 20 have an initial metal layer 21 thereon.

The covering member further comprises a surface treatment layer 27, which is disposed on the second plating metal layer 22b, and the material forming the surface treatment layer 27 is selected from the group consisting of electroless nickel/gold, nickel immersion gold (ENIG), One of a group of nickel-palladium immersion gold (ENEPIG), electroless tin plating (Immersion Tin), and organic solder resist (OSP).

The cover member includes a sound hole 28 extending through the plate body 26 and the second plated metal layer 22b in the opening 201.

In summary, the covering member of the MEMS device of the present invention and the method for manufacturing the same are formed by forming a plurality of through holes through which a through hole is formed to form a large opening in the thin substrate, and the first plating is performed on the exposed portion. A second plating metal layer is formed on the metal layer and the metal layer in the opening to provide good electromagnetic matching (EMC) between the microelectromechanical device and the covering member to achieve a shielding effect against electromagnetic interference.

Furthermore, the second plated metal layer of the cover member is electrically connected to the first plated metal layer of the other regions and thus has a grounding or other electrical function. Moreover, the process time of the present invention is short, so that the output can be increased.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

1‧‧‧covering components

10,20‧‧‧ core board

100,201‧‧‧ openings

11,26‧‧‧ plate

12,25‧‧‧Adhesive layer

13, 260‧‧‧ metal layer

20a‧‧‧ first surface

20b‧‧‧second surface

200‧‧‧through hole

200a‧‧‧ hole material

201’‧‧‧ first opening

250‧‧‧second opening

21‧‧‧Initial metal layer

22a‧‧‧First electroplated metal layer

22b‧‧‧Second plated metal layer

23‧‧‧ seed layer

27‧‧‧Surface treatment layer

28‧‧‧ sound hole

Figure 1 is a schematic cross-sectional view of a cover member on a conventional MEMS device;

2A to 2I are cross-sectional views showing a covering member of the microelectromechanical device of the present invention and a method of manufacturing the same, and Fig. 2E' is another embodiment of Fig. 2E.

20‧‧‧ core board

200‧‧‧through hole

201‧‧‧ openings

20a‧‧‧ first surface

20b‧‧‧second surface

21‧‧‧Initial metal layer

22a‧‧‧First electroplated metal layer

22b‧‧‧Second plated metal layer

23‧‧‧ seed layer

25‧‧‧Adhesive layer

26‧‧‧ board

260‧‧‧metal layer

Claims (10)

A covering member for a microelectromechanical device includes:
The core plate has opposite first and second surfaces, and has a plurality of through holes and at least one opening extending through the first and second surfaces;
a first plating metal layer is disposed on the first and second surfaces of the core plate and the surface of the through hole;
An adhesive layer is disposed on the first electroplated metal layer on the second surface of the core plate;
a plate body having a metal layer on one side thereof, and the metal layer is disposed on the adhesive layer such that the plate body seals one end of the opening and exposes the metal layer of the plate body to the opening; And a second plating metal layer, the first plating metal layer disposed on the first surface of the core plate and the metal layer exposed in the opening, and the second plating metal layer located in the opening is electrically connected a first plated metal layer on the second surface of the core plate. The covering member of the microelectromechanical device of claim 1, wherein the first and second surfaces of the core plate have an initial metal layer. The covering member of the microelectromechanical device according to claim 1, further comprising a surface treatment layer disposed on the second plating metal layer. The covering member of the microelectromechanical device according to claim 3, wherein the material for forming the surface treatment layer is selected from the group consisting of electroless nickel/gold, nickel immersion gold (ENIG), and nickel-palladium immersion gold (ENEPIG). ), one of a group of electroless tin plating (Immersion Tin) and organic solder resist (OSP). The covering member of the microelectromechanical device according to claim 1, 2, 3 or 4, further comprising a sound hole penetrating the plate body and the second plated metal layer in the opening. A method for fabricating a covering member of a microelectromechanical device includes:
Providing a core plate having opposite first and second surfaces;
Forming a plurality of through holes penetrating the first and second surfaces in the core plate;
Forming a seed layer on the first and second surfaces of the core plate and the holes of the through holes;
Forming a first plated metal layer on the seed layer;
Forming an adhesive layer on the first plated metal layer on the second surface of the core plate;
Passing through the core plate, the first plating metal layer and the adhesive layer to form at least one opening;
Bonding a plate having a metal layer on the adhesive layer to seal one end of the opening, and bonding the metal layer to the adhesive layer to expose the metal layer in the opening; and in the exposed A second electroplated metal layer is formed on the electroplated metal layer and the metal layer in the opening, and the second electroplated metal layer in the opening is electrically connected to the first electroplated metal layer on the second surface of the core plate. The method of fabricating a covering member for a microelectromechanical device according to claim 6, wherein the first and second surfaces of the core plate have an initial metal layer. The method of fabricating a covering member for a microelectromechanical device according to claim 6, further comprising forming a surface treatment layer on the second plated metal layer. The method of fabricating a covering member for a microelectromechanical device according to claim 6, wherein the material for forming the surface treatment layer is selected from the group consisting of electroless nickel/gold, nickel immersion gold (ENIG), and nickel-palladium immersion gold. One of a group of (ENEPIG), electroless tin plating (Immersion Tin) and organic solder resist (OSP). The method of fabricating a covering member of a microelectromechanical device according to claim 6, wherein the sound hole is formed in the opening through the plate body and the second plated metal layer.