TWI388675B - A silicon-based metal alloy film, a silicon-based metal alloy film and an electronic device, and a method of manufacturing a silicon-based metal alloy film on a surface of a case - Google Patents

Description

矽-based metal alloy film, ruthenium-based metal alloy film cover and electronic device, and method for forming bismuth-based metal alloy film on a surface of a casing

The invention relates to a coating film, a coating outer cover and an electronic device, and a manufacturing method for forming a coating film on a surface of a casing, in particular, a bismuth based metal alloy film, a bismuth based metal alloy film outer cover and an electron A device and a method of forming a ruthenium-based metal alloy film on a surface of a casing.

In order to increase the aesthetics and added value of the product, a decorative coating is placed on the surface of the product. For example, in the case of mobile 3C products (such as mobile phones or personal digital assistants), in order to reduce production costs and mass production, the conventional 3C products use plastic as the material for the outer casing, and only the high-end models use magnesium. Metal materials such as alloys. In order to improve the cheap feeling of plastic materials, the industry often sprays metal particles or pearl pigments on the outer shell of the product to increase the beauty, technology and modernity of the product, so as to enhance the quality and value of the product.

In recent years, almost all 3C products have infrared (IR), Bluetooth, Wi-Fi, Wi-Max or Global Positioning System (GPS) due to the wide application of wireless communication. One of the functions, however, the transmission of high frequency electromagnetic waves of the above functions is susceptible to metal barrier. In general, materials with good electrical conductivity, such as films of metals such as copper, aluminum, and silver, are as thick as thousands. (10 ^{- 10} meters), it will completely block the transmission and reception of electromagnetic waves. Therefore, how to make the plastic material shell have a metallic luster, and does not affect the transmission and reception of the wireless signal, and becomes a topic of decorative coating with a wireless transmission and reception function product.

Figure 1 shows a partial schematic view of a conventional product housing. The conventional product shell 1 comprises a plastic substrate 11, a decorative coating 12 and a transparent dye layer 13. The decorative coating 12 is deposited on the plastic substrate 11 by an indium or tin deposition process. The decorative coating 12 has a plurality of discontinuous island structures 121, so it has no conductive property and therefore does not interfere with wireless transmission signals. The intensity, and the scattering effect of the island structures 121 of the decorative coating 12, can reflect the gloss of the external light to produce a flowing metal-like light and shadow.

The transparent dye layer 13 is formed by a spraying method, and the transparent dye layer 13 covers the decorative plating film 12 and a part of the plastic substrate 11. The decorative coating 12 is designed to increase the product value in order to impart a metallic reflection effect to the product shell member 1. However, the decorative coating 12 has disadvantages such as uneven distribution, easy discoloration, low production yield, large difference in color between batches, poor weather resistance, poor adhesion, and inability to be applied to an in-mold injection process with high production efficiency.

Therefore, it is necessary to provide an innovative and progressive ruthenium-based metal alloy film, a ruthenium-based metal alloy film cover and an electronic device, and a method of forming a ruthenium-based metal alloy film on a surface of a casing to solve the above problems.

The present invention provides a bismuth-based metal alloy film in which the content of cerium is 62 to 85 percent by weight, and the remaining weight percentage is metal, and the metal is selected from the group consisting of aluminum, nickel, titanium, zinc or a combination thereof. .

The invention further provides a bismuth-based metal alloy film outer cover comprising: a casing and a bismuth-based metal alloy film. The base metal alloy film It is disposed on a surface of the casing, wherein the content of cerium is 62 to 85 percent by weight, and the remaining weight percentage is metal, and the metal is selected from the group consisting of aluminum, nickel, titanium, zinc or a combination thereof.

The invention further provides an electronic device with a ruthenium-based metal alloy film, comprising: a shell and a ruthenium-based metal alloy film. The bismuth-based metal alloy film is disposed on a surface of the casing, wherein the content of bismuth is 62 to 85 percent by weight, and the remaining weight percentage is metal, and the metal is selected from the group consisting of aluminum, nickel, titanium, and zinc. Or a group of combinations thereof.

The present invention further provides a method of forming a bismuth-based metal alloy film on a surface of a casing, the method comprising the steps of: (a) providing a bismuth-based metal alloy target, wherein the metal is selected from the group consisting of aluminum, nickel, and titanium. And a group of zinc or a combination thereof; and (b) forming a ruthenium-based metal alloy film on the surface of the casing, wherein the ruthenium-based metal alloy film has a cerium content of 62 to 85 percent by weight, The remaining weight percentage is the metal.

The bismuth-based metal alloy film of the present invention is an amorphous continuous structure, and the bismuth-based metal alloy film is electrically insulated, so that it does not attenuate any electromagnetic wave signal, thereby keeping the electromagnetic wave signal effective and good. Transmission and reception. Moreover, the bismuth-based metal alloy film has an amorphous continuous structure, so that the surface of the shell of the product is smoother, and the effect of reflecting external light is increased, so as to produce an excellent flowing metal-like light and shadow, thereby increasing the product value.

In addition, the present invention provides the bismuth-based metal alloy film on the surface of the shell of the product by a sputtering method, so that the bismuth-based metal alloy film has uniform distribution, is not easy to change color, has high production yield, small difference in color between batches, and is resistant to weathering. Sex Good, strong adhesion, long storage time of semi-finished products, etc.

Furthermore, the bismuth-based metal alloy film of the present invention can be directly applied to an in-mold injection process, and the in-mold injection process has a high production efficiency, thereby increasing the yield. In addition, since the bismuth-based metal alloy target may be a crystalline structure, that is, the bismuth-based metal alloy target may be an electrical conductor, the present invention can utilize a lower cost DC sputtering method to fabricate the ruthenium base. Metal alloy film can reduce production costs.

Fig. 2A shows a schematic view of a ruthenium-based metal alloy film of the present invention. In the present embodiment, the bismuth-based metal alloy film 2 is produced by a sputtering method using a bismuth-based metal alloy target (not shown). Among them, depending on the application, the sputtering method may use direct current (DC) sputtering, DC and pulse sputtering or radio frequency (RF) sputtering.

In the present embodiment, the bismuth-based metal alloy film 2 has a cerium content of 62 to 85 percent by weight, and the remaining weight percentage is metal. Wherein, the metal is selected from the group consisting of aluminum, nickel, titanium, zinc or a combination thereof. Preferably, the bismuth based metal alloy is a bismuth aluminum alloy. The thickness of the bismuth-based metal alloy film 2 is preferably 200 to 600 nm. In the embodiment, the thickness of the bismuth-based metal alloy film 2 is 500 nm, and the resistance of the bismuth-based metal alloy film 2 is greater than 100 M. Ohm (Ω). Among them, the bismuth-based metal alloy thin film 2 has an extremely thin thickness and is electrically insulating, and is a uniform amorphous continuous structure. Therefore, the bismuth-based metal alloy film 2 does not attenuate any electromagnetic wave signals, so that the electromagnetic wave signals can be effectively and efficiently transmitted and received, that is, the bismuth-based metal alloy film 2 can be applied to low electromagnetic wave shielding. (Low Electro Magnetic Shielding, LEMS) technical field.

In addition, the bismuth-based metal alloy film 2 obtained by the sputtering method has a uniform distribution, a higher appearance color, is less prone to discoloration, a reflectance of more than 50% in the visible light range, and a process temperature up to 580 ° C. .

Wherein, the present invention may further form at least one pattern 201 (for example, text or graphics) on one surface of the bismuth-based metal alloy film 2 (as shown in FIG. 2B), and may further form a color light-transmitting layer (not shown). Shown to cover the base metal alloy film 2 and the pattern 201. In other applications, a base film 202 may be further included, and the pattern 201 is disposed between the base metal alloy film 2 and the base film 202, as shown in FIG. 2C. Preferably, the base film 202 is a polymer film.

3 is a flow chart showing the manufacturing method of the first embodiment of the present invention for forming a bismuth-based metal alloy film on a surface of a casing, wherein the bismuth-based metal alloy film is substantially the same as the structure of FIG. 2A, so that FIG. 2A The component symbols of the base metal alloy film 2 are described. Referring to FIG. 2A and FIG. 3, first referring to step S31, a bismuth-based metal alloy target is provided, wherein the metal is selected from the group consisting of aluminum, nickel, titanium, zinc or a combination thereof. In this embodiment, the ruthenium group is used. The metal alloy target is a crystalline structure, and the bismuth based metal alloy is a bismuth aluminum alloy. Referring to step S32, a base metal alloy film 2 is formed on the surface of a casing.

In the present embodiment, the base metal alloy film 2 is formed on the surface of the casing by a sputtering method. The sputtering method can be selected from DC sputtering, DC plus pulse sputtering or RF plating. Among them, the DC sputtering method costs more The bismuth-based metal alloy target is a crystalline structure. Therefore, the sputtering method of the embodiment of the present invention preferably uses DC sputtering to reduce the production cost.

4 is a flow chart showing a manufacturing method of a second embodiment of the present invention for forming a bismuth-based metal alloy film on a surface of a casing, wherein the bismuth-based metal alloy film is substantially the same as the structure of FIG. 2B, so that FIG. 2B The component symbols of the base metal alloy film 2 are described. Referring to FIG. 2B and FIG. 4, first referring to step S41, a bismuth-based metal alloy target is provided, wherein the metal is selected from the group consisting of aluminum, nickel, titanium, zinc or a combination thereof, and the bismuth-based metal alloy target system It is a crystalline structure.

Referring to step S42, the base metal alloy film 2 is formed on the surface of a casing. The manufacturing method of the second embodiment is different from the manufacturing method of the first embodiment in that, in the second embodiment, after step S42, a step S43 may be further included to form at least one pattern 201. The surface of the base metal alloy film 2, wherein the pattern 201 is formed on the surface of the base metal alloy film 2 by a spraying method.

In this embodiment, after the pattern 201 is formed on the surface of the bismuth-based metal alloy film 2, a step S44 may be further included to form a color light-transmitting layer to cover the bismuth-based metal alloy film 2 and the pattern 201. .

5A is a flow chart showing a manufacturing method of a third embodiment of the present invention for forming a bismuth-based metal alloy film on a surface of a casing, wherein the bismuth-based metal alloy film is substantially the same as the structure of FIG. 2C, so that FIG. 2C The component symbols of the base metal alloy film 2 are described. Referring to FIG. 2C and FIG. 5, first referring to step S51, a germanium-based metal alloy target is provided, wherein The metal is selected from the group consisting of aluminum, nickel, titanium, zinc, or a combination thereof, and the bismuth-based metal alloy target is a crystalline structure.

Referring to step S52, a bismuth-based metal alloy film is formed on the surface of a casing, and the bismuth-based metal alloy film 2 is an amorphous continuous structure. Wherein, in the third embodiment, step S52 includes the following steps.

First, referring to step S521, a base film 202 is provided. Preferably, the base film 202 is a plastic film. Referring to step S522, at least one pattern 201 is formed on one surface of the base film 202. Referring to step S523, the base metal alloy film 2 is sputtered on the surface of the base film 202, and the pattern 201 and the base film 202 are covered to form a transfer substrate.

Referring to FIG. 5B and step S524, the transfer substrate is disposed in a molding die 203. The internal shape of the molding die matches the shape of the casing, and the other surface of the base film 202 contacts the molding die 203. surface. Referring to step S525, the material for manufacturing the casing is set in the molding die 203 by an injection molding method, and the casing is bonded to the base metal alloy film 2.

Referring to FIG. 5B and step S526, the molding die 203 and the base film 202 are removed. The bonding force between the casing and the base metal alloy film 2 is greater than the bonding force between the base film 202 and the base metal alloy film 2, so that the molding die 203 can be removed after injection molding the casing. And the base film 202. Preferably, after step S526, a step S53 of forming a color light transmitting layer may be further included to cover the germanium-based metal alloy film 2 and the pattern 201.

Fig. 6 is a schematic cross-sectional view showing the outer cover of the bismuth-based metal alloy film of the present invention. The bismuth-based metal alloy film outer cover 3 comprises: a casing 4 and a raft Base metal alloy film 2. Here, the bismuth-based metal alloy thin film 2 is substantially the same as the above-described structure of FIG. 2B, and therefore, the element symbols of the bismuth-based metal alloy thin film 2 of FIG. 2B will be described below. Referring to FIG. 2B and FIG. 6, in the present embodiment, the base metal alloy film 2 is disposed on one surface of the casing 4. Further, at least one pattern 201 is disposed on the surface of the bismuth-based metal alloy film 2, and a color light-transmitting layer 204 further covers the bismuth-based metal alloy film 2 and the pattern 201.

Fig. 7 is a view showing the electronic device of the present invention having a ruthenium-based metal alloy film. Referring to FIG. 6 and FIG. 7, the electronic device 5 having a bismuth-based metal alloy film includes a casing 4 and a bismuth-based metal alloy film 2. Here, the casing 4 and the base metal alloy film 2 are substantially the same as the outer cover 3 of Fig. 6, and therefore, the components of the outer cover 3 of Fig. 6 will be described. In this embodiment, the housing 4 is a non-metallic substrate, such as a plastic material. Among them, the casing 4 can be manufactured by an injection molding method or a mold forming method.

In an application in different fields, the electronic device 5 can be a mobile communication device, such as a mobile phone or a personal digital assistant (PDA); the electronic device 5 can be an image display device, such as a cathode ray tube display, a liquid crystal display, or A flat-panel display having a light-emitting diode; the electronic device 5 can be a computing device, such as a personal computer or a notebook computer; the electronic device 5 can be an audio-visual multimedia device that can receive/play images and At least one of the audio, such as a cassette type audio playback device, a combined audio system, an MP3 player or an MP4 player; or the electronic device 5 can be a computer input device such as a mouse or a keyboard. In this embodiment, the electronic device 5 is a mobile communication with a touch display screen. Device.

Especially, in the above-mentioned electronic device having electromagnetic waves, since the bismuth-based metal alloy film 2 is an amorphous continuous structure, and the bismuth-based metal alloy film 2 is electrically insulated, no electromagnetic wave is applied thereto. The signal (for example, the high-frequency electromagnetic wave signal of the mobile communication device) is attenuated, so that the electromagnetic wave signal can be effectively and well transmitted and received.

It should be noted that the bismuth-based metal alloy film 2 can be disposed on the surface of the casing 4 after forming the casing 4 (as in the present invention, the bismuth-based metal alloy film 2 is disposed on the surface of a casing Or the base metal alloy film 2 may be preceded by a surface of one of the base films to form a transfer substrate, and then the transfer substrate is disposed in a molding die to The other surface of the base film contacts the inner surface of the molding die, and the material for manufacturing the casing 4 is placed in the molding die by an injection molding method, and finally the molding die and the base film are removed to make the base. The metal alloy film 2 covers the surface of the casing 4 (as in the third embodiment of the present invention in which the base metal alloy film 2 is provided on a surface of a casing).

Preferably, after the bismuth-based metal alloy film 2 is disposed on the surface of the casing 4, a colored light-transmissive layer may be formed to cover the bismuth-based metal alloy film 2 according to different product requirements; or at least one pattern may be set first. On the surface of the base metal alloy film 2, a color light transmitting layer is formed to cover the base metal alloy film 2 and the pattern. The above-mentioned color light-transmitting layer and the method for forming the same are described in detail in the second embodiment and the manufacturing method of the third embodiment in which the bismuth-based metal alloy film 2 is provided on the surface of a casing of the present invention, and no longer Repeat them.

In this embodiment, at least one pattern 201 is disposed on the surface of the base metal alloy film 2, and a color light transmitting layer 204 further covers the base metal alloy film 2 and the pattern 201.

In addition, regarding the conductive properties of materials, when free electrons move in the material, their velocity is affected by lattice defects, holes, poor rows, impurities, and lattice atomic vibrations, thus reducing the free electron migration velocity. The cause of the resistance. Therefore, the electrical resistance or electrical conductivity of the material can be calculated based on the speed of movement of the electrons in the material.

The Matthiessen and Nordheim rules assume that the added alloying elements are randomly distributed impurities, causing the surrounding lattice to distort and causing a change in potential when electrons approach this region, resulting in scattering of electrons. If the alloy atoms are not randomly distributed, but occupy a specific lattice position, respectively, the alloy structure can be regarded as a pure compound (such as a crystalline structure), and the resistance value will be lower than the alloy with the same composition and arbitrary arrangement of atoms (such as an amorphous structure). ). The bismuth-based metal alloy target of the embodiment of the invention is a crystalline structure, which has a low resistance value and is therefore an electrical conductor. The bismuth-based metal alloy film 2 of the embodiment of the present invention has an amorphous structure and has a high electrical resistance value, so it is electrically insulated. Therefore, in the above embodiments of the present invention, a bismuth-based metal alloy target having a crystalline structure is used, and since the bismuth-based metal alloy target is an electrical conductor, a lower cost DC sputtering method can be selected. To form the bismuth based metal alloy film.

Fig. 8 is a view showing the reflectance of a conventional decorative coating film and a bismuth-based metal alloy film of the present invention under light sources of different wavelengths. Wherein, the curve L1 shows the reflectance change of the conventional decorative coating under the light source of different wavelengths; the curve L2 shows the reflection of the germanium-based metal alloy film 2 of the present invention under the light source of different wavelengths. Rate changes. The comparison between the curve L1 and the curve L2 shows that the reflectance of the conventional decorative coating is 20% to 40%, and the reflectance of the bismuth-based metal alloy film 2 of the present invention is greater than 50% under the light source of the wavelength ( The reflectivity is 50% to 65%). Therefore, the bismuth-based metal alloy film 2 of the present invention does have an excellent light source reflection effect, that is, has a better metallic texture.

The bismuth-based metal alloy film of the present invention is an amorphous continuous structure, and the bismuth-based metal alloy film is electrically insulated, so that it does not attenuate any electromagnetic wave signal, thereby keeping the electromagnetic wave signal effective and good. Transmission and reception. Moreover, the bismuth-based metal alloy film has an amorphous continuous structure, so that the surface of the shell of the product (for example, an electronic device) is smoother, and the effect of reflecting external light is further increased to produce an excellent flowing metal-like light and shadow. Therefore, the product value can be increased.

In addition, the present invention provides the bismuth-based metal alloy film on the surface of the shell of the product by a sputtering method, so that the bismuth-based metal alloy film has uniform distribution, is not easy to change color, has high production yield, small difference in color between batches, and is resistant to weathering. Good effect, strong adhesion, long storage time of semi-finished products, etc.

Furthermore, the bismuth-based metal alloy film of the present invention can be directly applied to an in-mold injection process, and the in-mold injection process has a high production efficiency, thereby increasing the yield. In addition, since the bismuth-based metal alloy target may be a crystalline structure, that is, the bismuth-based metal alloy target may be an electrical conductor, the present invention can utilize a lower cost DC sputtering method to fabricate the ruthenium base. Metal alloy film can reduce production costs.

The above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Therefore, those skilled in the art have modified the above embodiments and Changes remain without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims.

1‧‧‧Study product shell

2‧‧‧ 矽-based metal alloy film of the invention

3‧‧‧The present invention has a base metal alloy film cover

4‧‧‧Shell

5‧‧‧Electronic device with bismuth-based metal alloy film of the present invention

11‧‧‧Plastic substrate

12‧‧‧Decorative coating

13‧‧‧Transparent dye layer

121‧‧‧ island structure

201‧‧‧ pattern

202‧‧‧Basic film

203‧‧‧Molding mould

204‧‧‧Color transparent layer

1 is a partial schematic view showing a conventional product shell member; FIGS. 2A to 2C are views showing three aspects of the bismuth-based metal alloy film of the present invention; and FIG. 3 is a view showing the first step of forming a bismuth-based metal alloy film on a surface of a casing of the present invention. FIG. 4 is a flow chart showing a manufacturing method of a second embodiment of the present invention for forming a bismuth-based metal alloy film on a surface of a casing; FIG. 5A is a view showing a method for forming a bismuth-based metal alloy film in a casing according to the present invention; FIG. 5B is a schematic view showing the arrangement of a transfer substrate in a molding die according to the present invention; FIG. 6 is a schematic cross-sectional view showing the outer cover of the bismuth-based metal alloy film according to the present invention; A schematic view showing an electronic device having a ruthenium-based metal alloy thin film of the present invention; and FIG. 8 is a view showing a reflectance of a conventional decorative plating film and a bismuth-based metal alloy film of the present invention under light sources of different wavelengths.

2‧‧‧ 矽-based metal alloy film of the invention

3‧‧‧The present invention has a base metal alloy film cover

4‧‧‧Shell

201‧‧‧ pattern

204‧‧‧Color transparent layer

Claims (18)

A bismuth-based metal alloy film in which the content of cerium is 62 to 85 percent by weight, and the remaining weight percentage is metal, and the metal is selected from the group consisting of aluminum, nickel, titanium, zinc or a combination thereof. The base metal alloy film includes at least one pattern and a base film disposed on a surface of the base metal alloy film, and the pattern is disposed between the base metal alloy film and the base film. The bismuth based metal alloy film of claim 1, wherein the bismuth based metal alloy film has a thickness of 200 to 600 nm. The bismuth based metal alloy film of claim 1, wherein the bismuth based metal alloy film has a resistance value greater than 100 M ohms. The bismuth based metal alloy film of claim 1, wherein the bismuth based metal alloy is a bismuth aluminum alloy. The bismuth based metal alloy film of claim 1, wherein the bismuth based metal alloy film is electrically insulating. The bismuth-based metal alloy film of claim 1, wherein the bismuth-based metal alloy film is an amorphous continuous structure. The bismuth-based metal alloy film according to claim 1, wherein the base film is a polymer film. A ruthenium-based metal alloy film outer cover comprising: a casing; a ruthenium-based metal alloy film disposed on a surface of the casing, wherein the content of niobium is 62 to 85 percent by weight, and the rest The weight percentage is metal, and the metal is selected from aluminum, nickel, titanium, zinc or a group of combinations; at least one pattern disposed on a surface of the base metal alloy film; and a colored light transmitting layer covering the pattern and the base metal alloy film. The outer cover of claim 8 wherein the base metal alloy is a tantalum aluminum alloy. The outer cover of claim 8, wherein the base metal alloy film is electrically insulated. The outer cover of claim 8, wherein the bismuth-based metal alloy film is an amorphous continuous structure. A method of forming a bismuth-based metal alloy film on a surface of a casing, comprising: (a) providing a bismuth-based metal alloy target, wherein the metal is selected from the group consisting of aluminum, nickel, titanium, zinc, or a combination thereof; (b) forming a bismuth-based metal alloy film on the surface of the casing, wherein the bismuth-based metal alloy film has a cerium content of 62 to 85 percent by weight, and the remaining weight percentage is the metal; The step (b) further includes forming at least one pattern on the surface of the bismuth-based metal alloy film, and after forming the pattern, further comprising forming a color light-transmitting layer to cover the bismuth-based metal alloy film and the pattern. The manufacturing method of claim 12, wherein the bismuth-based metal alloy target used in the step (a) is a crystalline structure. The manufacturing method of claim 12, wherein in the step (b), the sputtering method is utilized The method forms the bismuth based metal alloy film on the surface of the casing. The method of claim 12, wherein the step (b) comprises the steps of: (b1) providing a base film; and (b2) sputtering the base metal alloy film on the surface of the base film to form a transfer base. (b3) disposing the transfer substrate in a molding die, the internal shape of the molding die is matched with the shape of the casing, and the other surface of the base film contacts the inner surface of the molding die; (b4) The injection molding method provides a material for manufacturing the casing in the molding die, bonding the casing to the base metal alloy film: and (b5) removing the molding die and the base film. The method of claim 15, wherein the step (b1) further comprises a step of forming at least one pattern on a surface of the base film. The method of claim 16, wherein after the step (b5), further comprising a step of forming a color light transmissive layer to cover the bismuth based metal alloy film and the pattern. The manufacturing method of claim 12, wherein the sputtering method in the step (b) is direct current (DC) sputtering, direct current (DC and pulse) sputtering, or radio frequency (RF) sputtering.