TWI387036B - - Google Patents
Info
- Publication number
- TWI387036B TWI387036B TW98133084A TW98133084A TWI387036B TW I387036 B TWI387036 B TW I387036B TW 98133084 A TW98133084 A TW 98133084A TW 98133084 A TW98133084 A TW 98133084A TW I387036 B TWI387036 B TW I387036B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98133084A TW201112345A (en) | 2009-09-30 | 2009-09-30 | Protection device for release film of wafer film laminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98133084A TW201112345A (en) | 2009-09-30 | 2009-09-30 | Protection device for release film of wafer film laminator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201112345A TW201112345A (en) | 2011-04-01 |
| TWI387036B true TWI387036B (https=) | 2013-02-21 |
Family
ID=44909239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98133084A TW201112345A (en) | 2009-09-30 | 2009-09-30 | Protection device for release film of wafer film laminator |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201112345A (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6367530B1 (en) * | 1998-09-04 | 2002-04-09 | Nisshinbo Industries, Inc. | Conveyor apparatus for laminator |
| US6451670B1 (en) * | 1997-08-27 | 2002-09-17 | Canon Kabushiki Kaisha | Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method |
| US6481482B1 (en) * | 1998-09-24 | 2002-11-19 | Nisshinbo Industries, Inc. | Laminating apparatus for manufacturing photovoltaic module |
| US20060201629A1 (en) * | 2000-11-30 | 2006-09-14 | Koji Hashizume | Apparatus for manufacturing bonded substrate |
| US7537670B2 (en) * | 2003-09-16 | 2009-05-26 | Canon Kabushiki Kaisha | Thermal contact-bonding method and thermal contact-bonding apparatus |
-
2009
- 2009-09-30 TW TW98133084A patent/TW201112345A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6451670B1 (en) * | 1997-08-27 | 2002-09-17 | Canon Kabushiki Kaisha | Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method |
| US6367530B1 (en) * | 1998-09-04 | 2002-04-09 | Nisshinbo Industries, Inc. | Conveyor apparatus for laminator |
| US6481482B1 (en) * | 1998-09-24 | 2002-11-19 | Nisshinbo Industries, Inc. | Laminating apparatus for manufacturing photovoltaic module |
| US20060201629A1 (en) * | 2000-11-30 | 2006-09-14 | Koji Hashizume | Apparatus for manufacturing bonded substrate |
| US7537670B2 (en) * | 2003-09-16 | 2009-05-26 | Canon Kabushiki Kaisha | Thermal contact-bonding method and thermal contact-bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201112345A (en) | 2011-04-01 |