TWI385677B - Method for processing electrodes of compact passive elements - Google Patents

Description

Electrode processing method for small passive components

The present invention relates to an electrode processing method for a small passive component, and more particularly to an electrode processing method for a small passive component capable of improving yield and yield.

Nowadays, in order to meet the increasing demand for use, electronic products must be provided with more electronic components without providing excessive volume to provide more functions. Moreover, for some electronic products (such as mobile phones), it is more necessary to simultaneously reduce the size of the product to meet the trend of miniaturized product design. Therefore, how to make and process small electronic components has become an important key technology.

For example, please refer to FIGS. 1A to 1H, which discloses an electrode processing method for a conventional small electronic component, which comprises the following steps: First, as shown in FIG. 1A, a positioning plate 11, a tape 12 and a sieve are prepared. The plate 13 first adheres the tape 12 having a single-sided adhesiveness to the lower surface of the positioning plate 11, and the sieve plate 13 is placed on the positioning plate 11. Then, a plurality of passive components 2 (for example, chip resistors) are spread on the sieve plate 13, and the passive component 2 is guided through the plurality of guide holes 131 of the sieve plate 13 by a vibration machine (not shown). And falling into the plurality of positioning holes 111 of the positioning plate 11. At this time, the first end 21 of the passive component 2 will adhere to the exposed tape 12 in the positioning hole 111, and then the sieve plate 13 is removed. As shown in Fig. 1B, a layer of electrode material 16 is applied to a carrier 14 by a feeder 15, which has a doctor blade 151 which controls the thickness of the electrode material 16. As shown in FIG. 1C, the positioning plate 11 to which the passive component 2 is adhered is inverted, and the second end 22 of the passive component 2 is moved toward the electrode material 16 on the carrier 14 so as to be dip at the second end 22. The electrode material 16 is applied. Subsequently, the hot material is baked to adhere the electrode material 16 to the second end 22.

Next, as shown in Fig. 1D, an auxiliary positioning plate 17 having a plurality of positioning holes 171 and having a tape 18 adhered on one side thereof has a single-sided adhesiveness. Then, the positioning plate 11 and the auxiliary positioning plate 17 are abutted together, and the second end 22 of the passive component 2 is inserted into the positioning hole 171 of the auxiliary positioning plate 17 and adhered to the exposed tape in the positioning hole 111. 18 on. As shown in FIG. 1E, the positioning plate 11 and the auxiliary positioning plate 17 are inverted, and the tape 12 on the positioning plate 11 is removed by hand or by a machine. Next, as shown in FIG. 1F, the positioning plate 11 is removed such that the first end 21 of the passive component 2 is exposed outside the positioning hole 171 of the auxiliary positioning plate 17. As shown in FIG. 1G, a layer of electrode material 16 is applied to the carrier 14 again, and the auxiliary positioning plate 17 to which the passive component 2 is adhered is inverted, so that the first end 21 of the passive component 2 is adhered to the electrode. Material 16. Subsequently, baking is performed by hot air to adhere the electrode material 16 to the first end 21. Finally, as shown in FIG. 1H, the tape 18 on the auxiliary positioning plate 17 is torn off by hand or implement, thereby disengaging the passive element 2 from the auxiliary positioning plate 17. Thereby, the passive component 2 can be prepared.

However, the electrode processing method of the conventional small electronic component still has the following problems in practical use, for example, as shown in FIGS. 1E and 1H, when the tape 12 or 18 is peeled off, since the tape 12 or 18 itself has a certain degree of viscosity, so during the tearing off, the metal surface (not labeled) or the adhered electrode material 16 of the first end 21 or the second end 22 of the passive component 2 may be accommodated with the tape 12 or 18 The tape is removed, thereby causing damage to the shape of the first end 21 or the second end 22, thereby affecting the yield of the passive component 2. Furthermore, when the size of the passive component 2 is increasingly miniaturized, the positioning plate 11 or the auxiliary positioning plate 17 must be reduced in thickness due to the length of the passive component 2, and the positioning hole 111 is narrowed by the sectional area of the passive component 2. Or the aperture of 171. However, the positioning plate 11 or the auxiliary positioning plate 17 whose thickness is too thin is not only difficult to control the processing precision, but also cannot provide sufficient supporting strength, which may cause the plate body to be easily bent and deformed. In order to replace the positioning plate 11 or the auxiliary positioning plate 17, the process may be interrupted and the entire batch of passive components 2 may be scrapped, thereby relatively reducing production efficiency and product yield, and increasing the replacement cost of the consumables. The above problem causes the conventional electrode processing method to be unsuitable for manufacturing the passive component 2 which is increasingly miniaturized in size, that is, it cannot satisfy the manufacturing requirements of miniaturization of the passive component. Furthermore, in order to ensure sufficient supporting strength, the positioning plate 11 or the auxiliary positioning plate 17 cannot further open more positioning holes 111 or 171, that is, the layout density in a unit area cannot be increased, so that the batch will be relatively reduced. Production and increase overall production costs.

Therefore, it is necessary to provide an electrode processing method for a small passive component to solve the problems of the prior art.

The main object of the present invention is to provide an electrode processing method for a small passive component, which uses a support plate having a double-sided adhesive layer to temporarily adhere a passive component to perform operations such as adhering electrode materials and changing plates, thereby facilitating production improvement. Efficiency and product yield, and can meet the manufacturing needs of passive components.

A secondary object of the present invention is to provide an electrode processing method for a small passive component, wherein the passive component can be disposed on the double-sided adhesive layer of the support plate at an arbitrary density without being restricted by the conventional positioning plate, thereby facilitating the addition of components. Layout density, increase batch yield and reduce production costs.

Another object of the present invention is to provide an electrode processing method for a small passive component, which uses a support plate having a double-sided adhesive layer to temporarily adhere to a passive component, and the support thickness of the support plate is not affected by the size or layout density of the passive component. The limitation is, in turn, beneficial to increase the support strength, extend the life of the support plate, and reduce the cost of consumable replacement.

To achieve the above objective, an embodiment of the present invention provides a method for processing an electrode of a small passive component, comprising the steps of: arranging a plurality of passive components in a plurality of positioning holes of a positioning fixture, wherein each of the passive components One of the first ends faces the positioning hole, and one of the second ends of each of the passive components faces the positioning hole; a support plate is provided and a double-sided adhesive layer is adhered to one side of the support plate to utilize the support a double-sided adhesive layer of the board is bonded to the second end of each of the passive components; the support plate is moved such that the first end of each of the passive components is adhered to an electrode material; and the passive component on the double-sided adhesive layer of the support plate is baked Fixing the electrode material to the first end; and, the double-sided adhesive layer is debonded so that the passive component is separated from the support plate and the double-sided adhesive layer thereof.

In an embodiment of the present invention, before the step of disengaging the passive component from the support plate and the double-sided adhesive layer thereof, an auxiliary support plate is provided and an auxiliary double-sided adhesive layer is adhered on one side of the auxiliary support plate to Passing the auxiliary double-sided adhesive layer of the auxiliary support plate to bond the passive component on the double-sided adhesive layer of the support plate to the first end of the electrode material; and, the double-sided adhesive layer of the support plate is lost to the adhesive layer, The support plate and its double-sided adhesive layer are removed.

In an embodiment of the present invention, after the step of disengaging the passive component from the support plate and the double-sided adhesive layer thereof, the auxiliary support plate is moved such that the second end of each of the passive components adheres to the electrode material; Bake the passive component on the auxiliary double-sided adhesive layer of the auxiliary support plate to fix the electrode material to the second end; and, the auxiliary double-sided adhesive layer of the auxiliary support plate is deactivated, so that the passive component is detached from the Auxiliary support plate and its auxiliary double-sided adhesive layer.

In an embodiment of the invention, the double-sided adhesive layer is selected from the group consisting of a thermosetting resin, and the double-sided adhesive layer on the support plate is lost in viscosity by heating.

In an embodiment of the invention, the loss-adhesive temperature of the double-sided adhesive layer is greater than the baking temperature of the passive component and the electrode material.

In an embodiment of the invention, the auxiliary double-sided adhesive layer is selected from the group consisting of a thermosetting hardening resin, and the auxiliary double-sided adhesive layer on the auxiliary support plate is lost in viscosity by heating.

In an embodiment of the invention, the loss-adhesive temperature of the auxiliary double-sided adhesive layer is greater than the baking temperature of the passive component and the electrode material.

In an embodiment of the invention, the double-sided adhesive layer is selected from the group consisting of ultraviolet curable resins, and the double-sided adhesive layer on the support plate is lost in viscosity by irradiation of ultraviolet rays.

In an embodiment of the invention, the auxiliary double-sided adhesive layer is selected from the group consisting of ultraviolet curable resins, and the auxiliary double-sided adhesive layer on the auxiliary support plate is lost in viscosity by ultraviolet rays.

In an embodiment of the invention, the support plate and the auxiliary support plate are selected from the group consisting of metal plates.

In one embodiment of the invention, the electrode material is selected from the group consisting of tin, silver, lead, copper, or alloys thereof.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Referring to FIGS. 2A to 2L, the electrode processing method of the small passive component of the preferred embodiment of the present invention mainly includes the following steps: arranging a plurality of passive components 4 in a plurality of positioning holes 31 of the positioning fixture 3, The first end 41 of each of the passive components 4 faces the positioning hole 31, and the second end 42 of each of the passive components 4 faces the positioning hole 31; a support plate 5 is provided and is disposed on the support plate 5 a double-sided adhesive layer 51 is adhered to one side to bond the second end 42 of each of the passive components 4 with the double-sided adhesive layer 51 of the support plate 5; and the support plate 5 is moved to make the first end of each of the passive components 4 41 is adhered to an electrode material 6; the passive component 4 on the double-sided adhesive layer 51 of the support plate 5 is baked to fix the electrode material 6 to the first end 41; an auxiliary support plate 7 is provided and supported on the auxiliary support One side of the plate 7 is adhered to an auxiliary double-sided adhesive layer 71 to bond the passive component 4 on the double-sided adhesive layer 51 of the support plate 5 with the auxiliary double-sided adhesive layer 71 of the auxiliary support plate 7 to adhere the electrode material 6 The first end 41; the double-sided adhesive layer 51 of the support plate 5 is lost to remove the support plate 5 and its double-sided adhesive layer 51; The auxiliary support plate 7 is moved so that the second end 42 of each of the passive components 4 is adhered to the electrode material 6; the passive component 4 on the auxiliary double-sided adhesive layer 71 of the auxiliary support plate 7 is baked to make the electrode material 6 Fixed to the second end 42; and, the auxiliary double-sided adhesive layer 71 of the auxiliary support plate 7 is lost in viscosity, so that the passive component 4 is separated from the auxiliary support plate 7 and its auxiliary double-sided adhesive layer 71. In this embodiment, the first end 41 and the second end 42 of the passive component 4 are subjected to tinning processing. However, depending on the product requirements, only one end of the electrode may be processed, which is also one of the possibilities of the present invention. Implementation. The above steps will be explained in detail below with the drawings.

Referring to FIG. 2A, a first step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is: arranging a plurality of passive components 4 in a plurality of positioning holes 31 of the positioning fixture 3, wherein each One of the first ends 41 of the passive component 4 faces the positioning hole 31, and one of the second ends 42 of each of the passive components 4 faces the positioning hole 31. In the present invention, the passive component 4 may be selected from a chip resistor, a multilayer ceramic capacitor (MLCC) or a multilayer ceramic inductor, but is not limited thereto, and may be selected from the group consisting of Other small passive components that can be manufactured through mass production processes. In this embodiment, the positioning fixture 3 is a metal plate body, and the positioning hole 31 can be formed in advance according to the size of the passive component 4, and the positioning hole 31 is selected from a blind hole, wherein the positioning hole 31 is selected from the blind hole. The aperture is slightly larger than the passive component 4 to accommodate the passive component 4, and the distance between the positioning holes 31 can be reduced as much as possible to arrange a greater number of the passive components 4. In this embodiment, the positioning fixture 3 can be mounted on a vibration device (not shown), and the passive component 4 is scattered on the surface of the positioning fixture 3, and the horizontal direction is generated by the vibration device. The reciprocating vibration causes the passive component 4 to fall into each of the positioning holes 31 one by one. As long as most of the positioning holes 31 accommodate the passive component 4, the passive component 4 on the positioning fixture 3 can be performed. The next processing step.

Referring to FIG. 2B, a second step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is to provide a support plate 5 and a double-sided adhesive layer 51 on one side of the support plate 5 to The second end 42 of each of the passive components 4 is bonded by the double-sided adhesive layer 51 of the support plate 5. In this step, the support plate 5 is preferably selected from a metal plate or other flat plate body, and the thickness thereof is not limited, but at least it is necessary to provide sufficient support strength to prevent bending deformation in subsequent processing steps. The double-sided adhesive layer 51 has a peelable protective layer (not shown) on both sides before it is pasted. When pasting, the protective layer on one side of the double-sided adhesive layer 51 is first peeled off, the double-sided adhesive layer 51 is adhered to one side of the support plate 5, and then the other side of the double-sided adhesive layer 51 is peeled off. Protective layer. In the present invention, the double-sided adhesive layer 51 is preferably selected from the group consisting of thermosensitive resin, but may be selected from ultraviolet curable resins such as double-sided tapes selected from the group consisting of epoxy resins.

Referring to FIGS. 2C, 2D and 2E, the third step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is: moving the support plate 5 to make the first end 41 of each passive component 4 sticky. An electrode material 6. As shown in FIG. 2C, after the double-sided adhesive layer 51 of the support plate 5 is bonded to the second end 42 of each of the passive components 4, the support plate 5 is moved to move the passive component 4 away from the positioning fixture 3. As shown in Fig. 2D, a layer of electrode material 6 is applied to a carrier 60 by a feeder 61. The feeder 61 has a doctor blade 62 for controlling the thickness of the electrode material 6. As shown in Fig. 2E, the support plate 5 is moved such that the first end 41 of the passive element 4 is moved toward the electrode material 6 on the carrier plate 60 so that the electrode material 6 is applied to the first end 41. In the present embodiment, the electrode material 6 is selected from the group consisting of tin, silver, lead, copper or alloys thereof, but may additionally contain a flux (such as rosin) and other elements (such as ruthenium or osmium).

Referring to FIG. 2F, a fourth step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is: baking the passive component 4 on the double-sided adhesive layer 51 of the support plate 5 to make the electrode material 6 Fixed to the first end 41. In this step, if the double-sided adhesive layer 51 is selected from the thermosetting resin, the loss-adhesive temperature of the double-sided adhesive layer 51 is designed to be larger than the baking temperature of the passive component 4 and the electrode material 6. For example, if the baking temperature of the passive component 4 and the electrode material 6 is between 100 ° C and 120 ° C, the loss-adhesive temperature of the double-sided adhesive layer 51 may be designed to be 150 ° C in advance, but is not limited thereto. The above temperature design is mainly to prevent the double-sided adhesive layer 51 from losing prematurely during baking. Further, if the double-sided adhesive layer 51 is selected from the group consisting of ultraviolet curable resins, the above temperature control can be omitted.

Referring to FIG. 2G, a fifth step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is to provide an auxiliary support plate 7 and attach an auxiliary double-sided adhesive layer on one side of the auxiliary support plate 7. 71, the passive element 4 on the double-sided adhesive layer 51 of the support plate 5 is bonded to the first end 41 of the electrode material 6 by the auxiliary double-sided adhesive layer 71 of the auxiliary support plate 7. In this embodiment, the auxiliary support plate 7 is substantially identical to the support plate 5, which may also be selected from a metal plate or other flat plate body, and the thickness thereof is not limited, but at least it must provide sufficient support strength. To prevent bending deformation in subsequent processing steps. Furthermore, the auxiliary double-sided adhesive layer 71 is substantially the same as the double-sided adhesive layer 51, and may also be selected from a thermosetting resin or an ultraviolet curing resin, for example, a double-sided tape formed of an epoxy resin. The auxiliary double-sided adhesive layer 71 is used to bond the first end 41 of the electrode material 6 to which the passive component 4 has been adhered.

Referring to FIG. 2H, a sixth step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is: removing the double-sided adhesive layer 51 of the support plate 5 to remove the support plate 5 and Its double-sided adhesive layer 51. In this step, if the double-sided adhesive layer 51 is selected from the thermosetting resin, the double-sided adhesive layer 51 on the support plate 5 can be deactivated by heating. If the double-sided adhesive layer 51 is selected from the group consisting of ultraviolet curable resins, the double-sided adhesive layer 51 on the support sheet 5 can be lost in viscosity by irradiation of ultraviolet rays. After the double-sided adhesive layer 51 loses the adhesiveness, the auxiliary support plate 7 and the support plate 5 need only be moved relative to each other in the opposite direction, so that the second end 42 of the passive component 4 can be disengaged from the double on the support plate 5. Mask layer 51. At this time, the first end 41 of the passive component 4 to which the electrode material 6 has been adhered is bonded to the auxiliary double-sided adhesive layer 71 of the auxiliary support plate 7.

Referring to FIG. 2I, a seventh step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is: moving the auxiliary support plate 7 such that the second end 42 of each passive component 4 adheres to the electrode material. 6. This step is substantially the same as the third step described above. The seventh step again applies a layer of electrode material 6 on the carrier 60, and moves the auxiliary support plate 7 to move the second end 42 of the passive component 4 toward the electrode material 6 on the carrier 60 so as to The second end 42 is stained with the electrode material 6. In the present embodiment, the electrode material 6 is also selected from tin, silver, lead, copper or alloys thereof, but may additionally contain a flux (such as rosin) and other elements (such as ruthenium or osmium).

Referring to FIG. 2J, the eighth step of the electrode processing method for the small passive component of the preferred embodiment of the present invention is: baking the passive component 4 on the auxiliary double-sided adhesive layer 71 of the auxiliary support plate 7 to make the electrode Material 6 is secured to the second end 42. This step is substantially the same as the fourth step described above. In this step, if the auxiliary double-sided adhesive layer 71 is selected from the heat-sensitive hardening resin, the loss-adhesive temperature of the auxiliary double-sided adhesive layer 71 is pre-designed to be larger than the baking temperature of the passive component 4 and the electrode material 6. . For example, if the baking temperature of the passive component 4 and the electrode material 6 is between 100 ° C and 120 ° C, the loss-adhesive temperature of the auxiliary double-sided adhesive layer 71 may be previously designed to be 150 ° C, but is not limited thereto. The above temperature design is mainly to prevent the auxiliary double-sided adhesive layer 71 from losing prematurely during baking. Further, if the auxiliary double-sided adhesive layer 71 is selected from the group consisting of ultraviolet curable resins, the above temperature control can be omitted.

Referring to FIGS. 2K and 2L, the ninth step of the electrode processing method for a small passive component according to a preferred embodiment of the present invention is to make the auxiliary double-sided adhesive layer 71 of the auxiliary support plate 7 lose its viscosity so that the passive component 4 is detached from the auxiliary support plate 7 and its auxiliary double-sided adhesive layer 71. This step is substantially the same as the sixth step described above. In this step, if the auxiliary double-sided adhesive layer 71 is selected from the thermosensitive resin, the auxiliary double-sided adhesive layer 71 on the auxiliary support plate 7 can be deactivated by heating. If the auxiliary double-sided adhesive layer 71 is selected from the ultraviolet curable resin, the auxiliary double-sided adhesive layer 71 on the auxiliary support plate 7 can be deactivated by irradiation of ultraviolet rays. After the auxiliary double-sided adhesive layer 71 loses its adhesiveness, the first end 41 of the passive component 4 can be disengaged from the auxiliary double-sided adhesive layer 71 on the auxiliary support plate 7 only by the toggle of the passive component 4. In this way, the processing process in which the first end 41 and the second end 42 of the passive component 4 adhere to the electrode material can be completed. After the processing process is completed, the passive component 4 can be transported to perform a general shape inspection or electrical test to determine a good or defective product, and then the package can be shipped.

As described above, the electrode processing method of the conventional small electronic component of FIGS. 1A to 1H is difficult to achieve both the yield and the production efficiency, and is disadvantageous for the manufacture of the small size of the passive component 2, etc., the second to the second embodiment. The invention uses the support plate 5 having the double-sided adhesive layer 51 to temporarily adhere the passive component 4, thereby facilitating the work of adhering the electrode material 6 and changing the plate, thereby facilitating improvement of production efficiency and product yield, and satisfying Manufacturing requirements for miniaturization of passive components. Moreover, since the passive component 4 is directly bonded to the double-sided adhesive layer 51 of the support plate 5, the passive component 4 can be disposed on the double-sided adhesive layer 51 of the support plate 5 at an arbitrary density without being affected by The limitation of the conventional positioning plate is beneficial to increase the component layout density, increase the batch yield and reduce the production cost. In addition, the passive component 4 is temporarily adhered by the support plate 5 having the double-sided adhesive layer 51. Since the support thickness of the support plate 5 is not limited by the size or layout density of the passive component 4, it is also advantageous. Increase the support strength, extend the service life of the support plate 5, and reduce the cost of consumable replacement. Further, after the board is changed, when the auxiliary support plate 7 and the auxiliary double-sided adhesive layer 71 are used, they also have the same effects as described above.

The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

11. . . Positioning plate

111. . . Positioning hole

12. . . tape

13. . . Sieve plate

131. . . Guide hole

14. . . Carrier board

15. . . Feeder

151. . . scraper

16. . . Electrode material

17. . . Auxiliary positioning board

171. . . Positioning hole

18. . . tape

2. . . Passive component

twenty one. . . First end

twenty two. . . Second end

3. . . Positioning fixture

31. . . Positioning hole

4. . . Passive component

41. . . First end

42. . . Second end

5. . . Support plate

51. . . Double-sided adhesive layer

6. . . Electrode material

60. . . Carrier board

61. . . Feeder

62. . . scraper

7. . . Auxiliary support plate

71. . . Auxiliary double-sided adhesive layer

Figures 1A to 1H are schematic diagrams showing the flow of an electrode processing method for a conventional passive component.

2A to 2L are schematic views showing the flow of an electrode processing method for a small passive component according to a preferred embodiment of the present invention.

4. . . Passive component

41. . . First end

42. . . Second end

5. . . Support plate

51. . . Double-sided adhesive layer

6. . . Electrode material

60. . . Carrier board

Claims (12)

An electrode processing method for a small passive component, comprising the steps of: arranging a plurality of passive components in a plurality of positioning holes of a positioning fixture, wherein a first end of each of the passive components faces the positioning hole, and each of the plurality of passive components a second end of the passive component faces the positioning hole; a support plate is provided and a double-sided adhesive layer is adhered to one side of the support plate to bond the second of the passive components with the double-sided adhesive layer of the support plate Moving the support plate such that the first end of each of the passive components is adhered to an electrode material; the passive component on the double-sided adhesive layer of the support plate is baked to fix the electrode material to the first end; The double-sided adhesive layer loses viscosity so that the passive component is detached from the support plate and its double-sided adhesive layer. An electrode processing method for a small passive component according to claim 1, wherein an auxiliary support plate is provided and one of the auxiliary support plates is provided before the passive component is separated from the support plate and the double-sided adhesive layer thereof. Adhesively bonding an auxiliary double-sided adhesive layer to bond the first end of the adhesive material on the double-sided adhesive layer of the support plate by using the auxiliary double-sided adhesive layer of the auxiliary support plate; and The double-sided adhesive layer loses its tackiness to remove the support plate and its double-sided adhesive layer. An electrode processing method for a small passive component according to claim 2, wherein after the step of disengaging the passive component from the support plate and the double-sided adhesive layer thereof, the auxiliary support plate is moved to make each of the passive components The second end is adhered to the electrode material; the passive component on the auxiliary double-sided adhesive layer of the auxiliary support plate is baked to fix the electrode material to the second end; and the auxiliary double-sided adhesive layer of the auxiliary support plate is made The viscous property is lost so that the passive component is detached from the auxiliary support plate and its auxiliary double-sided adhesive layer. The electrode processing method for a small passive component according to claim 1, wherein the double-sided adhesive layer is selected from the group consisting of a thermosetting resin, and the double-sided adhesive layer on the support plate is lost in viscosity by heating. The electrode processing method for a small passive component according to claim 4, wherein the double-sided adhesive layer has a loss-resistance temperature greater than a baking temperature of the passive component and the electrode material. The electrode processing method for a small passive component according to claim 3, wherein the auxiliary double-sided adhesive layer is selected from a thermosetting hardening resin, and the auxiliary double-sided adhesive layer on the auxiliary support plate is lost by heat. Sex. The electrode processing method of the small passive component according to claim 6, wherein the auxiliary double-sided adhesive layer has a viscosity loss temperature greater than a baking temperature of the passive component and the electrode material. The electrode processing method for a small passive component according to claim 1, wherein the double-sided adhesive layer is selected from the group consisting of ultraviolet-curable resin, and the double-sided adhesive layer on the support plate is lost in viscosity by irradiation of ultraviolet rays. The electrode processing method of the small passive component according to claim 3, wherein the auxiliary double-sided adhesive layer is selected from the group consisting of ultraviolet curing resin, and the auxiliary double-sided adhesive layer on the auxiliary support plate is lost by irradiating ultraviolet rays. Sticky. The electrode processing method of a small passive component according to claim 1, wherein the support plate is selected from a metal plate. The electrode processing method of a small passive component according to claim 2, wherein the auxiliary support plate is selected from a metal plate. The electrode processing method of a small passive component according to claim 1 or 3, wherein the electrode material is selected from the group consisting of tin, silver, lead, copper or an alloy thereof.