TWI384713B - Laser module - Google Patents

Description

Laser module

The invention relates to a laser module, in particular to an image sealing lens enclosed in the laser module by using a gas-tight structure, and becomes a waterproof and moisture-proof laser module.

The conventional laser module is composed of a front case provided with a focusing lens and a rear case having one of the laser diodes. Usually, an image lens is disposed between the front case and the rear case. The light beam projected through the laser diode exhibits a specific pattern, but does not effectively prevent moisture from entering the laser module, and the image lens is often caused to generate misty moisture, so that the laser module The use efficiency is greatly reduced, and the temperature generated by the laser diode during operation cannot be effectively detected.

Therefore, the present invention utilizes a hermetic structure to seal and seal the laser diode and the front and rear casings to which the image lens belongs, thereby preventing moisture from entering the laser module. a temperature sensing component and a temperature control plate are disposed under the laser diode to detect the operating temperature of the laser diode, and the laser receiving diode is further used to further the laser mode. The wavelength and temperature control of the group are more precise.

The main object of the present invention is to provide a laser module that utilizes an airtight structure to achieve moisture shielding of an image lens in a laser module.

Another object of the present invention is to provide a laser module that utilizes a temperature sensing element to achieve the operating temperature of the laser diode.

Another object of the present invention is to provide a laser module that utilizes a temperature control plate to maintain the temperature of the laser diode.

A further object of the present invention is to provide a laser module that utilizes a light receiving diode to achieve the purpose of detecting the optical power of the laser diode.

For the above purposes, the laser module of the present invention is connected to a circuit board and includes: a main body, a focusing lens, a casing, a laser diode, an image lens, and an airtight The structure, a temperature sensing element, a temperature control plate, and a light receiving diode. The body further includes: a front open end, a rear open end, and an inner wall. The focusing lens is incorporated into the front open end of the body. The housing is sleeved outside the main body, and a uniform hole is formed at one end of the housing and corresponding to the focusing lens, and the other end is configured as an opening for receiving the main body and extending into the housing. Inside.

The laser diode system is coupled to the inner wall of the main body by the pressing end of the main body and corresponding to the focusing lens, and is further electrically connected to the circuit board. The image lens is disposed within the through hole and corresponds to the focusing lens. The airtight structure is disposed within the through hole and encloses the image lens within the housing.

The temperature sensing component is located below the laser diode and disposed on the circuit board and electrically connected to the circuit board, wherein the temperature control plate is located at the laser diode and the temperature sense The measuring element is disposed below the opening of the housing, and the main body is enclosed in the housing, and the laser diode is temperature-controlled through the temperature control plate. The light receiving diode system is located below the laser diode and disposed on the circuit board and electrically connected to the circuit board for detecting the optical power of the laser diode.

In order to more clearly describe the laser module proposed by the present invention, the following will be described in detail in conjunction with the drawings.

Referring to FIG. 1 , FIG. 2A , FIG. 2B , and FIG. 2C , the laser module 1 is connected to a circuit board 2 , and includes a cylindrical body 11 and a focusing lens 12 . A laser diode 13, a housing 14, a hermetic structure 15, a temperature sensing element 16, a temperature control plate 17, and an image lens 9. The main body 11 further includes a front open end 111, a rear open end 112, and an inner wall 113. A concave step 1131 is disposed on the inner wall 113 adjacent to the front open end 111. The airtight structure 15 is configured to block the intrusion of the outside water into the laser module 1 and affect the projection effect of the image lens 9. The method further includes: a pressure ring 151, a plurality of sealing rubber rings 152, And a stopper 153. In the first preferred embodiment of the present invention, the circuit board 2 can be a thin film circuit board.

The focusing lens 12 is coupled to the concave step 1131 in the front end 111 of the main body 11, and the gap between the focusing lens 12 and the concave step 1131 of the main body 11 is sealed by a rubber ring 152. The laser diode 13 is joined to the inner wall 113 of the main body 11 by the pressing end of the main body 11 and corresponding to the focusing lens 12. The laser diode 13 is electrically connected to the circuit board 2 by using a plurality of conductive pins 131. Wherein, in the process of gradually pushing the laser diode 13 into the inner wall 113 of the main body 11, the procedure of the focus correction can be performed at the same time, and once the range of the focus is accurate, the push is stopped. The action of the laser diode 13. At this time, since the laser diode 13 and the inner wall 113 of the main body 11 are tightly engaged, once the pushing action is stopped, the laser diode 13 will be positioned at the position to maintain a good focus. effect. In the first preferred embodiment of the present invention, the main body 11 may be preferably made of a metal material to improve the heat dissipation effect on the laser diode 13.

The housing 14 is formed in a cylindrical shape and is disposed outside the main body 11. At one end of the housing 14 and corresponding to the focusing lens 12, a constant hole 141 is defined, and at the inner edge of the through hole 141. A card step 1411 is provided to provide the image lens 9 to be coupled therein, and the other end of the housing 14 is configured as an opening 142 for receiving the body 11 to extend into the housing 14. In the first preferred embodiment, the housing 14 can be made of a heat-insulating plastic material.

The image lens 9 is disposed in the through hole 141, and the focusing lens 12 and the main body 11 are sealed by the sealing rubber ring 152', and the other sealing rubber is further utilized by the pressing ring 151. The ring 152' is pressed into the step 1411, and the gap between the periphery of the main body 11 and the casing 14 is coated through the sealing glue 153, so that the image lens 9 is enclosed in the casing 14 and Corresponding to the focus lens 12. The laser beam projected by the laser diode 13 is used to generate a predetermined pattern through the image lens 9 and is projected to the outside. The image lens 9 may be one of a DIFF (Diffraction Optical Element) and a Holographic Optical Element (HOD).

The laser diode 13 is extended with a plurality of conductive pins 131 electrically connected to the circuit board 2, wherein the conductive pin 131' connecting the laser diode housing is along the laser diode 13 A copper pad 132 is extended on the bottom portion, and the temperature sensing component 16 is disposed on the copper pad 132 and electrically connected to the circuit board 2, thereby detecting the temperature of the copper pad 132 and further passing through the temperature control plate. 17 adjusting the operating temperature of the laser diode 13 to bring the temperature sensing component 16 closer to the laser diode 13 to make the temperature control of the laser module 1 more precise.

In the first preferred embodiment of the present invention, the temperature control plate 17 is a semiconductor cooler, and is disposed under the laser diode 13, the temperature sensing component 16, and the circuit board 2 At the opening 142 of the casing 14, the main body 11 is enclosed in the casing 14, and the laser diode 13 is temperature-controlled through the temperature control plate 17. In this way, the temperature sensing plate 16 cooperates with the temperature sensing component 16 to further control the operating temperature of the laser diode 13 more accurately, and since the temperature control plate 17 not only has good heat conduction effect, the temperature difference thereof is reduced. At the same time, it has the function of protecting and extending the service life of the laser diode 13.

The inner wall 113 of the main body 11 and the outer periphery of the laser diode 13 are respectively provided with a tight fitting structure 18, and the tight fitting structure 18 includes a rib 181 and a guiding groove 182. In the first preferred embodiment of the present invention, the rib 181 is disposed on the inner wall 113 of the main body 11, and the guiding groove 182 is disposed on the periphery of the laser diode 13 and corresponds to the rib 181. .

When the main body 11 and the laser diode 13 are tightly combined, the guide groove 182 is embedded on the rib 181, and is axially displaced from the main body 11 on the rib 181, and The laser diode 13 and the focusing lens 12 fixed in the main body 11 can be axially displaced by the tight fitting structure 18 to adjust the laser module 1 to achieve an optimal focal length, and due to the tight structure The 18 has the same directivity as the axial direction of the main body 11, so that the laser diode 13 is incorporated into the main body 11 without causing inclination or rotation.

In addition, a corresponding mating structure 19 is respectively disposed at the outer edge of the main body 11 and the inner edge of the through hole 141 of the housing 14 , and the mating structure 19 further includes: a guiding slot 191, and a rib 192. In the first preferred embodiment of the present invention, the guiding groove 191 is disposed at an inner edge of the through hole 141 of the housing 14, and the protruding rib 192 is disposed at a periphery of the main body 11 and The guide grooves 191 correspond to each other.

When the main body 11 is coupled to the housing 14 , the rib 192 of the main body 11 is embedded in the guiding slot 191 of the housing 14 and axially displaced from the main body 11 in the guiding slot 191. The main body 11 is embedded in the through hole 141 of the housing 14 , and the image lens 9 disposed on the housing 14 is disposed above the focusing lens 12 and located in the laser diode. 13 projected laser beam paths.

In the other preferred embodiments of the present invention described below, since the components are the same or similar to the foregoing embodiments, the same components and structures will not be described below, and the same components will be directly given the same names. And number, and the same name is given for similar components, but an additional letter is added after the original number to distinguish and not repeat them.

Referring to FIG. 3, FIG. 4A and FIG. 4B, the second preferred embodiment of the present invention is different from the first preferred embodiment described above in that the image lens 9 of the laser module 1a is The first open end 111a is disposed substantially in a flared shape, and the front open end 111a is substantially flared, and a concave step 1131a is disposed inside the main body 11a to provide the focusing lens 12a to be integrated therein. The laser diode 13 corresponds to 11a. In the second preferred embodiment of the present invention, the circuit board 2a may be a printed circuit board having a predetermined thickness, and further provided while the laser diode 13 is electrically connected to the circuit board 2a. The main body 11a is fixed thereto.

The laser module 1a is provided with a plurality of steps 1132a near the inner edge of the front opening end 111a in the recess 1131a of the main body 11a to provide the airtight structure 15a to enclose the image lens 9 in the main body. Within 11a. The airtight structure 15a further includes a pressing ring 151a, a plurality of sealing rubber rings 152a, and a fixed pressing ring 154a. The fixing pressure ring 154a presses the sealing rubber ring 152a against the focusing lens 12a, and the image lens 9 is disposed on the fixing pressure ring 154a, and further uses the pressure ring 151a to seal another sealing ring 151a. The rubber ring 152a' is pressed into the step 1132a to fix the image lens 9 in the main body 11a, and penetrates the focusing lens 12a and the laser diode through the hollow of the fixing pressure ring 154a. 13 corresponds.

A screw hole 1141a is defined in the center of the main body 11a, and a screw hole 1141a is provided in the center of the fixing base 114a to provide a screw 1142a for screwing the main body 11a through the screw hole 1141a. One of the fixing holes 21a is preset on the circuit board 2a, so that the entire laser module 1a is fixed on the circuit board 2a.

In the second preferred embodiment of the present invention, the temperature control plate 17a is substantially U-shaped and disposed on the other side of the circuit board 2a to which the rear open end 112a of the main body 11a is coupled, and has a U shape. The two side walls 171a of the temperature control plate 17a respectively pass through one of the predetermined through holes 22a of the circuit board 2a, so that the two side walls 171a of the temperature control plate 17a protrude from the circuit board 2a and are located at the two sides of the main body 11a. On the side, the temperature control plate 17a is connected to one of the bottom walls 172a of the two side walls 171a to be attached to the circuit board 2a, and the laser diode 13 is temperature-controlled by the temperature control plate 17a.

Referring to FIG. 5, FIG. 6A and FIG. 6B, the third preferred embodiment of the present invention is different from the first preferred embodiment described above in that the airtight structure 15b of the laser module 1b. The utility model further comprises: a rubber ring 152b, a stopper rubber 153b, a rubber pad 155b, and a loading table 156b. When the focusing lens 12b is coupled to the inner wall 113b of the main body 11b, the focusing lens 12b is press-fitted into the concave step 1131b of the inner wall 113b by the sealing rubber ring 152b, and The sealing rubber ring 152b is embedded between the focusing lens 12b and the inner wall 113b, and further the effect of the waterproofing effect on the laser diode 13 located in the main body 11b.

The image lens 9 is press-fitted and fixed in one of the receiving grooves 1561b of the center of the stage 156b by the rubber pad 155b, and the stage 156b is disposed above the focusing lens 12b, and further the stage 156b is The main body 11b is nested in the cylindrical casing 14b, so that the laser beam projected by the laser diode 13 passes through the image lens 9 through the focusing lens 12b and passes through the rubber pad 155b. The hole 141b is projected to the outside.

In addition, the temperature sensing component 16 is located below the laser diode 13 and disposed under the circuit board 2b, and is electrically connected to the circuit board 2b. An annular heat-dissipating patch 3 is disposed on the circuit board 2b between the laser diode 13 and the circuit board 2b, and the conductive portion of the annular heat-dissipating patch 3 provides the conductive portion. The pins 131, 131' are electrically connected to the circuit board 2b.

However, the other side of the laser diode 13 is coupled to the circuit board 2b, and another heat dissipation patch 4 is disposed between the temperature control board 17 and the circuit board 2b, and the heat dissipation patch 4 is disposed. The two sides are respectively attached to the temperature control board 17 and the circuit board 2b and correspond to the heat dissipation patch 3, and the temperature sensing component 16 and the laser diode 13 are transmitted through the temperature control board. 17 to carry out the action of temperature control. In other words, the operating temperature of the laser diode 13 is transmitted to the temperature control plate 17 through the two heat dissipation patches 3, 4, respectively, for a faster heat conduction operation.

Referring to FIG. 7 , the fourth preferred embodiment of the present invention is different from the foregoing third preferred embodiment in that the laser module 1c further includes a light receiving diode 5 (Photodiode). The light receiving diode 5, that is, the light receiving diode or the light sensing diode, is disposed on the circuit board 2c and electrically connected to the circuit board 2c, and is located at the laser diode 13 and Between the boards 2c.

When the laser diode 13 is in normal operation, the laser diode 13 is electrically connected to the plurality of conductive pins 131 and 131' of the circuit board 2c to transmit a laser beam. Therefore, the laser beam is transmitted through the laser beam. The light receiving diode 5 is disposed under the laser diode 13 and located adjacent to the temperature sensing component 16 for detecting the laser beam optical power of the laser diode 13 during operation. Whether the output is working properly.

In summary, the laser module 1 is connected to a circuit board 2, and includes a cylindrical body 11, a focusing lens 12, a laser diode 13, and a housing 14. An airtight structure 15, a temperature sensing element 16, a temperature control plate 17, and an image lens 9. The main body 11 further includes a front open end 111, a rear open end 112, and an inner wall 113. A concave step 1131 is disposed on the inner wall 113 adjacent to the front open end 111. The airtight structure 15 further includes a pressing ring 151, a plurality of sealing rubber rings 152, and a stopper 153. The focusing lens 12 is coupled to the concave step 1131 in the front end 111 of the main body 11, and the gap between the focusing lens 12 and the concave step 1131 of the main body 11 is sealed by a rubber ring 152.

The laser diode 13 is coupled to the inner wall 113 of the main body 11 by the open end 112 of the main body and corresponding to the focusing lens 12, and further electrically connected to the circuit board 2. connection. The temperature sensing component 16 is disposed on the circuit board 2 and spans one of the copper pads 132 extending from the conductive pin 131 ′ below the laser diode 13 to make the laser diode The temperature control of the body 13 is more precise. The temperature control plate 17 is located below the laser diode 13 and the temperature sensing element 16 and is disposed at an opening 142 of the housing 14 , and the main body 11 is enclosed in the housing 14 . The laser diode 13 is temperature-controlled by the temperature control plate 17.

The inner wall 113 of the main body 11 and the outer periphery of the laser diode 13 are respectively provided with a tight fitting structure 18, and are respectively located at the outer periphery of the main body 11 and the inner edge of the through hole 141 of the housing 14 respectively. The other matching structure 19 is provided, so that the laser diode 13 can be axially displaced by the tight fitting structure 18 to be tightly inserted into the main body 11 , and further through the tight fitting structure 19 The main body 11 is embedded in the through hole 141 of the housing 14 , and the image lens 9 disposed on the housing 14 is disposed above the focusing lens 12 and located at the laser diode 13 . Projected laser beam path.

In an embodiment, the image lens 9 of the laser module 1a is disposed in the front open end 111a of the main body 11a and is coupled to the plurality of cards disposed in the front open end 111a. The step 1132a corresponds to the focusing lens 12a in the main body 11a. The circuit board 2a is a printed circuit board having a predetermined thickness, and when the laser diode 13 is electrically connected to the circuit board 2a, the main body 11a is further provided thereon.

In an embodiment, the airtight structure 15b of the laser module 1b further includes a rubber ring 152b, a rubber pad 155b, and a loading table 156b. The sealing rubber ring 152b is embedded between the focusing lens 12b and the inner wall 113b, thereby further achieving the waterproof effect of the laser diode 13. The image lens 9 is press-fitted and fixed in one of the receiving grooves 1561b of the center of the stage 156b by the rubber pad 155b, and the stage 156b is disposed on the focusing lens 12b, and the stage 156b is further The main body 11b is nested in the cylindrical casing 14b, so that the laser beam projected by the laser diode 13 passes through the image lens 9 through the focusing lens 12b and passes through the rubber pad 155b. The hole 141b is projected to the outside.

In one embodiment, the laser module 1c is disposed on the circuit board 2c by using a light receiving diode 5, and is located between the laser diode 13 and the circuit board 2c for detecting It is measured whether the optical power of the laser diode 13 is normally output.

The above-mentioned embodiments are not intended to limit the scope of application of the present invention, and the scope of the present invention should be based on the technical spirit defined by the content of the patent application scope of the present invention and the scope thereof. It is to be understood that the scope of the present invention is not limited by the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention.

1, 1a, 1b, 1c. . . Laser module

11, 11a, 11b. . . main body

111, 111a. . . Front open end

112, 112a. . . Rear open end

113, 113. . . Inner wall

1131, 1131a, 1131b. . . Concave step

1132a. . . Card order

114a. . . Fixed seat

1141a. . . Screw hole

1142a. . . Screw

12, 12a, 12b. . . Focusing lens

13. . . Laser diode

131. . . Conductive pin

132. . . Copper pad

14, 14b. . . case

141, 141b. . . Through hole

1411. . . Card order

142. . . Opening

15, 15a, 15b. . . Airtight structure

151, 151a. . . Pressure ring

152, 152', 152a, 152a', 152b. . . Sealing rubber ring

153, 153b. . . Sealing glue

154a. . . Fixed pressure ring

155b. . . Rubber mat

156b. . . Loading platform

1561b. . . Locating slot

16. . . Temperature sensing element

17, 17a. . . Temperature control board

171a. . . Side wall

172a. . . bottom

18. . . Tight structure

181. . . Rib

182. . . Guide slot

19. . . Tight structure

191. . . Guide slot

192. . . Rib

2, 2a, 2b, 2c. . . Circuit board

21a. . . Fixed hole

22a. . . perforation

3, 4. . . Cooling patch

5. . . Light receiving diode

9. . . Image lens

1 is an exploded perspective view of a first preferred embodiment of a laser module of the present invention.

2A is a perspective assembled view of a first preferred embodiment of the laser module of the present invention.

2B is a cross-sectional view showing a first preferred embodiment of the laser module of the present invention.

Figure 2C is a schematic view showing the position of the temperature sensing element of the first preferred embodiment of the laser module of the present invention.

FIG. 3 is an exploded perspective view of a second preferred embodiment of the laser module of the present invention.

FIG. 4A is a perspective assembled view of a second preferred embodiment of the laser module of the present invention.

4B is a cross-sectional view showing a second preferred embodiment of the laser module of the present invention.

FIG. 5 is an exploded perspective view of a third preferred embodiment of the laser module of the present invention.

Figure 6A is a perspective view of a third preferred embodiment of the laser module of the present invention.

Figure 6B is a cross-sectional view showing a third preferred embodiment of the laser module of the present invention.

Figure 7 is an exploded perspective view of a fourth preferred embodiment of the laser module of the present invention.

1. . . Laser module

11. . . main body

111. . . Front open end

112. . . Rear open end

113. . . Inner wall

1131. . . Concave step

12. . . Focusing lens

13. . . Laser diode

131, 131’. . . Conductive pin

14. . . case

141. . . Through hole

1411. . . Card order

142. . . Opening

15. . . Airtight structure

151. . . Pressure ring

152, 152’. . . Sealing rubber ring

153. . . Sealing glue

16. . . Temperature sensing element

17. . . Temperature control board

18. . . Tight structure

181. . . Rib

182. . . Guide slot

19. . . Tight structure

191. . . Guide slot

192. . . Rib

2. . . Circuit board

9. . . Image lens

Claims (28)

A laser module is connected to a circuit board, comprising: a main body, comprising: a front open end, a rear open end, and an inner wall; a focusing lens positioned at the front open end a laser diode is coupled to the inner wall of the main body by the pressing end of the main body and corresponding to the focusing lens, and further electrically connected to the circuit board. An image lens corresponding to the focusing lens; and an airtight structure for functioning the image lens to moisture. The laser module of claim 1, further comprising: a temperature sensing component, and a temperature control plate; the temperature sensing component is located below the laser diode and disposed at The circuit board is electrically connected to the circuit board, and the temperature control board is located below the laser diode and the temperature sensing component, and the laser diode is used to conduct the laser diode through the temperature control board. Temperature control action. The laser module of claim 1, comprising a housing, the sleeve being disposed outside the main body, and having a constant hole at one end of the housing and corresponding to the focusing lens, and One end is configured as an opening for receiving the body to extend into the housing; wherein a step is provided at the inner edge of the consistent hole of the housing to provide the image lens to be coupled therein, and the shell The system is made of heat-insulating plastic material. The laser module of claim 3, wherein the airtight structure further comprises: a pressure ring, a plurality of sealing rubber rings, and a stopper; wherein the sealing ring is used The rubber ring is tightened within the step, and the focusing lens is sealed between the lens and the body by another sealing rubber ring, and further the gap between the periphery of the body and the casing is further transmitted through the sealing rubber. Coating is applied to enclose the image lens within the housing. The laser module of claim 2, wherein the temperature control plate is a semiconductor refrigerator. The laser module of claim 1, wherein the image lens is a DIFF (Diffraction Optical Element) and a Holographic Optical Element (HOD). A laser beam projected by the laser diode is used to generate a predetermined pattern through the image lens. The laser module of claim 1, further comprising a light receiving diode, the light receiving diode system being located below the laser diode and disposed on the circuit board, And electrically connected to the circuit board for detecting the optical power of the laser diode. The laser module of claim 1, wherein the inner wall of the main body and the outer periphery of the laser diode are respectively provided with a tight fitting structure, the tight fitting structure comprising: a rib, And a guiding groove, wherein the guiding groove is embedded on the protruding rib, and is axially displaced from the main body on the rib, so that the laser diode is fixed to the main body and the focus is fixed The lens can be displaced to adjust the focal length using the tight fit structure. The laser module of claim 3, wherein a corresponding one of the outer periphery of the body and the inner edge of the through hole of the housing is respectively provided with a corresponding one of the tightly fitting structures. The method further includes: a guiding groove, and a rib; wherein the rib is embedded in the guiding groove and axially displaced from the main body in the guiding groove, so that the main body can be embedded in the housing . The laser module of claim 2, wherein the laser diode system has a plurality of conductive pins extending electrically connected to the circuit board, wherein the conductive lead of the laser diode housing is connected A foot pad extends along a bottom of the laser diode, and the temperature sensing component is placed on the copper pad to detect the temperature of the copper pad to further adjust the laser through the temperature control plate. The operating temperature of the diode. The laser module of claim 3, wherein the airtight structure further comprises: a rubber pad and a loading frame; wherein the sealing rubber ring is embedded in the focusing lens and the inner wall of the main body The image lens is press-fitted and fixed in one of the receiving grooves in the center of the stage by the rubber pad, and the stage is placed on the focusing lens, and the stage is further inserted into the main body. In the housing, the laser beam projected by the laser diode is projected to the outside through the image lens through the image lens and through the rubber pad. A laser module is connectable to a circuit board, comprising: a main body, comprising: a front open end, a rear open end, and an inner wall; a focusing lens is positioned to the front opening Inside the end; a laser diode is bonded to the inner wall of the body by the pressing end of the main body and corresponding to the focusing lens, and further electrically connected to the circuit board Connecting; an image lens disposed in the front open end and corresponding to the focusing lens; and an airtight structure enclosing the image lens within the body. The laser module of claim 12, wherein a plurality of steps are provided in the body near the inner edge of the front open end to provide the airtight structure to be coupled thereto. The laser module of claim 13, wherein the airtight structure further comprises: a pressure ring, a plurality of sealing rubber rings, and a fixed pressure ring; wherein the fixed pressure ring is a sealing rubber ring is pressed over the focusing lens, and the image lens is disposed on the fixing pressure ring, and the pressing ring is further used to press the other sealing rubber ring into the card step, so that The image lens is fixed in the body and corresponds to the focusing lens through the hollow of the fixing pressure ring. The laser module of claim 12, wherein a protrusion and a locator are provided on a periphery of the main body, and a screw hole is respectively arranged at a center of the fixing seat to provide a screw The rear open end of the main body is screwed into one of the fixing holes preset on the circuit board through the screw hole. The laser module of claim 12, further comprising: a temperature sensing component and a temperature control plate; the temperature sensing component is located below the laser diode and disposed at The circuit board is electrically connected to the circuit board, and the temperature control board is located below the laser diode and the temperature sensing element and disposed at the rear open end of the body. The temperature control plate controls the temperature of the laser diode. The laser module of claim 16, wherein the temperature control plate is a semiconductor refrigerator. The laser module of claim 12, wherein the image lens is a DIFF (Diffraction Optical Element) and a Holographic Optical Element (HOD). A laser beam projected by the laser diode is used to generate a predetermined pattern through the image lens. The laser module of claim 12, further comprising a light receiving diode, the light receiving diode system being located below the laser diode and disposed on the circuit board And electrically connected to the circuit board for detecting the optical power of the laser diode. The laser module of claim 12, wherein the inner wall of the main body and the outer periphery of the laser diode are respectively provided with a tight fitting structure, and the tight fitting structure comprises: a rib, And a guiding groove, wherein the guiding groove is embedded on the protruding rib, and is axially displaced from the main body on the rib, so that the laser diode is fixed to the main body and the focus is fixed The lens can be displaced to adjust the focal length using the tight fit structure. The laser module of claim 12, wherein the laser diode system has a plurality of conductive pins extending electrically connected to the circuit board, wherein the conductive lead of the laser diode housing is connected A foot pad extends along a bottom of the laser diode, and the temperature sensing component is placed on the copper pad to detect the temperature of the copper pad to further adjust the laser through the temperature control plate. The operating temperature of the diode. A laser module is connectable to a circuit board, comprising: a main body, comprising: a front open end, a rear open end, and an inner wall; a focusing lens is positioned to the front opening a housing, disposed outside the main body, at one end of the housing and corresponding to the focusing lens is provided with a constant hole, and the other end is set as an opening for receiving the main body Inserted into the housing; a laser diode is coupled to the inner wall of the body by a forced end at the rear end of the body and corresponding to the focusing lens, and further to the circuit The board is electrically connected; an image lens is disposed in the through hole and corresponding to the focusing lens; an airtight structure is disposed in the through hole and enclosing the image lens in the housing a temperature sensing element is disposed below the laser diode and disposed on the circuit board and electrically connected to the circuit board; a temperature control plate is located in the laser diode And below the temperature sensing element and disposed at the opening of the housing, and The main body is enclosed in the housing; and a light receiving diode is disposed below the laser diode and disposed on the circuit board and electrically connected to the circuit board for detecting the The optical power of the laser diode. The laser module of claim 22, wherein a card step is disposed at an inner edge of the through hole of the casing to provide the image lens to be coupled therein, and the casing is a heat-insulating plastic. And the gas-tight structure further comprises: a pressure ring, a plurality of sealing rubber rings, and a stopper; wherein the sealing ring is used to press the sealing rubber ring into the step, and Further sealing the focusing lens and the main body by another sealing rubber ring, further coating the gap between the periphery of the main body and the housing through the sealing glue, so that the image lens is sealed to the shell in vivo. The laser module of claim 22, wherein the temperature control plate is a semiconductor refrigerator. The laser module of claim 22, wherein the image lens is a DIFF (Diffraction Optical Element) and a Holographic Optical Element (HOD). A laser beam projected by the laser diode is used to generate a predetermined pattern through the image lens. The laser module of claim 22, wherein the inner wall of the main body and the outer periphery of the laser diode are respectively provided with a tight fitting structure, the tight fitting structure comprising: a rib, And a guiding groove, wherein the guiding groove is embedded on the protruding rib, and is axially displaced from the main body on the rib, so that the laser diode is fixed to the main body and the focus is fixed The lens can be displaced to adjust the focal length using the tight fit structure. The laser module of claim 22, wherein a corresponding one of the outer edge of the body and the inner edge of the through hole of the casing is respectively provided with a matching structure, the tight structure The method further includes: a guiding groove, and a rib; wherein the rib is embedded in the guiding groove and axially displaced from the main body in the guiding groove, so that the main body can be embedded in the housing . The laser module of claim 22, wherein the laser diode system has a plurality of conductive pins extending electrically connected to the circuit board, wherein the conductive lead of the laser diode housing is connected A foot pad extends along a bottom of the laser diode, and the temperature sensing component is placed on the copper pad to detect the temperature of the copper pad to further adjust the laser through the temperature control plate. The operating temperature of the diode.