1379920 ' 101年.06月06日核正替g頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明關於一種流體化床反應器，尤其涉及一種流體化 床預鍍反應器及預鍍方法。 【朱前技術】 [0002] 於電鍍工藝流程中，通常都需要對待鍍覆之工件進行多 步鍍前預處理，以提升鍍層之性能，其中，預鍍步驟係 電鍍工藝流程中最重要之鍍前預處理步驟之一。 [0003] 例如化學鍍鎳工藝，化學鍍鎳又稱無電解鍍鎳 € (Electroless Nickel Plating)，爲一自催化電鍍 (Autocatalytic Plating)工藝。化學錄鐘層不僅均勻 性良好、孔隙度小、耐腐蝕性能佳，而且還具有磁性， 因此被廣泛應用於飛機零件、汽車工業、石油、化學工 業、電子與計算機工業等方面。化學鍍鎳之工藝流程一 般爲：熱脫脂—酸活化—預鍍鎳—化學鍍鎳—清洗。因 爲化學鍍鎳係依靠先形成於工件表面之預鍍金屬鎳啓動 進行自催化反應，使鎳離子化學還原而鍍覆到工件上， 所以，預鍍鎳步騾係化學鍍鎳工藝流程中最重要之步驟 〇 [0004] 隨著科技進步與工業發展，特別係進入到微型化科技時 代以來，各種奈米或微米級材料之應用日益增多，更希 望這些材料可以結合性能良好之鍍層來擴展應用範圍。 因此，就需要對奈米或微米材料進行電鍍前之預鍍處理 。惟，目前之預鍍工藝，預鍍槽因電極設計之限制只可 以鍍覆大型工件，而對小型工件，尤其係奈米或微米級 0951071#單編號 A〇101 第4頁/共15頁 1013213375-0 Γ379920 |· 101年.06月06曰接正替‘英 粒子之疲覆則十分困難’甚至可以說無能爲力。 [0005] 有鑑於此，提供一種奈米或微米級微粒之流體化床預鍍 反應器及預鑛方法實為必要。 【發明内容】 [0006] 以下以實施例說明一種奈米或微米級微粒之流體化床預 鍍反應器及預鍍方法。 [0007] —種流體化床預鑛反應器，其包括一反應室、一陽極、 一陰極、及一多孔分佈擋板，該反應室底部開設有一鍍 # 液進口，用於通入預鍍液，該反應室上部側壁開設有一 溢流出口 ’用於預鍵液溢流出，該陽極、陰極及多孔分 佈擋板設置於該鍍液進口與該溢流出口之間的反應室中 ，該陽極緊附於該反應室内壁上，該陰極爲多孔狀電極 ，其與該陽極間隔一定距離並水平固定於該反應室内， 該多孔分佈擋板水平固定於反應室内，且位於該陽極與 該陰極之下方。 [0008] 一種微粒之流體化床預鍍方法，其包括以下步驟：提供 一流體化床預鍍反應器；將流體化床預鍍反應器中之陽 極與陰極分別與一直流電源之正極與負極相連；將待鍍 微粒放置於流體化床預鍍反應器之多孔分佈擋板上，通 入預鍍液形成流體化床；流體化床中之待鍍微粒與流體 化床預鍍反應器中之陰極接觸，於待鍍微粒表面形成預 鍵層。 [0009]相對于先前技術’所述流體化床預鍵反應器及預鍍方法 之優點在於：首先，突破了傳統預鍍槽設計與使用方法 095_@單編號 Α〇101 第5頁/共15頁 1013213375-0 1379920 [0010] 101年.06月06日修正替换頁 之限制，使得奈米與微米級之微粒亦可以簡單實現預鍍 ;其次，待鍍微粒於預鍍液流體之作用下流體化，形成 流體化床接觸陰極進行電鍍，不僅可以一次實現多個微 粒之預鍍，而且還可以形成均勻預鍍層。 【實施方式】 以下將以實施例說明一種微粒之流體化床預鍍反應器及 方法。 [0011] [0012] 請參閱圖1，為實施例一提供之流體化床預鍍反應器10， 其包括一反應室101、一陽極102、一陰極103、一多孔 分佈擋板104。 該反應室101形狀可以根據實際需要進行設計，本實施例 中反應室101爲一直立式圓筒狀反應室，其材質選自聚丙 烯、聚四氟乙烯、聚氣乙烯或陶瓷中之一種，並可加裝 不銹鋼外殼。該反應室101底部開設有一鍍液進口 105， 用於通入預鍍液。該反應室101上部側壁開設有一溢流出 口 106，用於預鍍液溢流出。陽極102、陰極103及多孔 分佈擋板104設置於鍍液進口 105與溢流出口 106之間的 反應室101中。 [0013] 該陽極102爲一環狀陽極或一陽極組，其緊附於該反應室 101内壁上。當陽極102爲一環狀陽極時，通過導線直接 連出到反應室101外。當陽極102爲一陽極組時，該陽極 組包括至少一個電極，其共同連接到同一根導線再連出 到反應室101外。該陽極102材質爲待鍍微粒30上所預鍍 之預鍍層金屬。以預鍍鎳爲例，該陽極102材質選用金屬 鎳。本實施例中，該陽極102爲一環狀陽極，通過導線21 09510718产單编號 A0101 第6頁/共15頁 1013213375-0 1379920 101 年 直接連出到反應室101外。 ~ [0014] 該陰極103爲一多孔狀電極。本實施例中，該陰極1〇3爲 網格狀多孔電極，請參閱圖2。陰極103之材質可以選自 金屬鈦、鉑或鈀，本實施例中選用鉑製作成網格狀電極 。該陰極103水平固定於該反應室1〇1内，與反應室1〇1 内壁相連，形成網格狀擋板。該陰極1〇3位於陽極1〇2上 方並與陽極102間隔一定距離，通過導線22連出到反應室 1 01 外。 • [0015] 該多孔分佈擋板104水平固定於反應室101内，與反應室 101内壁相連，且位於陽極102與陰極1〇3之下方，用於 放置待鐘微粒30以及均勻分佈進入到反應室ιοί中之預錢 液。該多孔分佈擋板104材質選自聚丙烯、聚四氟乙締、 聚氯乙烯及陶瓷_之一種。 [0016] 優選地’該流體化床預鍍反應器10還包括一絕緣墊圈1〇7 ’該絕緣墊圈107位於陽極1〇2與陰極103之間，用於防 • 止陽極102與陰極1〇3直接接觸而發生短路。該墊圈1〇7 材質爲絕緣材料，可選自橡膠或塑料》 [0017] 請參閱圖3，為實施例二提供之流體化床預鍍反應器2〇， 其與實施例一提供之流體化床預鍍反應器10結構上大致 相同’包括一反應室101、一陽極102、一陰極103、一 多孔分佈擋板1〇4、一鍍液進口 1〇5及一溢流出口 106。 陽極102、陰極1〇3及多孔分佈擋板1〇4設置於鍍液進口 105與溢流出口 1〇6之間的反應室1〇1中。不同之處在於 ’陰極103水平固定於該反應室ίο!内，與反應室1〇1内 09510718产單編號 A〇101 第7頁/共15頁 1〇13213375-〇 1379920 101年.06月06日梭正脊&頁 璧相連’其位於陽極102下方並與陽極102隔開一定距離 [0018] 本實施例以預鍍鎳爲例，提供之利用流體化床預鍍反應 器10對待鍍微粒30進行預鍍之方法，其具體實施步驟爲 [0019] 第一步，提供一流體化床預鍍反應器10。 [0020] 該流體化床預鑛反應器10包括一反應室101、一陽極102 、一陰極103、一多孔分佈擋板104。該反應室101底部 開設有一鍍液進口 105，用於通入預鍍液。該反應室1〇1 上部側壁開設有一溢流出口 106，用於預鍍液溢流出。陽 極102、陰極1〇3及多孔分佈擋板1〇4設置於鍍液進口 105 與溢流出口 106之間的反應室101中。該反應室101材質 可選自聚丙烯、聚四氟乙烯、聚氣乙烯或陶瓷中之一種 。本實施例中，反應室101爲一直立式圓筒狀反應室，材 質選用聚氣乙烯，加裝不銹鋼外殼，聚氣乙烯於化學預 鍍液溶液中呈惰性，確保了預鍍過程中，預鍍液中之鎳 離子不易於其表面還原沈積。 [0021] 第二步，將流體化床預鍍反應器1〇中之陽極102與陰極 103分別與一直流電源之正極與負極相連。 [0022] 所連接直流電源之電壓通常根據預鍍鍍層之種類以及預 鍍液之種類來決定。本實施例中，於待鍍微粒30表面預 鍍鎳，以氣化鎳溶液作爲預鍍液，因此選用1~5V之直流 電源® [0023] 第三步，將待鍍微粒30放置於流體化床預鍍反應器10中 1013213375-0 09510718#單编號A〇101 第8頁/共15頁 [0024] [0024] Γ379920 1101年06月06曰修正_百"| 形成流體化床 [0025] 首先，將待鍍微粒30放置於流體化床預鍍反應器10之多 孔分佈擋板104上。待鍍微粒30指粒徑爲奈米級或微米級 之微小粒子。 其次，將預鍍液以一定流速通過鍍液進口 105通入到流體 化床預鍍反應器10中，使待鍍微粒30流體化形成流體化 床0 [0026]1379920 '101年.06月06日核正定g页六, invention description: [Technical field of invention] [0001] The present invention relates to a fluidized bed reactor, and more particularly to a fluidized bed pre-plating reactor and Pre-plating method. [Pre-June Technology] [0002] In the electroplating process, it is usually necessary to perform multi-step pre-plating pretreatment on the workpiece to be coated to improve the performance of the coating. The pre-plating step is the most important plating in the electroplating process. One of the pre-processing steps. [0003] For example, an electroless nickel plating process, also known as electroless nickel plating (Electroless Nickel Plating), is an autocatalytic plating process. The chemical logging layer is not only uniform, has low porosity, good corrosion resistance, but also magnetic properties, and is therefore widely used in aircraft parts, the automotive industry, petroleum, chemical industry, electronics and computer industries. The process of electroless nickel plating is generally: thermal degreasing - acid activation - pre-nickel plating - electroless nickel plating - cleaning. Because electroless nickel plating relies on pre-plated nickel formed on the surface of the workpiece to initiate autocatalytic reaction, and nickel ion is chemically reduced and plated onto the workpiece. Therefore, the most important step in the pre-nickel nickel plating process is the electroless nickel plating process. The steps [0004] With the advancement of science and technology and industrial development, especially since the era of miniaturization technology, the application of various nano or micro-scale materials is increasing. It is hoped that these materials can be combined with the performance of the coating to expand the application range. . Therefore, it is necessary to perform pre-plating treatment on the nano or micron material before electroplating. However, in the current pre-plating process, the pre-plating tank can only be plated with large workpieces due to the limitation of the electrode design, and for small workpieces, especially the nanometer or micron grade 0951071# single number A 〇 101 page 4 / a total of 15 pages 1013213375 -0 Γ379920 |· 101 years. 06/06/06 It is very difficult to even replace the 'English particles' fatigue. It can even be said to be powerless. In view of this, it is necessary to provide a fluidized bed pre-plating reactor and a pre-mineralization method of nano or micron-sized particles. SUMMARY OF THE INVENTION [0006] Hereinafter, a fluidized bed pre-plating reactor and a pre-plating method of nano or micron-sized particles will be described by way of examples. [0007] A fluidized bed pre-mineral reactor comprising a reaction chamber, an anode, a cathode, and a porous distribution baffle, and a plating inlet is provided at the bottom of the reaction chamber for introducing pre-plating Liquid, an overflow outlet is formed in the upper side wall of the reaction chamber for pre-key overflow, and the anode, the cathode and the porous distribution baffle are disposed in a reaction chamber between the plating liquid inlet and the overflow outlet, the anode Adhering to the inner wall of the reaction chamber, the cathode is a porous electrode, which is spaced apart from the anode and horizontally fixed in the reaction chamber. The porous distribution baffle is horizontally fixed in the reaction chamber, and is located at the anode and the cathode. Below. [0008] A fluidized bed pre-plating method for microparticles, comprising the steps of: providing a fluidized bed pre-plating reactor; and connecting the anode and the cathode in the fluidized bed pre-plating reactor to the positive and negative electrodes of the DC power source, respectively Connected; the particles to be plated are placed on the porous distribution baffle of the fluidized bed pre-plating reactor, and the pre-plating solution is introduced to form a fluidized bed; the particles to be plated in the fluidized bed and the fluidized bed pre-plating reactor The cathode contacts form a pre-bond layer on the surface of the particles to be plated. [0009] Compared with the prior art, the advantages of the fluidized bed pre-bonding reactor and the pre-plating method are: first, breaking through the design and use of the conventional pre-plating tank 095_@单号Α〇101 Page 5 of 15 Page 1013213375-0 1379920 [0010] The limitation of the replacement page is corrected on October 06, 2006. The nano- and micro-scale particles can also be simply pre-plated. Secondly, the particles to be plated under the action of the pre-plating fluid The formation of a fluidized bed contact cathode for electroplating can not only achieve pre-plating of a plurality of particles at one time, but also form a uniform pre-plated layer. [Embodiment] A fluidized bed pre-plating reactor and method for microparticles will be described below by way of examples. [0012] Referring to FIG. 1, a fluidized bed pre-plating reactor 10 according to Embodiment 1 includes a reaction chamber 101, an anode 102, a cathode 103, and a porous distribution baffle 104. The shape of the reaction chamber 101 can be designed according to actual needs. In the embodiment, the reaction chamber 101 is a vertical cylindrical reaction chamber, and the material thereof is selected from one of polypropylene, polytetrafluoroethylene, polyethylene or ceramic. It can be fitted with a stainless steel housing. A plating inlet 105 is opened at the bottom of the reaction chamber 101 for introducing the pre-plating solution. An overflow port 106 is defined in the upper side wall of the reaction chamber 101 for pre-plating liquid overflow. The anode 102, the cathode 103, and the porous distribution baffle 104 are disposed in the reaction chamber 101 between the plating liquid inlet 105 and the overflow outlet 106. [0013] The anode 102 is an annular anode or an anode group attached to the inner wall of the reaction chamber 101. When the anode 102 is a ring-shaped anode, it is directly connected to the outside of the reaction chamber 101 through a wire. When the anode 102 is an anode group, the anode group includes at least one electrode that is commonly connected to the same wire and then connected out of the reaction chamber 101. The anode 102 is made of a pre-plated metal pre-plated on the particles 30 to be plated. Taking pre-nickel plating as an example, the anode 102 is made of metal nickel. In this embodiment, the anode 102 is a ring-shaped anode, which is directly connected to the reaction chamber 101 through a wire 21 09510718, a single number A0101, page 6 / a total of 15 pages 1013213375-0 1379920. [0014] The cathode 103 is a porous electrode. In this embodiment, the cathode 1〇3 is a grid-like porous electrode, see Fig. 2. The material of the cathode 103 may be selected from the group consisting of titanium metal, platinum or palladium. In this embodiment, platinum is used to form a grid electrode. The cathode 103 is horizontally fixed in the reaction chamber 1〇1 and connected to the inner wall of the reaction chamber 1〇1 to form a grid-like baffle. The cathode 1〇3 is located above the anode 1〇2 and spaced apart from the anode 102 by a wire 22 and connected to the outside of the reaction chamber 101. [0015] The porous distribution baffle 104 is horizontally fixed in the reaction chamber 101, is connected to the inner wall of the reaction chamber 101, and is located below the anode 102 and the cathode 1〇3 for placing the particles 30 to be uniformly distributed and entering the reaction. Pre-money liquid in the room ιοί. The material of the porous distribution baffle 104 is selected from the group consisting of polypropylene, polytetrafluoroethylene, polyvinyl chloride and ceramics. [0016] Preferably, the fluidized bed pre-plating reactor 10 further includes an insulating gasket 1 〇 7 '. The insulating gasket 107 is located between the anode 1 〇 2 and the cathode 103 for preventing the anode 102 and the cathode 1 〇 3 Short circuit occurs due to direct contact. The gasket 1〇7 is made of an insulating material and can be selected from rubber or plastic. [0017] Please refer to FIG. 3 , which is a fluidized bed pre-plating reactor 2 provided in the second embodiment, which is fluidized with the first embodiment. The bed pre-plating reactor 10 is substantially identical in structure 'comprising a reaction chamber 101, an anode 102, a cathode 103, a porous distribution baffle 1〇4, a bath inlet 1〇5, and an overflow outlet 106. The anode 102, the cathode 1〇3, and the porous distribution baffle 1〇4 are disposed in the reaction chamber 1〇1 between the plating liquid inlet 105 and the overflow outlet 1〇6. The difference is that the 'cathode 103 is horizontally fixed in the reaction chamber ίο!, and the reaction chamber 1 〇1 in the inside of the 09510718 production order number A 〇 101 page 7 / total 15 pages 1 〇 13213375 - 〇 1379920 101 years. 06 06 The Rizhao ridge & 璧 璧 '' is located below the anode 102 and spaced a distance from the anode 102. [0018] This example uses pre-nickel plating as an example, providing a fluidized bed pre-plating reactor 10 to be coated with particles. 30. A method of performing pre-plating, the specific implementation step of which is [0019] The first step is to provide a fluidized bed pre-plating reactor 10. [0020] The fluidized bed pre-mineral reactor 10 includes a reaction chamber 101, an anode 102, a cathode 103, and a porous distribution baffle 104. A plating inlet 105 is formed at the bottom of the reaction chamber 101 for introducing the pre-plating solution. An overflow outlet 106 is defined in the upper side wall of the reaction chamber 1〇1 for pre-plating liquid overflow. The anode 102, the cathode 1〇3, and the porous distribution baffle 1〇4 are disposed in the reaction chamber 101 between the plating liquid inlet 105 and the overflow outlet 106. The material of the reaction chamber 101 may be selected from one of polypropylene, polytetrafluoroethylene, polyethylene or ceramic. In the embodiment, the reaction chamber 101 is a vertical cylindrical reaction chamber, and the material is made of polystyrene, and a stainless steel outer casing is added. The polyethylene gas is inert in the chemical pre-plating solution to ensure the pre-plating process. The nickel ions in the plating solution are not easily deposited on the surface. [0021] In the second step, the anode 102 and the cathode 103 in the fluidized bed pre-plating reactor 1 are respectively connected to the positive electrode and the negative electrode of the DC power source. [0022] The voltage of the connected DC power source is usually determined according to the type of the pre-plated layer and the type of the pre-plating solution. In this embodiment, the surface of the particles 30 to be plated is pre-plated with nickel, and the vaporized nickel solution is used as a pre-plating solution. Therefore, a DC power supply of 1 to 5 V is selected. [0023] The third step is to place the particles 30 to be plated in a fluidized state. Bed pre-plating reactor 10 in 1013213375-0 09510718# single number A〇101 page 8 / total 15 pages [0024] [0024] Γ379920 1101 June 06曰 correction _ hundred "| forming a fluidized bed [0025] First, the particles 30 to be plated are placed on the porous distribution baffle 104 of the fluidized bed pre-plating reactor 10. The particles to be plated 30 refer to minute particles having a particle diameter of nanometer or micrometer. Next, the pre-plating solution is introduced into the fluidized bed pre-plating reactor 10 through the plating solution inlet 105 at a certain flow rate to fluidize the particles 30 to be formed to form a fluidized bed. [0026]
[0027] [0028] 當預鍍液由鍍液進口 105以一定流速進入到流體化床預鍍 反應器10中，預鍍液穿過多孔工件板104以及待鍍微粒30 間之空隙往上流動時，所有之待鍍微粒30被懸浮於往上 流動之預鍍液中’而呈現均勻之狀態，預鍍液與待鍍微 粒30間之摩擦力與待鍍微粒30所受之浮力與待鍍微粒30 之重量相等，從而得到十分均勻之待鍍微粒30之流體化 床。控制預鍍液之流速，使所形成待鍍微粒30流體化床 之床層高度與陰極103所處之高度相同，以使待鍍微粒30 能接觸到陰極103爲宜。 第四步’流體化床中之待鍍微粒3〇與流體化床預鍍反應 器中之陰極103接觸，於待鍍微粒30表面形成預鍍層。 隨著流體化床之形成，待鍍微粒3〇與陰極1〇3接觸時，待 鍍微粒30即作爲陰極1〇3之一部分，而待鍍微粒3〇又存在 於含欲鍍金屬離子之預鍍液中，配合陽極1〇2構成電鍍系 統，通入直流電後，就會於待鍍微粒3〇表面析出金屬。 本實施例中，待鍍微粒30於氯化鎳預鍍液中形成流體化 床，其接觸陰極103作爲陰極1〇3之一部分時，與環狀之 09510718^^^^ A0101 第9頁/共15頁 1013213375-0 1379920 陽極102以及氯化鎳預鍍液構成電鍍系統，通入直流電後 ，於待鍍微粒30表面析出金屬鎳》同時，可以收集從溢 流出口 106溢出之預鍍液進行循環利用。 [〇〇29] 上述流體化床預鍍反應器10對待鍍微粒3〇子進行預鍍之 方法’亦可以用於預鍍其他任何金屬鍍層，例如，銅、 金、銀等，但並不以此爲限》 [〇〇30] 上述流體化床預鍍反應器及方法之優點在於：首先，突 破了傳統預鍍槽設計與使用方法之限制，使得奈米與微 米級之微粒亦可以簡單實現預鍍；其次，待鍍微粒於預 鐘液流體之作用下流體化，形成流體化床接觸陰極進行 電鍍，不僅可以一次實現多個微粒之預鍍，而且還可以 形成均勻預鐘層。 [0031] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施方式，舉 凡熟悉本案技藝之人士，在援依本案發明精神所作之等 效修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 [0032] 圖1係實施例一之流體化床預鍍反應器示意圖。 [0033] 圖2係流體化床預鍍反應器之金屬網格狀陰極示意圖。 [0034] 圖3係實施例二之流體化床預鍍反應器示意圖。 [0035] 圖4係流體化床預鍍反應器預鍍方法流程圖。 【主要元件符號說明】 1013213375-0 [0036] 流體化床預鍍反應器：10、20 095麵产單编號Α〇101 第1〇頁/共巧頁 1379920 [0037] [0038] [0039] [0040] [0041] [0042] [0043][0028] When the pre-plating solution enters the fluidized bed pre-plating reactor 10 from the plating solution inlet 105 at a certain flow rate, the pre-plating solution flows upward through the porous workpiece plate 104 and the gap between the particles 30 to be plated. When all the particles to be plated 30 are suspended in the pre-plating liquid flowing upward, the state is uniform, the friction between the pre-plating solution and the particles 30 to be plated, and the buoyancy of the particles 30 to be plated are to be plated. The particles 30 are equal in weight, resulting in a fluidized bed of substantially uniform particles 30 to be plated. The flow rate of the pre-plating solution is controlled so that the height of the bed forming the fluidized bed to be plated 30 is the same as the height at which the cathode 103 is located, so that the particles 30 to be plated can be in contact with the cathode 103. The fourth step 'the particles to be plated 3 in the fluidized bed are in contact with the cathode 103 in the fluidized bed pre-plating reactor to form a pre-plated layer on the surface of the particles 30 to be plated. With the formation of the fluidized bed, when the particles to be plated 3〇 are in contact with the cathode 1〇3, the particles 30 to be plated serve as a part of the cathode 1〇3, and the particles 3 to be plated are present in the pre-containing metal ions. In the plating solution, the plating system is formed by the anode 1〇2, and after the direct current is applied, the metal is deposited on the surface of the particles to be plated. In this embodiment, the to-be-plated particles 30 form a fluidized bed in the nickel chloride pre-plating solution, and when the cathode 103 is contacted as a part of the cathode 1〇3, the ring-shaped 09510718^^^^ A0101 page 9/total 15 pages 1013213375-0 1379920 The anode 102 and the nickel chloride pre-plating solution constitute an electroplating system, and after the direct current is applied, the metal nickel is deposited on the surface of the particles 30 to be plated, and the pre-plating solution overflowing from the overflow outlet 106 can be collected for circulation. use. [〇〇29] The fluidized bed pre-plating reactor 10 described above may be used for pre-plating any other metal plating, such as copper, gold, silver, etc., but not The limit of the above fluidized bed pre-plating reactor and method is: First, it breaks through the limitations of the traditional pre-plating design and use method, so that nano and micro-scale particles can be easily realized. Pre-plating; secondly, the particles to be plated are fluidized under the action of the pre-clock fluid to form a fluidized bed contact cathode for electroplating, which can not only achieve pre-plating of a plurality of particles at one time, but also form a uniform pre-clock layer. [0031] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. The above-mentioned embodiments are only the preferred embodiments of the present invention, and those skilled in the art will be able to incorporate the equivalent modifications and variations of the invention in the spirit of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0032] FIG. 1 is a schematic view of a fluidized bed pre-plating reactor of the first embodiment. 2 is a schematic view of a metal grid-like cathode of a fluidized bed pre-plating reactor. 3 is a schematic view of a fluidized bed pre-plating reactor of the second embodiment. 4 is a flow chart of a fluidized bed pre-plating reactor pre-plating method. [Main component symbol description] 1013213375-0 [0036] Fluidized bed pre-plating reactor: 10, 20 095 face number Α〇 101 page 1 / page 1379920 [0037] [0039] [0043] [0043] [0043]
[0044] [0045] ..,. 101年.06月06日核正替換頁 > ' - 陽極：102 多孔分佈擋板：104 溢流出口 ： 1 0 6 導線：21、22 反應室：101 陰極：103 鍵液進口 ： 105 絕緣墊圈：107 待鍍微粒：30[0045] ..,. 101.06.06 Nuclear replacement page > ' - Anode: 102 Porous distribution baffle: 104 Overflow outlet: 1 0 6 Conductor: 21, 22 Reaction chamber: 101 Cathode: 103 key liquid inlet: 105 Insulation washer: 107 Particles to be plated: 30
095·#單編號 A0101 第11頁/共15頁 1013213375-0095·#单号 A0101 Page 11 of 15 1013213375-0