1379435 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種封裝結構，且特別是有關於一種 發光二極體的封裝結構。 【先前技術】 隨著發光二極體元件操作功率的增加，發光二極體封 裝結構的散熱設計也越來越重要。為使發光二極體發光時 所產生之熱可以順利自發光晶片排出，通常在晶片下方會 安裝一個金屬塊以吸附晶片發光所產生之熱。為了使散熱 效率可以提升，通常會安裝較大之金屬塊，因而造成封裝 體的體積增加，同時也使得發光晶片與外部電能連結的金 線也相對需要加長。上述封裝結構在激烈的溫度變化下， 往往會因過大的封裝材質間的熱膨脹係數差異，使金線容 易拉斷而導致信賴性的問題。 請參照第1圖，其繪示習知的一種高導熱發光二極體 封裝結構100的剖面圖。高功率發光二極體丨〇2固定於一 大金屬塊104上（提升散熱效率），並藉由兩金線ι〇6與兩邊 的引腳114連接。發光二極體1〇2接著以透明樹脂108封 裝’並加上光學透鏡Π〇,最後再以樹脂112包裝固定光學 透鏡110、金屬塊104及引腳114。就如同上一段文字所述， 當金屬塊104體積過大時，樹脂112與金屬塊1〇4或引腳 114之間的熱膨脹係數的差異，可能會使過長金線1〇6容易 拉斷而導致信賴性的問題。 5 13794351379435 IX. Description of the Invention: [Technical Field] The present invention relates to a package structure, and more particularly to a package structure of a light-emitting diode. [Prior Art] As the operating power of the light-emitting diode element increases, the heat dissipation design of the light-emitting diode package structure becomes more and more important. In order to allow the heat generated by the light-emitting diode to be smoothly discharged from the light-emitting chip, a metal block is usually mounted under the wafer to adsorb the heat generated by the light emitted from the wafer. In order to improve the heat dissipation efficiency, a large metal block is usually installed, which causes an increase in the volume of the package, and also requires a relatively long length of gold wire connecting the light-emitting chip to the external power. Under the severe temperature change, the above-mentioned package structure tends to cause the reliability of the gold wire due to the difference in thermal expansion coefficient between the oversized package materials. Referring to FIG. 1, a cross-sectional view of a conventional high thermal conductivity LED package structure 100 is shown. The high power LED 丨〇2 is fixed to a large metal block 104 (to improve heat dissipation efficiency), and is connected to the pins 114 on both sides by two gold wires 〇6. The light-emitting diode 1 2 is then packaged with a transparent resin 108 and an optical lens is applied thereto, and finally the optical lens 110, the metal block 104, and the leads 114 are packaged by the resin 112. As described in the previous paragraph, when the metal block 104 is too large, the difference in thermal expansion coefficient between the resin 112 and the metal block 1〇4 or the lead 114 may cause the excessively long gold wire 1〇6 to be easily broken. The problem that leads to reliability. 5 1379435
【發明内容】 因此本發㈣目的就是在提供— 結構’心心改善封裝結構的信賴，卜 的封裝 根據本發明之上述目的，提出_種高導孰發光 ^裝結構。此二極體封裝結構具有—金屬塊…高: 緣鍍層’其位置介於該金屬塊與其基板之間一光 體晶片固定於金屬塊上。發光二極體晶片具有兩傭= 以上的電極，此兩電極與金屬塊彼此分離，其中—電备盍 金屬塊以金線連接。兩個或兩個以上的⑽，位於該金屬 塊周圍，此引腳與金屬塊彼此分離，其中一個或_個以上 的引腳與該金屬塊以金線連接。—樹脂材料封裝及固定上 述7L件於金屬塊上。上述高導熱絕緣鍍層材質可以是鑽石 鍵膜、類鑽㈣膜、氣㈣、氧化㉝、氧化鉻、氧化石夕或 氮化梦的等絕緣材料。 由上述可知，應用本發明之高導熱發光二極體封裝結 構的改良結構，將發光二極體的其中一電極以金線連接至 承載的余屬塊’能同時減少連接兩電極的金線的拉斷機會 而增加其信賴性。 【實施方式】 如上所述’本發明提供一自第1圖之高導熱發光二極 體封裝結構的改良結構，將發光二極體的其中一電極以金 線連接至承載的金屬塊以減短金線長度，而且增加一高導 熱絕緣鍍層於金屬塊與成承載的基板之間。以下將配合較 佳實施例來詳細說明此高導熱發光二極體封裝結構。 6 1379435 请參照第2圖’其繪示依照本發明一較佳實施例的一 種高導熱發光二極體封裝結構的剖面圖。高功率發光二極 定於-大金屬塊204上，藉由金屬的高導熱的特 性將發光二極體202所產生的熱量經金屬塊2〇4傳導至一 連接之基板216。金屬塊204的材質可以是金、銀、銀合金、 銅、銅合金、16 '鋁、鋁合金、鎳、錫或鎂。本較佳實施 例與第1圖之實施例不同的是其中—電極2〇2b以金線2嶋 連接至金屬塊204,再連接至引腳214b。因此，兩段金線 206b都相對於第！圖之實施例縮短了。雖然，金線2〇6a 的長度並未较第1圖之實施例縮短，但只縮短一邊的金線 206b卻能同時帶來兩邊的金線2〇6a及金線2〇讣信賴性的 增加（較不易拉斷）。因為樹脂112與金屬塊1〇4或引腳114 之間的熱膨脹係數的差異·，在熱漲冷縮時對本較佳實施例 的金線206a及金線206b產生應力較小（相較於第1圖之實 施例），因此金線較不容易因疲勞破壞而拉斷。 雖然，上述貫施例是以兩個電極的發光二極體說明， 此封裝結構當然也適用於三個電極以上的發光二極體。將 發光二極體複數個電極的其中之一（或以上）以金線連接至 金屬塊，再連接至引腳。當然，引腳的數量也可以三根以 上。 打（金）線完成的發光二極體202加上光學透鏡21〇，接 著以透明樹脂材料208封裝。發光二極體202的位置能對 準光學透鏡210的光學軸心為較佳。上述光學透鏡21〇的 材質可以是PS(聚苯乙烯）、ABS(苯乙烯-丁二烯-丙烯酯）、 PMMA(聚甲基丙烯甲酯）、PC(聚碳酸酯）、環氧樹脂或玻 7 1379435 璃。樹脂材料212之功能為固定光學透鏡21〇、金屬塊2〇4 及引腳214a及214b。 為了使金屬塊204與基板216絕緣，一高導熱絕緣鑛 層205形成於金屬塊204與基板216的接觸面上（形成於金 屬塊204與基板216兩者之間）。此高導熱絕緣鍍層205除 了要具有電絕緣的特性外，還必需具有高導熱的特性。因 此，高導熱絕緣鍍層205適當的材料可以是例如鑽石鑛膜、 類鑽碳（Diamond like carbon)鍍膜、氮化鋁（Am)、氣化 鋁（A1203)、氧化鉻（Cr203)、氧化矽（Si02)或氮化矽（SiN4) 等材料® 由上述本發明較佳實施例可知，應用本發明之高導熱 發光一極體封裝結構的改良結構，將發光二極體的其中一 電極以金線連接至承載的金屬塊，能同時減少連接兩電極 的金線的拉斷機會而增加其信賴性。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與濁飾，因此本發明之保 護範圍當視後附之申請專.利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 此更明顯易懂’所附圖式之詳細說明如下： 第1圖係缘示習知的一種高導熱發光二極體封裝結構 的剖面圖；以及 第2圖係緣示依照本發明一較佳實施例的一種高導熱 8 1379435 發光二極體封裝結構的剖面圖。SUMMARY OF THE INVENTION Therefore, the purpose of the present invention is to provide a structure to improve the reliability of the package structure. According to the above object of the present invention, a highly conductive light-emitting structure is proposed. The diode package has a - metal block ... high: edge plating 'position between the metal block and its substrate. A photo wafer is attached to the metal block. The light-emitting diode wafer has two electrodes of more than **, and the two electrodes are separated from the metal blocks, wherein the metal blocks are connected by gold wires. Two or more (10) are located around the metal block, and the pins are separated from the metal blocks, and one or more of the pins are connected to the metal block by a gold wire. - Resin material encapsulation and fixing of the above 7L pieces on the metal block. The high thermal conductive insulating coating material may be an insulating material such as a diamond bond film, a diamond-like (four) film, a gas (four), an oxidation 33, a chromium oxide, an oxidized stone or a dream of nitriding. It can be seen from the above that with the improved structure of the high thermal conductivity LED package structure of the present invention, one of the electrodes of the light emitting diode is connected to the carrying residual block by a gold wire, which can simultaneously reduce the gold wire connecting the two electrodes. Pull off opportunities and increase their trust. [Embodiment] As described above, the present invention provides an improved structure of the high thermal conductivity light emitting diode package structure of the first embodiment, wherein one of the electrodes of the light emitting diode is connected to the metal block carried by the gold wire to shorten the length. The length of the gold wire is increased by a high thermal conductivity insulating coating between the metal block and the substrate being carried. The high thermal conductivity LED package structure will be described in detail below in conjunction with a preferred embodiment. 6 1379435 Please refer to FIG. 2, which illustrates a cross-sectional view of a high thermal conductivity LED package structure in accordance with a preferred embodiment of the present invention. The high-power light-emitting diode is positioned on the large metal block 204, and the heat generated by the light-emitting diode 202 is conducted to the connected substrate 216 via the metal block 2〇4 by the high thermal conductivity of the metal. The material of the metal block 204 may be gold, silver, silver alloy, copper, copper alloy, 16' aluminum, aluminum alloy, nickel, tin or magnesium. The preferred embodiment differs from the embodiment of Figure 1 in that the electrode 2〇2b is connected to the metal block 204 by a gold wire 2嶋 and then to the pin 214b. Therefore, the two gold lines 206b are relative to the first! The embodiment of the figure is shortened. Although the length of the gold wire 2〇6a is not shortened compared to the embodiment of the first figure, the gold wire 206b which shortens only one side can simultaneously increase the reliability of the gold wire 2〇6a and the gold wire 2〇讣 on both sides. (It is not easy to pull off). Because of the difference in thermal expansion coefficient between the resin 112 and the metal block 1〇4 or the lead 114, the stress on the gold wire 206a and the gold wire 206b of the preferred embodiment is less at the time of thermal expansion and contraction (compared to the first In the embodiment of Fig. 1, the gold wire is less likely to be broken due to fatigue damage. Although the above embodiment is illustrated by a two-element LED, the package structure is of course applicable to three or more LEDs. One (or more) of the plurality of electrodes of the light-emitting diode is connected to the metal block by a gold wire and then to the pin. Of course, the number of pins can be more than three. The light-emitting diode 202 completed by the (gold) wire is bonded to the optical lens 21, and then encapsulated with a transparent resin material 208. The position of the light-emitting diode 202 can be preferably aligned with the optical axis of the optical lens 210. The material of the optical lens 21A may be PS (polystyrene), ABS (styrene-butadiene-propylene), PMMA (polymethyl methacrylate), PC (polycarbonate), epoxy resin or Glass 7 1379435 glass. The function of the resin material 212 is to fix the optical lens 21A, the metal block 2〇4, and the leads 214a and 214b. In order to insulate the metal block 204 from the substrate 216, a highly thermally conductive insulating ore layer 205 is formed on the contact surface of the metal block 204 with the substrate 216 (formed between the metal block 204 and the substrate 216). This high thermal conductive insulating coating 205 must have high thermal conductivity in addition to electrical insulating properties. Therefore, suitable materials for the high thermal conductive insulating coating 205 may be, for example, diamond ore film, diamond like carbon coating, aluminum nitride (Am), vaporized aluminum (A1203), chromium oxide (Cr203), antimony oxide ( Materials such as SiO 2 or SiN 4 are known from the preferred embodiments of the present invention, and the improved structure of the high thermal conductivity LED package structure of the present invention is such that one of the electrodes of the LED is a gold wire. Connecting to the metal block of the load can simultaneously reduce the chance of breaking the gold wire connecting the two electrodes and increase the reliability. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and various modifications and changes may be made without departing from the spirit and scope of the invention. The scope of protection of the present invention is subject to the definition of the scope of the application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A cross-sectional view of a diode package structure; and a second diagram showing a cross-sectional view of a high thermal conductivity 8 1379435 light emitting diode package structure in accordance with a preferred embodiment of the present invention.
【主要元件符號說明】 100 ： 發光二極體封裝結構 202a/202b :電極 102 ： 發光二極體 204 :金屬塊 104 ： 金屬塊 205 :高導熱絕緣鍍層 106 ： 金線 206a/206b :金線 108 ： 樹脂材料 208 :透明材料 110 ： 光學透鏡 210 :光學透鏡 112 ： 樹脂材料 212 :樹脂材料 114 ： 引腳 214a/214b :引腳 200 ： 202 ： 發光二極體封裝結構 發光二極體 216 :基板[Main component symbol description] 100 : Light-emitting diode package structure 202a/202b: Electrode 102: Light-emitting diode 204: Metal block 104: Metal block 205: High thermal conductive insulating coating 106: Gold wire 206a/206b: Gold wire 108 : Resin material 208 : Transparent material 110 : Optical lens 210 : Optical lens 112 : Resin material 212 : Resin material 114 : Lead 214a / 214b : Pin 200 : 202 : Light-emitting diode package structure Light-emitting diode 216 : Substrate