TWI373521B - Mold cleaning composition - Google Patents

Description

丄 373521 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a mold cleaning composition, which is a mold cleaning material for mold cleaning, renewal, and the like, and the mold beans are: A mold for a thermoplastic resin composition forming material which has been repeatedly contaminated by a molding work, in particular, the mold cleaning material is used for mold cleaning, updating, and the like of a mold for transfer molding, and the mold is used for the mold. Molding work for molding a semiconductor element by transfer molding using an epoxy resin molding material [Prior Art] For a conventional mold cleaning method, it is known to perform mold cleaning work by detaching a mold from a molding apparatus. Methods such as sand blasting, spray drying, water spray and strong alkali cleaning. However, in the case where the mold is cleaned by detaching the mold from the molding apparatus, the work requires a long working time and requires a lot of labor. Therefore, more and more methods for performing cleaning work in the case where the mold is mounted on the molding apparatus, a cleaning method using melamine resin, a cleaning method using ultraviolet irradiation, a cleaning method using a sheet-like cleaning composition, and the like are increasingly used. A similar method has been carried out as the cleaning method. Where 'has been performed by thermally curing the sheet-like cleaning composition placed in the mold and removing the cured sheet-like cleaning composition to transfer contaminants to the cured sheet-like cleaning composition from the mold. The mold cleaning method for contaminants has excellent working efficiency due to the method. For the sheet-like cleaning composition, for example, a mold cleaning composition using an unvulcanized rubber can be mentioned (see Patent Document 丨). Further, a sheet-like base material can be mentioned. 121307.doc 1373521 A mold-cleaning material coated with a compound which can be shaped for cleaning (see Patent Document 2). Patent Document 1: JP-A-9-262843 Patent Document 2: JP-T-63-502497 SUMMARY OF THE INVENTION However, a sheet-like cleaning composition is used and contaminants are transferred to the sheet-like cleaning composition to be moved. There is a problem with mold cleaning methods other than contaminants: • Depending on the shape and size of the cavity of the mold, air is contained in the cavity during the molding process and air accumulates at the corners of the cavity, causing the sheet-like cleaning composition to fail to fill. In the corner _ condition, resulting in insufficient removal of contaminants. For example, with respect to the mold cleaning composition disclosed in jp-A-9-262843, it is necessary to leave the upper and lower molds slightly during the clamping process to leave a gap of about mm to 1.5 mm to prevent rubber. After the sheet is thermally vulcanized in the mold, the rubber sheet is cut during the process of removing the rubber sheet, and the rubber sheet is prevented from remaining in the mold. However, in a cavity having a mold cavity of a small size and a large depth, air is trapped in the corner of the cavity, resulting in the formation of an unfilled portion. Therefore, there is a problem that the contaminants at the unfilled portion are not sufficiently removed. Similarly, in the case of the mold cleaning material disclosed in jp_T_502497, since the entire surface of the cavity is covered, the trapped air cannot overflow from the cavity to form an unfilled portion, resulting in insufficient removal of contaminants at the unfilled portion. problem. Therefore, since it is not suitable to use the sheet-like cleaning composition in the mold facing the above problems, a cleaning method different from the use of the sheet-like cleaning composition is employed for the molds. However, as described above, other cleaning methods take a long time' and a large amount of labor is actually unaffordable. 121307.doc 1373521 The present invention has been achieved in view of the above circumstances, and an object of the present invention is to provide a mold cleaning composition which has excellent mold filling properties and achieves an excellent contaminant cleaning effect in a mold. [Embodiment] In order to achieve the above object, the mold cleaning composition of the present invention is a cleaning composition for a mold which is used for molding a molding material, which contains an unvulcanized rubber as a basic component, and is cleaned. And a vulcanizing agent according to the measurement by gel permeation chromatography (GPC), the cleaning composition as a whole and having a weight average molecular weight (Mw) 设 in the range of 2 〇〇, 0 〇〇 to 460,000 The inventors of the present invention have conducted intensive studies to obtain a satisfactory filling of the mold in the mold cleaning operation using the mold cleaning composition by preventing the formation of an unfilled portion which is additionally caused by air trapping. Each part of the cavity, as well as the cleaning that effectively removes contaminants in the mold cavity! The inventors focused on the filling performance of the mold cavity and conducted a series of studies on the fluidity of the cleaning composition capable of minimizing air trapping during the process of filling the cleaning composition into the mold cavity. More specifically, in order to enhance the filling performance of the mold cavity, it is necessary to obtain a flow in which the air can be minimized during the process of cleaning the composition, and it is necessary to reduce the mold during the molding process. The gap is to increase the internal pressure of the mold cavity. In view of the matching performance of the mold cavity, the cleaning composition may preferably have a low viscosity, but when the viscosity is too low, the internal pressure of the mold cavity is lowered during the molding process, and the air may not be trapped. This results in the formation of an unfilled port P. On the other hand, when the viscosity of the cleaning composition is too high, the fitting property to the mold cavity 121307.doc 1373521 is deteriorated, resulting in easy formation of an unfilled portion. Based on the above findings, the inventors conducted further studies to obtain a cleaning composition having an appropriate viscosity, and found that the weight average molecular weight (Mw) was within the above specified range according to the measurement by gel permeation chromatography (GPC). The cleaning composition can have an appropriate viscosity and good filling properties, thereby realizing the present invention. That is, the present invention relates to the following items.

(1) A mold cleaning composition comprising an unvulcanized rubber, a detergent, and a vulcanizing agent, wherein the cleaning composition as a whole has a range of 200,000 to 460,000 according to a measurement by gel permeation chromatography (Gpc) Weight average molecular weight (Mw). (2) The mold cleaning composition according to (1), wherein the cleaning composition as a whole has a weight average in the range of 22 〇〇〇〇 to 43 0,000 according to the measurement by gel permeation chromatography (GPC). Molecular weight (mw) β (3) The mold cleaning composition of (1) or (2), which is in the form of a sheet or a belt.

(4) The mold cleaning composition according to any one of (1) to (3), wherein the cleaning agent is at least one member selected from the group consisting of glycol ether, imipenem, imidazole, and amine group. alcohol. (5) The mold cleaning composition according to any one of (1) to (4), wherein the detergent is contained in an amount of from 1 to 6 parts by weight based on 100 parts by weight of the unvulcanized rubber. (6) The mold cleaning composition according to any one of (1) to (5), which further comprises water in an amount of from 1% by weight to 20% by weight. (7) The mold cleaning composition according to any one of (1) to (6), further comprising 121307.doc comprising a mold release agent, such as a mold cleaning composition of (1) to (7) t-, and wherein the mold is The fourth (4) is that a plurality of linear slits are disposed on the surface of the sheet in parallel with each other in the direction of the limbs. J9) The mold cleaning composition of (8), wherein the gaps are set such that the sheet mold cleaning composition can be folded. (10) The mold cleaning composition of (8), wherein the slits are disposed such that the sheet mold cleaning composition can be cut along the slits. (11) A mold cleaning composition according to any of (1U (1G), which is a cleaning composition for a mold for reversing thermoforming to mold a material. As described above, the mold cleaning composition of the present invention Containing unvulcanized rubber, detergent and vulcanizing agent as essential components, and based on the measurement by gel permeation chromatography (^), the weight average molecular weight (Mw) is within the range of the buckle. The cleaning composition has an appropriate viscosity and achieves excellent properties of filling in a mold. When the mold surface is cleaned by using the mold cleaning composition of the present invention, the mold cavity is filled with the mold cleaning composition. Allowing contaminants on the surface of the mold to adhere to the mold cleaning composition, thereby effectively removing contaminants and mold cleaning composition from the mold integrally. For example, the molding for molding the semiconductor element is formed. The mold on the surface of the mold (which has been used in the molding using the epoxy resin composition) is combined with the mold prepared by the mold cleaning composition to be effectively removed from the mold. In the article, the mold cleaning can be performed efficiently. Therefore, the semiconductor device formed by using the mold cleaned by the mold cleaning composition of the present invention has an excellent appearance. 121307.doc 1373521 The mold cleaning composition is in the form of a sheet or a belt. In this case, the mold cleaning composition may be easily positioned to clean the mold cavity. Further, it is possible to obtain an excellent mold cleaning effect by using a glycol ether, an imidazole, an imidazoline or an amino alcohol as a cleaning agent. When the cleaning composition contains 1% by weight to 2% by weight of water, it is possible to obtain more excellent cleaning performance. When the mold cleaning composition is molded to be in the form of a sheet and has a plurality of settings on the surface of the sheet In the case of a linear slit in one direction, it may be easily stacked by folding the sheet along the slits. In this case, since the respective block segments separated by the parallel slits are at portions below the slits Connected to each other, so the sheets can be stacked neatly without dislocation during the folding process, and the individual block segments do not intersect or appear similarly when stacked Therefore, the resulting stacked shape is regular. By using a neatly stacked sheet-like cleaning composition to clean the mold, it is possible to eliminate cleaning defects caused by, for example, insufficient pressure contact between the unvulcanized rubber and the mold surface. The size of the sheet is measured to cut the sheet into pieces of the same size, and complicated work of aligning the cut pieces is not necessary for stacking, so that the cleaning work may be simplified. - In addition, when the mold cleaning composition is in the form of a sheet And especially on the surface of the sheet • having a plurality of linear slits disposed in one direction to cut the sheet mold cleaning composition along the slits, the sheet may be easily cut to fit a regular smaller mold size. An embodiment of the present invention will be described. The mold cleaning composition of the present invention as a whole has a specific weight average molecular weight of 121307.doc 1373521 dilute or a mixture thereof. The Mooney viscosity of the butadiene rubber (Mooney viSC〇Sity) ML1+4 (i〇〇t) may be from 20 to 80, more preferably from 35 to 60. It is preferred to use a butadiene rubber having a weight average molecular weight (Mw) of 200,000 to 60 Å, hydrazine, more preferably 400,000 to 6,000 Å. Examples of the detergent include glycol ethers, imidazoles, imidazolines, and amino alcohols. These detergents may be used singly or in combination of two or more of them. The above glycol ether is a compound represented by the following formula (丨):

Ri 0 CHi 0^· a Rj · (1) 0 (In the formula (1), n is a positive integer, and each of the core and the rule 2 is hydrogen or an alkyl group. When one of Ri and R2 is hydrogen The other one is an alkyl group. When both the heart and the heart are alkyl groups, 'R! and r2 may be the same or different.) Examples of the glycol ether represented by the formula (1) include ethylene glycol dimethyl ether, diethyl Diol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dioxime ether, polyethylene glycol dimethyl sulfonate, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol two

B, ethylene glycol monoterpene ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether. These glycol ethers may be used singly or in combination of two or more of them. In the above glycol ether represented by the formula (1), it is preferred to use a repeating number of 11 to 1 and 2, and one of Ri and Rz is an alkyl group having 1 to 4 carbon atoms while the other is gas. a glycol ether; or a repeating number n of 1 to 2 and which is a group having 1 to 4 carbon atoms when both the center and the heart are alkyl groups. Herein, in the case where the repetition number η is 3 or more, the compatibility with the rubber is deteriorated. Further, in the case where the number of carbon atoms in the alkyl group is 5 or more, the permeability to the oxidative degradation demolding 121307. doc layer or the like is deteriorated. The boiling point of the glycol ether may preferably be from about 130 ° C to 250 ° C. More specifically, since the mold is usually molded at 150 ° C to 185 ° C, when the boiling point of the glycol ether is lower than 13 〇 < t, the evaporation during the cleaning process is very fast and the cleaning work environment is cleaned. Degraded in some cases. When the boiling point exceeds 25 Torr, evaporation becomes difficult to cause the glycol ether to remain in the vulcanized rubber, so that the strength of the vulcanized rubber after cleaning is lowered and the vulcanized rubber may be broken or the like after the cleaning composition is taken out from the mold. Therefore, it is difficult to satisfactorily peel the oxidative degradation release agent layer or the like from the mold surface, resulting in a tendency to reduce the cleaning work efficiency. In use, each glycol ether can be used as it is or in combination with water such as hydrazine: an alcohol of ethanol and n-propanol or an organic solvent such as toluene and xylene. In the case of mixing the glycol ether with an organic solvent, the amount of the organic solvent is preferably 50 parts by weight or less, more preferably 20 parts by weight or less, per 100 parts by weight of the glycol ether. Good results can be obtained by using the rice shown in the following formula (2) as the above-mentioned mic:

R R

(1) each R' in 弋() is H, has a substituent and has 1 or 1 unit of a linear hydrocarbon group having an atom, a linear hydrocarbon group having no substituent and having one or more carbon atoms, or Aryl groups, and R, may be the same or different. 12 J307.doc μ Examples of such saliva include 2-methyl oxime, 2-ethyl 4-methyl oxazole, 2-phenyl odor saliva, q-卞 & -2-methylimidazole and 2 4 · Diamino _6 [2, _ methyl imidazolyl ' (1) 乙 B its L ς = π Α ^ - well. These imidazoles may be used singly or in combination of two or more thereof. Good results can be obtained by using the imidazoline represented by the following formula (3) as the above imidazoline:

(In the formula (3), 'each R' is an anthracene, a linear hydrocarbon group having a substituent and having 1 or less carbon atoms, a substituent having no substituent and having 1 or less carbon atoms a linear hydrocarbon group of an atom, or an aryl group, and R, which may be the same or different.) Examples of the porphyrin include 2-mercaptoimidazoline, 2·methyl-4-isoimidazoline, 2-phenylimidazoline, 丨-benzyl-2-methylimidazoline, 2_phenyl_4_ Methyl 5-hydroxymethylimidazoline, 2,4-diamino- 6 [2,-methylimidazolidinylethyl-s-trin, 2,4-diamino] 6 [2,- Methyl-4,-imidazolinyl-(1),]ethyl·s_di-p well, 1-cyanoethyl-2-methyl-tauline and 1-cyanoethyl-2-methyl_ 4-ethylimidazoline. These imidazolines may be used singly or in combination of two or more of them. As in the case of the glycol ether, in use, the taste is saliva. Each of the rice sages may be used as it is or mixed with an alcohol such as decyl alcohol, ethanol and n-propanol or an organic solvent such as toluene and dimethyl stearate. In the case where imidazole is mixed with an alcohol or an organic solvent, the amount of the alcohol or the organic solvent is preferably set to 50 by weight with respect to at least one of 1 part by weight of the imidazole and the oxazoline 12l307.doc • 14-. Parts or less, more preferably 20 parts by weight or less. For the above amino alcohol, the following amino alcohol can be used to obtain a good effect. Representative examples of the amino alcohol include monoethylamine, diethylamine, triethylamine, N-methylethylamine, N,N-dimercaptoethanol, ν, Ν·dibutyl Amine alcohol, hydrazine, hydrazine-diethylethylamine, hydrazine-methyl-hydrazine, hydrazine-diethylamino alcohol, 2-amino-2-methylpropanol, 3-aminopropanol and 2-amine Propyl alcohol. These amino alcohols may be used singly or in combination of two or more. As in the case of the above other detergents, in use, the amino alcohol may be used as it is or in combination with an alcohol such as methanol, ethanol and n-propanol or an organic solvent such as benzene and hydrazine. In the case where the alcohol amine is mixed with an alcohol and or an organic solvent, the amount of the alcohol or the organic solvent may be preferably 50 parts by weight or less, more preferably 20 parts by weight or less based on 100 parts by weight of the amino alcohol. less. The content of the detergent (glycol ether, imidazole, imidazoline or amino alcohol) may preferably be from 1 part by weight to part by weight, more preferably from 15 parts to 25 parts by weight, per 100 parts by weight of the unvulcanized rubber. Within the scope. When the content of the detergent is less than 10 parts by weight, it is difficult to exhibit a satisfactory cleaning effect on the mold. When the content of the detergent exceeds 6 Å by weight in the case where the mold is cleaned by using the thus obtained mold cleaning composition, the composition adheres to the mold, thereby lowering the work efficiency of peeling the composition from the mold. The vulcanizing agent is not limited, and a conventional vulcanizing agent can be used. Examples of vulcanizing agents include sulfur and organic peroxides such as n-butyl-4,4•bis(t-butylperoxy)valerate and U-di(t-butylperoxy)3,3. , 5_ 三曱基121307.doc 1373521 环己烧. These vulcanizing agents may be used singly or in combination of two or more thereof. The vulcanizing agent may be preferably contained in an amount of from 1 part by weight to 3 parts by weight per 100 parts by weight of the unvulcanized rubber. Further, the mold cleaning composition of the present invention may contain, in addition to the unvulcanized rubber, the cleaning agent and the vulcanizing agent, a release agent, a reinforcing agent and the like.

The release agent is not particularly limited' and a conventional release agent can be used. Examples of the release agent include: long-chain fatty acids such as stearic acid and behenic acid; metal salts of long-chain fatty acids are represented by zinc stearate and calcium stearate; Partially saponified vinegar of carnauba wax, montan wax and montanic acid; long-chain aliphatic decylamine, represented by stearyl ethylenediamine; and paraffin wax, represented by polyethylene wax.

The content of the releasing agent may preferably be in the range of 1% by weight to 1% by weight based on the total weight of the mold cleaning composition. When the content of the release agent is less than i weight ° /. It is difficult to demonstrate sufficient release effect. When the content exceeds 1% by weight, the cleaning ability may be lowered and the appearance of the molded article manufactured by using the mold after repeated use is affected. Examples of the reinforcing agent include inorganic reinforcing agents (fillers) such as cerium oxide, aluminum oxide, carbon black, calcium carbonate, calcium silicate, aluminum hydroxide, titanium oxide, and titanium oxide. The content of the reinforcing agent may preferably be in the range of 10 parts by weight to 50 parts by weight based on 100 parts by weight of the unvulcanized rubber. Further, when the cleaning composition contains an unvulcanized rubber paste as a base material, water may be added to the undeuterated rubber. The water content can preferably be set relative to the total weight of the mold cleaning composition! Range of % by weight to 2% by weight 121307.doc 16 1373521 Internal 0 The mold cleaning composition of the present invention can be produced, for example, as follows. The unvulcanized rubber, detergent, vulcanizing agent and other additives used as the base material are mixed, and the mixture is kneaded by a batch type kneader, and then formed into a sheet or a belt by using an extruder or a roller. This obtains a mold cleaning composition. In the case where the mold cleaning composition is used in the form of a sheet, the thickness of the sheet is usually set to 3 mm to 1 mm. _ The weight average molecular weight of the mold cleaning composition thus obtained (the river) must be adjusted to 200, 〇〇〇 to 46 〇, 〇〇〇, which is measured by gel permeation chromatography (GPC). The weight average molecular weight (Mw) thereof is particularly preferably from 430 to 〇00. When - less than 2 〇〇, 黏, the viscosity of the mold cleaning composition is reduced, and during the molding process, the pressure overflows from the mold gap, so that the mold cleaning composition cannot be dispersed in various parts of the mold because the inside of the mold cavity The pressure is reduced, resulting in the formation of an unfilled portion. When its Mw exceeds 460,000, the viscosity of the mold cleaning composition is increased to reduce the mold cleaning _ composition and mold cavity compatibility, resulting in the formation of unfilled portions. (For example) GPC measurement is performed as described below. The resulting mold cleaning composition was immersed in a gas embossing and allowed to stand for 3 days. Next, the gas-soluble soluble portion is heated on the hot plate to dry and solidify. The resulting dried and solidified material was adjusted to stand overnight by using a 0.1% by weight tetrahydrofuran, (THF) solution. Next, the solution is filtered by using a 0.45 μπι membrane filter, and the Gpc amount is measured on the filtrate under predetermined conditions by using a predetermined analyzer. In the PC measurement, the solvent used is not limited to the solution and may be based on the amount. The composition of the object cleaning composition is appropriately selected. 121307.doc: The cleaning composition may preferably have a light color, such as white and near white color. By adjusting the color, after the mold is cleaned, it may be easily removed from the mold and adhered to the mold after the mold is cleaned. The cleaning composition thereby achieves an effect that the mold cleaning state can be easily determined.

In the case of using the mold cleaning composition of the present invention, it is preferred to use a mold-molded mold to clean the composition. When using a sheet mold to clean the composition, it is suitable to use the surface of the sheet as shown in Fig. 2 by using the <1 mold cleaning (4) for the ease of mold cleaning work and the like. The linear slits 11 are disposed at predetermined intervals and in parallel with each other such that the sheets 10 are foldable. More preferably, the sheet 1 has a sheet surface with a striped pattern. By folding the sheets 10 using the slits 11, it is possible to stack the sheets 10 neatly.

The sheet 10 having the slits 11 can be manufactured as follows. The rolled sheet obtained as described above is cut into a predetermined shape and size to obtain a sheet 10, and a formation of a slit U ^ slit is formed on the surface of each sheet 10 (for example, as shown in FIG. 2) The use of a ribbon slitter is attached to the rotary shaft 12, and the cutting blade 13 is moved from the upper surface of the sheet 1 in the lateral direction of the sheet 1 A predetermined depth is inserted into the sheet 1 to form slits parallel to each other. By repeating the above operation, the slits 11 which are disposed at a strange pitch and which are disposed in parallel with each other are formed on the entire upper surface of the sheet 10. The sheet 10 is divided into the block segments 10a of the same size via the slit u. Since the slits 11 are formed at a constant pitch, when the sheets are folded, the slits have a scale function, so that the sheets 10 may be cut or folded depending on the size of the mold or cavity to be cleaned. 121307.doc • 18 · 1373521 Furthermore, as shown in Fig. 3, the distance D between the end of each slit u and the sheet surface facing the end of the slit u can preferably be set to about Oi mm to 0.8 mm, Good for about 0.2 and to 〇5 with. When the distance is smaller than the 〇" face, the block segments 10a tend to be easily separated, and when the distance exceeds 〇 8 claws, the folding is less smooth. The method of cleaning the mold by using the mold-forming mold cleaning composition of the present invention is carried out on a mold to be used for molding a semiconductor device. For example, a sheet in an unvulcanized state is placed in a mold and then thermally vulcanized to cause the contaminants to adhere integrally to the sheet. The mold is then cleaned by removing the vulcanized sheet from the mold. The mold cleaning method using the sheet mold cleaning composition will be described in detail below based on the sequence of events. The preparation begins with the preparation of the sheet mold cleaning composition of the present invention. Next, as shown in FIG. 4, the sheet-shaped mold cleaning composition 1 is placed between the upper mold 1 in which the depression is formed and the lower mold 2 in which the depression is formed, and as shown in FIG. The upper mold 1 is clamped with the lower mold 2 to sandwich the sheet-shaped mold cleaning composition 1 therein for pressure molding. The sheet 10 is filled in a recess 3a formed in the upper mold 1 and formed in the lower mold 2 The pressure formed in the cavity 3 formed by the recess 31 is brought into pressure contact with the surface of the mold. In this state, the heat for molding thermally vulcanizes the unvulcanized rubber into vulcanized rubber, thereby forming the cavity 3. The oxidative degradation release agent layer and the like are combined with the vulcanized rubber. In some cases, the burrs around the cavity 3 are also combined with the vulcanized rubber. Next, as shown in FIG. 6, after a predetermined period of time, the upper mold 1 is opened. The lower mold 2 is peeled from the upper mold 1 and the lower mold 2 to form a vulcanized rubber sheet 121307.doc -19. The mold cleaning the resultant 10, whereby the surface of the lower mold 2 is peeled off from the upper mold 2 and bonded to the sheet 10. Oxidative degradation layer and its similar layer. For the sheet mold cleaning composition, it is possible to use a plurality of linear slits 11 formed at a predetermined pitch and parallel to each other on the sheet surface as shown in Fig. 1 to make the sheet 1 foldable sheet mold cleaning composition. In the case of using the sheet-like cleaning composition, as shown in Fig. 7, a desired number of block segments i 〇a are cut from the sheet along the slit 11. The sheet 10 can be picked up by fingers and repeatedly folded along the slit U or This cutting is performed by using a knife or the like. Then, as shown in Fig. 8, the sheet bundle is folded along the slit, wherein the upper surface of the sheet 10 (the surface on which the slit 11 is formed) faces outward (here) The four block segments 10a) are cut in Fig. 8, and the sheets 1〇 are continuously folded until their lower surfaces are in contact with each other to stack the block segments 1〇a as shown in Fig. 8. During the folding process, 10a are not separated from each other because the block segments l〇a are connected to each other at the bottom 11a of the slit U. Therefore, it is possible to stack the block segments l〇a neatly by simple folding operation, in which the block segments l〇 a aligned in the longitudinal and lateral directions and block The segments 10a do not intersect each other. Therefore, it may be possible to omit the size of the sheet 1 to cut the sheet 10 into pieces having the same size or to align the separated block segments 10a. Although shown in FIG. The state in which two block segments 1〇a are stacked on the other two block segments 10a by folding four block segments 1 〇a cut from the sheet at the center of the block 10a, but The invention is not limited thereto, and it is possible to cut and fold an appropriate number of block segments 10a according to the size of the mold and cavity to be cleaned to stack the block segments 1〇a into appropriate sizes (for example, 121307.doc • 20 · 1373521 5, 3 block segments 1〇a are stacked on the other 3 block segments i〇a to use 6 block segments l〇a). An example of a mold for cleaning a composition using the mold of the present invention is (Example >) a mold for molding a semiconductor device, which is repeatedly molded by using a mold using a thermosetting resin composition. • In the case of a mold for molding a semiconductor device which is an example of a mold for cleaning a composition using the mold of the present invention, an example of a composition of a thermal resin to be used as a molding resin material includes containing as a main component Epoxy resin composition of epoxy resin. In the thermosetting resin composition 15, a curing agent is usually used together with an epoxy resin used as a component. Since the mold cleaned by the mold cleaning composition of the present invention contains no contaminants and returns to the mold surface in the initial state, it is usually coated on the mold surface before molding the semiconductor package using the thermosetting resin composition used as the mold material. Release agent. For example, in molding a mold material containing brown _ (tetra) hydrazine as a release agent, preferably coating brown (tetra) t. For the method of coating a lignite wax on the surface of the mold, it is preferred to use a lignite wax and form a W shape. An unvulcanized rubber component such as a sheet obtainable by combining the aforementioned unvulcanized rubber and a release agent. The month in which the unvulcanized rubber composition containing the lignite soil is formed in the mold and heated in the same manner as in the method of cleaning the composition using the sheet mold cleaning method, thereby causing the brown coal contained therein The acid ants are applied to the surface of the mold. It is considered that the lignite acid in the unvulcanized rubber composition is melted by thermal vulcanization and exuded to the surface of the mold to form a uniform release agent film on the surface. 121307.doc -21· 1373521 In the unvulcanized rubber composition, the content of the montanic acid wax is preferably from 15 parts by weight to 35 parts by weight, more preferably from 20 parts by weight to 30 parts by weight, per 100 parts by weight of the rubber material. ratio. When the content of the montanic acid wax is less than 15 parts by weight, a sufficient release effect is not exhibited. When the content exceeds 35 parts by weight, the excess montanic acid wax is applied to the surface of the mold to affect the appearance of the molded article obtained by using the mold after cleaning and recycling. The following describes examples and comparative examples.

Examples 1 to 6 and Comparative Examples 1 to 5 The components shown in Tables 1 to 2 were mixed in proportion, and each mixture was kneaded by using a kneader and rolled using a pressure roll to obtain a sheet having a thickness of 5 mm. Thereby, the desired sheet-like mold cleaning composition is obtained.

The weight average molecular weight (Mw) of each of the sheet mold cleaning compositions was measured as described below. The sheet mold cleaning composition was immersed in the air sample to stand for 3 days. Next, the chloroform-soluble portion was heated on a hot plate at 5 ° C to dry and solidify, and the obtained dried and solidified substance was adjusted by using a solution of 0.1% by weight of tetrahydrofuran (THF) to make it Resting in the sky. Next, the solution was filtered by using a 0.45 μm membrane filter, and the weight average molecular weight (Mw) of the filtrate was measured under the following measurement conditions by using a Gpc analyzer (HLC-8120GPC' manufactured by Tosoh Corporation). Measurement conditions: Column: GMHXL+GMHXL+G3000HXL, manufactured by Tosoh Corporation. Column size. Each has a diameter of 7.8 mm x 30 cm, total size: 90 cm 121307.doc • 22- 1373521 Column temperature: 40 °C Dissolution Solution: THF Flow rate: 0.8 ml/min Inlet pressure: 2.3 MPa Injection volume: 100 μΐ Detector: Differential refractor (RI) Standard sample: Polystyrene (PS)

Data Processing Apparatus: GPC-8020, manufactured by Tosoh Corporation The filling performance of each of the thus obtained sheet-like mold cleaning compositions was evaluated by the evaluation examples, comparative examples, and conventional examples described below. Evaluation of the worst filling performance in 16 cavities by using a mold for filling performance evaluation [mold size: 24 mm X 91 mm: mold cavity size: 4 mm x 5 mm x 2.0 mm (total depth of upper and lower chambers)] The filling rate of the cavity. The results are shown in Tables 1 and 2. The filling rate is calculated by the bottom surface of the mold cavity and the resulting molded article.

The bottom surface area of the cavity portion is then calculated by calculating the ratio of the bottom surface areas. As shown in Fig. 4, in the mold formed by the upper mold 丨 and the lower mold 2, the eight chambers 3 are aligned in two columns parallel to each other. The spacing between the cavities 3 disposed parallel to each other as described above is 1 〇 mm, and each column causes the eight aligned cavities 3 to be arranged at intervals of mm. The size of the sheet-like mold cleaning composition used as a sample was set to 10 mm width, 91 mm length, and 5 mm thickness, and the sample was placed between the cavities 3 in the mold for evaluation, and then the mold was closed. For hot forming. For the forming conditions, the forming system was at 175. (: 5 minutes under, and the gap between the clamped molds is 〇5 mm. 121307.doc •23- 1373521 The filling rate of the example wood is lower, and the comparison example is difficult to use due to poor filling performance. An example of cleaning a composition using a sheet mold having a slit will be described. Example 7 As shown in Fig. 1, each of the sheet mold cleaning compositions obtained in the above Examples 1 to 6 was cleaned (thickness (τ in the figure i) ) is 5 mm) cut into sheets ι 各自 each having a width (A in Fig. 1) of 230 mm and a length (8 in Fig. i) of 3 〇〇 mm. On the entire upper surface of the sheet ίο in the sheet 1 〇 In the width direction, at intervals of 15 claws (c in Fig. 1), slits η ^ which are parallel to each other having a depth of 4 5 mm are formed, that is, the end of each slit 11 and the sheet facing the end 1 The distance between the surfaces (D in Fig. 3) is 0.5 mm. In the sheet 1 ,, two block-shaped segments are formed. Several types of transfer forming devices according to different mold sizes cut each slit 11 The sheet mold cleaning composition 10 and folding it at a portion of the slit 11 to be placed in a stacked manner in the mold After that, the mold was closed for thermoforming to measure the filling rate. As a result, it was found that the above-mentioned sheet-like mold cleaning composition was high in filling rate and excellent in filling performance. The mold cleaning composition of the present invention is suitable for cleaning and Reusing a mold such as a mold for thermosetting resin molding, for example, for cleaning and reusing a mold for transfer molding, which is used for molding a semiconductor by transfer molding using an epoxy molding material. The present invention has been described in detail and in accordance with the specific embodiments thereof, and it is contemplated by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. 121307.doc • 26-1373521. This application is based on a patent application No. 2006-145 544, filed May 25, 2006, the entire content of which is hereby incorporated by reference. To show a perspective view of a monthly mold cleaning composition in accordance with an embodiment of the present invention.

Fig. 2 is a view showing a state in which a slit is formed in the sheet-like mold cleaning composition. Figure 3 is an enlarged side elevational view showing a portion of the slits. Fig. 4 is a perspective view showing a state in which the composition is cleaned using the sheet mold. Fig. 5 is a perspective view showing a state in which the composition is cleaned using the sheet mold.

Figure ό is a perspective view showing the state in which the composition is cleaned using the sheet mold. Fig. 7 is an illustration of the effect of the sheet mold cleaning composition for molding a semiconductor device. The figure is an illustration of the effect of the sheet mold cleaning composition for molding a semiconductor device. [Main component symbol description] 1 Upper mold 2 Lower mold 3 cavity 121307.doc -27· 1373521

3a depression 3b depression 10 piece 10a block segment 11 slit 12 rotating shaft 13 cutting blade A width B length C spacing D distance T thickness

121307.doc -28-

Claims (1)

1373521 Patent application scope: = mold cleaning composition 'which contains unvulcanized rubber, detergent and vulcanizing agent as shown in (A) below: (A) Ethylene·propylene containing 6 ene/propylene/ethylene decene Di-thin rubber' or a mixture of ethylene/acrylic propylene-ethylene oxide and 1,4-polybutadiene containing ethylene/propylene/ethylene decene; wherein it is based on gel permeation chromatography (GPC) Measurement, the cleaning The composition as a whole has a weight average molecular weight (Mw) in the range of 200,000 to 460,000. A mold cleaning composition according to Kiss 1, wherein the cleaning composition as a whole has a range of 22 〇〇〇〇 to 430, 〇〇〇 according to a measurement by gel permeation chromatography (GPC) Weight average molecular weight (Mw). 3. The mold cleaning composition of the item is in the form of a sheet or a strip. 4. The mold cleaning composition of claim 2, which is in the form of a sheet or a belt. 5. The mold cleaning composition of any one of claims 1 to 4, wherein the cleaning The agent is at least one selected from the group consisting of glycol ethers and microphones. Sitting, imidazoline and amino alcohol. The mold cleaning composition according to any one of items 1 to 4, wherein the detergent is contained in an amount of from 1 part by weight to 60 parts by weight per 100 parts by weight of the unvulcanized rubber. 7. The mold cleaning composition 16 of any one of clauses 1 to 4, further comprising water in an amount of from 1% by weight to 20% by weight. The mold cleaning composition according to any one of claims 1 to 4, which further comprises a release agent. The mold cleaning composition of any one of items 1 to 4, wherein the mold cleaning composition has a sheet shape in which a plurality of linear slits: "a predetermined distance in one direction" And disposed parallel to each other on one surface thereof. 10. The mold cleaning composition of claim 9, wherein the slits are configured such that the sheet mold cleaning composition can be folded. 11. The mold cleaning composition of claim 9, wherein the slits are configured such that the sheet mold cleaning composition is capable of being cut along the slits. The mold cleaning composition according to any one of claims 1 to 4, which is a cleaning composition for a mold for reverse thermoforming to mold a material. 121307-1010530.doc