SG137816A1 - Mold cleaning composition - Google Patents

Mold cleaning composition

Info

Publication number
SG137816A1
SG137816A1 SG200703779-9A SG2007037799A SG137816A1 SG 137816 A1 SG137816 A1 SG 137816A1 SG 2007037799 A SG2007037799 A SG 2007037799A SG 137816 A1 SG137816 A1 SG 137816A1
Authority
SG
Singapore
Prior art keywords
cleaning composition
mold
mold cleaning
cleaning
property
Prior art date
Application number
SG200703779-9A
Inventor
Koichi Takashima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG137816A1 publication Critical patent/SG137816A1/en

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)

Abstract

The present invention relates to a mold cleaning composition comprising an unvulcanized rubber, a cleaning agent, and a vulcanizing agent, in which the cleaning composition as a whole has a weight average molecular weight (Mw) within a range of from 200,000 to 460,000 according to the measurement by gel permeation chromatography (GPC) The mold cleaning composition has an excellent property of being filled in a mold and capable of exhibiting an excellent cleaning effect on contaminants of the mold due to the excellent filling property.
SG200703779-9A 2006-05-25 2007-05-25 Mold cleaning composition SG137816A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006145544 2006-05-25

Publications (1)

Publication Number Publication Date
SG137816A1 true SG137816A1 (en) 2007-12-28

Family

ID=38871511

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200703779-9A SG137816A1 (en) 2006-05-25 2007-05-25 Mold cleaning composition

Country Status (5)

Country Link
KR (1) KR20070114036A (en)
CN (1) CN101077995B (en)
MY (1) MY148591A (en)
SG (1) SG137816A1 (en)
TW (1) TWI373521B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101788859B1 (en) * 2009-07-17 2017-10-20 닛토덴코 가부시키가이샤 Mold cleaner composition and mold cleaning material, and method of cleaning using the same
KR101490577B1 (en) * 2010-06-07 2015-02-05 미츠비시 레이온 가부시키가이샤 Method for producing article having fine recessed and projected structure on surface, mold release treatment method for mold, and active energy ray-curable resin composition for mold surface release treatment
JP5741398B2 (en) * 2011-11-21 2015-07-01 日立化成株式会社 Mold cleaning sheet
CN103205032A (en) * 2013-03-14 2013-07-17 西北工业大学 Mold cleaning rubber for in-place mold cleaning and preparation method of mold cleaning rubber
CN104450302A (en) * 2014-11-17 2015-03-25 厦门市钰林丰橡塑科技有限公司 Flame-retardant high-temperature resistant environment-friendly cleaning product
CN105773882A (en) * 2016-04-19 2016-07-20 上海东恒化工有限公司 Composition for die cleaning and die cleaning method
CN107011553A (en) * 2017-05-04 2017-08-04 天津德高化成新材料股份有限公司 A kind of rubber mould exempts from dismounting mold cleaning material and preparation method thereof with online
CN112553009A (en) * 2020-11-28 2021-03-26 无锡市科宇橡胶模具厂 Cleaning agent for rubber mold and using method thereof
CN112662489B (en) * 2020-12-15 2021-10-26 广东红日星实业有限公司 Resin lens cleaning agent and preparation method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3585631B2 (en) * 1996-03-29 2004-11-04 日東電工株式会社 Mold cleaning method
JP3764239B2 (en) * 1996-12-10 2006-04-05 日東電工株式会社 Mold cleaning composition for molding semiconductor device and mold cleaning method using the same

Also Published As

Publication number Publication date
CN101077995A (en) 2007-11-28
CN101077995B (en) 2011-05-11
MY148591A (en) 2013-05-15
TW200806785A (en) 2008-02-01
TWI373521B (en) 2012-10-01
KR20070114036A (en) 2007-11-29

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