TWI372320B - Apparatus and method of generating map data for a probe tester - Google Patents

Apparatus and method of generating map data for a probe tester

Info

Publication number
TWI372320B
TWI372320B TW097113698A TW97113698A TWI372320B TW I372320 B TWI372320 B TW I372320B TW 097113698 A TW097113698 A TW 097113698A TW 97113698 A TW97113698 A TW 97113698A TW I372320 B TWI372320 B TW I372320B
Authority
TW
Taiwan
Prior art keywords
map data
generating map
probe tester
tester
probe
Prior art date
Application number
TW097113698A
Other languages
Chinese (zh)
Other versions
TW200846859A (en
Inventor
Byoung-Hak Cho
Gyun Jeong
Original Assignee
Secron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Secron Co Ltd filed Critical Secron Co Ltd
Publication of TW200846859A publication Critical patent/TW200846859A/en
Application granted granted Critical
Publication of TWI372320B publication Critical patent/TWI372320B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW097113698A 2007-05-22 2008-04-15 Apparatus and method of generating map data for a probe tester TWI372320B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070049489A KR20080102708A (en) 2007-05-22 2007-05-22 Map building system for probing tester and method for building map using the same

Publications (2)

Publication Number Publication Date
TW200846859A TW200846859A (en) 2008-12-01
TWI372320B true TWI372320B (en) 2012-09-11

Family

ID=40100408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097113698A TWI372320B (en) 2007-05-22 2008-04-15 Apparatus and method of generating map data for a probe tester

Country Status (3)

Country Link
KR (1) KR20080102708A (en)
CN (1) CN101311668B (en)
TW (1) TWI372320B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548878B (en) * 2013-02-27 2016-09-11 Tokyo Seimitsu Co Ltd Probe device
TWI829804B (en) * 2018-11-27 2024-01-21 日商東京威力科創股份有限公司 Check device system

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102402208A (en) * 2010-09-15 2012-04-04 江苏凯路威电子有限公司 Probe station remote control device and control method thereof
KR101877432B1 (en) * 2012-02-06 2018-07-11 삼성전자주식회사 Method of auto focusing and auto cleaning Needles of a Probe Card
TWI548014B (en) * 2014-04-24 2016-09-01 聯詠科技股份有限公司 Method and apparatus for chip measurement
CN105223389B (en) * 2015-09-28 2018-02-02 大族激光科技产业集团股份有限公司 A kind of alignment method of flying probe tester
CN106814307B (en) * 2017-01-10 2020-05-12 深圳鼎缘电子科技有限公司 Automatic debugging method and system for cavity filter
CN107621245B (en) * 2017-09-06 2019-12-31 深圳市华星光电技术有限公司 Automatic point position correction method and device for measuring machine
CN110033470B (en) * 2019-04-17 2021-08-24 英特尔产品（成都）有限公司 Wafer edge tube core judging method and system
CN113358557B (en) * 2021-05-24 2023-04-28 深圳市艾比森光电股份有限公司 Thrust measuring method and device
TWI799024B (en) * 2021-12-22 2023-04-11 技嘉科技股份有限公司 Procsssing systyem and method for automatic measurement signal

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001274208A (en) * 2000-03-23 2001-10-05 Mitsubishi Electric Corp Apparatus and method for generating map data

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548878B (en) * 2013-02-27 2016-09-11 Tokyo Seimitsu Co Ltd Probe device
TWI829804B (en) * 2018-11-27 2024-01-21 日商東京威力科創股份有限公司 Check device system

Also Published As

Publication number Publication date
CN101311668B (en) 2011-08-24
TW200846859A (en) 2008-12-01
KR20080102708A (en) 2008-11-26
CN101311668A (en) 2008-11-26

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