TWI371831B - Chip carrier with improved thermal dissipation and chip package structure using the same - Google Patents

Chip carrier with improved thermal dissipation and chip package structure using the same

Info

Publication number
TWI371831B
TWI371831B TW097107617A TW97107617A TWI371831B TW I371831 B TWI371831 B TW I371831B TW 097107617 A TW097107617 A TW 097107617A TW 97107617 A TW97107617 A TW 97107617A TW I371831 B TWI371831 B TW I371831B
Authority
TW
Taiwan
Prior art keywords
chip
same
package structure
improved thermal
thermal dissipation
Prior art date
Application number
TW097107617A
Other languages
Chinese (zh)
Other versions
TW200939410A (en
Inventor
Ming Hsun Li
Tsung Lung Chen
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW097107617A priority Critical patent/TWI371831B/en
Publication of TW200939410A publication Critical patent/TW200939410A/en
Application granted granted Critical
Publication of TWI371831B publication Critical patent/TWI371831B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
TW097107617A 2008-03-05 2008-03-05 Chip carrier with improved thermal dissipation and chip package structure using the same TWI371831B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097107617A TWI371831B (en) 2008-03-05 2008-03-05 Chip carrier with improved thermal dissipation and chip package structure using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097107617A TWI371831B (en) 2008-03-05 2008-03-05 Chip carrier with improved thermal dissipation and chip package structure using the same

Publications (2)

Publication Number Publication Date
TW200939410A TW200939410A (en) 2009-09-16
TWI371831B true TWI371831B (en) 2012-09-01

Family

ID=44867689

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107617A TWI371831B (en) 2008-03-05 2008-03-05 Chip carrier with improved thermal dissipation and chip package structure using the same

Country Status (1)

Country Link
TW (1) TWI371831B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567880B (en) * 2015-05-13 2017-01-21 南茂科技股份有限公司 Film packaging substrate, chip on film package and packaging method thereof
TWI631684B (en) * 2017-09-05 2018-08-01 恆勁科技股份有限公司 Medium substrate and the manufacture thereof

Also Published As

Publication number Publication date
TW200939410A (en) 2009-09-16

Similar Documents

Publication Publication Date Title
TWI341005B (en) Semiconductor die and package structure
TWI369009B (en) Light-emitting chip device with high thermal conductivity
EP2366200A4 (en) Battery module having excellent heat dissipation ability and battery pack employed with the same
EP1913633A4 (en) Packaged integrated circuit with enhanced thermal dissipation
EP2179445A4 (en) Semiconductor package and camera module
TWI369768B (en) Flip chip packages with spacers separating heat sinks and substrates
EP2179444A4 (en) Semiconductor package including through-hole electrode and light-transmitting substrate
HK1113228A1 (en) Semiconductor package structure having enhanced thermal dissipation characteristics
EP2084739A4 (en) Flip chip semiconductor package with encapsulant retaining structure and strip
ZA201008376B (en) Container and package using the same
EP2286451A4 (en) Foil based semiconductor package
EP2434297A4 (en) Structure having chip mounted thereon and module provided with the structure
EP2120261A4 (en) Semiconductor package
TWI369765B (en) Package and semiconductor device
HK1167740A1 (en) Semiconductor package and semiconductor package mounting structure
DE602008004858D1 (en) The semiconductor package
EP2297787A4 (en) Solar component and devices containing the same
EP2061079A4 (en) Semiconductor package and semiconductor package assembly
EP2214224A4 (en) Outer package label for battery and battery with the label affixed thereto
TWI365521B (en) Semiconductor package structure with heat sink
SG122956A1 (en) Semiconductor package system with substrate heat sink
TWI339881B (en) Chip package
TWI370534B (en) Semiconductor chip with chip selection structure and stacked semiconductor package having the same
HK1147596A1 (en) Semiconductor package structure having enhanced thermal dissipation characteristics
TWI372476B (en) Circuit structure of package carrier and multi-chip package