TWI371653B - - Google Patents

Info

Publication number
TWI371653B
TWI371653B TW096142536A TW96142536A TWI371653B TW I371653 B TWI371653 B TW I371653B TW 096142536 A TW096142536 A TW 096142536A TW 96142536 A TW96142536 A TW 96142536A TW I371653 B TWI371653 B TW I371653B
Authority
TW
Taiwan
Application number
TW096142536A
Other languages
Chinese (zh)
Other versions
TW200821753A (en
Inventor
Dai Shiota
Masaru Shida
Yasuhide Ohuchi
Tetsuya Kato
Kiyoshi Uchikawa
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200821753A publication Critical patent/TW200821753A/en
Application granted granted Critical
Publication of TWI371653B publication Critical patent/TWI371653B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B11/00—Diaryl- or thriarylmethane dyes
    • C09B11/04—Diaryl- or thriarylmethane dyes derived from triarylmethanes, i.e. central C-atom is substituted by amino, cyano, alkyl
    • C09B11/10—Amino derivatives of triarylmethanes
    • C09B11/24—Phthaleins containing amino groups ; Phthalanes; Fluoranes; Phthalides; Rhodamine dyes; Phthaleins having heterocyclic aryl rings; Lactone or lactame forms of triarylmethane dyes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW096142536A 2006-11-14 2007-11-09 Colored photosensitive resin composition TW200821753A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006308398A JP4949810B2 (en) 2006-11-14 2006-11-14 Colored photosensitive resin composition

Publications (2)

Publication Number Publication Date
TW200821753A TW200821753A (en) 2008-05-16
TWI371653B true TWI371653B (en) 2012-09-01

Family

ID=39507599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096142536A TW200821753A (en) 2006-11-14 2007-11-09 Colored photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP4949810B2 (en)
KR (1) KR100928762B1 (en)
CN (1) CN101226330B (en)
TW (1) TW200821753A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5173543B2 (en) * 2008-04-08 2013-04-03 東京応化工業株式会社 Positive photosensitive resin composition
JP2010062120A (en) * 2008-08-06 2010-03-18 Mitsubishi Chemicals Corp Photosensitive composition for barrier rib of organic electroluminescent element, and organic electroluminescent display device
JP5329192B2 (en) * 2008-11-27 2013-10-30 東京応化工業株式会社 Photosensitive resin composition
TWI516450B (en) * 2009-10-19 2016-01-11 富士軟片股份有限公司 Titanium black dispersion, photosensitive resin composition, wafer level lens, light-shielding film and producing method thereof, and solid-state image pick-up device
JP5431225B2 (en) * 2010-03-29 2014-03-05 新日鉄住金化学株式会社 Alkali-developable photosensitive resin composition, partition wall for display element formed using the same, and display element
JP5740275B2 (en) * 2011-09-30 2015-06-24 富士フイルム株式会社 Printing method using on-press development type lithographic printing plate precursor
CN104530313B (en) * 2014-12-15 2018-12-25 京东方科技集团股份有限公司 Dye composition and preparation method thereof, colorant, Photosensitve resin composition, optical filter
JP6826325B2 (en) * 2016-03-15 2021-02-03 東レ株式会社 Method for manufacturing photosensitive resin composition, cured film, laminate, touch panel member and cured film
KR101832097B1 (en) 2016-10-31 2018-02-23 롬엔드하스전자재료코리아유한회사 Colored photosensitive resin composition and light shielding spacer prepared therefrom
KR102465156B1 (en) * 2017-09-08 2022-11-10 디아이씨 가부시끼가이샤 Acid group-containing (meth)acrylamide resin, curable resin composition, resin material for solder resist and resist member
KR102611643B1 (en) * 2018-11-08 2023-12-11 가부시끼가이샤 레조낙 Copolymers and resin compositions containing copolymers thereof
CN110995980B (en) * 2020-02-26 2020-06-19 杭州美迪凯光电科技股份有限公司 Light filter for reducing stray light and camera module comprising same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3738863A1 (en) * 1987-11-16 1989-05-24 Hoechst Ag LIGHT-SENSITIVE PRINTING PLATE FOR WATERLESS OFFSET PRINTING
JP4442838B2 (en) * 2000-03-10 2010-03-31 日本化薬株式会社 Resin, resin composition, film thereof and cured product thereof
EP1560068B1 (en) * 2002-11-06 2008-01-23 Asahi Glass Company Ltd. Barrier rib and its method of preparation
JP3938375B2 (en) * 2003-03-12 2007-06-27 三菱化学株式会社 Photosensitive coloring composition, color filter, and liquid crystal display device
TWI337689B (en) * 2003-04-24 2011-02-21 Sumitomo Chemical Co Black photosensitive resin composition
JP5177933B2 (en) * 2003-08-12 2013-04-10 東洋インキＳｃホールディングス株式会社 Partition wall composition, pixel forming substrate using the same, and pixel forming method
KR100777582B1 (en) * 2005-12-01 2007-11-28 주식회사 엘지화학 Composition for preparing thermosetting resin, thermosetting resin prepared by the same, and thermosetting resin composition comprising the same

Also Published As

Publication number Publication date
CN101226330A (en) 2008-07-23
KR100928762B1 (en) 2009-11-25
JP4949810B2 (en) 2012-06-13
KR20080043704A (en) 2008-05-19
TW200821753A (en) 2008-05-16
JP2008122806A (en) 2008-05-29
CN101226330B (en) 2011-05-25

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