TWI370670B - Tape and installation method of image sensor using same - Google Patents

Tape and installation method of image sensor using same

Info

Publication number
TWI370670B
TWI370670B TW094117775A TW94117775A TWI370670B TW I370670 B TWI370670 B TW I370670B TW 094117775 A TW094117775 A TW 094117775A TW 94117775 A TW94117775 A TW 94117775A TW I370670 B TWI370670 B TW I370670B
Authority
TW
Taiwan
Prior art keywords
tape
same
image sensor
installation method
installation
Prior art date
Application number
TW094117775A
Other languages
Chinese (zh)
Other versions
TW200610375A (en
Inventor
Hiroyuki Kondou
Tadashi Terashima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200610375A publication Critical patent/TW200610375A/en
Application granted granted Critical
Publication of TWI370670B publication Critical patent/TWI370670B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Facsimile Heads (AREA)
TW094117775A 2004-09-08 2005-05-31 Tape and installation method of image sensor using same TWI370670B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004260786A JP4969032B2 (en) 2004-09-08 2004-09-08 Adhesive tape and video sensor mounting method using the same

Publications (2)

Publication Number Publication Date
TW200610375A TW200610375A (en) 2006-03-16
TWI370670B true TWI370670B (en) 2012-08-11

Family

ID=36156795

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117775A TWI370670B (en) 2004-09-08 2005-05-31 Tape and installation method of image sensor using same

Country Status (4)

Country Link
JP (1) JP4969032B2 (en)
KR (1) KR101206643B1 (en)
CN (1) CN1746249B (en)
TW (1) TWI370670B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008217859A (en) * 2007-02-28 2008-09-18 Tomoegawa Paper Co Ltd Protective film for optical pickup photodetector
EP2186849A1 (en) * 2008-05-14 2010-05-19 Nitto Denko Corporation Composite film
JP2013159616A (en) * 2012-02-01 2013-08-19 Nitto Denko Corp Surface-protective film, method for producing solid image-pickup device using the same, and solid image-pickup device obtained by the method
JP6286703B2 (en) 2013-03-25 2018-03-07 藤森工業株式会社 Optical member pressure-sensitive adhesive composition, optical member pressure-sensitive adhesive film and surface protective film
JP6756429B2 (en) * 2014-09-19 2020-09-16 リンテック株式会社 Surface protective film
JP6770134B2 (en) * 2019-05-15 2020-10-14 藤森工業株式会社 Surface protective film
JP7491717B2 (en) 2020-04-01 2024-05-28 日東電工株式会社 Foam Composite
JP7309964B2 (en) * 2020-09-23 2023-07-18 藤森工業株式会社 adhesive film
JP7071460B2 (en) * 2020-09-23 2022-05-19 藤森工業株式会社 Adhesive composition for optical members, adhesive film for optical members and surface protection film

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636597Y2 (en) * 1987-08-20 1994-09-21 リンテック株式会社 Protection tape for electronic parts
JPH0987599A (en) * 1995-09-26 1997-03-31 Nitto Denko Corp Tacky adhesive composition, and tacky adhesive sheet and the like
JPH108000A (en) * 1996-06-25 1998-01-13 Oji Paper Co Ltd Tacky adhesive composition and tacky adhesive sheet
JPH10298539A (en) * 1997-04-22 1998-11-10 Arutetsuku Kk Antistatic agent, and coating and adhesive agent containing the same
JP4497579B2 (en) * 1999-04-27 2010-07-07 日本エラストマー株式会社 Novel adhesive composition
JP3748799B2 (en) 2001-10-11 2006-02-22 シチズン電子株式会社 Electronic component package and mounting method thereof
JP2003138228A (en) * 2001-11-02 2003-05-14 Nitto Denko Corp Pressure-sensitive adhesive sheet for protecting semiconductor wafer
SG120911A1 (en) * 2002-02-25 2006-04-26 Nitto Denko Corp Aqueous dispersion type pressure-sensitive adhesive composition and pressure-sensisive adhesive product
SG121782A1 (en) * 2003-02-13 2006-05-26 Nitto Denko Corp Aqueous-dispersion type pressure-sensitive adhesive composition and pressure-sensitive adhesive product
JP2004244585A (en) * 2003-02-17 2004-09-02 Nippon Shokubai Co Ltd Adhesive composition and adhesive product

Also Published As

Publication number Publication date
TW200610375A (en) 2006-03-16
JP4969032B2 (en) 2012-07-04
CN1746249B (en) 2011-04-13
KR101206643B1 (en) 2012-11-29
CN1746249A (en) 2006-03-15
KR20060051077A (en) 2006-05-19
JP2006077072A (en) 2006-03-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees