TW200610375A - Tape and installation method of image sensor using same - Google Patents
Tape and installation method of image sensor using sameInfo
- Publication number
- TW200610375A TW200610375A TW094117775A TW94117775A TW200610375A TW 200610375 A TW200610375 A TW 200610375A TW 094117775 A TW094117775 A TW 094117775A TW 94117775 A TW94117775 A TW 94117775A TW 200610375 A TW200610375 A TW 200610375A
- Authority
- TW
- Taiwan
- Prior art keywords
- tape
- image sensor
- installation method
- same
- oxidants
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Abstract
A highly recognizable tape with high thermal resistance is provided, and an installation method of an image sensor using the same tape for protection purpose is also provided. The image sensor is used in the solid image device. A tape with a sticking layer on at least one surface is provided, characterized in that, according to L*a*b* chromaticity diagram of JIS Z 8729, the b* value of the tape is under 5.0 after the tape is heated in 180 DEG C for one hour. The tape with anti-oxidants in said sticking layer is characterized in that the proportion of the anti-oxidants in the tape to the total amount of the tape is 0.1~10wt%.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004260786A JP4969032B2 (en) | 2004-09-08 | 2004-09-08 | Adhesive tape and video sensor mounting method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200610375A true TW200610375A (en) | 2006-03-16 |
TWI370670B TWI370670B (en) | 2012-08-11 |
Family
ID=36156795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094117775A TWI370670B (en) | 2004-09-08 | 2005-05-31 | Tape and installation method of image sensor using same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4969032B2 (en) |
KR (1) | KR101206643B1 (en) |
CN (1) | CN1746249B (en) |
TW (1) | TWI370670B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI593767B (en) * | 2013-03-25 | 2017-08-01 | 藤森工業股份有限公司 | Adhesive composition for optical members, adhesive film for optical members, and surface-protective adhesive film |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008217859A (en) * | 2007-02-28 | 2008-09-18 | Tomoegawa Paper Co Ltd | Protective film for optical pickup photodetector |
EP2186849A1 (en) | 2008-05-14 | 2010-05-19 | Nitto Denko Corporation | Composite film |
JP2013159616A (en) * | 2012-02-01 | 2013-08-19 | Nitto Denko Corp | Surface-protective film, method for producing solid image-pickup device using the same, and solid image-pickup device obtained by the method |
JP6756429B2 (en) * | 2014-09-19 | 2020-09-16 | リンテック株式会社 | Surface protective film |
JP6770134B2 (en) * | 2019-05-15 | 2020-10-14 | 藤森工業株式会社 | Surface protective film |
JP2021160299A (en) | 2020-04-01 | 2021-10-11 | 日東電工株式会社 | Foam composite |
JP7071460B2 (en) * | 2020-09-23 | 2022-05-19 | 藤森工業株式会社 | Adhesive composition for optical members, adhesive film for optical members and surface protection film |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0636597Y2 (en) * | 1987-08-20 | 1994-09-21 | リンテック株式会社 | Protection tape for electronic parts |
JPH0987599A (en) * | 1995-09-26 | 1997-03-31 | Nitto Denko Corp | Tacky adhesive composition, and tacky adhesive sheet and the like |
JPH108000A (en) * | 1996-06-25 | 1998-01-13 | Oji Paper Co Ltd | Tacky adhesive composition and tacky adhesive sheet |
JPH10298539A (en) * | 1997-04-22 | 1998-11-10 | Arutetsuku Kk | Antistatic agent, and coating and adhesive agent containing the same |
JP4497579B2 (en) * | 1999-04-27 | 2010-07-07 | 日本エラストマー株式会社 | Novel adhesive composition |
JP3748799B2 (en) | 2001-10-11 | 2006-02-22 | シチズン電子株式会社 | Electronic component package and mounting method thereof |
JP2003138228A (en) * | 2001-11-02 | 2003-05-14 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for protecting semiconductor wafer |
SG120911A1 (en) * | 2002-02-25 | 2006-04-26 | Nitto Denko Corp | Aqueous dispersion type pressure-sensitive adhesive composition and pressure-sensisive adhesive product |
SG121782A1 (en) * | 2003-02-13 | 2006-05-26 | Nitto Denko Corp | Aqueous-dispersion type pressure-sensitive adhesive composition and pressure-sensitive adhesive product |
JP2004244585A (en) * | 2003-02-17 | 2004-09-02 | Nippon Shokubai Co Ltd | Adhesive composition and adhesive product |
-
2004
- 2004-09-08 JP JP2004260786A patent/JP4969032B2/en not_active Expired - Fee Related
-
2005
- 2005-05-31 TW TW094117775A patent/TWI370670B/en not_active IP Right Cessation
- 2005-06-16 CN CN2005100781736A patent/CN1746249B/en not_active Expired - Fee Related
- 2005-09-07 KR KR1020050083203A patent/KR101206643B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI593767B (en) * | 2013-03-25 | 2017-08-01 | 藤森工業股份有限公司 | Adhesive composition for optical members, adhesive film for optical members, and surface-protective adhesive film |
Also Published As
Publication number | Publication date |
---|---|
KR20060051077A (en) | 2006-05-19 |
CN1746249A (en) | 2006-03-15 |
JP2006077072A (en) | 2006-03-23 |
CN1746249B (en) | 2011-04-13 |
JP4969032B2 (en) | 2012-07-04 |
KR101206643B1 (en) | 2012-11-29 |
TWI370670B (en) | 2012-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |