TWI370506B - Substrate processing apparatus having a sensing unit - Google Patents
Substrate processing apparatus having a sensing unitInfo
- Publication number
- TWI370506B TWI370506B TW097122352A TW97122352A TWI370506B TW I370506 B TWI370506 B TW I370506B TW 097122352 A TW097122352 A TW 097122352A TW 97122352 A TW97122352 A TW 97122352A TW I370506 B TWI370506 B TW I370506B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing apparatus
- sensing unit
- substrate processing
- sensing
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070077462A KR100920417B1 (ko) | 2007-08-01 | 2007-08-01 | 센싱유닛 및 이를 가지는 기판처리장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200908190A TW200908190A (en) | 2009-02-16 |
TWI370506B true TWI370506B (en) | 2012-08-11 |
Family
ID=40331983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097122352A TWI370506B (en) | 2007-08-01 | 2008-06-16 | Substrate processing apparatus having a sensing unit |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090032189A1 (zh) |
KR (1) | KR100920417B1 (zh) |
CN (1) | CN101359580B (zh) |
TW (1) | TWI370506B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI403409B (zh) * | 2009-05-22 | 2013-08-01 | Primax Electronics Ltd | 具有即時熱度控制功能之薄片熱疊合裝置 |
WO2011109758A2 (en) * | 2010-03-05 | 2011-09-09 | Applied Materials, Inc. | Measuring flow properties of multiple gas nozzles of a gas distributor |
US20170301567A9 (en) * | 2012-11-20 | 2017-10-19 | Tokyo Electron Limited | System of controlling treatment liquid dispense for spinning substrates |
CN104332378B (zh) * | 2013-07-22 | 2016-09-07 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其温度测试装置 |
US10607817B2 (en) * | 2016-11-18 | 2020-03-31 | Applied Materials, Inc. | Thermal repeatability and in-situ showerhead temperature monitoring |
CN110634723B (zh) * | 2018-06-21 | 2022-07-05 | 中微半导体设备(上海)股份有限公司 | 一种耐腐蚀的气体混合装置及等离子体处理设备 |
CN111261540A (zh) * | 2018-11-30 | 2020-06-09 | 东泰高科装备科技有限公司 | 工艺腔室和半导体处理设备 |
CN112713074B (zh) * | 2019-10-25 | 2023-03-07 | 中微半导体设备(上海)股份有限公司 | 气体喷淋头组件及等离子体处理设备 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2640245A (en) * | 1951-06-27 | 1953-06-02 | United Carr Fastener Corp | Mounting of threaded fastening devices |
US3018127A (en) * | 1958-10-30 | 1962-01-23 | Westinghouse Electric Corp | Enclosed device with cover-mounting means |
US3368602A (en) * | 1966-04-01 | 1968-02-13 | Tridair Industries | Self-locking captive screw assembly |
US4387497A (en) * | 1980-11-07 | 1983-06-14 | Bulent Gulistan | Captive screw assembly method and product |
DE3244718A1 (de) * | 1982-12-03 | 1984-06-07 | Degussa Ag, 6000 Frankfurt | Vorrichtung zum befestigen von elektrischen bauteilen im anschlusskopf von elektrischen thermometern |
US4915557A (en) * | 1988-09-13 | 1990-04-10 | Rexnord Holdings Inc. | Captive screw assembly |
US5600104A (en) * | 1993-10-20 | 1997-02-04 | Structural Instrumentation, Inc. | Load cell having reduced sensitivity to non-symmetrical beam loading |
US5806980A (en) * | 1996-09-11 | 1998-09-15 | Novellus Systems, Inc. | Methods and apparatus for measuring temperatures at high potential |
US6063234A (en) * | 1997-09-10 | 2000-05-16 | Lam Research Corporation | Temperature sensing system for use in a radio frequency environment |
US6073577A (en) | 1998-06-30 | 2000-06-13 | Lam Research Corporation | Electrode for plasma processes and method for manufacture and use thereof |
JP3077693B1 (ja) * | 1999-04-12 | 2000-08-14 | 国産部品工業株式会社 | 管継手 |
JP4437351B2 (ja) * | 2000-01-14 | 2010-03-24 | キヤノンアネルバ株式会社 | プラズマエッチング装置 |
JP4896337B2 (ja) * | 2000-05-17 | 2012-03-14 | 東京エレクトロン株式会社 | 処理装置およびそのメンテナンス方法,処理装置部品の組立機構およびその組立方法,ロック機構およびそのロック方法 |
KR101004173B1 (ko) * | 2001-02-09 | 2010-12-24 | 도쿄엘렉트론가부시키가이샤 | 성막 장치 |
JP4121269B2 (ja) * | 2001-11-27 | 2008-07-23 | 日本エー・エス・エム株式会社 | セルフクリーニングを実行するプラズマcvd装置及び方法 |
US6646233B2 (en) * | 2002-03-05 | 2003-11-11 | Hitachi High-Technologies Corporation | Wafer stage for wafer processing apparatus and wafer processing method |
KR100901892B1 (ko) * | 2003-09-03 | 2009-06-10 | 도쿄엘렉트론가부시키가이샤 | 가스 처리 장치 및 처리 가스 토출 구조체 |
JP4451221B2 (ja) * | 2004-06-04 | 2010-04-14 | 東京エレクトロン株式会社 | ガス処理装置および成膜装置 |
JP5519105B2 (ja) * | 2004-08-02 | 2014-06-11 | ビーコ・インストゥルメンツ・インコーポレイテッド | 化学気相成長の方法及び化学気相成長リアクタ用のガス供給システム |
KR20060013276A (ko) * | 2004-08-06 | 2006-02-09 | 삼성전자주식회사 | 조립성이 개선된 샤워헤드를 갖는 반도체 제조설비 |
US7429410B2 (en) * | 2004-09-20 | 2008-09-30 | Applied Materials, Inc. | Diffuser gravity support |
KR100628888B1 (ko) * | 2004-12-27 | 2006-09-26 | 삼성전자주식회사 | 샤워 헤드 온도 조절 장치 및 이를 갖는 막 형성 장치 |
JP5044931B2 (ja) * | 2005-10-31 | 2012-10-10 | 東京エレクトロン株式会社 | ガス供給装置及び基板処理装置 |
US7829468B2 (en) * | 2006-06-07 | 2010-11-09 | Lam Research Corporation | Method and apparatus to detect fault conditions of plasma processing reactor |
-
2007
- 2007-08-01 KR KR1020070077462A patent/KR100920417B1/ko not_active IP Right Cessation
-
2008
- 2008-06-16 CN CN2008101106883A patent/CN101359580B/zh not_active Expired - Fee Related
- 2008-06-16 TW TW097122352A patent/TWI370506B/zh not_active IP Right Cessation
- 2008-06-24 US US12/144,677 patent/US20090032189A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR100920417B1 (ko) | 2009-10-14 |
TW200908190A (en) | 2009-02-16 |
CN101359580A (zh) | 2009-02-04 |
KR20090013389A (ko) | 2009-02-05 |
US20090032189A1 (en) | 2009-02-05 |
CN101359580B (zh) | 2010-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |