TWI370507B - Apparatus for processing a substrate - Google Patents

Apparatus for processing a substrate

Info

Publication number
TWI370507B
TWI370507B TW097143759A TW97143759A TWI370507B TW I370507 B TWI370507 B TW I370507B TW 097143759 A TW097143759 A TW 097143759A TW 97143759 A TW97143759 A TW 97143759A TW I370507 B TWI370507 B TW I370507B
Authority
TW
Taiwan
Prior art keywords
substrate
processing
Prior art date
Application number
TW097143759A
Other languages
Chinese (zh)
Other versions
TW200931572A (en
Inventor
Park Gi-Hong
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW200931572A publication Critical patent/TW200931572A/en
Application granted granted Critical
Publication of TWI370507B publication Critical patent/TWI370507B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW097143759A 2007-11-21 2008-11-12 Apparatus for processing a substrate TWI370507B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070118944A KR100930887B1 (en) 2007-11-21 2007-11-21 Apparatus for processing a substrate

Publications (2)

Publication Number Publication Date
TW200931572A TW200931572A (en) 2009-07-16
TWI370507B true TWI370507B (en) 2012-08-11

Family

ID=40726358

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097143759A TWI370507B (en) 2007-11-21 2008-11-12 Apparatus for processing a substrate

Country Status (4)

Country Link
JP (1) JP5179324B2 (en)
KR (1) KR100930887B1 (en)
CN (1) CN101441989B (en)
TW (1) TWI370507B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102529274B1 (en) * 2018-04-11 2023-05-08 주식회사 디엠에스 Apparatus for supplying fluid and assembling method thereof and substrate process system using the same
CN118002335B (en) * 2024-04-08 2024-07-09 山东智宏新材料科技有限公司 Aluminum alloy door and window leakproofness drenches water check out test set

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4251894B2 (en) * 2003-03-24 2009-04-08 大日本スクリーン製造株式会社 Substrate processing equipment
JP4393941B2 (en) * 2004-07-30 2010-01-06 大日本スクリーン製造株式会社 Substrate processing equipment
JP2006135162A (en) * 2004-11-08 2006-05-25 Fuji Photo Film Co Ltd Spraying method and apparatus thereof
JP2006287159A (en) * 2005-04-05 2006-10-19 Nikon Corp Gas supplying apparatus, exposure apparatus and method of manufacturing device

Also Published As

Publication number Publication date
TW200931572A (en) 2009-07-16
JP5179324B2 (en) 2013-04-10
JP2009130353A (en) 2009-06-11
CN101441989B (en) 2010-09-22
KR20090052446A (en) 2009-05-26
CN101441989A (en) 2009-05-27
KR100930887B1 (en) 2009-12-10

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