TWI367706B - Method of fabricating package substrate - Google Patents

Method of fabricating package substrate

Info

Publication number
TWI367706B
TWI367706B TW098114944A TW98114944A TWI367706B TW I367706 B TWI367706 B TW I367706B TW 098114944 A TW098114944 A TW 098114944A TW 98114944 A TW98114944 A TW 98114944A TW I367706 B TWI367706 B TW I367706B
Authority
TW
Taiwan
Prior art keywords
package substrate
fabricating package
fabricating
substrate
package
Prior art date
Application number
TW098114944A
Other languages
Chinese (zh)
Other versions
TW201041465A (en
Inventor
Ying Tung Wang
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW098114944A priority Critical patent/TWI367706B/en
Publication of TW201041465A publication Critical patent/TW201041465A/en
Application granted granted Critical
Publication of TWI367706B publication Critical patent/TWI367706B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
TW098114944A 2009-05-06 2009-05-06 Method of fabricating package substrate TWI367706B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098114944A TWI367706B (en) 2009-05-06 2009-05-06 Method of fabricating package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098114944A TWI367706B (en) 2009-05-06 2009-05-06 Method of fabricating package substrate

Publications (2)

Publication Number Publication Date
TW201041465A TW201041465A (en) 2010-11-16
TWI367706B true TWI367706B (en) 2012-07-01

Family

ID=44996328

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098114944A TWI367706B (en) 2009-05-06 2009-05-06 Method of fabricating package substrate

Country Status (1)

Country Link
TW (1) TWI367706B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411362B (en) * 2011-08-09 2013-10-01 Unimicron Technology Corp Coreless package substrate and manufacturing method thereof
TWI555452B (en) * 2014-08-12 2016-10-21 南亞電路板股份有限公司 Circuit board and method for forming the same
CN110703949B (en) * 2019-10-10 2022-05-13 业成科技（成都）有限公司 Improved structure for insulation glue protection

Also Published As

Publication number Publication date
TW201041465A (en) 2010-11-16

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