TWI373094B - Manufacturing method of substrate structure - Google Patents

Manufacturing method of substrate structure

Info

Publication number
TWI373094B
TWI373094B TW097109584A TW97109584A TWI373094B TW I373094 B TWI373094 B TW I373094B TW 097109584 A TW097109584 A TW 097109584A TW 97109584 A TW97109584 A TW 97109584A TW I373094 B TWI373094 B TW I373094B
Authority
TW
Taiwan
Prior art keywords
manufacturing
substrate structure
substrate
Prior art date
Application number
TW097109584A
Other languages
Chinese (zh)
Other versions
TW200941637A (en
Inventor
Wen Hung Hu
wei wen Cheng
Chao Meng Cheng
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW097109584A priority Critical patent/TWI373094B/en
Publication of TW200941637A publication Critical patent/TW200941637A/en
Application granted granted Critical
Publication of TWI373094B publication Critical patent/TWI373094B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
TW097109584A 2008-03-19 2008-03-19 Manufacturing method of substrate structure TWI373094B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097109584A TWI373094B (en) 2008-03-19 2008-03-19 Manufacturing method of substrate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097109584A TWI373094B (en) 2008-03-19 2008-03-19 Manufacturing method of substrate structure

Publications (2)

Publication Number Publication Date
TW200941637A TW200941637A (en) 2009-10-01
TWI373094B true TWI373094B (en) 2012-09-21

Family

ID=44868367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097109584A TWI373094B (en) 2008-03-19 2008-03-19 Manufacturing method of substrate structure

Country Status (1)

Country Link
TW (1) TWI373094B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI463622B (en) * 2010-03-04 2014-12-01 Advanced Semiconductor Eng Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (en) 2010-03-22 2013-10-01 Advanced Semiconductor Eng Semiconductor package and manufacturing method thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof

Also Published As

Publication number Publication date
TW200941637A (en) 2009-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees