TWI366424B - Method of treating and probing a via - Google Patents

Method of treating and probing a via

Info

Publication number
TWI366424B
TWI366424B TW095114526A TW95114526A TWI366424B TW I366424 B TWI366424 B TW I366424B TW 095114526 A TW095114526 A TW 095114526A TW 95114526 A TW95114526 A TW 95114526A TW I366424 B TWI366424 B TW I366424B
Authority
TW
Taiwan
Prior art keywords
probing
treating
Prior art date
Application number
TW095114526A
Other languages
English (en)
Other versions
TW200701849A (en
Inventor
Alexander Leon
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of TW200701849A publication Critical patent/TW200701849A/zh
Application granted granted Critical
Publication of TWI366424B publication Critical patent/TWI366424B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW095114526A 2005-04-22 2006-04-24 Method of treating and probing a via TWI366424B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/112,016 US7461771B2 (en) 2005-04-22 2005-04-22 Method of treating and probing a via

Publications (2)

Publication Number Publication Date
TW200701849A TW200701849A (en) 2007-01-01
TWI366424B true TWI366424B (en) 2012-06-11

Family

ID=37185817

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114526A TWI366424B (en) 2005-04-22 2006-04-24 Method of treating and probing a via

Country Status (3)

Country Link
US (2) US7461771B2 (zh)
CN (1) CN1897793B (zh)
TW (1) TWI366424B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7453278B2 (en) * 2005-04-22 2008-11-18 Hewlett-Packard Development Company, L.P. Methods of using a blade probe for probing a node of a circuit
US7867404B2 (en) * 2005-11-15 2011-01-11 Joel Allen Deutsch Method for converting electrical components
DE102005063282A1 (de) * 2005-12-30 2007-07-19 Robert Bosch Gmbh Verfahren zur Herstellung von Druck-Schablonen, insbesondere für Rakeldruckverfahren, sowie Schablonenvorrichtung
US8294042B2 (en) * 2010-07-27 2012-10-23 Unimicron Technology Corp. Connector and manufacturing method thereof
CA2903839C (en) * 2013-03-15 2023-10-03 Theranos, Inc. Systems, devices, and methods for bodily fluid sample collection
JP2014192476A (ja) * 2013-03-28 2014-10-06 Fujitsu Ltd プリント基板の半田実装方法及び半田実装構造
JP6175296B2 (ja) * 2013-06-28 2017-08-02 日置電機株式会社 検査ポイント設定装置、及びプログラム
JP2015093465A (ja) * 2013-11-14 2015-05-18 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及び電子部品実装システム並びにスクリーン印刷方法
CN106304627B (zh) * 2015-05-13 2019-10-29 上海和辉光电有限公司 一种测试焊盘结构及其制备方法
DE102017213838B4 (de) * 2017-08-08 2024-06-13 Vitesco Technologies GmbH Verfahren zur Durchkontaktierung einer Leiterplatte und eine solche Leiterplatte
DE102017213841A1 (de) * 2017-08-08 2019-02-14 Continental Automotive Gmbh Druckschablone zur Verwendung in einem Verfahren zur Durchkontaktierung einer Leiterplatte und Verwendung solch einer Druckschablone in einem solchen Verfahren
US11619665B2 (en) * 2020-01-07 2023-04-04 International Business Machines Corporation Electrical apparatus having tin whisker sensing and prevention
JPWO2023037824A1 (zh) * 2021-09-13 2023-03-16

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032787A (en) * 1989-11-03 1991-07-16 Everett/Charles Contact Products, Inc. Electrical test probe having rotational control of the probe shaft
US5597737A (en) * 1995-11-03 1997-01-28 Motorola Inc. Method for testing and burning-in a semiconductor wafer
US5875102A (en) * 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure
US6395995B1 (en) * 2000-03-15 2002-05-28 Intel Corporation Apparatus for coupling integrated circuit packages to bonding pads having vias
US6538424B1 (en) * 2000-07-31 2003-03-25 Le Croy Corporation Notched electrical test probe tip
US6833615B2 (en) * 2000-12-29 2004-12-21 Intel Corporation Via-in-pad with off-center geometry
CN1191747C (zh) * 2001-09-06 2005-03-02 株式会社理光 电子元件组装检查方法
US6750084B2 (en) * 2002-06-21 2004-06-15 Delphi Technologies, Inc. Method of mounting a leadless package and structure therefor
US20040099716A1 (en) * 2002-11-27 2004-05-27 Motorola Inc. Solder joint reliability by changing solder pad surface from flat to convex shape
US7025628B2 (en) * 2003-08-13 2006-04-11 Agilent Technologies, Inc. Electronic probe extender
WO2006007440A1 (en) * 2004-06-16 2006-01-19 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
US7518384B2 (en) * 2005-01-31 2009-04-14 Agilent Technologies, Inc. Method and apparatus for manufacturing and probing test probe access structures on vias

Also Published As

Publication number Publication date
US7954693B2 (en) 2011-06-07
US20060237516A1 (en) 2006-10-26
CN1897793A (zh) 2007-01-17
US20090051379A1 (en) 2009-02-26
CN1897793B (zh) 2010-04-14
TW200701849A (en) 2007-01-01
US7461771B2 (en) 2008-12-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees