TWI366234B - Method, apparatus and system to control temperature of a wafer edge or wafer edge support during heating, and machine-readable medium having data therein - Google Patents

Method, apparatus and system to control temperature of a wafer edge or wafer edge support during heating, and machine-readable medium having data therein

Info

Publication number
TWI366234B
TWI366234B TW094121184A TW94121184A TWI366234B TW I366234 B TWI366234 B TW I366234B TW 094121184 A TW094121184 A TW 094121184A TW 94121184 A TW94121184 A TW 94121184A TW I366234 B TWI366234 B TW I366234B
Authority
TW
Taiwan
Prior art keywords
wafer edge
machine
readable medium
data
during heating
Prior art date
Application number
TW094121184A
Other languages
Chinese (zh)
Other versions
TW200614382A (en
Inventor
Jack Hwang
Robert James
Eric J Lambert
Jonathan Leonard
Richard Brindos
Karson L Knutson
Mark Armstrong
Justin Sandford
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/882,894 external-priority patent/US20060004493A1/en
Priority claimed from US11/156,381 external-priority patent/US20060286807A1/en
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200614382A publication Critical patent/TW200614382A/en
Application granted granted Critical
Publication of TWI366234B publication Critical patent/TWI366234B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094121184A 2004-06-30 2005-06-24 Method, apparatus and system to control temperature of a wafer edge or wafer edge support during heating, and machine-readable medium having data therein TWI366234B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/882,894 US20060004493A1 (en) 2004-06-30 2004-06-30 Use of active temperature control to provide emmisivity independent wafer temperature
US11/156,381 US20060286807A1 (en) 2005-06-16 2005-06-16 Use of active temperature control to provide emmisivity independent wafer temperature

Publications (2)

Publication Number Publication Date
TW200614382A TW200614382A (en) 2006-05-01
TWI366234B true TWI366234B (en) 2012-06-11

Family

ID=35124365

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121184A TWI366234B (en) 2004-06-30 2005-06-24 Method, apparatus and system to control temperature of a wafer edge or wafer edge support during heating, and machine-readable medium having data therein

Country Status (4)

Country Link
DE (1) DE112005001387B4 (en)
GB (1) GB2430551B (en)
TW (1) TWI366234B (en)
WO (1) WO2006004783A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818285B (en) * 2020-09-28 2023-10-11 日商國際電氣股份有限公司 Temperature control method, semiconductor device manufacturing method, program and substrate processing device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7860379B2 (en) 2007-01-15 2010-12-28 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
WO2018144901A1 (en) 2017-02-03 2018-08-09 Geodynamics, Inc. Proppant transport efficiency system and method
CN116988157B (en) * 2023-09-26 2023-12-05 山西第三代半导体技术创新中心有限公司 Silicon carbide seed crystal bonding furnace capable of reducing crystal growth holes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3348936B2 (en) * 1993-10-21 2002-11-20 東京エレクトロン株式会社 Vertical heat treatment equipment
US5551982A (en) * 1994-03-31 1996-09-03 Applied Materials, Inc. Semiconductor wafer process chamber with susceptor back coating
US6375749B1 (en) * 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US6383330B1 (en) * 1999-09-10 2002-05-07 Asm America, Inc. Quartz wafer processing chamber
US7037797B1 (en) * 2000-03-17 2006-05-02 Mattson Technology, Inc. Localized heating and cooling of substrates
US20020004897A1 (en) * 2000-07-05 2002-01-10 Min-Cheng Kao Data processing apparatus for executing multiple instruction sets
JP4842429B2 (en) * 2000-10-03 2011-12-21 東京エレクトロン株式会社 Heat treatment apparatus design method and computer-readable recording medium
US6888104B1 (en) * 2004-02-05 2005-05-03 Applied Materials, Inc. Thermally matched support ring for substrate processing chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818285B (en) * 2020-09-28 2023-10-11 日商國際電氣股份有限公司 Temperature control method, semiconductor device manufacturing method, program and substrate processing device

Also Published As

Publication number Publication date
GB2430551B (en) 2009-11-04
WO2006004783A1 (en) 2006-01-12
GB0620832D0 (en) 2006-12-13
TW200614382A (en) 2006-05-01
GB2430551A (en) 2007-03-28
DE112005001387T5 (en) 2009-03-12
DE112005001387B4 (en) 2013-08-22

Similar Documents

Publication Publication Date Title
GB2418819B (en) Setting information distribution apparatus, method, program, and medium, authentication setting transfer apparatus, method, program, and medium, and setting
HK1116278A1 (en) Device, method and system for controlling data exchange
GB2434910B (en) A temperature control, apparatus for a hard disk drive and a method of varying the temperature of a hard disk drive
EP1850372A4 (en) Temperature setting method for heat treating plate, temperature setting device for heat treating plate, program and computer-readable recording medium recording program
HK1079035A1 (en) Apparatus and method for heating works
HK1127517A1 (en) System and method for control of heat pump operation
GB0523707D0 (en) Improved apparatus and method for temperature controlled processes
GB2423158B (en) Method and apparatus for improving steam temperature control
IL190653A0 (en) Method and system for providing control information for supporting high speed downlink and uplink
GB0511865D0 (en) Disk array system and method for controlling disk array system
GB0814628D0 (en) Methods and apparatus for accessing process control data
GB2432018B (en) Program creating device for programmable controller, program creating method for programmable controller, and recording medium
AU2003268085A8 (en) Method and apparatus for temperature control
EP1711755A4 (en) Method, apparatus and system for transferring heat
EP1622798A4 (en) Fluid heater temperature control apparatus and method
GB2406898B (en) Heater controller and heater control method for refrigerator
TWI366234B (en) Method, apparatus and system to control temperature of a wafer edge or wafer edge support during heating, and machine-readable medium having data therein
EP1794097A4 (en) Method and apparatus for heating sheets of glass
GB0517554D0 (en) Apparatus, system and method for data transfer by thermal variations
PL1643191T3 (en) Apparatus and method for treating heating water
EP1538242A4 (en) Heater for crystal formation, apparatus for forming crystal and method for forming crystal
AU2003234284A8 (en) System and method for controlling wafer temperature
TWI371779B (en) Temperature setting method thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate
EP1752529A4 (en) Method and device for controlling temperature
EP1852765A4 (en) Temperature control method and temperature controller

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees