TWI371779B - Temperature setting method thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate - Google Patents
Temperature setting method thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plateInfo
- Publication number
- TWI371779B TWI371779B TW096134671A TW96134671A TWI371779B TW I371779 B TWI371779 B TW I371779B TW 096134671 A TW096134671 A TW 096134671A TW 96134671 A TW96134671 A TW 96134671A TW I371779 B TWI371779 B TW I371779B
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature setting
- thermal processing
- processing plate
- computer
- recording medium
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006141351A JP4664233B2 (en) | 2006-05-22 | 2006-05-22 | Heat treatment plate temperature setting method, program, computer-readable recording medium storing the program, and heat treatment plate temperature setting device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200915386A TW200915386A (en) | 2009-04-01 |
TWI371779B true TWI371779B (en) | 2012-09-01 |
Family
ID=38844248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096134671A TWI371779B (en) | 2006-05-22 | 2007-09-17 | Temperature setting method thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4664233B2 (en) |
TW (1) | TWI371779B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4796476B2 (en) * | 2006-11-07 | 2011-10-19 | 東京エレクトロン株式会社 | Heat treatment plate temperature setting method, program, computer-readable recording medium storing the program, and heat treatment plate temperature setting device |
JP5162314B2 (en) * | 2008-04-25 | 2013-03-13 | 東京エレクトロン株式会社 | Substrate processing method, program, computer storage medium, and substrate processing system |
JP6942555B2 (en) | 2017-08-03 | 2021-09-29 | 東京エレクトロン株式会社 | Board processing method, computer storage medium and board processing system |
KR102626801B1 (en) * | 2018-02-14 | 2024-01-18 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus, substrate processing method, and storage medium |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3875158B2 (en) * | 2002-08-09 | 2007-01-31 | 株式会社東芝 | Exposure apparatus determination system, exposure apparatus determination method, exposure apparatus determination program, and semiconductor device manufacturing method |
US7042550B2 (en) * | 2002-11-28 | 2006-05-09 | Asml Netherlands B.V. | Device manufacturing method and computer program |
JP2007227570A (en) * | 2006-02-22 | 2007-09-06 | Toshiba Corp | System and method for adjusting manufacturing equipment |
-
2006
- 2006-05-22 JP JP2006141351A patent/JP4664233B2/en active Active
-
2007
- 2007-09-17 TW TW096134671A patent/TWI371779B/en active
Also Published As
Publication number | Publication date |
---|---|
TW200915386A (en) | 2009-04-01 |
JP2007311690A (en) | 2007-11-29 |
JP4664233B2 (en) | 2011-04-06 |
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