TWI361738B - Device for switching over a laser beam and laser machining device - Google Patents

Device for switching over a laser beam and laser machining device Download PDF

Info

Publication number
TWI361738B
TWI361738B TW095104035A TW95104035A TWI361738B TW I361738 B TWI361738 B TW I361738B TW 095104035 A TW095104035 A TW 095104035A TW 95104035 A TW95104035 A TW 95104035A TW I361738 B TWI361738 B TW I361738B
Authority
TW
Taiwan
Prior art keywords
laser beam
output
laser
output laser
partial
Prior art date
Application number
TW095104035A
Other languages
Chinese (zh)
Other versions
TW200700179A (en
Inventor
Ernst Affolter
Jean-Noel Fehr
Urban Georg Schnell
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200700179A publication Critical patent/TW200700179A/en
Application granted granted Critical
Publication of TWI361738B publication Critical patent/TWI361738B/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • G02B27/14Beam splitting or combining systems operating by reflection only
    • G02B27/144Beam splitting or combining systems operating by reflection only using partially transparent surfaces without spectral selectivity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/705Beam measuring device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905Dividing and/or superposing multiple light beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/06Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the phase of light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation

Description

1361738 * I 九、發明說明: 【發明所屬之技術領域】 本發明有關一種裝置用於選擇性將一輸入雷射束導入一 第一輸出雷射束與/或導入一第二輸出雷射束》因此,本發 明有關一雷射加工裝置用於加工加工件,特別用於鑽孔與/ 或結構化電子電路載體’具有包括如上述一雷射束轉向裝 置之雷射加工裝置。 【先前技術】 現今,能以小型構形實現之電子總成經常以多層電路板 載體被建構,特別在多層電路板上。於如此作時,需要使 該電路板之特定導電層接觸。此以鑽一肓孔或穿孔進入欲 接觸之該些層及接著以導電金屬化覆鍍該孔被實現。以此 方式電路路徑不僅可以二度空間式形成且以三度空間式形 成,使得電子總成所需之空間可相當地被減低。 通常’對電子界電子電路基板藉’由特定雷射加工裝置 中,脈衝雷射照射鑽孔。通常,C〇2或固態雷射,如Nd:YAG 或Nd:YVO<雷射,被使用爲雷射光源。對一競爭性雷射加 工裝置之重要特色爲輸出,即,一方面於一特定時間單元 中可被鑽孔之數量,另一方面雷射加工裝置之採購成本。 因此,雷射加工裝置已發展爲以一單一雷射源射出之雷射 束可選項地藉由一光學切換元件被導入二輸出路徑之一。 在光線之每一輸出路徑中,可提供一偏向單元與一影像光 學系統,藉此該個別輸出射束被導向至欲加工之一個或數 個加工件上不同目標點。對使用數個雷射束用以相互鑽孔 —電路板之對應裝置,例如,日本專利文件2 0 0 2 0 1 1 5 8 4 A, 1361738 爲已知的。 可機械式旋轉之反射器亦知用於選擇性將一雷射束導入 光線之各種路徑,其中它們爲空間上分離的。於此製程中, 視反射器之個別傾斜角度而定,一輸入雷射束被反射至不 同方向。此等機械式可旋轉反射器爲不利地,因爲反射器 之質量慣性其切換時間爲相當長的。通常,至少1 00 μ5, 使得已在10 kHz之一脈衝重覆頻率,二輸出雷射束間之一 界定切換於二連續雷射脈衝間之時間幅度爲不再可能的。 日本專利文件2003053576 A號揭示一裝置與一方法,其 中一雷射束藉由一聲-光調變器(AOM)被偏向至不同方向。 在此,一聲音駐波產生於一石英,其作爲一繞射閘用於雷 射束入射於該晶體上。AOM因石英之堅固性與壽命被限制 而爲不利的,且通常僅可產生小偏向角。另一缺點爲對應 某繞射指令,雷射束之強度未完全偏向至一特定方向。而 且,一未未忽略之雷射照射強度總是被導向至不同繞射指 令。 日本專利 2003126982 A號揭示一雷射加工裝置,其包括 —電-光調變器(EOM)作爲一射束切換元件,其與極化相依 反射器聯合作用。假如EOM被相應地電氣致動,撞擊在極 化相依反射器上之雷射束的極化方向可被故意的影響,使 得雷射束可選擇地導入連接極化相依反射器下游之光線的 二輸出路徑之一者。然而,撞擊在EOM上之雷射照射從未 完美地線性極化而且,以Ε Ο Μ產生之極化方向旋轉角度總 是顯示某些模糊,一些殘餘強度總是進入該關閉雷射束之 光線路徑。又,使用一 ΕΟΜ爲不利的因爲(a)需要相當高電 1361738 壓操作EOM,(b)EOM之預期使用壽命爲未知的,特別是欲 * 偏向雷射束之高功率密度情形,且(c)EOM爲相當昂貴的光 學元件。 【發明內容】 本發明之一目的爲提供一種裝置,用於選擇性將一輸入 雷射束導入一第一輸出雷射束與/或導入一第二輸出雷射 ' 束’其中該裝置使它能以一簡單方式於輸出雷射束二者 間,精確地快速且同時地切換一雷射束。又,本發明之目 φ 的爲提供一種雷射加工裝置,其使用如上述之一雷射束轉 向裝置’以有利方式快速且精確地加工加工件。 此目的以一裝置用於選擇性將一輸入雷射束導入一第一 輸出雷射束與/或一第二輸出雷射束達成,包括獨立申請專 利範圍第1項之特色。本發明裝置包括一射束分離元件設 立以空間地將輸入雷射束分離成一第一部分射束與一第二 部分射束’一射束疊加元件設立與排列以空間上疊加該二 部分射束,及將該二部分射束轉換成該第一輸出雷射束與/ φ 或該第二輸出雷射束。該二部分射束被疊加,使得該二輸 出雷射束之強度視在該射束疊加元件之該二部分射束間之 相對相位而定。此以部分射束二者被同調性疊加,使得本 發明裝置代表一干涉計其中輸出雷射束二者間之強度分 ' 佈’可藉改變僅—半波長之部分射束之光學路徑長度被自 由調整。依據本發明,一光致動元件設置於該第一部分射 束中且設置使得該第一部分射束之光學路徑長度,可於該 射束分離元件與該射束疊加元件間變化。 本發明爲基於藉一干涉計同調性疊加二部分射束,能自 13617381361738 * I IX. Description of the Invention: [Technical Field] The present invention relates to a device for selectively introducing an input laser beam into a first output laser beam and/or into a second output laser beam. Accordingly, the present invention relates to a laser processing apparatus for processing workpieces, particularly for drilling and/or structuring electronic circuit carriers, having a laser processing apparatus including a laser beam steering apparatus as described above. [Prior Art] Today, electronic assemblies that can be implemented in a small configuration are often constructed with a multilayer circuit board carrier, particularly on a multilayer circuit board. In doing so, it is necessary to bring the specific conductive layer of the board into contact. This is accomplished by drilling a hole or perforation into the layers to be contacted and then plating the holes with conductive metallization. In this way, the circuit path can be formed not only in a two-dimensional manner but also in a three-dimensional space, so that the space required for the electronic assembly can be considerably reduced. Usually, the electronic circuit board is borrowed by a pulsed laser in a specific laser processing apparatus. Typically, C〇2 or solid-state lasers, such as Nd:YAG or Nd:YVO<,, are used as laser sources. An important feature of a competitive laser processing apparatus is the output, i.e., the amount that can be drilled in a particular time unit, and the procurement cost of the laser processing apparatus. Thus, laser processing devices have been developed such that a laser beam emitted from a single laser source is optionally introduced into one of the two output paths by an optical switching element. In each of the output paths of the light, a biasing unit and an image optical system are provided whereby the individual output beams are directed to different target points on one or more of the workpieces to be machined. For the use of a plurality of laser beams for mutually drilling - a corresponding device of a circuit board, for example, Japanese Patent Publication No. 2 0 0 2 1 1 5 8 4 A, 1361738 is known. Mechanically rotatable reflectors are also known for selectively routing a laser beam into various paths where they are spatially separated. In this process, depending on the individual tilt angle of the reflector, an input laser beam is reflected in different directions. These mechanical rotatable reflectors are disadvantageous because the mass of the reflector is inert and its switching time is quite long. Typically, at least 100 μ5, such that one of the 10 kHz pulses has been repeated, it is no longer possible to define one of the two output laser beams to switch between two consecutive laser pulses. Japanese Patent Publication No. 2003053576 A discloses a device and a method in which a laser beam is biased to a different direction by an acousto-optic modulator (AOM). Here, a sound standing wave is generated from a quartz which acts as a diffraction gate for the laser beam to be incident on the crystal. AOM is disadvantageous due to the limited robustness and longevity of quartz, and usually only produces small deflection angles. Another disadvantage is that the intensity of the laser beam is not completely biased to a particular direction corresponding to a diffraction command. Moreover, a laser illumination intensity that has not been ignored is always directed to different diffraction commands. Japanese Patent No. 2003126982 A discloses a laser processing apparatus comprising an electro-optical modulator (EOM) as a beam switching element that cooperates with a polarization dependent reflector. If the EOM is electrically actuated accordingly, the polarization direction of the laser beam impinging on the polarization dependent reflector can be deliberately affected such that the laser beam is selectively introduced into the light connecting the downstream of the polarization dependent reflector One of the output paths. However, the laser illumination impinging on the EOM is never perfectly linearly polarized and the angle of rotation of the polarization direction produced by Ε Μ always shows some ambiguity, and some residual intensity always enters the light of the closed laser beam. path. Again, the use of a ΕΟΜ is unfavorable because (a) requires a relatively high power of 1361738 to operate the EOM, (b) the expected lifetime of the EOM is unknown, especially in the case of high power densities that are biased towards the laser beam, and (c EOM is a relatively expensive optical component. SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus for selectively directing an input laser beam into a first output laser beam and/or into a second output laser 'beam' wherein the device causes it A laser beam can be switched accurately and quickly and simultaneously in a simple manner between the output laser beams. Further, the object of the present invention is to provide a laser processing apparatus which uses a laser beam turning device as described above to process a workpiece in an advantageous manner quickly and accurately. This object is achieved by a device for selectively directing an input laser beam into a first output laser beam and/or a second output laser beam, including the features of item 1 of the independent application patent. The apparatus of the present invention includes a beam splitting element setup to spatially separate the input laser beam into a first partial beam and a second partial beam 'a beam superposition element setup and arrangement to spatially superimpose the two partial beams, And converting the two partial beams into the first output laser beam and / φ or the second output laser beam. The two partial beams are superimposed such that the intensity of the two output laser beams depends on the relative phase between the two partial beams of the beam superimposing element. This is a homogenous superposition of the partial beams, such that the apparatus of the present invention represents an interferometer in which the intensity of the output laser beam can be changed by only changing the optical path length of the partial beam of the half wavelength. Free adjustment. In accordance with the present invention, a light actuating element is disposed in the first partial beam and is disposed such that an optical path length of the first partial beam is variable between the beam splitting element and the beam superimposing element. The present invention is based on a homodyne superimposed two-part beam by means of an interferometer, which can be derived from 1361738

I 由地調整光線二輸出路徑間之強度分佈之認識。例如,二 ' 部分射束間之同調性疊加,就它們具有剛好相同長度之光 學路徑長度而言,因爲該二部分射束在此方向中破壞性彼 此干涉,使輸入雷射束被導入第一輸出雷射束。無強度被 直接導入第二輸出雷射束。假如第一部分射束之光學路徑 * 長度僅以一半雷射波長被改變,由於一破壞性干涉,部分 - 射束二者之同調性疊加在第一輸出雷射束中不會產生任何 輸出功率。一破壞性干涉發生於第二輸出雷射束方向之部 Φ 分射束二者間,使得輸入雷射束之全部強度被轉移至第二 輸出雷射束。 應留意的是假如該二部分射束之路徑長度差異小於雷射 束之同調性長度,當然該二部分射束之同調性疊加僅爲可 能的。 又’應留意的是依據本發明之裝置可被使用以選擇性將 一輸入雷射束導入超過二輸出雷射束。此可以數個發明性 轉向單元’其可以串聯形式連接級聯之聯合作用達成。以 Φ 此方式它能有目地性將輸入雷射束導向成三個,四個或多 個輸出雷射束。 依據申請專利範圍第2項一第一光接收器被附加設置, 其是光耦合至第一輸出雷射束。爲調整第一輸出雷射束之 強度,光接收器更稱合至致動元件,例如經由一電線。較 佳爲光耦合至第一輸出雷射束經由一射束耦合元件達成, 射束耦合元件宜僅導向第一輸出雷射束強度之一小部分至 光接收器。光接收器爲例如一習知光二極體。較佳地,光 接收器對致動元件之耦合經由光接收器之電氣輸出被執 1361738 行,於光接收器作業中其輸出傳遞一輸出電壓,其位準爲 ' 直接正比於目前撞擊於光接收器上之光線強度。 依據申請專利範圍第3項,一第二光接收器被附加設置, 其是光耦合至第二輸出雷射束,且耦合至致動元件用於調 整第二輸出雷射束強度。此使它能特別精確調整該致動元 • 件’且如此以一清楚界定方式切換於二不同作業條件間。 • 於第一作業條件下輸入雷射束之全部強度被導向成第一輸 出雷射束’且第二輸出雷射束之強度至少接近零。於第二 φ 作業條件中第一輸出雷射束之強度爲幾乎是零,且輸入雷 射束之整個強度被導向成第二輸出雷射束。 調的徑,-置。 整以被相構二部 可短路中的位度 調,實對被第一 性常光形小前程 可換事相件向第 械非之情微目之 性變之之元朝使 機僅束轉此之保 械位徑間學直會 1 中射移如鏡確 機相路束光垂不 括令雷換爲該被 一對光射S是而 包指出變動與加 爲相之分¾總轉 件之輸 一 移其疊。件之束部。面移 元長隔之鏡,調轉元間射二 ® 出位 動波分鏡該疊同移動束分得胃輸相 致射間該合重 一束致射部使^1與 I ,雷空於聯此之射,分 I 面生 項在二指轉彼間略項部第度 U 入產 4 ,於意移上束忽 5二入厚1輸能 第說以此束間射似第中導同 _ 一它 圍解,。射空分近圍其被不光之, 範前的束 I 仍部好範,質爲轉件徑 利先要射之束二良利件介如旋元路 專上需雷束射至以專元射例或學光 請以爲入射分疊能請學折可換光之 申如動輸分部重它申光明此變得束 據。移換部二,,據射透。藉使射 依鏡片切 一得關此依折光生可,分 整鏡間第使無如 式一產位形部 -10- 1361738 分射束之光路徑受光學元件影響。如此,假如該裝置被較 佳調整,二部分射束可完全重疊,使得射束疊加元件中之 二部分射束之空間同調性不受光學元件之調整影響。因 此’它能目的性將輸入雷射束正好導向成一具有高精確度 輸出雷射束’或具有精確界定強度分佈之二輸出雷射束。 依據申請專利範圍第6項’致動元件包括一壓電驅動裝 ' 置,其啓動致動元件之一特別快速調整。如此,雖然在輸 入雷射束之高反覆率情形’它能在二連續脈衝間之光線二 φ 路徑間切換輸出雷射束之強度。 第二目的以用於加工加工件一雷射加工裝置達成,特別 對鑽孔與/或結構化電子電路載體,包括獨立項申請專利範 圍第7項之特色。本發明雷射加工裝置包括:—雷射光源 用於產生一輸入雷射束,依據申請專利範圍第1至6項中 任一項之雷射束轉向裝置,用於選擇性將輸入雷射束導向 成第一輸出雷射束與/或第二輸出雷射束,一第一偏向單元 設置於光線之第一輸出路徑中,與一第二偏向單元設置於 • 光線之第二輸出路徑中。該二偏向單元被設置於至少一工 作件上,用於定位該二輸出雷射束至規定的目標點上。 依據本發明該雷射加工裝置,能二加工區域上產生材料 相互加工。於加工中藉第一輸出雷射束,第二偏向單元被 ' 位於—目標點上’其是以第一輸出雷射束藉由切換於雷射 束轉向裝置完成加工後,以第二輸出雷射束達成。在輸入 雷射束之光波長指令中因僅光致動元件之簡短移動爲需要 的’以切換輸出強度於第一輸出雷射束之光路徑與第二輸 出雷射束之光路徑間,它能於一脈衝雷射振盪器之二連續 -11 - 1361738 脈衝間達成一射束切換,假如一合適驅動被使 * 元件的話。於此方式第二處理次數,其因偏向 分隔目標位置間之跳躍移動造成,在材料加工 去。 通常,偏向單元被稱爲Gal vo系統,其中二片 ' 於軸彼此垂直旋轉支撐被移動,使得一雷射束繫 - 鏡導引,可被導向於一加工區域內任何目標點 本發明之更多優點與特色可從以下目前較佳 φ 示性描述得知。 【實施方式】 於圖示中,僅示意性顯示一雷射加工裝置, 切換單元,其中Mach Zehnder干涉計之二部分 疊加’且選擇性導入第一輸出雷射束與/或第 束。 依據目前例示實施例之雷射加工裝置包括 1 0 5,其發射一較佳脈衝輸入雷射束丨! 〇,例如 φ 光譜範圍,於可見光光譜範圍或近紅外光光譜 紅外光雷射束情形中,一 c〇2雷射特別宜爲一 於發射可見光或近紫外光光譜範圍之雷射光源 極體激發之固態雷射宜被使用,其基本波長 ' 式,藉安裝於雷射光源1 05中之非線性石英的 轉換。 又,該雷射加工裝置包括一同調性射束切換^ 選擇性將輸入雷射束110導入第一輸出雷射束 路徑與/或第二輸出雷射束140b之光線路徑。 用於光致動 單元在不同 中被完全除 Galvo鏡對 g 由二 Galvo 〇 實施例之例 包括一射束 射束被同調 二輸出雷射 一雷射光源 於近紫外光 範圍。於一 雷射光源, 情形,一二 經由已知方 頻率相乘被 装置100,其 14 0a之光線 該同調射束 -12- 1361738 I · 切換裝置100相對於雷射光源105被設置,使得輸入雷射 • 束110打到—射束分離器115,其分離該輸入雷射束110 成二部分射束,第一部分射束120a與第二部分射束120b。 二部分射束之強度爲大約相同的。第二部分射束12 〇b經 由一靜止鏡121b被導向至一更遠射束分離器135。第—部 分射束120a經由一可移動鏡i21a亦可被導向至射束分離 - 器135。在該射束分離器135二部分射束〗20a與120b被同 調性疊加,使得該經疊加雷射束被導入第一輸出雷射束 φ 140a之光路徑與/或第二輸出雷射束140b之光路徑,視該 二部分射束1 20a與1 20b間之相位關係而定。 輸入雷射束110分離成二部分射束12〇a與120b及二部分 射束120a ’ 120b之後續同調疊加,對應Mach Zehnder干 涉計中射束分離與射束結合。在第一部分射束丨2〇a之光學 路徑中光學路徑長度經由壓電驅動裝置171,藉轉移可移動 鏡1 2 1 a被改變,其中壓電驅動裝置代表一光致動元件! 7〇 與可移動鏡1 2 1 a。光學路徑長度之變化自動改變二部分射 φ 束1 20a與1 20b間之相對相位關係,使得第一輸出雷射束 140a之光路徑與第二輸出雷射束140b之光路徑間,離開干 涉計之雷射照射強度分佈結果可被自由調整。 於目前描述之設置該二部分射束120a與120b之個別部分 ' 分別爲成對平行運行,使得該二輸出雷射束於射束分離器 135後彼此成直角運行,其中該二部分射束120a與120b被 同調性疊加。爲能以簡單方式調整整個雷射加工裝置,第 二輸出雷射束1 40b在一靜態鏡1 4 1 b被反射。對二輸出雷 射束140a與1 40b此使它能於彼此平行之光路徑中,分別 -13· 1361738 • *ψ · 啓動輸入雷射束110之強度的選擇性切換至第一輸出雷射 ' 束140a或第二輸出雷射束140b,該壓電驅動裝置171以放 大器1 65被致動,使得光偵測器1 50a之偵測器訊號與光 偵測器 1 50b之偵測器訊號間差異爲儘可能大的。假如在 二輸出雷射束之一者中之強度爲最大,且同時另一輸出雷 • 射束之強度爲最小,較佳爲零時,此被正確達成。 • 如此,二光偵測器150a與150b、比較器電路160、放大 器電路1 65與壓電驅動裝置1 7 1連同對應訊號線,代表調 φ 整迴圈其調整輸入雷射束110之強度分離,成爲第一輸出 雷射束140a與第二輸出雷射束140b至一預定値。 總而言之,以下可觀察到: 同調性射束切換裝置100包括一 Mach Zehnder干涉計與 —調整迴圈用於最佳地改變二輸出雷射束140a與140b之 強度,使它能以簡單方式快速且精確地偏向以雷射光源1 05 射出之輸入雷射束110至第一偏向單元180a與/或第二偏 向單元180b。Mach Zehnder干涉計包括二射束分離器1 15 φ 與1 3 5及二反射器、一靜態反射器1 2 1 b與一可轉移反射器 121a。調整迴圈包括二耦合射束分離器145a與145b,二光 偵測器150a與150b,電子電路160與165連同合適的訊 號線1 5 1 a、1 5 1 b、1 6 1與1 66及一驅動裝置1 7 1用於精確地 ' 移動該可移動反射器121a。 【圖式簡單說明】 第1圖爲顯示一雷射加工裝置之示意圖。 【主要元件符號說明】 100 同調射束切換裝置 -15- 1361738- ♦ l » , 105 1 10 120a 120b 12 1a 121b 135 雷射光源 輸入雷射束 射束分離器 第一部分射束 第二部分射束 可移動鏡 靜止鏡 射束分離器I adjust the intensity distribution between the two output paths of the light by ground. For example, the coherent superposition of the two 'partial beams, in terms of their optical path lengths of exactly the same length, because the two partial beams interfere destructively with each other in this direction, causing the input laser beam to be introduced into the first Output the laser beam. No intensity is directly introduced into the second output laser beam. If the optical path of the first partial beam * is only changed by half the wavelength of the laser, due to a destructive interference, the coherence of the partial-beams will not produce any output power in the first output laser beam. A destructive interference occurs between the portions of the second output laser beam Φ split beam such that the full intensity of the input laser beam is transferred to the second output laser beam. It should be noted that if the path length difference of the two partial beams is less than the coherence length of the laser beam, of course, the coherent superposition of the two partial beams is only possible. Again, it should be noted that a device in accordance with the present invention can be used to selectively direct an input laser beam into more than two output laser beams. This can be achieved by a combination of several inventive steering units' which can be connected in series to connect the cascades. In this way, it can purposefully direct the input laser beam into three, four or more output laser beams. A first optical receiver is additionally provided in accordance with item 2 of the scope of the patent application, which is optically coupled to the first output laser beam. To adjust the intensity of the first output laser beam, the light receiver is more referred to as an actuating element, such as via a wire. Preferably, the optical coupling to the first output laser beam is achieved via a beam coupling element, and the beam coupling element preferably only directs a small portion of the intensity of the first output laser beam to the optical receiver. The optical receiver is, for example, a conventional photodiode. Preferably, the coupling of the optical receiver to the actuating element is carried out via the electrical output of the optical receiver 1361738. In the operation of the optical receiver, its output delivers an output voltage whose level is directly proportional to the current impact on the light. The intensity of light on the receiver. According to claim 3, a second optical receiver is additionally provided which is optically coupled to the second output laser beam and coupled to the actuating element for adjusting the intensity of the second output laser beam. This allows it to adjust the actuating element ' particularly precisely and thus switches between two different operating conditions in a clearly defined manner. • The full intensity of the input laser beam is directed to the first output laser beam 'under the first operating condition and the intensity of the second output laser beam is at least near zero. The intensity of the first output laser beam in the second φ operating condition is almost zero, and the entire intensity of the input laser beam is directed to the second output laser beam. Adjust the diameter, - set. The whole is adjusted by the positionality of the two sections that can be short-circuited by the phase, and the pair is changed to the first-order normal light-shaped small-forward changeable phase-to-phase. In the case of the mechanical protection of the distance between the two, the movement of the mirror is as good as the mirror, and the beam is replaced by a pair of light shots, and the change is added to the balance. The loss is shifted. The bundle of pieces. The surface shifting element is separated by a long-range mirror, and the modulating element is divided into two parts. The moving wave splitting mirror is the same as the moving beam, and the combined moving beam is divided into the gastric phase. In conjunction with this shot, the sub-division of the sub-item is in the second part of the first part of the U-input, and the U-input is in the middle of the second. Same as _ a solution to it. The front of the air is not only the light, the front of the beam I is still a good model, the quality of the transfer of the diameter of the first to shoot the bundle of two good things, such as the spine road, the need for the thunder beam to special Shooting examples or learning light, please think that the incident splitting can be learned, the light can be exchanged, and the light-changing division is heavy. The second part of the shift, according to the penetration. If the lens is cut by the lens, it can be separated by the light. The entire mirror is made as follows. -10- 1361738 The beam path of the beam is affected by the optical component. Thus, if the device is better tuned, the two partial beams can be completely overlapped such that the spatial homology of the two partial beams in the beam superposition element is unaffected by the adjustment of the optical elements. Therefore, it can purposely direct the input laser beam to a high-accuracy output laser beam or a two-output laser beam with a precisely defined intensity distribution. According to the sixth application of the patent application, the actuating element comprises a piezoelectric drive device, which initiates a particularly rapid adjustment of one of the actuating elements. Thus, although in the case of a high repetitive rate of the input laser beam, it is capable of switching the intensity of the output laser beam between the two φ paths between two consecutive pulses. The second object is achieved by a laser processing apparatus for processing workpieces, particularly for drilled and/or structured electronic circuit carriers, including the features of item 7 of the independent patent application. The laser processing apparatus of the present invention comprises: - a laser source for generating an input laser beam, the laser beam steering device according to any one of claims 1 to 6 for selectively inputting the laser beam Oriented into a first output laser beam and/or a second output laser beam, a first deflection unit is disposed in the first output path of the light, and a second deflection unit is disposed in the second output path of the light. The two deflection units are disposed on at least one of the workpieces for positioning the two output laser beams to a prescribed target point. According to the laser processing apparatus of the present invention, materials generated in the two processing regions can be mutually processed. Borrowing the first output laser beam during processing, the second deflection unit is 'located at the target point', which is the first output laser beam after switching to the laser beam steering device to complete the processing, and the second output lightning The beam is reached. In the light wavelength command of the input laser beam, only a short movement of the light actuating element is required to switch the output intensity between the light path of the first output laser beam and the light path of the second output laser beam. A beam switching can be achieved between two consecutive -11 - 1361738 pulses of a pulsed laser oscillator, provided that a suitable drive is enabled for the * component. In this way, the second number of processings is caused by the jump movement between the target positions and the material processing. Typically, the deflection unit is referred to as a Galvo system in which the two pieces are moved relative to each other with the axis perpendicular to each other so that a laser beam-mirror guide can be directed to any target point within a processing region. A number of advantages and features are known from the following description of the preferred φ. [Embodiment] In the drawings, only one laser processing apparatus, a switching unit in which two parts of a Mach Zehnder interferometer are superimposed and selectively introduced into a first output laser beam and/or a first beam, is schematically illustrated. The laser processing apparatus according to the present exemplary embodiment includes 105, which emits a preferred pulse input laser beam 丨! 〇, for example, φ spectral range, in the visible light spectrum range or near-infrared spectroscopy infrared light beam, a c〇2 laser is particularly suitable for excitation of a laser source in the visible or near-ultraviolet spectral range. Solid-state lasers should be used, with their basic wavelengths, converted by nonlinear quartz installed in a laser source 105. Further, the laser processing apparatus includes a homogenous beam switching to selectively direct the input laser beam 110 into the first output laser beam path and/or the second output laser beam 140b. For the light actuating unit to be completely divided in different Galvo mirror pairs g by two Galvo 〇 Examples include a beam beam is coherent two output lasers a laser source in the near ultraviolet range. In the case of a laser source, in the case of a multiplication by a known square frequency by the device 100, the light of the 140a is the same dimming beam -12-1361738 I. The switching device 100 is set relative to the laser source 105 such that the input The laser beam 110 is struck - a beam splitter 115 that separates the input laser beam 110 into a two-part beam, a first partial beam 120a and a second partial beam 120b. The intensity of the two partial beams is approximately the same. The second partial beam 12 〇b is directed to a further beam splitter 135 via a stationary mirror 121b. The first partial beam 120a can also be directed to the beam splitter 135 via a movable mirror i21a. The two-part beams 20a and 120b of the beam splitter 135 are coherently superimposed such that the superimposed laser beam is directed into the optical path of the first output laser beam φ 140a and/or the second output laser beam 140b. The light path depends on the phase relationship between the two partial beams 1 20a and 1 20b. The input laser beam 110 is split into subsequent coherent superpositions of the two partial beams 12a and 120b and the two partial beams 120a' 120b, corresponding to beam splitting and beam combining in the Mach Zehnder interferometer. In the optical path of the first partial beam 丨2〇a, the optical path length is changed via the piezoelectric actuator 171 by means of a transfer movable mirror 1 2 1 a, wherein the piezoelectric drive represents a light actuating element! 7〇 with movable mirror 1 2 1 a. The change in optical path length automatically changes the relative phase relationship between the two partial shots φ beams 1 20a and 1 20b such that the optical path of the first output laser beam 140a and the light path of the second output laser beam 140b exit the interferometer The results of the laser irradiation intensity distribution can be freely adjusted. The individual portions ' of the two partial beams 120a and 120b are now arranged to operate in pairs, respectively, such that the two output laser beams are operated at right angles to each other after the beam splitter 135, wherein the two partial beams 120a It is superimposed with 120b. In order to be able to adjust the entire laser processing apparatus in a simple manner, the second output laser beam 1 40b is reflected at a static mirror 1 4 1 b. The pair of output laser beams 140a and 1 40b are such that they can be in parallel with each other in the optical path, respectively -13·1361738 • *ψ · Selectively switch the intensity of the input laser beam 110 to the first output laser' The beam 140a or the second output laser beam 140b is actuated by the amplifier 165 such that the detector signal of the photodetector 150a and the detector signal of the photodetector 150b The difference is as large as possible. This is correctly achieved if the intensity in one of the two output laser beams is greatest and the intensity of the other output lightning beam is at a minimum, preferably zero. In this manner, the two photodetectors 150a and 150b, the comparator circuit 160, the amplifier circuit 165 and the piezoelectric driving device 177 together with the corresponding signal line represent the intensity separation of the adjusted input laser beam 110. And becoming the first output laser beam 140a and the second output laser beam 140b to a predetermined chirp. In summary, it can be observed that: The tonal beam switching device 100 includes a Mach Zehnder interferometer and an adjustment loop for optimally changing the intensity of the two output laser beams 140a and 140b so that it can be fast and simple in a simple manner The input laser beam 110 emitted by the laser source 105 is accurately deflected to the first deflection unit 180a and/or the second deflection unit 180b. The Mach Zehnder interferometer includes a two beam splitter 1 15 φ and 135 and a two reflector, a static reflector 1 2 1 b and a transferable reflector 121a. The adjustment loop includes two coupled beam splitters 145a and 145b, two photodetectors 150a and 150b, and electronic circuits 160 and 165 together with suitable signal lines 1 5 1 a, 1 5 1 b, 1 6 1 and 1 66 and A drive unit 171 is used to precisely 'move the movable reflector 121a. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a laser processing apparatus. [Main component symbol description] 100 Coherent beam switching device -15- 1361738- ♦ l » , 105 1 10 120a 120b 12 1a 121b 135 Laser source input laser beam splitter first part beam second part beam Removable mirror static mirror beam splitter

140b 145a 145b 150a 150b 15 1a 15 1b 160 161 165 166 170 17 1 180a 180b 第一輸出雷射束 第二輸出雷射束 耦合射束分離器 耦合射束分離器 光偵測器 光偵測器 訊號線 訊號線 比較器電路 訊號線 放大器 訊號線 光致動元件 壓電驅動裝置 偏向單元 偏向單元 -16 -140b 145a 145b 150a 150b 15 1a 15 1b 160 161 165 166 170 17 1 180a 180b first output laser beam second output laser beam coupling beam splitter coupling beam splitter light detector light detector signal line Signal line comparator circuit signal line amplifier signal line light actuating element piezoelectric drive unit deflection unit deflection unit-16 -

Claims (1)

B61 酽 38 ^ mtL 第951 04 035號「切換雷射束之裝置及雷射加工機了_專列案 (2009年2月修正) 十、申請專利範圍: 1. —種用於選擇性將一輸入雷射束(110)導入一第一輸出雷 射束(140a)及/或一第二輸出雷射束(140b)之裝置,包括 • 一射束分離元件(115),設立以空間地將輸入雷射束 (110)分離成一第一部分射束(120a)與一第二部分射束 (120b); •一射束疊加元件(1 3 5)’設立並配置以空間上疊加該二 部分射束(120a,120b),及將該二部分射束(120a,120b) 轉換成該第一輸出雷射束(140a)及/或該第二輸出雷射 束(140b),其中 該二輸出雷射束(140a,140b)之強度視在該射束疊加元 件(135)處該二部分射束(120a,120b)間之相對相位轉 移而定;及 •一光致動元件(170),設置於該第一部分射束(120a) 中,且設立使得該第一部分射束(120 a)之光學路徑長度 可於該射束分離元件(115)與該射束疊加元件(13 5)間 變化。 2. 如申請專利範圍第1項之裝置,’其更包括一第一光接收 器(150 a),該第一光接收器(150a)光耦合至該第一輸出雷 射束(140a),且耦合至該致動元件(170),以便調整該第一 輸出雷射束(140a)強度。 3.如申請專利範圍第1項之裝置,其更包括一第二光接收 器(150b),該第二光接收器(150b)光耦合至該第二輸出雷 I3-61J38 * 畔Mirg修(¾正替 • 射束(140b) ’且耦合至該致動元件(1 7 !〇'㈣調整.該·家二」 輸出雷射束(140b)強度。 4. 如申請專利範圍第1至3項中任一項之裝置,其中該致 動元件(170)包括一機械式可調整鏡(121a)。 5. 如申請專利範圍第1至3項中任一項之裝置,其中該致 * 動元件(170)包括一機械式可調整折射光學元件。 • 6.如申請專利範圍第4項之裝置,其中該致動元件(17 0)包 括一壓電驅動裝置(171)。 φ 7.如申請專利範圍第5項之裝置,其中該致動元件(170)包 括一壓電驅動裝置(171)。 8 ·—種用於加工工件之雷射加工裝置,特別用於鑽孔及/或 • > 結構化電子電路載體,該裝置包括 •一雷射光源(105),用於產生一輸入雷射束(110); • 一如申請專利範圍第1至 7項中任一項之裝置 (100),用於選擇性將該輸入雷射束(110)導入一第一輸 出雷射束(140a)及/或一第二輸出雷射束(140b); φ ·—第一偏向單元(180a),設置於光線(140a)之該第一輸 出路徑;及 •—第二偏向單元(180b),設置於光線(140b)之該第二輸 * 出路徑,其中該二偏向單元(180a,180 b)被設置於至少 • 一工件上,用於定位該二輸出雷射束(140a,140b)至規 定的目標點。B61 酽38 ^ mtL No. 951 04 035 "Switching the device of the laser beam and the laser processing machine _Special case (amended in February 2009) X. Patent application scope: 1. Kind for selective input A device for introducing a laser beam (110) into a first output laser beam (140a) and/or a second output laser beam (140b), comprising: a beam splitting element (115), set to spatially input The laser beam (110) is separated into a first partial beam (120a) and a second partial beam (120b); a beam superposition element (1 3 5) is set up and configured to spatially superimpose the two partial beam (120a, 120b), and converting the two-part beam (120a, 120b) into the first output laser beam (140a) and/or the second output laser beam (140b), wherein the two output lasers The intensity of the beam (140a, 140b) depends on the relative phase shift between the two partial beams (120a, 120b) at the beam superposition element (135); and a light actuating element (170) is provided The first partial beam (120a) is set up such that an optical path length of the first partial beam (120a) is available for the beam The device (115) and the beam superimposing element (13 5) are changed. 2. The device of claim 1, wherein the device further comprises a first light receiver (150 a), the first light receiving The device (150a) is optically coupled to the first output laser beam (140a) and coupled to the actuating element (170) for adjusting the intensity of the first output laser beam (140a). The device of claim 1, further comprising a second optical receiver (150b) optically coupled to the second output Ray I3-61J38* Mirg repair (3⁄4 positive • beam ( 140b) 'and coupled to the actuating element (1 7 !〇 '(4) adjustment. The second home) outputs the intensity of the laser beam (140b). 4. The device of any one of claims 1 to 3 The actuating element (170) includes a mechanically adjustable mirror (121a). 5. The device of any one of claims 1 to 3, wherein the actuating element (170) comprises a mechanical Adjustable refractive optical element. 6. The device of claim 4, wherein the actuating element (170) comprises a piezoelectric actuator [017] φ 7. The device of claim 5, wherein the actuating element (170) comprises a piezoelectric driving device (171). 8 - a laser processing device for processing a workpiece, Particularly for drilling and/or • > structured electronic circuit carrier, the device comprising: a laser source (105) for generating an input laser beam (110); • as claimed in claim 1 The apparatus (100) of any one of the items 7 for selectively introducing the input laser beam (110) into a first output laser beam (140a) and/or a second output laser beam (140b); φ · - a first biasing unit (180a) disposed in the first output path of the light (140a); and a second deflecting unit (180b) disposed in the second output path of the light (140b) The two deflecting units (180a, 180b) are disposed on at least one workpiece for positioning the two output laser beams (140a, 140b) to a prescribed target point.
TW095104035A 2005-06-16 2006-02-07 Device for switching over a laser beam and laser machining device TWI361738B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005027898A DE102005027898A1 (en) 2005-06-16 2005-06-16 Apparatus for selectively steering a laser beam having an optical control element such that the wavelength of the beam is variable

Publications (2)

Publication Number Publication Date
TW200700179A TW200700179A (en) 2007-01-01
TWI361738B true TWI361738B (en) 2012-04-11

Family

ID=37489672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104035A TWI361738B (en) 2005-06-16 2006-02-07 Device for switching over a laser beam and laser machining device

Country Status (6)

Country Link
JP (1) JP4490933B2 (en)
KR (1) KR20060131606A (en)
CN (1) CN1881064B (en)
DE (1) DE102005027898A1 (en)
HK (1) HK1095638A1 (en)
TW (1) TWI361738B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007045454B4 (en) 2007-09-24 2013-04-25 Hellma Materials Gmbh & Co. Kg Pulse stretcher with variable delay lines
KR100945134B1 (en) 2008-02-29 2010-03-02 아이피지 포토닉스 코리아(주) Laser beam switching apparatus possible back-up.
DE102012009547A1 (en) * 2012-05-12 2013-11-14 Hochschule Mittweida (Fh) Device for performing power modulation of laser beam, has combining device to combine two different polarized partial beams at impingement point before coupling modulators, and beam deflecting unit to deflect partial beams
CN102932060B (en) * 2012-10-08 2016-04-27 中国科学院西安光学精密机械研究所 A kind of high speed optical communication system full light XOR gate implementation method
CN107052579A (en) * 2017-03-29 2017-08-18 苏州镭缘激光科技有限公司 A kind of continuous timesharing laser soldering device
CN109131041A (en) * 2017-06-19 2019-01-04 深圳市绎立锐光科技开发有限公司 A kind of vehicle self-adapting illumination device and lighting system
JP6769424B2 (en) * 2017-11-13 2020-10-14 株式会社安川電機 Laser processing method, controller and robot system
WO2020178813A1 (en) * 2019-03-06 2020-09-10 Orbotech Ltd. High-speed dynamic beam shaping

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471300A (en) * 1994-04-12 1995-11-28 Northrop Grumman Corporation Apparatus and method for providing a feedback measurement in a laser system
JP2002250827A (en) * 2001-02-26 2002-09-06 Furukawa Electric Co Ltd:The Light gain equalizing filter
JP2004271592A (en) * 2003-03-05 2004-09-30 Toto Ltd Mach-zehnder type optical interferometer and method of manufacturing same

Also Published As

Publication number Publication date
CN1881064C (en)
DE102005027898A1 (en) 2006-12-21
HK1095638A1 (en) 2007-05-11
CN1881064B (en) 2010-04-07
CN1881064A (en) 2006-12-20
JP4490933B2 (en) 2010-06-30
JP2006350292A (en) 2006-12-28
KR20060131606A (en) 2006-12-20
TW200700179A (en) 2007-01-01

Similar Documents

Publication Publication Date Title
TWI361738B (en) Device for switching over a laser beam and laser machining device
JP7116174B2 (en) Optical device for direct laser interference structuring
US6727462B2 (en) Laser machining device
JP2004249364A (en) Multi-beam laser drilling apparatus
KR20080087709A (en) Lazer processing apparatus
JP5293791B2 (en) Laser processing apparatus and processing method of workpiece using laser processing apparatus
JP4490410B2 (en) Laser irradiation apparatus and laser processing method
US8502110B2 (en) Multibeam laser device for fabricating a microretarder by heating process
JP2009039732A (en) Laser machining apparatus
JP6869623B2 (en) Laser processing equipment
KR102143187B1 (en) Laser processing apparatus and laser processing method using the same
KR101421091B1 (en) Micro-pattern processing device and method using ultra-short pulse laser
JP5465120B2 (en) Optical axis adjustment method and laser processing apparatus
KR20230130046A (en) Additive manufacturing system and related methods using Risley prism beam steering
JP4662411B2 (en) Laser processing equipment
JP7203315B2 (en) LASER OSCILLATOR AND LASER PROCESSING DEVICE USING THE SAME
JP2008126306A (en) Laser beam machining apparatus and method
JP2007520724A (en) Apparatus and method for self-controlling phase with an amplifier having a stimulated Brillouin scattering phase conjugate mirror
JP5828852B2 (en) Laser processing apparatus and processing method of workpiece using laser processing apparatus
JP5178622B2 (en) Laser processing apparatus and laser processing method
KR101057457B1 (en) Drilling device and drilling method
JPH08222793A (en) Automatic focal point laser light source
KR20230163873A (en) Fast beamforming method for beam scanning device using optical waveguide phased array
TW201620657A (en) Autofocus system and method changing focus in accordance to light beam sensitivity
JP2013188779A (en) Laser beam machining device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees