HK1095638A1 - Device for switching over a laser beam and laser machining device - Google Patents

Device for switching over a laser beam and laser machining device

Info

Publication number
HK1095638A1
HK1095638A1 HK07102887.5A HK07102887A HK1095638A1 HK 1095638 A1 HK1095638 A1 HK 1095638A1 HK 07102887 A HK07102887 A HK 07102887A HK 1095638 A1 HK1095638 A1 HK 1095638A1
Authority
HK
Hong Kong
Prior art keywords
switching over
laser
laser beam
machining device
laser machining
Prior art date
Application number
HK07102887.5A
Inventor
Ernst Affolter
Jean-Noel Fehr
Urban Georg Schnell
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of HK1095638A1 publication Critical patent/HK1095638A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/144—Beam splitting or combining systems operating by reflection only using partially transparent surfaces without spectral selectivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/06—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the phase of light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Lasers (AREA)
HK07102887.5A 2005-06-16 2007-03-19 Device for switching over a laser beam and laser machining device HK1095638A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005027898A DE102005027898A1 (en) 2005-06-16 2005-06-16 Apparatus for selectively steering a laser beam having an optical control element such that the wavelength of the beam is variable

Publications (1)

Publication Number Publication Date
HK1095638A1 true HK1095638A1 (en) 2007-05-11

Family

ID=37489672

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07102887.5A HK1095638A1 (en) 2005-06-16 2007-03-19 Device for switching over a laser beam and laser machining device

Country Status (6)

Country Link
JP (1) JP4490933B2 (en)
KR (1) KR20060131606A (en)
CN (1) CN1881064B (en)
DE (1) DE102005027898A1 (en)
HK (1) HK1095638A1 (en)
TW (1) TWI361738B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007045454B4 (en) 2007-09-24 2013-04-25 Hellma Materials Gmbh & Co. Kg Pulse stretcher with variable delay lines
KR100945134B1 (en) 2008-02-29 2010-03-02 아이피지 포토닉스 코리아(주) Laser beam switching apparatus possible back-up.
DE102012009547A1 (en) * 2012-05-12 2013-11-14 Hochschule Mittweida (Fh) Device for performing power modulation of laser beam, has combining device to combine two different polarized partial beams at impingement point before coupling modulators, and beam deflecting unit to deflect partial beams
CN102932060B (en) * 2012-10-08 2016-04-27 中国科学院西安光学精密机械研究所 Method for implementing all-optical exclusive-OR gate of high-speed optical communication system
CN107052579A (en) * 2017-03-29 2017-08-18 苏州镭缘激光科技有限公司 A kind of continuous timesharing laser soldering device
CN109131041A (en) * 2017-06-19 2019-01-04 深圳市绎立锐光科技开发有限公司 A kind of vehicle self-adapting illumination device and lighting system
JP6769424B2 (en) * 2017-11-13 2020-10-14 株式会社安川電機 Laser processing method, controller and robot system
US20220121082A1 (en) * 2019-03-06 2022-04-21 Orbotech Ltd. High-Speed Dynamic Beam Shaping
CN111843242A (en) * 2020-08-24 2020-10-30 深圳市超越激光智能装备股份有限公司 Double-head laser cutting machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471300A (en) * 1994-04-12 1995-11-28 Northrop Grumman Corporation Apparatus and method for providing a feedback measurement in a laser system
JP2002250827A (en) * 2001-02-26 2002-09-06 Furukawa Electric Co Ltd:The Light gain equalizing filter
JP2004271592A (en) * 2003-03-05 2004-09-30 Toto Ltd Mach-zehnder type optical interferometer and method of manufacturing same

Also Published As

Publication number Publication date
DE102005027898A1 (en) 2006-12-21
CN1881064B (en) 2010-04-07
JP2006350292A (en) 2006-12-28
TWI361738B (en) 2012-04-11
CN1881064A (en) 2006-12-20
TW200700179A (en) 2007-01-01
JP4490933B2 (en) 2010-06-30
CN1881064C (en)
KR20060131606A (en) 2006-12-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140224