TWI361452B - - Google Patents
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- Publication number
- TWI361452B TWI361452B TW97140378A TW97140378A TWI361452B TW I361452 B TWI361452 B TW I361452B TW 97140378 A TW97140378 A TW 97140378A TW 97140378 A TW97140378 A TW 97140378A TW I361452 B TWI361452 B TW I361452B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- integrated circuit
- pattern
- laser light
- grain
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 18
- 239000013078 crystal Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 9
- 230000001788 irregular Effects 0.000 claims description 6
- 238000010586 diagram Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 31
- 238000012360 testing method Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97140378A TW201017734A (en) | 2008-10-22 | 2008-10-22 | Method of rapidly removing irregular die integrated circuit pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97140378A TW201017734A (en) | 2008-10-22 | 2008-10-22 | Method of rapidly removing irregular die integrated circuit pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201017734A TW201017734A (en) | 2010-05-01 |
| TWI361452B true TWI361452B (enExample) | 2012-04-01 |
Family
ID=44830968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97140378A TW201017734A (en) | 2008-10-22 | 2008-10-22 | Method of rapidly removing irregular die integrated circuit pattern |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201017734A (enExample) |
-
2008
- 2008-10-22 TW TW97140378A patent/TW201017734A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201017734A (en) | 2010-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |