1357794 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種應用於電子裝置之腳塾，特別是一種腳塾調整模組 與其調整方法。 【先前技術】1357794 VI. Description of the Invention: [Technical Field] The present invention relates to an ankle for an electronic device, and more particularly to an ankle adjustment module and an adjustment method thereof. [Prior Art]
科技的進步使人們越加依賴各種電子裝置，也就是說人們每天的日常 生活，皆會接觸到多種不同種類的電子裝置。此外，在資訊發達的時代， 人們要求電子裝置能擁有龐大的功能，且必須具有快速的運算能力。然而， 在電子裝置為了提高效能而快速運轉的情況下.，相對的將產生更多的熱 能。當廢熱造成溫度過高時，可能會引起電子裝置的當機，嚴重時甚至會 毀壞電子裝置的元件。 一般運轉效能較高的電子裝置，例如：筆記型電腦、或多種可攜式 (portable)電子裝置，皆會在裝置的底部(亦即與置放平面所接觸的那一面) 設置腳墊。所設置的腳墊可支撐電子裝置，進而使電子裝置與所置放的工 作平面之間產生散熱m *讓電子裝置内部的廢熱可以藉由電子裝置底 職生的散熱空間，以與環境中的空氣進行對流， 如此即可降低電子裝置畴的卫作溫度。由此可知，腳墊賴置可有效提 升電子裝置的散熱效能。 ‘二而為了符D使用者的需求，電子裝置的運轉效能不斷的往上提升， 的廢熱亦跟隨著増加，因此’將造祕麟紗構成的散熱空間， 不足以提供電子裝置内部溫細有效散熱。 3 1357794 【發明内容】 有鐘於此本發明提出一種腳塾調整模組與其調整方法 提出的模組或枝，可依魏子裝置的溫度_整聊塾， 間。 本發明提出-種腳嫩模組，雜具有殼體之電子裝置，且電子 裝置適於置於平面，該輕難Advances in technology have made people more dependent on a variety of electronic devices, which means that people's daily life will be exposed to many different kinds of electronic devices. In addition, in the era of developed information, people are required to have huge functions and must have fast computing power. However, in the case where the electronic device operates quickly for improved performance, relatively more heat will be generated. When the waste heat causes the temperature to be too high, it may cause the electronic device to crash, and even severely destroy the components of the electronic device. Generally, an electronic device with high performance, such as a notebook computer or a plurality of portable electronic devices, is provided with a foot pad at the bottom of the device (that is, the side that is in contact with the placement plane). The foot pad can support the electronic device, thereby generating heat dissipation between the electronic device and the placed work surface. * The waste heat inside the electronic device can be used in the environment by the heat dissipation space of the electronic device. The air is convected, which reduces the temperature of the electronics sector. It can be seen that the mat lying can effectively improve the heat dissipation performance of the electronic device. 'In order to meet the needs of users, the operating efficiency of electronic devices has been continuously improved, and the waste heat has been followed. Therefore, the cooling space formed by the secret cymbal yarn is insufficient to provide an internal temperature and effective effect of the electronic device. Cooling. 3 1357794 [Summary of the Invention] The present invention proposes an ankle adjustment module and an adjustment method thereof. The module or the branch can be arranged according to the temperature of the Weizi device. The invention provides a foot-and-feel module, an electronic device with a housing, and the electronic device is adapted to be placed on a plane, which is difficult
c3 了@式雜、溫絲應單元、 工制^及驅動私。可調式腳塾設置贿體内，且至少-部分突出於殼 ==朗。溫織㈣峨子版溫度。蝴㈣接於溫 又感應早心雜溫度酿生朗峨。_單元連胁糊單元與可調 式腳墊’雜控制織㊉調整可調朗體之長度。C3 @式杂,温丝应单位,工制^ and drive private. The adjustable ankle is placed in the body of the bribe and at least partially protrudes from the shell == lang. Warm weaving (four) dice version temperature. Butterfly (4) is connected to the temperature and senses the early heart temperature. _ unit connected to the paste unit and adjustable foot pad 'Miscellaneous control weaving ten adjust the length of the adjustable body.
。利用本發明所 進而調整散熱空 本發明亦提出-種腳墊調整方法，細於具有殼體之電子裝置，且電 子裝置適㈣於平面，包含下列步驟：設置可調式腳墊於殼翻，且可調 式腳塾至少—部分突出於殼體贿平面接觸：制電子裝置之溫度；依據 溫度，產生控制訊號；依據控制訊號，調整可調式腳墊突出於殼體之長度。 如此’當電子裝置溫度較高時，透過本發騎提出賴組或方法，可 具有較大的散熱帥’目而可提升電子裝置的散熱效能。 有關本發明的較佳實施例及其功效，茲配合圖式說明如后。 【實施方式】 請參照「第1圖」，該圖所示為腳墊調整模組之—實施例示意圖。本發 明所提出之腳墊調整模組應用於具有殼體2之電子裝置丨，且電子裝置ι適 合放置於平面3(可參照「第2A圖」或「第2B圖」）。其中，電子裳置^ 4 1357794 可為筆記型電腦、可攜式電子裝置或其他具有腳墊而用以散熱的電子裝 置。於此’腳墊調整模組包含：可調式腳墊10、溫度感應單元2〇、控制單 元30及驅動單元40。 . 可調式腳墊10設置於殼體2内，並且至少有一部分突出於殼體2，而 、 與平面3互相接觸。其中，可調式腳墊10突出於殼體2的部份，即可與平 面3之間形成電子裝置1與外界的散熱空間。如此，利用可調式腳塾比所 產生的散熱空間’而與環境中的空氣進行對流，即可降低電子裝置】運作 籲時所產生的溫度。 溫度感應單元20用以偵測電子裝置1的溫度。舉例說明，但不以此為 限，由於一般電子裝置1(例如：筆記型電腦)中，產生較多廢熱的元件為中 央處理單元(CPU)，因此可在電子裝置丨的中央處理單元附近，裝設溫度感 應單元2〇 ’而就近偵測t央處理單元的溫度；又或者，由於目前電子裝置 1中的顯示卡效能日益提升，因此許多顯示卡也具有獨立的處理單元 (GHJ)，卿也可在_卡_近裝舰_解元2()，而就賴測顯示 _卡的溫度。由此可知’可依電子裝置i或消費者的需求等，而於電子裝置【 . ㈣適#位置設置溫度感鮮元2G’如此即可得知電子裝置丨整體的溫度， 或電子裝置1中具有溫度指標代表性元件的溫度。 控制單元3G _於溫度感應單元2〇，依據溫度_單元所偵測的 溫度，而纽测喊。赖料4〇 __解元3Q與可赋腳塾1〇， 依據控制單元30所產生伽號，_奸調式尋iq突出於殼體之 長度。 1357794 驅動單元40可包 請續參照「第1圖」， 含：馬達42及驅動件44。 由圖中所示之一實施例可知， 馬達4議於控制單元30，接收控制單元3〇所產生的控制訊號後， 依據控制城而·，件44連胁騎42射财難⑴，經由馬 達42的運轉而帶動可調式_ 1〇。也就是說，可調式腳塾⑴可依據電子 裝置i的溫度’而調整突出於殼體2之長度，進而可調整電子裝置^與平 面3之間的散熱。其中，驅動件44可以為齒輪、祕或惰輪等/而可 調式腳墊K)為了配合驅動件44的結構，因此可具有對應於驅動件44之齒 狀結構12。如此’可調式腳塾1〇即可魏齒狀結構12，以與驅動件44相 互喃合’並藉由馬達42的運轉使驅動件私轉動，進而帶動可調式卿㈣ 調整突出於殼體2之長度。 請參照「第2A圖」與「第2B圖」’分別為腳墊調整模組之使用狀態示 意圖㈠與㈡。「第2A圖」為可調式腳墊1〇下降的狀態，也就是可調式 腳墊H)伸長突出於殼體2之長度的情形。舉例說明，當溫度感應單元2〇 偵測到電子裝置1的溫度升高，此時電子裝置丨必雜提升餘效率，使 溫度能有效的降低。因此’當遇到電子裝置丨的溫度升高時，控制單㈣ 便會控制驅動單元40，而伸長可調式腳墊1〇突出於殼體2的長度。如此， 即可使可調式腳塾1〇突出於殼體2外，而與平面3之間所形成的散熱空間’ 能明顯的增加。如此’藉蝴时調式鹏1G來增加電子裝置丨與外界的 散熱空間，便可有效提升整體的散熱效率。 「第2B圖」為可調式腳墊1〇升起的狀態，也就是可調式腳塾縮小 6 突出於殼體2之長度的情形。舉例說明 示，依據本身瓣而調整可調輪「㈣圖」所 子裝置1顯，驅動單⑽便會自動 爾2的長度，此時若電 10突出_ 2外的_最小2墊10，使得可調式腳塾 1時，並不會____=^不使用電子裝置 的收納空間，也砸_伽的她的W電子裝置1 縣縮何_塾1G _殼體2之長度_，也可能是 後Z式腳墊1G突出於殼體2的長度較長，但當電子裝置1的溫度降低 後此時便不需這麼大的謝間，因此便可藉由控制單元糊驅動單 2 ’而縮小可調式腳塾嶋於殼體2之長度。如此，爾目前電子 1的溫度，贿職㈣突崎體2後，㈣生目前電 子裝置1所適合的散熱空間。 請參照「第3圖」，該圖所示為腳塾調整方法之流程圖，應用於具有殼 體之電子裝置’且電子裝置置於平面，包訂列步驟。 步驟隊設置可調式腳墊於殼體内，且可調式腳塾至少—部分突出於 殼體以與平面接觸。 步驟S20 :偵測電子裝置之溫度。 步驟S30 :依據溫度，產生控制訊號。 步驟S40 .依據控制訊號，調整可調式腳塾突出於殼體之長度。於此步 驟中’調整的方式可為：調整可調式腳塾，使可調式腳塾突出於殼體之長 度正比於溫度。 1357794 除上述步驟外，更包含下列步驟：當電子裝置關機時，調整可調式腳 塾’使可調式腳墊突出於殼體之長度為最小。 雖然本發明的技細容已㈣較佳實關跡如上，财並非用以限 定本發明’任何熟習此技藝者，在不_本發明之精神所作些許之更動與 潤飾，皆應涵蓋於本發明的齡内，因此本發日月之保護範圍當視後附之申 請專利範圍所界定者為準。 【圖式簡單說明】 第1圖：腳墊調整模組之一實施例示意圖 第2A圖：腳墊調整模組之使用狀態示意圖(一） 第2B圖：腳墊調整模組之使用狀態示意圖(二） 第3圖：腳墊調整方·法之流程圖 【主要元件符號說明】 1 :電子裝置 2 :殼體 3 :平面 1〇 :可調式腳墊 12 :齒狀結構 2〇 :溫度感應單元 30 :控制單元 40 ·驅動單 42 ·馬達 1357794 44 :驅動件. The invention further provides for adjusting the heat dissipation space. The invention also proposes a method for adjusting the foot pad, which is finer than the electronic device having the casing, and the electronic device is adapted to the plane, comprising the following steps: setting the adjustable foot pad to the shell, and The adjustable ankle is at least partially protruded from the shell bristle plane contact: the temperature of the electronic device; the control signal is generated according to the temperature; and the adjustable foot pad is adjusted to protrude from the length of the casing according to the control signal. Thus, when the temperature of the electronic device is high, the heat dissipation performance of the electronic device can be improved by providing a large heat dissipation by the present invention. Preferred embodiments of the present invention and their effects are described below in conjunction with the drawings. [Embodiment] Please refer to "FIG. 1", which is a schematic view of an embodiment of a foot pad adjustment module. The foot pad adjustment module of the present invention is applied to an electronic device having a casing 2, and the electronic device ι is suitably placed on a plane 3 (refer to "2A" or "2B"). Among them, the electronic skirt ^ 4 1357794 can be a notebook computer, portable electronic device or other electronic device with a foot pad for heat dissipation. The 'foot pad adjustment module' includes: an adjustable foot pad 10, a temperature sensing unit 2, a control unit 30, and a driving unit 40. The adjustable foot pad 10 is disposed in the housing 2, and at least a portion protrudes from the housing 2, and is in contact with the plane 3. Wherein, the adjustable foot pad 10 protrudes from the portion of the casing 2, and the heat dissipation space of the electronic device 1 and the outside is formed between the flat surface 3 and the flat surface 3. In this way, the convection of the air in the environment by the adjustable heat dissipation space of the pedals can reduce the temperature generated by the operation of the electronic device. The temperature sensing unit 20 is configured to detect the temperature of the electronic device 1. For example, but not limited thereto, since a component that generates more waste heat in a general electronic device 1 (for example, a notebook computer) is a central processing unit (CPU), it can be located near a central processing unit of the electronic device. The temperature sensing unit is installed to detect the temperature of the central processing unit; or, because the performance of the display card in the electronic device 1 is increasing, many display cards also have independent processing units (GHJ). It can also be used in _ card_ near loading ship _ solution 2 (), and it depends on the temperature of the display _ card. Therefore, it can be known that the temperature of the electronic device 丨 can be known in the electronic device 1 according to the requirements of the electronic device i or the consumer, etc., in the electronic device [4] The temperature of a representative component with a temperature index. The control unit 3G_ is in the temperature sensing unit 2〇, and according to the temperature detected by the temperature unit, the button is detected. According to the gamma generated by the control unit 30, the 寻 调 3 3 Q 依据 依据 依据 依据 〇 〇 〇 〇 〇 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据1357794 The drive unit 40 can be further referred to as "FIG. 1" and includes a motor 42 and a drive member 44. It can be seen from the embodiment shown in the figure that the motor 4 is in the control unit 30, and after receiving the control signal generated by the control unit 3, according to the control city, the member 44 is connected to the risk of riding the 42 (1), via the motor. The operation of 42 drives the adjustable _ 1 〇. That is, the adjustable footrest (1) can be adjusted to protrude from the length of the casing 2 in accordance with the temperature of the electronic device i, thereby adjusting the heat dissipation between the electronic device and the plane 3. Here, the driving member 44 may be a gear, a secret or an idler wheel, etc., and the adjustable foot pad K) may have a tooth structure 12 corresponding to the driving member 44 in order to match the structure of the driving member 44. Thus, the 'adjustable pedal 1 can be used to align the drive member 44 with each other' and the drive member 44 is rotated by the operation of the motor 42 to drive the adjustable cover (4) to protrude from the housing 2 The length. Please refer to "2A" and "2B" for the indications of the use of the mat adjustment module (1) and (2). "Fig. 2A" is a state in which the adjustable foot pad is lowered, that is, the adjustable foot pad H) is extended to protrude from the length of the casing 2. For example, when the temperature sensing unit 2 detects that the temperature of the electronic device 1 is increased, the electronic device must increase the residual efficiency, so that the temperature can be effectively reduced. Therefore, when the temperature of the electronic device is increased, the control unit (4) controls the driving unit 40, and the elongated adjustable foot pad 1b protrudes from the length of the casing 2. In this way, the adjustable footrest 1〇 can be protruded outside the casing 2, and the heat dissipation space formed between the plane 3 and the plane 3 can be significantly increased. In this way, by using the 1G to adjust the heat dissipation space of the electronic device and the outside world, the overall heat dissipation efficiency can be effectively improved. "Fig. 2B" is a state in which the adjustable foot pad is raised, that is, the adjustable ankle is narrowed 6 to protrude from the length of the casing 2. For example, according to the lobes of the adjustment wheel, the device (1) of the adjustable wheel is adjusted, and the drive unit (10) will automatically length 2, and if the electric 10 protrudes _ 2 _ minimum 2 pad 10, so that When the adjustable pedal 1 is used, it does not ____=^ does not use the storage space of the electronic device, and also _ _ _ her W electronic device 1 county shrinks _ 塾 1G _ the length of the housing 2 _, may also be The rear Z-type foot pad 1G protrudes longer than the length of the casing 2, but when the temperature of the electronic device 1 is lowered, there is no need for such a large thank-you, so that the control unit paste can drive the single 2' to be reduced. The adjustable foot is at the length of the housing 2. Thus, the current temperature of the electronic 1 , bribe (4) after the sudden body 2, (four) is the current thermal space suitable for the electronic device 1. Please refer to "Fig. 3", which shows a flow chart of the method for adjusting the ankle, which is applied to the electronic device having the housing and the electronic device is placed on the plane, and the steps are listed. The step team is provided with an adjustable foot pad in the housing, and the adjustable ankle at least partially protrudes from the housing to contact the plane. Step S20: detecting the temperature of the electronic device. Step S30: generating a control signal according to the temperature. Step S40. Adjust the adjustable foot to protrude from the length of the housing according to the control signal. In this step, the adjustment can be made by adjusting the adjustable ankle so that the length of the adjustable ankle protruding from the housing is proportional to the temperature. In addition to the above steps, 1357794 includes the following steps: when the electronic device is turned off, adjust the adjustable foot 塾 to minimize the length of the adjustable foot pad protruding from the housing. Although the technical details of the present invention have been described above, it is not intended to limit the present invention to anyone skilled in the art, and some modifications and refinements that are not made in the spirit of the present invention are encompassed by the present invention. Within the scope of the application, the scope of protection of this issue is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment of a foot pad adjusting module. Fig. 2A is a schematic view showing the state of use of the foot pad adjusting module (1) Fig. 2B: a state of use of the foot pad adjusting module ( 2) Figure 3: Flow chart of the pad adjustment method [Description of the main components] 1 : Electronic device 2 : Housing 3 : Plane 1 〇: Adjustable foot pad 12 : Toothed structure 2 〇: Temperature sensing unit 30: Control unit 40 · Drive unit 42 · Motor 1357794 44 : Driver