TWI669599B - Electronic device - Google Patents

Abstract

An electronic device includes a body, at least one heat source, a shape memory component, a support member, a sensor, a control module, and at least one thermal resistor. The heat source is disposed on the body. The shape memory element is twistably disposed to the body. The support member is linked to the shape memory element. The sensor is disposed on the body and is used to sense temperature information of the heat source. The control module is disposed on the body and electrically connected to the sensor. The thermal resistance is electrically connected to the control module and thermally coupled to the shape memory element. The control module drives the thermal resistance according to the temperature information received from the sensor, so that the thermal resistance heats and deforms the shape memory element, and drives the support to open relative to the body.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device including an automatic rotating support structure.

With the rapid development of technology, the demand for the use of electronic devices has gradually increased in recent years. As the performance of electronic devices increases, the heating power of electronic components used inside electronic devices continues to rise. For example, an gaming-grade Gaming Laptop for high computing needs is designed to be lightweight and easy to carry, and requires high-performance electronic components to be placed in a thin and light space. Game software with high computational processing requirements can have sufficient heat dissipation effect, which is the focus of such product design.

The current heat dissipation of e-sports notebook products usually requires passive heat sink components with active heat sinks. The passive heat dissipating component includes a pen electric cooling pad, a pen electric heat dissipating frame, etc., and the main purpose thereof is to pad the electric pen to enable the airflow to flow between the pen and the desktop, and can transfer the heat generated by the electronic component to the electronic device. External, reducing the temperature of the overall electronic device. However, the heat-dissipating pad and the heat-dissipating frame need to be time-adjusted in the case where heat dissipation is required, and it is not convenient to carry.

The invention provides an electronic device which can automatically adjust the opening angle between the heat dissipation mechanism and the body according to the temperature of the heat source, so that the body can be lifted up to provide a heat dissipation airflow passage.

The electronic device of the present invention comprises a body, at least one heat source, a shape memory component, a support member, a sensor, a control module and at least one thermal resistor. The heat source is disposed on the body. The shape memory element is twistably disposed to the body. The support member is linked to the shape memory element. The sensor is disposed on the body and is used to sense temperature information of the heat source. The control module is disposed on the body and electrically connected to the sensor. The thermal resistance is electrically connected to the control module and thermally coupled to the shape memory element. The control module drives the thermal resistance according to the temperature information received from the sensor, so that the thermal resistance heats and deforms the shape memory element, and drives the support to open relative to the body.

Based on the above, in the electronic device of the present invention, the support member coupled to the shape memory element is disposed, and the control module drives at least one thermal resistor mounted on the shape memory element according to the temperature information measured by the sensor. Having deformed the shape memory element to receive heat from the thermal resistor, and thereby driving the support member to open with respect to the body with the thermally deformed shape memory element, and at least the partial support member is moved into or removed from the body. The body is lifted relative to the platform to thereby provide a cooling air flow passage and improve heat dissipation.

The above described features and advantages of the invention will be apparent from the following description.

1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the electronic device 10 is, for example, a notebook computer, but the embodiment does not limit the type of the electronic device 10 . Meanwhile, FIG. 1 only schematically shows some of the components of the present invention, and the electronic device 10 is illustrated in the above and below inverted manner. Here, the electronic device 10 includes a body 100, at least one heat source 110, a shape memory component 120, a support member 130, a sensor 140, a control module 150, and at least one thermal resistor 160. The heat source 110, the sensor 140 and the control module 150 are disposed in the body 100. The shape memory component 120 and the support member 130 are movably disposed on the bottom surface 101 of the body 100. The support member 130 is driven by the shape memory component 120 to be convex. Out or immersed in the bottom surface 101.

Figure 2 is a partial cross-sectional view taken along line A-A' of Figure 1. 3 is a partial schematic view of the electronic device of FIG. 1. Referring to FIG. 2 and FIG. 3 first, in the embodiment, the bottom surface 101 of the body 100 is formed with a slot 102. The shape memory element 120 is twistably disposed in the axial direction L adjacent the slot 100 of the body 100. Further, the shape memory element 120 has a long thin plate shape extending in the axial direction L and including a first end 121 and a second end 122 corresponding to the axial direction, that is, the first end 121 and the second end 122 are in the axial direction L. The opposite ends of the first end 121 are disposed on the body 100 and are fixedly received in the slot 102, and the second end 122 is connected to the support member 130. In this embodiment, a card slot 133 is formed on the surface of the support member 130 facing the shape memory component 120. The second end 122 is inserted into the card slot 133, and the shape memory component 120 is coupled to the support member 130 through the second end 122 thereof. . Furthermore, the thermal resistor 160 is, for example, a cement resistor disposed in the body 100 and thermally coupled to the shape memory element 120, where the thermal coupling means that heat generated by the thermal resistor 160 can be smoothly transmitted to at least a portion of the shape memory element 120. In order to allow the shape memory element 120 to reach its memory temperature, a corresponding deformation can be produced.

4 is a diagram showing electrical characteristics of components of the electronic device of FIG. 1. As shown in FIG. 1 and FIG. 4, the heat source 110 is, for example, a processor inside the notebook computer, a memory, or any electronic component disposed inside the body 100 and capable of generating heat during operation, and the type thereof is not limited to the above. The sensor 140 is configured to sense the temperature information of the heat source 110 and provide temperature information to the control module 150 to cause the control module 150 to heat the shape memory element 120 according to the driving of the thermal resistor 160.

Referring to FIG. 1 to FIG. 4 , in detail, the heat source 110 of the embodiment is a processor, and the control module 150 includes an embedded controller 151 (Embedded controller) and at least one power switch 152, and the sensor 140 is The built-in electronic unit of the processor is electrically connected to the embedded controller 151. Moreover, the power switch 152 is electrically connected to the voltage source 180, and the embedded controller 151 stores the temperature-voltage corresponding information and is used to turn on and off the power switch 152. When the power switch 152 is turned on by the embedded controller 151, The voltage source 180 can be controlled to provide a corresponding voltage to the thermal resistor 160 according to the temperature-voltage corresponding information, and the thermal resistor 160 operates to receive the voltage and generates heat, and heats the shape memory element 120. In addition, the embedded controller 151 can also obtain the required voltage corresponding to the temperature by its firmware operation, and thereby drive the power switch 152 to provide the voltage to the thermal resistor 160.

Although the single power switch 152 corresponds to the single thermal resistor 160, in the other embodiments of the present invention, the embedded controller 151 can also control the plurality of thermal resistors correspondingly by the single power switch 152. 160, or a plurality of power switches 152 are correspondingly controlled to control the plurality of thermal resistors 160, and the dominant relationship is not limited herein. In the embodiment, a pair of shape memory elements 120 and a pair of support members 130 are illustrated in FIG. 1 , but in other embodiments not shown, they may also be disposed at the bottom 101 of the body 100 of the electronic device 10 . The plurality of shape memory elements 120 and the plurality of supports 130 increase a plurality of modes of operation that allow the body 100 to change its raised state.

Referring to FIG. 2 and FIG. 3 , in the embodiment, the electronic device 10 further includes a fixing component 170 disposed between the body 100 and the support 130 . The fixing assembly 170 includes a first magnetic member 171 and a second magnetic member 172 corresponding to the first magnetic member 171, which are respectively disposed on the body 100 and the support member 130. As shown in FIG. 2, when the shape memory element 120 is not heated, that is, when the temperature sensed by the sensor 140 is not yet up to a preset value, the embedded controller 151 does not start the power supply. The switch 152 is such that the support member 130 is detachably abutted against the body 100 by the fixing member 170, that is, the support member 130 is fixed to the body 100 by the first magnetic member 171 and the second magnetic member 172.

Figure 5 is a partial cross-sectional view of the electronic device in another state. Figure 6 is a partial schematic view of the electronic device in another state. Referring to FIG. 5 and FIG. 6 simultaneously, and referring to FIG. 2 and FIG. 3, once the processor improves the processing performance and rises to a high temperature state, the embedded controller 151 can receive the temperature information provided by the sensor 140, and according to To drive the power switch 152, a corresponding voltage is supplied to the thermal resistor 160 to cause the thermal resistor 160 to heat the shape memory element 120 to deform. At this time, the second end 122 of the shape memory element 120 is twisted about the axial direction L to rotate the support member 130 relative to the body 100, thereby overcoming the magnetic attraction between the first magnetic member 171 and the second magnetic member 172. The support member 130 is separated from the body 100 and partially protrudes from the bottom surface 101.

As shown in FIG. 4, the support member 130 further includes a first side edge 131 and a second side edge 132. In the present embodiment, the positions of the first side edge 131 and the second side edge 132 are substantially at the cross section of the support member 130. On the diagonal. As shown in FIG. 5 and FIG. 6 , when the shape memory element 120 is thermally twisted, the first side edge 131 abuts the body 100 , and the second side edge 132 is away from the bottom surface 101 of the body 100 and protrudes from the slot 102 . The second side edge 132 protruding from the slot 102 is adapted to lift the electronic device 10 on a plane (for example, a desktop, not shown) to allow a gap between the electronic device 10 and the plane, and form an internal portion of the electronic device 10. A heat dissipating member (such as a fan) performs a passage of airflow generated by heat dissipation, thereby improving heat dissipation.

It should be noted that the illustrated embodiment is exemplified by only a pair of first magnetic members 171 and second magnetic members 172 that can be magnetically attracted to each other, but in other embodiments not shown, it may also be a magnetic member. The mutual matching of the magnetic conductive members can also achieve the above-mentioned required fixing effect by magnetic attraction.

FIG. 7 is a partial cross-sectional view of an electronic device in accordance with another embodiment of the present invention. Referring to FIG. 7 , the fixing assembly of the embodiment is composed of a hook 191 and a recess 192 on the body 100 . The hook 191 is disposed on the support 130 and has a protrusion 191 a . a recess 192 adapted to be snapped to the body 110. When the temperature of the shape memory element 120 reaches or exceeds the preset temperature, the deformation force is sufficient to drive the hook 191 away from the recess 192, and the support member 130 is moved away from the body 100 and thus reaches the aforementioned state protruding from the bottom surface 101. Relatively when the temperature of the processor drops back to the preset value, the shape memory element 120 can be restored to its original shape again, and the support member 130 is moved back to the slot 102, and the hook 191 is again driven back to the recess 192. Here, the support member and the shape memory element 120 operate in the same manner as described above, and will not be described again. In addition, although the fixing component of the present invention is disclosed above, in other embodiments not shown, the fixing method may also adopt a rotating spring or the like, and the invention is not limited thereto.

In summary, in the above embodiments of the present invention, in summary, the electronic device can automatically remove the support member from the electronic device according to different operating temperatures by using the control module and the thermal resistance. The body of the device is configured to raise the state of the electronic device relative to the plane on which it is placed or placed, so that the gap between the electronic device and the plane acts as a heat dissipation airflow passage to improve heat dissipation efficiency.

In more detail, since the shape memory element can provide a corresponding deformation state at a preset temperature, the electronic device can be used as a foot pad for lifting the body by using the supporting member, and can be smoothly processed from the embedded controller. The sensor of the device instantly knows the temperature state of the processor, so that the voltage can be supplied to the thermal resistor through the power switch, so that the thermal resistor heats the shape memory element to generate a predetermined denaturation, so that the support can be smoothly obtained. Raise the body of the electronic device to the desired opening angle.

When the processor temperature drops, the shape memory element returns to its original deformed shape, allowing the support to return to the slot of the electronic device while still performing the desired fixed action by the fixed assembly.

Accordingly, the operation of the support member of the present invention does not require additional temperature measurement evaluation and does not require manual adjustment to achieve heat dissipation, protect the internal components of the electronic device, and maintain the comfort of the user of the electronic device. In addition, the support that can be automatically retracted can also make the electronic device easy to store.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Electronic devices

100‧‧‧ body

101‧‧‧ bottom

102‧‧‧ slotting

110‧‧‧heat source

120‧‧‧ Shape memory components

121‧‧‧ first end

122‧‧‧ second end

130‧‧‧Support

131‧‧‧First side edge

132‧‧‧Second side

133‧‧‧ card slot

140‧‧‧ sensor

150‧‧‧Control Module

151‧‧‧ embedded controller

152‧‧‧Power switch

160‧‧‧Thermal resistance

170‧‧‧Fixed components

171‧‧‧First magnetic parts

172‧‧‧Second magnetic parts

180‧‧‧voltage source

191‧‧‧ hook

191a‧‧‧protrusion

192‧‧‧Depression

L‧‧‧ axial

A-A’‧‧‧ cut line

1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention. Figure 2 is a partial cross-sectional view taken along line A-A' of Figure 1. 3 is a partial schematic view of the electronic device of FIG. 1. 4 is a diagram showing electrical characteristics of components of the electronic device of FIG. 1. Figure 5 is a partial cross-sectional view of the electronic device in another state. Figure 6 is a partial schematic view of the electronic device in another state. FIG. 7 is a partial cross-sectional view of an electronic device in accordance with another embodiment of the present invention.

Claims (9)

An electronic device comprising: a body; at least one heat source disposed on the body; a shape memory component reversibly disposed on the body; a support member coupled to the shape memory component; a sensor disposed on the body The body is configured to sense temperature information of the at least one heat source; a control module is disposed on the body, electrically connected to the sensor, and includes an embedded controller, and stores a temperature-voltage corresponding And the at least one thermal resistor electrically connected to the control module and thermally coupled to the shape memory component, wherein the embedded controller of the control module is based on the temperature information received from the sensor And driving the at least one thermal resistor according to the temperature-voltage corresponding information, so that the at least one thermal resistor heats and deforms the shape memory element to drive the support member to open relative to the body. The electronic device of claim 1, wherein the at least one heat source is at least one processor of the electronic device, and the sensor is a built-in electronic unit of the processor. The electronic device of claim 1, wherein the control module further comprises at least one power switch electrically connected between the embedded controller and the corresponding at least one thermal resistor to allow the embedded controller Opening and closing the power switch, the power source The switch is activated and provides a voltage to the at least one thermal resistor based on the temperature-voltage corresponding information. The electronic device of claim 1, wherein the at least one thermal resistance is a cement resistor. The electronic device of claim 1, wherein the shape memory element extends along an axial direction and includes a first end and a second end corresponding to the axial direction, the first end being fixed to the body, the first The two ends are connected to the support member. When the shape memory element is thermally deformed, the second end is twisted about the axial direction to interlock the support member to rotate relative to the body. The electronic device of claim 5, wherein a bottom surface of the body is formed with a slot, the first end of the shape memory element is fixedly received in the slot, when the shape memory element is thermally deformed, The second end interlocks the support such that at least a portion of the support protrudes from the slot. The electronic device of claim 6, wherein the support member comprises a first side edge and a second side edge opposite to the first side edge, the first shape when the shape memory element is thermally deformed The side edge abuts the body, and the second side edge is away from the bottom surface and protrudes from the slot. The electronic device of claim 1, further comprising a fixing component disposed between the body and the support member. When the shape memory component is not thermally deformed, the support component is provided by the fixing component. Separately against the body. The electronic device of claim 8, wherein the fixing component comprises a pair of magnetic members capable of magnetically attracting each other or a magnetic member and a magnetic conductive member capable of magnetically attracting each other, or the fixing assembly comprises a structure capable of mutually A hook of the buckle and a recessed portion.