1353349 年月日絛正替換頁 九、發明說明： 【發明所屬之技術領域】 本發明侧於-顧以製作-陶紅件之成财法及成型設 備。並且特別地，本發明係關於一種利用脫水作用以 陶 工件之成型方法及成型設備。 【先前技術】 材，層加工技術，X稱為快速原型(Rapid加 技術，快速原型技術領域橫跨機械、電機、 7 料、化學等領域，為一種高度整合性的技術。職九更材 决速原型製造技術使用層狀力口工技術，能夠依昭〔仙 體ί何圖形’自動製造出3D實體物件的技術。可克服Ϊ 尸成的幾何形狀死角，做到自動化實體自由形狀製 j(S〇hd Freeform Fabrication, SFF)，^ ^ 太、=原使?的材質分為高分子材料(感光樹醋）、金屬粉 以古八秘11_、、臌及複合材群’而A錄的朗快速原型機 金屬材料為主。但是這兩種材料的價格昂貴，因· 且有古=3技術的應用範圍與推廣速度。'然而，陶究材料 ’ 而且嶋料價 統。工作分為兩大系統:雷射系統及噴嘴系 狀的塑ΐ原pc)sitol M()deling，FDM)系統能將長條 形，製程的日匕的狀態’再經由喷嘴擠出材料堆疊成 而的時間較長’因此速度慢、效率差；而三維印刷法 6 1353349 . I 年月日修正替換頁 (3D Priming，3DP)系統利用喷嘴把黏結劑(binder)喷覆於粉末狀的 材料上，黏結劑能夠把顆粒狀粉末黏結起來，但是黏結劑也會受 毛細現象造成擴散使得成品尺寸精度不佳。雷射系統中，因為雷 射光能量可調整的範圍較大，可加工的材料義多，一般而言， 只要是粉末狀的原料都可以利用雷射光加以燒結或炫結成形。 =目別為止，使用雷射光為加熱卫具、陶究材料為原料疊層 f工技術可分為三大類：（1)立體郷成像法伽⑼脑ography ίΓΓΓ丄SLA):將陶变粉末與紫外光感光樹酯(UV郎in)混合， __顧喊找工件；（2) f ―㈣，SLS) ··使用雷射光為熱 作用i成菩仕;=丁ί擇性掃描，使粉末顆粒之間產生燒結。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 And in particular, the present invention relates to a molding method and a molding apparatus for a ceramic workpiece using dehydration. [Prior Art] Material, layer processing technology, X is called rapid prototyping (Rapid plus technology, rapid prototyping technology spans the fields of machinery, motors, materials, chemistry, etc., is a highly integrated technology. The rapid prototyping technology uses layered force-splitting technology to automatically create 3D solid objects based on the image of the celestial body. It can overcome the dead angle of the corpse and make the automatic free shape j ( S〇hd Freeform Fabrication, SFF), ^ ^ too, = original? The material is divided into polymer material (photosensitive tree vinegar), metal powder to the ancient eight secrets 11_, 臌 and composite group ' and A recorded The rapid prototyping machine is mainly made of metal materials. However, the prices of these two materials are expensive, because of the application range and promotion speed of the ancient=3 technology. 'However, the ceramic materials' and the price are unified. The work is divided into two majors. System: laser system and nozzle-like plastic pc original pc) sitol M ()deling, FDM) system can extend the long strip, the state of the process of the sundial, and then stack the material through the nozzle for a longer time 'So slow and inefficient; and Dimensional printing method 6 1353349. The 3D Priming (3DP) system uses a nozzle to spray a binder onto a powdered material. The binder can bond the granular powder, but the binder It is also spread by capillary phenomenon, resulting in poor dimensional accuracy of the finished product. In laser systems, because the range of laser light energy can be adjusted, the amount of material that can be processed is much. In general, as long as the powdery material can be sintered or dashed by laser light. = As far as the eyesight is concerned, the use of laser light as a heating fixture and ceramic materials as a raw material stacking technology can be divided into three categories: (1) stereoscopic imaging method gamma (9) brainography ΓΓΓ丄 LA SLA): the ceramic powder and Ultraviolet light-sensitive resin (UV Lang in) mixed, __ 喊 找 looking for the workpiece; (2) f ― (four), SLS) · · use laser light for heat effect i into the Pu Shi; = Ding selective scanning, make the powder Sintering between particles
ManufaCturing，L0M):先把（Lam_ed Object 將薄片材料切割成適當形狀，層J射5 成陶莞生链玉件。另有_種^間利用黏結劑連結並堆疊 二黏、刪進行掃描’使粉末直接產生炫 燒結後處縣輕結劑，在做 人工剝除二=黏結後處理去除，多餘材料需經 溶結形成陶糾，概結或直接 較大的收縮及變形。 射此里松度較大’容易造成 型設備:避1:|::7種用以製作-陶瓷工件之成型方法及成 【發明内容】 陶瓷工件之成型方 本發明之-鱗在於提供—_以製作一 7 1353349 羊月日修正替換頁 法及成型設備 工件提供-種利峨水作用以製作一喊 粉末。接著概 在-起以形之黏結劑耐 仍然保持具有“性的可=料狀;未經加熱脫水的陶麵 作二上塗佈另—層襞料於前一層毁料上。同樣地，依 it加熱剛塗佈的該層聚料之特定平面圖形， 妹在一起^ r =之特定平面51賴區域巾之黏結舰脫水而黏 丄2成層陶瓷固態薄層。同時，此層陶瓷固能薄層 亦與則-層陶i固態薄層黏結在—起。 d尤U心^專層 然後重，直至所需的陶兗固態薄層均已形成。 丁此=未*結的漿料。該等m態薄層即形成所需之陶奢 將該等陶步液‘㈣滲人該等喊_薄層中或 瓦u心潯層進仃燒結，以加強該陶瓷工件的強度。 應。熱係可使該黏結劑產生化學凝膠反 c/Sic、^ οΐΓ水成鍵狀分子結構(例如Si-〇_Si、Si-o-構。當此驗〜ft該峨分子結獅續成長形成網狀分子結 究材料。由ί夫)完成後即形成三維多孔性陶 即可輕易'4〆=有體，未黏結㈣料無需特別的溶劑 使黏结劑脫i / 發明得以雷射來加熱塗佈的漿料，以 -J脫K。由於使黏結劑脫水所需能量遠小於燒沾 8 年月 曰修正替換頁 ，因此可大幅降低收縮及變形的影響。 本發明相較於先前技術具有下述優點： 1.本發明採用的材料狀態為漿料狀態。 先前技術中，SLA所採用的材料狀能 固恶材科和液態材料的優點。 ^王衆具 2.本發明所應用的材料黏結原理為凝膠原理。 SLA所應用的黏結原理 (Ph〇_ymerization)。SLA 把陶絲末加^ (UV-Curable)樹酿中，用紫外公卜先了固化 成長為父又連結的聚合物，並將陶 =體刀子 結劑混合後製成薄片狀，再將薄片以=^多^黏 射功率大小不同分為：小功率雷射可對陶 結’大功率雷射可直接把陶聽末溶結 ^仃^ 外，還有將多分子黏結劑包覆_鎌末^ ^ 雷射光以掃描’使黏結_喊粉末黏結成形 = 理把黏結#1加熱去除⑽陶聽末燒結絲。 ^ 日^斤應用的黏結原理為凝膠原理。利 = =狀分子結構(例如Si_〇_si、祕咖 再I展為網狀分子結構將卩㈣齡娜崎在 w) 的分子_為氧化物喊成份’所 α = 結劑亦為喊成份，使得整個喊工件較為均^而月= 年月日修正替換1 所使用的黏結劑為多分子材料，不是陶資： 3.製作完成的陶瓷生坯工件具有多孔性。 SLA與LOM兩種方法所製作的生坯工件，其陶瓷顆 粒之間的空間被感光樹酯填滿，因此空孔少，所含的孔隙 比率低。選擇性雷射熔結(Selective Laser Sintering，SLM)直 接把陶瓷粉末完全溶化成為陶瓷工件，所含孔隙非常少。 SLS使喊粉末雌與顆粒之間產生局部的效果(即燒 結），因此工作具有-些孔隙。本發狀利用溶縣化物在 陶兗粉末顆粒與顆粒之間產生凝膠作用將陶曼粉末顆粒膠 結在一起，在進行凝膠反應時，水份蒸發後會遺留下許多着 空間，此外陶曼顆粒之間對本就具有許多空隙，所製作的 陶瓷生坯工件具有較多的空孔與孔隙(多孔性）。 式得精神可以藉由以下的發明詳述及所附圖 【實施方式】 呈體至二C。圖—係繪示根據本發明之較佳 具體貝域之成型方法流程圖，圖二 具體=1之成_之成型_塌 需先製備所需的陶贿。根據該較佳具 娜陶_。補_，本發明不 =陶ManufaCturing, L0M): Firstly, Lam_ed Object cuts the sheet material into a suitable shape, and the layer J shoots 5 into a pottery and stalked jade piece. In addition, the _ kind of material is bonded and stacked with two adhesives, and the scanning is performed to make the powder directly After the production of sinter sintering, the county lightening agent is removed after the artificial stripping 2 = bonding, and the excess material needs to be dissolved to form a ceramic correction, or a large direct shrinkage and deformation. Easily caused type equipment: Avoid 1:::: 7 kinds of molding methods for making ceramic workpieces and [invention content] Forming of ceramic workpieces The invention is based on the provision of -_ to make a 7 1353349 sheep month day Corrected the replacement page method and the workpiece of the molding equipment to provide a kind of water-repellent effect to make a shouting powder. Then the shape-forming adhesive still maintains the "sexual material"; the unheated dehydrated ceramic surface The second layer is coated with the other layer of the material on the previous layer of the material. Similarly, according to it, the specific plane pattern of the layer of the material just coated is heated, and the sisters together ^ r = the specific plane 51 Bonded ship dehydrated and bonded to 2 layers of ceramic solid At the same time, this layer of ceramic solid energy thin layer is also bonded with the thin layer of the layer-layer ceramic i. The layer of U-core is then thickened until the desired thin layer of ceramic clay has been formed. Ding this = not * knotted slurry. These m-state thin layers are formed into the required ceramics, and the pottery liquids (4) infiltrate the shouting _ thin layer or wa 浔 浔 layer into the , sintering, In order to strengthen the strength of the ceramic workpiece. The heat system can produce a chemical gel anti-c/Sic, ^ ΐΓ water into a bond-like molecular structure (such as Si-〇_Si, Si-o-structure. Test ~ ft The 峨 峨 结 结 续 续 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由The agent removes the laser and heats the coated slurry to remove the K by -J. Since the energy required to dehydrate the binder is much smaller than that of the 8 year old correction replacement page, the shrinkage and deformation can be greatly reduced. The present invention has the following advantages over the prior art: 1. The material state adopted by the present invention is a slurry state. In the prior art, the SLA is adopted. The material used can fix the advantages of the material and the liquid material. ^王众具2. The material bonding principle applied by the invention is the gel principle. The bonding principle applied by SLA (Ph〇_ymerization). SLA In the end of the silk-added (UV-Curable) tree, the polymer is first cured by the ultraviolet bub, and the mixture of the ceramic and the body is mixed into a sheet, and then the sheet is replaced by =^ Multi-battery power is divided into different sizes: low-power laser can be used for pottery knots. High-power laser can directly dissolve the pottery at the end of the pot, and there is also a multi-molecular binder coated _ 镰 ^ ^ ^ Shooting light to scan 'make the bonding_ shouting powder bonding forming = heat the bonding #1 to remove (10) the squeezing wire. ^ The bonding principle applied by the day is the gel principle. Li = = molecular structure (such as Si_〇_si, Mi coffee re-exhibited as a network structure, the 分子 (four) age Nazaki in w) molecules _ for oxide shouting ingredients 'α = knot is also shouting Ingredients, so that the entire shouting workpiece is more uniform ^ and months = year, month and day correction replacement 1 The adhesive used is a multi-molecular material, not ceramics: 3. The finished ceramic green workpiece has porosity. In the green workpiece produced by the SLA and LOM methods, the space between the ceramic particles is filled with the photosensitive resin, so that the voids are small and the porosity ratio is low. Selective Laser Sintering (SLM) directly dissolves the ceramic powder into a ceramic workpiece with very few voids. SLS causes a local effect (ie, sintering) between the squeaky powder female and the granules, so the work has some porosity. The hair-like compound utilizes a gelation effect between the ceramsite powder particles and the granules to bond the terracotta powder particles together, and when the gel reaction is carried out, the water will evaporate and leave a lot of space, in addition, Tao Man There are many voids between the particles, and the fabricated ceramic green workpiece has more voids and pores (porosity). The spirit of the invention can be as follows through the following detailed description of the invention and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a flow chart showing a molding method according to a preferred embodiment of the present invention, and Fig. 2 shows the formation of a concrete bribe. According to the preferred one, Nata. Supplement _, the invention does not = Tao
SiC粉末、Si3N4粉末、Ti〇柃古7S 〇2陶文私末亦可為 述組合之粉末。 〇2 &末、Zr〇2粉末、Α1Λ粉末或由前 接著，如圖一中步驟S102所示，依比例均 及黏結劑，以形絲料祕购〜°陶兔粉末 例，黏結_ Si〇2 轉 1353349 年月日修正替換頁 旦 v 匕 τ n Hi，m甘裉| 里刀、匕如·％〆〇〜％:如％均勻混合。補充說明，黏結劑不限於 Si〇2溶^，亦可為氧化鈦溶膠(Titania S0l)、氧化銘溶膠(Ahimina sol)或由前述組合之溶膠。 如圖一中步驟Sl〇4、S106所示，以塗層裝置12塗佈一層混 合後的漿料SL於工作纟μ上。根據該較佳具體實施例，塗層裝 置12可包合承裝毁料SL❸漏斗122及可使毁料％均句分佈於 工作台14上的到板124。漏斗122擠送適當的漿料SI；至工作台 14土，如步驟S104所示。刮板124將前述之漿料SL·塗佈成均勻 的薄層漿料SL’，如步驟si〇6所示。該層漿料SL，之厚度可控制 在0.05mm〜〇.15mn^但本發明不以此為限，所需的塗層厚度應視 成品設計及漿料特性而定。並且本發明亦不以水 等 ς 漿料為限。 饰 如圖一中步驟S108所示，依據特定平面圖形，以加埶裝置 16加熱該層漿料si：以對該層漿料sm水，使得被加熱的該層 ' 漿料'黏結在一起以形成陶瓷固態薄層(圖二B十深色部分）。& - 據該較佳具體實施例，加熱裝置16包含雷射162及鏡片組164。 雷射162為C〇2雷射。鏡片組164係用以實施振鏡式掃描 (galvanometer mirror scan)，其包含二個反射鏡片（圖二b僅以一 • 元件代表）。鏡片組164將雷射162所發射的光線掃描聚焦於該層 漀料SI^„L ’藉此，該級以平面掃描加_層祕％，以形成^ 竟固態薄層’如圖二B所示。根據該較佳具體實施例，該掃描 ，為100mm/s〜250mm/s ’雷射功率為7W〜15W。此外，該加熱傕 該層漿料SL'脫水，係由於黏結劑，即Si〇2溶膠，產生化學凝膠 反應。亦即Si〇2溶膠將脫水成Si-O-Si鏈狀分子結構，再進—^ 發展為網狀分子結構，並將陶甍粉末黏結在一起。請參閱圖二。 圖三係Si〇2陶瓷粉末與Si〇2溶膠經過化學凝膠反應後^ SEJ^ 片。根據錄佳具體實施例，陶竟粉末為Si〇2粉末，黏結劑亦=The SiC powder, the Si3N4 powder, and the Ti〇柃古 7S 〇2 Tao Wen may also be the combined powder. 〇 2 & end, Zr 〇 2 powder, Α 1 Λ powder or from the previous, as shown in step S102 in Figure 1, according to the ratio of the binder, to the shape of the silk material secret ~ ° Tao rabbit powder example, bonding _ Si 〇2 to 1353349 day of the month to replace the replacement page dan v 匕τ n Hi, m 裉 裉 | 刀 knife, 匕 如 · % 〆〇 ~%: such as % evenly mixed. In addition, the binder is not limited to Si〇2, and may be a titanium oxide sol (Titania S0l), an oxidized sol (Ahimina sol) or a sol of the foregoing combination. As shown in steps S1, 4 and S106 of Fig. 1, a layer of the mixed slurry SL is applied to the working layer by the coating device 12. According to the preferred embodiment, the coating apparatus 12 can include a sacrificial SL hopper 122 and a slab 124 that distributes the slag on the table 14. The funnel 122 squeezes the appropriate slurry SI; to the table 14 soil, as shown in step S104. The squeegee 124 coats the aforementioned slurry SL· into a uniform thin layer slurry SL' as shown in step si〇6. The thickness of the layer SL may be controlled to be 0.05 mm to 1515 mn. However, the present invention is not limited thereto, and the required coating thickness depends on the design of the finished product and the characteristics of the slurry. Further, the present invention is not limited to the slurry of water or the like. As shown in step S108 in Fig. 1, according to a specific plane pattern, the layer slurry si is heated by the twisting device 16 to sm water the layer slurry so that the heated layer 'slurry' is bonded together. A thin layer of ceramic solid is formed (Fig. 2B, ten dark portions). & - According to the preferred embodiment, the heating device 16 includes a laser 162 and a lens assembly 164. Laser 162 is a C〇2 laser. The lens set 164 is used to implement a galvanometer mirror scan comprising two reflective lenses (Fig. 2b is represented by only one element). The lens group 164 scans the light emitted by the laser 162 to focus on the layer of material SI^„L ', whereby the level is scanned by a plane scan to add a layer of % to form a solid thin layer as shown in FIG. According to the preferred embodiment, the scanning is from 100 mm/s to 250 mm/s and the laser power is from 7 W to 15 W. In addition, the heated layer of the slurry SL' is dehydrated due to the binder, ie, Si. 〇2 sol produces a chemical gel reaction. That is, the Si〇2 sol will dehydrate into a Si-O-Si chain-like molecular structure, and then develop into a network structure and bond the ceramic powder together. Refer to Figure 2. Figure 3 shows the SiJ2 film after the chemical gel reaction of the Si〇2 ceramic powder and the Si〇2 sol. According to the specific example of the recording, the ceramic powder is Si〇2 powder, and the binder is also =
Si〇2溶膠，因此形成的陶瓷固態薄層的均質性遠較一般高分匆 結劑產生的陶瓷固態薄層為佳。 。71 ^ 1353349 補充·，該___从連料 個分離的區域。本發明之加熱裝置16之加 ί二射162亦不限於C〇2雷射，亦可為Nd:YAG雷射、He-Cd SL 者/4/62亦㈣可變掃描速率加熱該漿料 度或是節"ίΪί^黏結密度。此可用以改善特定區域的強 :，η口: 形’母一個特定平面圖即該陶窨杜 # 乂在叙If 將依序依據該特定平面_彡_ 裝置16 形成對應的陶瓷固態薄層。經由CA f=層水枓加熱、脫水以 型設備縣’依據蝴找平面_可=’=電腦與將該成 熱，並進一步達成自動化製造。 產生)控制加 因此在所有陶瓷固態薄層完 步驟S104、S106及S108。如步驟 ^月之成型方法需重覆 面圖形是否已據以掃描加熱塗佈在工作不:判斷所有特定平 否，則還有陶究固態薄層尚未完成^ 的聚料SL’。若 及_。在塗佈新的一層裝料前成可===驟s104、祕i 的南度(如步驟S112所示），使得在後 二14下降-個薄層 =巧調整聚焦基準。補充說明，於漿料後， 固態缚層不以綱厚度為必要。 翻中，每-層陶竞 提的是，當形成第二層以上 裝置16之加熱除可形麟應的 騎時，加熱 固態薄層與前—層陶級穴::層’亦同時使該對應 ==究固態薄層，N“ :第?Γ工件 鱗置16之加熱除對應地形成 49 經加熱脫水未 當步驟Sli〇之刻鼢氐θ 士 完成。如圖二C所干，'，即表示所有陶瓷固態薄層均已 包含所需的陶莞工件、本二 1陶究固態薄層(圖二C中深色的部分〕 22的支雜24。=紐㈣料撐喊工件本體） 24。補充朗，^面積可_間賴鎌支撐柱 例中，第1層陶截面。而在該較佳具體實施 成支撐柱24的t 口 W層係由數個不相連的區域組成，其係構 結的S實 ^ 根據该幸父佳具體實施例，噠丰p/V地$ , 體(例如水)以去除未黏結的漿料SL，，。° 4置係以^霧液 於k結之别或之後移除。補充說明，雖^雜4可 他可渗入之物質滲人該等陶I固態薄層， =勻、隨機分佈的空，中，嶋 值得一提的是，由於漿料SL中之黏結劑因化 生脫水翻，使得漿料SL因H2〇被脫離而呈現|:== 1353349 所示。並且由於漿料s[由士 & --—-—~ϋ备正替換一 射⑹加熱的掃描i率中^身^的t以η裝置μ以雷 件呈現多孔性的中被去除，亦是使本發明產生的陶究工 、⑽，發明採用的材料狀態為聚料狀態，具有一定的 =黏細咖心，本發明所= τ當溶膠;要==; =====得均質 陶 =合比例及加熱掃描迷率，可更進一步製作具更== ahb藉由以上較佳具體實施例之詳述，係希望能更加清禁m ί s=::並非以上述所揭露的較佳以 ίΛί 本發明所欲中請之專利範圍的範_内。i 卢論ί酬帽之專利範_射應雜據上述的說明作最窗 廣的解釋，以致使其涵蓋所有可能的改變以及具相等^的= 14 【圖式簡單說明】 圖一係緣示 圖。 根據本發明之難具體實_之成型方法流程 圖二八係料該成财法之塗佈祕製程之示意圖。 圖-B係纟會示該成财法之掃描加減程之示意圖。 圖-C係緣示該成型方法之塗佈、加熱完畢後之示意圖。 ^係SK^喊粉末與叫溶雜過化學娜反應後之 θ系根據n亥較佳具體實施例之陶究工件之s謝照片。 【主要元件符號說明】 12 .塗層裳置 14 :工作台 16 :加熱裴置 22 ·本體 24 :支撐柱 122 :漏斗 124 :刮板 162 :雷射 164 I鏡片組 SL、SL1、SL” ：漿料 S100〜S116 :方法步驟The Si〇2 sol, thus forming a ceramic solid layer, is much more homogeneous than the ceramic solid layer produced by the general high-sorted rush agent. . 71 ^ 1353349 Supplementary, the ___ separated from the area. The heating device 16 of the present invention is also not limited to a C〇2 laser, and may also be a Nd:YAG laser, a He-Cd SL/4/62 or a (four) variable scanning rate to heat the slurry. Or section " ίΪί^ bond density. This can be used to improve the strength of a particular area: η: The shape of the parent a particular plan, ie, the Tao Du Du, will form a corresponding ceramic solid layer in accordance with the particular plane _ 彡 _ device 16 in sequence. By CA f = layer water enthalpy heating, dehydration to the type of equipment county 'based on the butterfly to find the plane _ can == = computer and the heat, and further automated manufacturing. The control is added so that steps S104, S106 and S108 are completed in all of the ceramic solid layers. If the molding method of the step ^ month requires the repeated pattern to be scanned according to the heating and coating work: not to judge all the specifics, there is also a polymer SL' which has not yet completed the solid thin layer. If and _. Before applying a new layer of charge, it can be ===step s104, the south degree of the secret i (as shown in step S112), so that the second layer 14 is lowered - a thin layer = the focus reference is adjusted. In addition, after the slurry, the solid layer is not necessary for the thickness of the layer. In the middle of the turn, each layer of the pottery is that when the heating of the second layer or more of the device 16 is formed, the solid layer and the front layer of the pottery layer: the layer are also Corresponding == study solid thin layer, N": the first Γ Γ workpiece scale 16 heating in addition to the corresponding formation of 49 by heating dehydration step Sli 〇 θ θ 士 finished. As shown in Figure 2 C, ', That is to say, all ceramic solid thin layers already contain the required ceramics and the solid layer (the dark part of Figure 2C) 22 of the mixed 24. = New (four) material shouting the workpiece body) 24. Supplementary Lang, ^ area can be _ 镰 镰 镰 support column example, the first layer of ceramic cross section. In the preferred implementation of the support column 24 t-port W layer is composed of several unconnected areas, According to the embodiment of the system, the body (for example, water) is removed from the p/V to remove the unbonded slurry SL, and the solution is set to Add or remove after the knot. Supplementary explanation, although the material that can be infiltrated by the material can infiltrate the solid layer of the ceramic I, = uniform, randomly distributed, medium, and 嶋, it is worth mentioning that The binder in the slurry SL is dehydrated due to metamorphism, so that the slurry SL is exhibited by the detachment of H2 | |:== 1353349. And because of the slurry s [by 士& -----~ϋ The positive scan is replaced by a (6) heated scan rate, and the n is removed by the η device μ in the presence of the ridge, which is also the material used by the present invention, (10), the material state used by the invention. For the state of the aggregate, there is a certain = sticky coffee heart, the invention = τ as a sol; to ==; ===== to obtain a homogeneous ceramic = proportional and heating scanning rate, can be further produced with more = = ahb By way of a detailed description of the preferred embodiment above, it is desirable to be able to unequivocally m ί s=:: not in the above-mentioned preferred scope of the invention as claimed in the specification. i Lu said that the patent model of the cap is based on the above description, so that it covers all possible changes and equals = 14 According to the present invention, the flow chart of the molding method is a schematic diagram of the coating process of the method. Schematic diagram of the scanning plus subtraction method of the method of forming a wealth. Figure-C shows the schematic diagram of the coating method after the coating method is completed, and the θ system is based on the reaction of the SK ^ shouting powder and the so-called miscible chemical reaction. The photo of the ceramics of the preferred embodiment is shown in the photo. [Main component symbol description] 12. Coating skirt 14: Workbench 16: Heating device 22 • Body 24: Support column 122: Funnel 124: Scraper 162: Laser 164 I lens group SL, SL1, SL": slurry S100~S116: method steps