200914396 九、發明說明： 【發明所屬之技術領域】 本發明係”肋f作-陶紅件 備。並且特別地’本發明係關於一種利用脫二; 工件之成型方法及成型設備。 【先前技術】 材料疊層加工馳，又稱為快速原雖apid p她柳㈣，靶 技術，快速原型技術領域橫跨機械、電機、自動化、光電、 料、化學等領域，為一種高度整合性的技術。200914396 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a rib-f-pottery piece and, in particular, the present invention relates to a method for forming a workpiece and a molding apparatus. 】 Material lamination processing, also known as fast original apid p her Liu (four), target technology, rapid prototyping technology across the field of machinery, electrical, automation, optoelectronics, materials, chemistry, etc., is a highly integrated technology.
快速原型製造技術使用層狀加工技術，能夠依昭CA 構的立體幾何圖形，自動製造出犯實體物件的技術。可克服工 法f完成何形狀死角’做到自動化實體自由形狀製 巧翻Freefbnn Fab脱tk)n, SFF}，而且做出的原型無形狀限 快速原型可使用的材質分為高分子材料(感光樹醋）、金 末、喊、紙張、臘及複合材料等，而大多數的商用原機 以局分子材料及金屬材料為主。但是這兩鋪料的價格昂f，因 此限制了快速原型技術醜圍婦廣速 . 具有高強度、高炼點、耐腐嶋毒性等優ς， 格便宜，所以值得發展。 间尤材才七貝 快速原型機所使用的工作分為兩大系統 統。：般使用喷嘴的RP機系統會有速度慢、精度較糸 例如熔解沉積法(Fused Deposition Modeling, FDM)卒统浐脾^仡 經由物 办袈私所而的時間較長，因此速度慢、效率差；而三維印刷法 200914396 (3D Printing，3DP)系統利用喷嘴把黏結劑(binder)喷覆於粉末狀的 材料上，黏結劑能夠把顆粒狀粉末黏結起來，但是黏結劑也會受 毛細現象造成擴散使得成品尺寸精度不佳。雷射李统由因為雷 射光能量可調整的範圍較大，可加工的材料 只要是粉末狀的原料都可以利用雷射光加以燒結或熔結成形。 到目前為止，使用雷射光為加熱工具、陶曼材料為原料疊層 加工技術可分為二大類.（1)立體微影成像法(Stere〇1池 Apparatus，SLA广將陶錄末與紫外光感光樹酯(uv re 合， 卜ίΪ射㈣㈣掃描固化後建構舰生坦工件；⑺ ^ Sint—，SLS):使用雷射光為熱 ί谓雜，I絲雌之生燒結 Μ / .，生坯工件，（3)堆疊製造（Laminated Object 將先把陶究材料製成薄片長條狀，以雷射光 件：以-射朵的 係直接雷射熔結法形成陶瓷工 贿行雜，末直接產生熔 燒結後處i去除用ϋ光感_s旨做為黏結劑，在做 中，層盥層之門p、會產生有害人體的氣體。在LOM 人工剝除十分^ 結後處理去除，多餘材料需經 溶結形成陶兗4，因此射光對陶究材料進行燒結或直接 較大的收縮及變形。 斤又的雷射能量密度較大，容易造成 種用以製作-陶£工件之成型方法及成 因此，有需要提供. 型設備以避免上述問題 【發明内容】 本發明之. 可在於提供一種用以製作一陶兗工件之成型方 6 200914396 法及成型設備 工件之成型方法及成型設備 一種利用脫水作用以製作-陶究 明士成型方法首先準備陶究粉末及黏結劑 後在工 ^的聚料中之黏結劑被耽水而黏结在一起；=陶：被 接著將陶瓷 ^末及黏結劑依均勻混合，以形成漿料一層漿料，並依據一截面圖形，掃描加熱該^漿料，口 態 再於工作台上塗佈另一層漿料於前一層漿料上。 =-截面圖形，掃描加_塗佈的該層漿料，致使被加孰的^ 2之黏結劑被脫水而黏結在—起以形成另—層陶曼固態薄層。 同牯，此層陶瓷固態薄層亦與前一層陶瓷固態薄層黏結在一起曰。 〃重覆塗佈、加熱步驟，直至所需的陶瓷固態薄層均已形 然後，去除未黏結的漿料。該等陶瓷固態薄層即形 工件。本發明亦可進-步將-液態轉人該等陶究 將該等陶瓷固態薄層進行燒結，以加強該陶瓷工件的強度。 於一具體實施例中，該加熱係可使該黏結劑產生化學凝膠反 應：亦即使黏結劑脫水而形成鏈狀分子結構(例如Si_0_Si、sf_Q_ C/Sic、Al-O-Al)，並且該鏈狀分子結構繼續成長形成網狀分子結 構。當此網狀分子結構成長接觸到陶瓷粉末顆粒時，會將粉末^ 粒黏結在一起，於凝膠(gelation)反應完成後即形成三維多孔性陶 瓷材料。由於未使用有機黏結劑，因此在去除餘料和後續可選擇 的燒結製程中不會產生有害氣體，未黏結的漿料無需特別的溶劑 即可輕易地清除·。此外，本發明得以雷射來加熱塗佈的漿料，二 使黏結劑脫水。由於使黏結劑脫水所需能量遠小於燒結所需能 量，因此可大幅降低收縮及變形的影響。 200914396 本發明相胁先麵術具有下述優點, 1.本發明採用的材料狀態為槳料狀態。 LOM採 態為固態粉 液態 末顆粒狀 黏結劑)充 固態材料和液態材料的優有—定的流動性，兼具 2.本發明所朗的材料黏結原理為凝_理。 SLA所應用的黏結原人 (Photop〇lymerizati〇n)。礼 咨為先承 口反應 (UV谓able)樹酯中，用末加入紫外光可固化 f雷射為光起始劑 ㈣合物，並_絲末黏結在一 ^ 结劑混結成形。L〇M把陶莞粉末及多分子黏 二成4片狀’再將薄片以雷射切割成所需形 M +1^、θ 4以黏結劑黏結堆疊成形。SLS依照使用的雷 大小不同分為：小功率雷射可對陶竟粉末進行燒 二’ j率雷射可直接把陶竟粉末溶結形成陶变工件。此 逛有將多分子黏結劑包覆於陶瓷粉末表面，以小功率 光以掃描，使黏結劑將陶瓷粉末黏結成形’再用後處 把黏結劑加熱去除域喊粉末燒結成形。反之，本發 曰所應用的黏結原理為凝膠原理。利用雷射光將溶膠脫 水’形成鏈狀分子結構(例如Si_〇_Si、si_〇_C/SiC、A1_〇_A1) 2發展為網狀分子結構將陶瓷顆粒凝膠黏結在一起。因溶 >所形成的分子結構為氡化物陶瓷成份，所以本發明的黏 結劑亦為陶瓷成份，使得整個陶瓷工件較為均質。而STLA 所使用的黏結劑為多分子材料，不是陶隻成份。 200914396 3·製作元成的喊生链工件具有多孔性。 I夕ίί f L〇M _方法所製作的魏工件，其陶莞顆 比率^的ΐ間被感光樹醋填滿，因此空孔少’所含的孔隙 接把陶瓷ίΐΐ雷射溶結(Sdective Laser Sintering，SLM)直 SLS使ίΐίί王溶化成為陶莞工件，所含孔隙非常少。 ΐ 與顆粒之間產生局部的效果(即燒 就以=遺:= 是生枉件具有較多的空孔與孔隙(多孔性）。 圖 式得到進一步的瞭解 【實施方式】 點無射㈣由w嚼述及所附 凊參閱圖一及圖二a $ - r fsn ^ ,κ _ 具體實_之_妓^^； 本發明之較佳 具體^例之成型設備之成型二 示’本發明之成型方法堂冰制 笮ッ驟S100所 體實施例，成型方法_用_f^=° f據該較佳具 Si〇2陶兗粉末。補充說明，本^不^顆=於30,以下的 sic粉末、啊粉末、取粉末、Zr〇2' 粉末’亦可為 述組合之粉末。 ^末八丨2〇3粉末或由前 及黏合輸末 例，黏結劑係Si〇2_，以混料裝）較佳具體實施 * W ^ tb 50：50〇^70:30〇/〇„ ^ Γ； ^The rapid prototyping technology uses layered processing technology to automatically create the technology of making physical objects in accordance with the solid geometry of the Zhao. Can overcome the method of f to complete the shape of the dead angle 'to automate the physical free shape to make the Freefbnn Fab off tk)n, SFF}, and make the prototype without shape limit rapid prototyping can be used to divide the material into polymer material (photosensitive tree Vinegar), gold, shouting, paper, wax and composite materials, and most of the commercial original machines are mainly molecular materials and metal materials. However, the price of these two paving materials is high, which limits the speed of rapid prototyping technology. It has high strength, high refining point, anti-corrosion and toxicity, and is cheap, so it is worth developing. The work used by the Rapid Prototype is divided into two major systems. The RP machine system that uses nozzles in general has a slow speed and a relatively high precision. For example, Fused Deposition Modeling (FDM) is a long time, so the speed is slow and efficient. The three-dimensional printing method 200914396 (3D Printing, 3DP) system uses a nozzle to spray a binder on a powdery material, and the binder can bond the granular powder, but the binder is also caused by capillary phenomenon. Diffusion makes the finished product dimensionally inaccurate. Laser Li Tong is made up of a wide range of laser light energy, and the material that can be processed can be sintered or sintered by laser light as long as it is a powdery material. So far, the use of laser light as a heating tool, Tauman material as a raw material lamination processing technology can be divided into two categories. (1) stereo lithography imaging method (Stere〇1 pool Apparatus, SLA Guangzhao Tao recorded and ultraviolet light Photosensitive resin (uv re, Bu Ϊ ( (4) (4) Scanned and solidified to construct the ship's stellite workpiece; (7) ^ Sint-, SLS): use laser light for heat 谓, I wire female Μ Μ / ,, green Workpiece, (3) Stacking manufacturing (Laminated Object will first make the ceramic material into a thin strip shape, with laser light: the direct laser fusion method of the - shot system to form the ceramics bribery, the end directly After melting and sintering, the i-ray is removed as a binder. In the process, the door p layer of the layer will produce harmful gases. After the LOM is manually stripped, the process is removed and the excess material is removed. It is necessary to form a pottery 4 by dissolution, so that the light is sintered or directly contracted and deformed directly by the ceramic material. The laser energy density of the pound is large, and it is easy to cause the seed to be used for the production of the workpiece. Therefore, there is a need to provide a type of equipment to avoid the above problems [ The present invention can provide a molding method for making a ceramic pottery workpiece. 6 200914396 Method and molding method of a workpiece of a molding apparatus and a molding apparatus using a dehydration method to prepare a ceramics molding method After the powder and the binder, the binder in the aggregate of the work is wetted and bonded together; = pottery: the ceramic powder and the binder are then uniformly mixed to form a slurry slurry, and according to one The cross-sectional pattern, scanning and heating the slurry, and then applying another layer of slurry to the previous layer of slurry on the worktable. =-section pattern, scanning plus the layer of the slurry, causing the coating to be twisted The bonding agent of ^ 2 is dehydrated and bonded to form another thin layer of Tauman solid. Similarly, this layer of ceramic solid layer is also bonded to the previous layer of ceramic solid layer. Cloth, heating step, until the desired ceramic solid layer has been formed, and then the unbonded slurry is removed. The ceramic solid layer is a shaped workpiece. The invention can also further improve the liquid Study the ceramic solid thin The layer is sintered to enhance the strength of the ceramic workpiece. In one embodiment, the heating causes the adhesive to produce a chemical gel reaction: even if the binder is dehydrated to form a chain-like molecular structure (eg, Si_0_Si, sf_Q_C /Sic, Al-O-Al), and the chain molecular structure continues to grow to form a network structure. When the network structure grows and contacts the ceramic powder particles, the powder is bonded together to the gel. (gelation) After the completion of the reaction, a three-dimensional porous ceramic material is formed. Since no organic binder is used, no harmful gas is generated in the removal of the residual material and the subsequent optional sintering process, and the unbonded slurry does not require a special solvent. Can be easily removed. Further, the present invention is capable of laser heating the coated slurry and dehydrating the binder. Since the energy required to dehydrate the binder is much smaller than the energy required for sintering, the effects of shrinkage and deformation can be greatly reduced. 200914396 The present invention has the following advantages: 1. The material state used in the present invention is the state of the paddle. The LOM adopts the state of solid powder, the liquid end of the granular binder, and the liquidity of the solid material and the liquid material, and the liquidity of the material is the same. 2. The material bonding principle of the invention is condensed. The original person (Photop〇lymerizati〇n) applied by SLA. In the first step of the reaction (UV-able) resin, the ultraviolet light can be used to cure the f-ray as the photoinitiator (tetra) compound, and the _ silk bond is formed in a mixture. L〇M puts the pottery powder and multi-molecular adhesive into four pieces, and then cuts the sheet into the desired shape by laser. M +1^, θ 4 is formed by bonding together with a binder. SLS is divided according to the size of the lightning used: the low-power laser can burn the ceramic powder. The two-j-rate laser can directly dissolve the ceramic powder to form the ceramic workpiece. This is a multi-molecular bonding agent coated on the surface of the ceramic powder, which is scanned with low-power light, so that the bonding agent bonds the ceramic powder into a shape. After reuse, the bonding agent is heated and removed to form a powder. On the contrary, the bonding principle applied in the present invention is the gel principle. The use of laser light to dehydrate the sol to form a chain-like molecular structure (e.g., Si_〇_Si, si_〇_C/SiC, A1_〇_A1) 2 develops into a network structure to bond the ceramic particles together. Since the molecular structure formed by the dissolution > is a telluride ceramic component, the binder of the present invention is also a ceramic component, so that the entire ceramic workpiece is relatively homogeneous. The binder used in STLA is a multi-molecular material, not a pottery component. 200914396 3. The production of Yuancheng's shouting chain workpiece is porous. I ̄ίί f L〇M _ method of the Wei workpiece, the ratio of the pottery and the square of the ^ is filled with photosensitive vinegar, so the pores contained in the pores are connected to the ceramic ΐΐ ΐΐ laser melting (Sdective Laser Sintering, SLM) Straight SLS dissolves the ΐ ί ί 成为 into a pottery, with very few voids.局部 A local effect is produced between the ΐ and the granules (ie, burning is ==:= is the raw material with more pores and pores (porosity). The schema is further understood [Embodiment] Point no shot (four) by嚼 嚼 凊 凊 凊 凊 a a a a a a a a a a a a a a a a a a a a a a a a a ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Molding method Tang ice system S100 body embodiment, molding method _ _f ^ = ° f according to the preferred Si〇 2 pottery powder. Supplementary explanation, this ^ ^ ^ ^ = 30, below Sic powder, powder, powder, Zr〇2' powder' can also be the powder of the combination. ^End gossip 2〇3 powder or pre- and adhesive transfer case, the binder is Si〇2_, to mix Packing) better implementation * W ^ tb 50:50〇^70:30〇/〇„ ^ Γ; ^
Si〇2溶膠，亦可為氧化敛、玄二T.t口 .補f祝明’黏結劑不限於 乳化鈦—a Sg1)、氧她溶膠(Ahzmina 200914396 sol)或由前述組合之溶谬。 如圖一中步驟S104、S106所示，以塗層裝置12塗佈一層混 合後的桌料SL於工作台14上。根據該較佳具體實施例，塗層裝 置12可包含承裝漿料SL的漏斗122及可使漿料SL·均勻分佈於 工作台14上的刮板124。漏斗122擠送適當的漿料SL，至工作台 14上，如步驟S104所示。刮板124將前述之漿料SI;塗佈成均勻 的薄層漿·料SL，如步驟S106所示。該層漿料SL'之厚度可控制 在0.05mm〜0.15mm。但本發明不以此為限，所需的塗層厚度應視 成品設計及漿料特性而定。並且本發明亦不以水平或等 漿料為限。 & 如圖一中步驟S108所示，依據特定平面圖形，以加鼽裝置 16加熱該層漿料SL'以對該層漿料SU脫水，使得被加熱&該層 漿料SL'黏結在一起以形成陶瓷固態薄層（圖二B中深色部分）。根 據該較佳具體實施例，加熱裝置16包含雷射162及鏡片組164。 雷射162為C〇2雷射。鏡片組164係用以實施振鏡式掃描 (galvanometer mirror scan)，其包含二個反射鏡片（圖二b僅以一 元件代表）。鏡片組164將雷射162所發射的光線掃描聚焦於該層 漿料SL'上，藉此，該光線以平面掃描加熱該層漿料SL,以形成^ 瓷固態薄層，如圖二B所示。根據該較佳具體實施例，該掃描速 率為lOOmm/s〜250mm/s，雷射功率為7W〜15W。此外，該加熱使 該層漿料SL1脫水，係由於黏結劑，即Si〇2溶勝，產生化學凝膠 反應。亦即Si〇2溶膠將脫水成Si_〇_si鏈狀分子結構，再進一^ 發展為網狀分子結構，並將陶瓷粉末黏結在一起。請參閱圖三= 圖三係Si〇2陶瓷粉末與Si〇2溶膠經過化學凝膠反應後之SE1^昭 片。根據該較佳具體實施例，陶瓷粉末為Si02粉末，黏結劑亦^The Si 〇 2 sol may also be a oxidized condensed, sinusoidal T.t mouth. The sufficiency of the binder is not limited to emulsified titanium — a Sg1 , an oxygen sol (Ahzmina 200914396 sol) or a combination of the foregoing. As shown in steps S104 and S106 of Fig. 1, a layered mixed sheet SL is applied to the table 14 by the coating device 12. According to the preferred embodiment, the coating apparatus 12 can include a funnel 122 for holding the slurry SL and a squeegee 124 for uniformly distributing the slurry SL· on the table 14. The funnel 122 squeezes the appropriate slurry SL onto the table 14, as shown in step S104. The squeegee 124 applies the aforementioned slurry SI; to a uniform thin layer slurry SL as shown in step S106. The thickness of the layer SL' can be controlled to be 0.05 mm to 0.15 mm. However, the invention is not limited thereto, and the required coating thickness depends on the design of the finished product and the characteristics of the slurry. Also, the invention is not limited to horizontal or equal slurry. & As shown in step S108 in Fig. 1, the layer slurry SL' is heated by the twisting device 16 according to a specific plane pattern to dehydrate the layer slurry SU so that the layered slurry SL' is bonded to Together to form a ceramic solid layer (dark part in Figure 2B). According to the preferred embodiment, the heating device 16 includes a laser 162 and a lens assembly 164. Laser 162 is a C〇2 laser. The lens set 164 is used to perform a galvanometer mirror scan comprising two reflective lenses (Fig. 2b is represented by only one element). The lens group 164 scans the light emitted by the laser 162 onto the layer of slurry SL', whereby the light is heated by plane scanning to form a thin layer of ceramic solid, as shown in Fig. 2B. Show. According to the preferred embodiment, the scanning rate is from 100 mm/s to 250 mm/s and the laser power is from 7 W to 15 W. Further, this heating dehydrates the layer slurry SL1, and the chemical gel reaction occurs because the binder, i.e., Si〇2, is dissolved. That is, the Si〇2 sol will be dehydrated into a Si_〇_si chain-like molecular structure, and then further developed into a network structure and the ceramic powders are bonded together. Please refer to Figure 3 = Figure 3 shows the SE1^ show of the Si〇2 ceramic powder and the Si〇2 sol after chemical gel reaction. According to the preferred embodiment, the ceramic powder is SiO 2 powder, and the binder is also
Si〇2溶膠’因此形成的陶瓷固態薄層的均質性遠較一般高分子黏 結劑產生的陶瓷固態薄層為佳。 呵刀 補充說明，該陶瓷固態薄層不以連續為必要，其亦可包含數 200914396 個分離的區域。本菸日日—丄&仙 限，亦可為其他可裝置16之加熱不以雷射加熱為 熱。雷射殿亦不加熱方式以配合特定平面圖形加 雷射或UV雷射。射，亦可為胤YAG雷射、He-Cd SL，，以獲取設計者所"射以可變掃描速率加熱該漿料 度或是節省製作ί程黏、、、°器度。此可用以改善特定區域的強 亦即係以層狀結構製作所需的陶曼工件， 層，並且每-個陶^固^圖二=含複數個連續的陶曼固態薄 形，每-個特料2 #層均對應—特定平面圖形。在一般情 ' 冑依序依據該等特^㈣陶竟'1'件之截面。藉此加紐置16 形成對應的陶瓷固J薄：圖-層漿料加熱、脫水以 型設備連線，依據主，由技術，可將電腦與將該成 熱，_ (侧⑽產生)控制加 步驟層完成前’本發明之成型方法需重覆 而岡# β又a站及si08。如步驟sn〇所示’判斷所有特定平 否描加熱塗佈在工作台14上的漿料％，。若 isl 薄層尚未完成’需再執行倾_、讓 1 在塗佈新的—層漿料前，可使工作# 14下降-個_ 固態薄====㈣，物撕，每—層陶究 值得一提的是，當形成第二層以上的陶 iij6 Ϊ加熱除可形成對應的陶瓷固態薄層，；同該對庫: 、人ί固態薄層與前一層陶瓷固態薄層黏結。例如，該陶資!工g 連續的陶兗固態薄層，N係—自然數。除第1層陶兗固 加熱裝置16之加熱除對應地形成 外，亦同時使/層喊固態薄層與第问層陶莞固態 ^2 11 200914396 層施結在一起，其t i係範圍從2至n令之—整數指標。 當步驟S110之判斷為是時， 完成。如圖二C所示，該等陶有陶細態薄層均已 包含所需的陶瓷工件本體22及^ ;(圖二c中深色的部分） 22的支擇柱24。每—個以支撐陶莞工件本體 桎24與陶瓷工件本體22 相同為必要。此外，支撐 Μ。補充綱，圖可，以利後續移除支撐柱 具體實施例之第1層陶莞gj離^1^、^不思’非真實反應該較佳 例中，第1層陶竟二ί:ί、:#ί之截面。而在該較佳具體實施 成支撐^24二5_層#'由數個不相連的區域組成，其係構 結的:發I顧方法財除裝置去除未黏 體(例如水)以去除i黏結x的mi例’該去除裝置係以喷霧液 可進—步以燒結裝置(例如_於攝氏 於料之f ϋ燒如步驟S116所示。其中，支撐柱24可 “ΓίΐΓΐ。補充說明，雖以燒結方式可增加該等陶 層強度。例ζ固態薄層，以增加該等陶究固態薄 加強度，亦可辦末渗入該等陶究固態薄層，除可增 該等陶变件的均。又例如，將液態金屬渗入 屬係滲入均ί ^機合材料的陶究工件。且因為液態金 係等向性的。機刀佈的工隙中，因此該陶究工件增加的強度 生脫二提Ϊί ’由於漿料SL中之黏結劑因化學凝膠反應產 所# FT i得漿料SL因Η2〇被脫離而呈現多孔性，如圖四 漿料SL中本身包含的水分以及加熱裝置16以雷 、 …的掃插速率設定，使得水分被蒸發以及未被加熱足夠 12 200914396 钟齡除，亦是使本發生的陶莞工 』上2固=採用的材料狀態為漿料狀態，具有-定的 衝擊·當溶膠=，減少對部分材料的熱 例及加;掃描速率，可以= 發明具例之詳述，係希望能更加清楚描述本 神’而並非以上述所揭露的較佳具體實施例來對 ΐ的的臟卿上述^二』 八釋磁使其涵盍所有可能的改變以及具相等性的安排。 13 200914396 【圖式簡單說明】 圖-雜示根據本發明讀佳具體實施例之成型方法流程 圖一A係繪示該成型方法之塗佈漿料製程之示意圖。 圖一B係繪示該成型方法之掃描加熱製程之示意圖。 圖一C係繪示該成型方法之塗佈、加熱完畢後之示意圖。 圖一係Si〇2陶瓷粉末與Si〇2溶膠經過化學凝膠反應後之 圖四係根據該較佳具體實施例之陶瓷工件之SEM照片。 【主要元件符號說明】 12 .塗層裂置 16 :加熱裝置 24 :支撐柱 124 :刮板 164 ’·鏡片組 SL、SL'、SL” ：漿料 14 :工作台 22 :本體 122 :漏斗 162 :雷射 S100〜S116 :方法步驟 14The uniformity of the ceramic solid layer formed by the Si〇2 sol' is much better than that of the ceramic solid layer produced by the general polymer binder. Knife added that the ceramic solid layer is not necessary for continuous, it can also contain several 200914396 separate areas. The daily heat of the cigarette - 丄 & 仙, can also be heated for other devices 16 without heating by laser. The Laser Temple is also not heated to match a specific plane pattern with a laser or UV laser. Shots can also be 胤YAG lasers, He-Cd SL, in order to obtain the designer's exposure to the variable scanning rate to heat the slurry or to save the production process. This can be used to improve the strength of a specific area, that is, to make the required Tauman workpieces in a layered structure, and each layer of ceramics is composed of a plurality of consecutive Tauman solid thin shapes, each of which Special material 2 # layer corresponds to - specific plane graphics. In the general situation ' 胄 according to the section of the special ^ (four) Tao Jing '1' pieces. By means of the addition of 16 to form the corresponding ceramic solid J thin: Figure-layer slurry heating, dehydration to type device wiring, according to the main, by technology, the computer can be heated, _ (side (10) generated) control Before the completion of the step layer, the molding method of the present invention needs to be repeated and the #β又阿站 and si08. As shown in step sn ’, it is judged that all of the specific tiling heats the slurry % coated on the table 14. If the isl thin layer has not been completed 'need to perform the pouring _, let 1 before coating the new layer slurry, can make the work # 14 down - a _ solid thin ==== (four), object tear, every layer of pottery It is worth mentioning that when the ceramic layer iij6 形成 above the second layer is formed, the corresponding ceramic solid layer can be formed by heating, and the solid layer of the ceramic layer is bonded to the solid layer of the ceramic layer. For example, the pottery! Gong g continuous ceramic pottery solid layer, N series - natural number. In addition to the formation of the heating of the first layer of ceramic tamping heating device 16, in addition to the corresponding layer, the layer of solid layer is combined with the layer of the first layer of the ceramic layer ^2 11 200914396, the ti range is from 2 To n orders - integer indicators. When the judgment of step S110 is YES, it is completed. As shown in Fig. 2C, the ceramic-ceramic thin layers each comprise the desired ceramic workpiece body 22 and the support column 24 of the dark portion (Fig. 2c). It is necessary to support the ceramic body body 桎24 and the ceramic workpiece body 22 each. In addition, support Μ. Supplementary outline, Fig. can be used to facilitate the subsequent removal of the support column. The first layer of the concrete layer is different from the ^1^, ^不思' non-real reaction. In the preferred example, the first layer of Tao Jing 2 ί: ί ,: #ί的曲线. In the preferred embodiment, the support layer is composed of a plurality of unconnected regions, and the system is configured to remove the non-adherent body (for example, water) to remove i. The example of the bonding x is 'the removal device is sprayed with a spray liquid to the sintering device (for example, as shown in step S116), wherein the support column 24 can be "ΓίΐΓΐ. Although the strength of the ceramic layer can be increased by sintering, for example, the solid thin layer can increase the strength of the solid state of the ceramics, and can also infiltrate into the ceramic solid layer, in addition to adding the ceramics. For example, the liquid metal is infiltrated into the ceramics of the genus, and because the liquid gold is isotropic, the mechanical strength of the knives is increased. Because the binder in the slurry SL is chemically gelled, the slurry SL is porous due to the detachment of the slurry, as shown in Figure 4, the moisture contained in the slurry SL itself. The heating device 16 is set at a sweep rate of lightning, such that moisture is evaporated and not heated. 12 200914396 In addition to the age of the clock, it is also the result of the state of the material used in the work of the pottery, which is the state of the slurry. It has a fixed impact. When the sol =, the heat and the addition of some materials are reduced; the scanning rate, It is possible to describe the details of the invention, and it is desirable to describe the present invention more clearly, and not to use the preferred embodiment disclosed above to confront the filthy filth. The change and the arrangement of the equalization. 13 200914396 [Simplified description of the drawings] Fig. 1 shows the flow chart of the molding method of the molding method according to the flow chart of the preferred embodiment of the present invention. Fig. 1B is a schematic view showing the scanning heating process of the molding method. Fig. 1C is a schematic view showing the coating and heating after the molding method is completed. Fig. 1 is a Si〇2 ceramic powder and a Si〇2 sol pass. Figure 4 after the chemical gel reaction is a SEM photograph of the ceramic workpiece according to the preferred embodiment. [Main component symbol description] 12. Coating cracking 16: Heating device 24: Support column 124: Scraper 164 '· Lens group SL SL ', SL ": The slurry 14: Table 22: body 122: funnel 162: Laser S100~S116: Method step 14