九、發明說明： C發明所屑之技術領域3 發明領域 本發明係有關一種不需接觸一外部裝置而與該裝置交 換資訊的RFID (Radio_Frequency_Identification ;射頻識別） 標籤，在嫻熟此技藝領域之人中，用於本發明之“RFID標 籤”亦被稱作“一無線1C標籤”。 C先前技術3 發明背景 近年來，不同的RFID標籤已被提出係以一讀取器與寫 入器所代表的一外部裝置藉由一無線電波不用接觸該外部 裝置來交換資訊(例如，見日本專利申請公報第20〇〇·311226 號、第2000-200332號及第2001-351082號）。如同這些RFID 標籤的一種，提出一個具有一結構，其中用於無線電通訊 的一天線圖案與一電路晶片被裝設在一由塑膠或紙所製成 的基部薄片上。對於此類型的RFID標籤，不同的應用被設 計。例如，該RF1D標籤被貼附至一物品等上以便與—外部 裝置交換有關該物品的資訊用以識別它們。 對於該等RFID標籤的應用，包含有一個其中~111?11)標 籤被貼附至其形狀係能容易改變的物品上，像衣服。在此 應用中，一個主要問題是，因該電路晶片不容易被彎折而 該基部薄片容易被彎折該電晶體路晶片 > 該電路晶g & % 一彎折應力，導致該電路晶片斷裂或剝落。傳統上，已提 出有技術其中包含圍繞該電路晶片之周圍的電路晶片ϋ 1352314 蓋有一硬加強構件以防止該RHD標籤之形狀改變到達圍繞 該電路晶片的周圍5因此減少施加至該電路晶片的·—彎折 應力。 然而，隨著利用以上所述的加強構件等的如此技術， 5 該構件或此類的一端與該天線交叉並且一彎折應力係集中 在該交叉點而導致該天線的破裂。 【發明内容:J 發明概要 有鑑於上述，根據本發明，提供有一種RFID標籤，其 10 中對於該電路晶片的彎折應力被減少並且同時防止天線的 破裂。 根據本發明的該等RFID標籤中，一第一RFID標籤包 含：一基部；一延伸在該基部上用於通訊的天線；一電路 晶片，其係電性連接至該天線而且其經由該天線來執行無 15 線電通訊；一晶片加強構件，當該基部係配置為該RFID標 籤的一底部時，其覆蓋該電路晶片的至少周圍.與至少該天 線一部分的二者中的至少上部分；及一覆蓋構件，其覆蓋 該基部、該天線、該電路晶片及該晶片加強構件，並且其 係比該晶片加強構件更具彈性。 20 根據本發明之第一RHD標籤，因為該電路晶片的一周 圍，其是執行無線電通訊的一關鍵成分，係覆蓋有該晶片 加強構件，對於該電路晶片的一彎折應力被減少。此外， 因為該晶片加強件的邊緣與該天線彼此相交的一部分係覆 蓋有一完全覆蓋該電路晶片與該晶片加強構件的可撓的覆 6 蓋構件，所以抑制了在此部份之彎折應力的集_並因此防 止該天線的破裂。換言之，根據本發明的第一RnD標籤， 對於該電路晶片的一彎折應力被減少並且同時防止該天線 的破裂。此外，依照用於該晶片加強構件的材料之一範例， 一硬塑膠被作為例子。然而，在本發明的第_RFIEM^籤中， 一覆蓋有該晶片加強構件的範圍係僅限於該基部的—部 分。因此，典型上具有可撓性的基部在一由該晶片加強構 件所保護的區域之外允許一自由度。本發明的第一尺打^標 籤根據一物品，諸如該RFID標籤被貼附到的一件衣服之形 狀變化來大概地改變形狀。另外，甚至在一種情況下其中 本發明的第一RFID標籤直接接觸使用者，因為kRFID標籤 係元全覆蓋有s玄具有可換性之覆蓋構件，所以有可能防止 該硬的晶片加強構件直接接觸使用者。此外，本發明的第 一RFID標籤中，即使此RFID標籤係破裂，因為該覆蓋構件 被提供，所以有可能防止該破裂的RFID標籤之碎片等傷金 使用者。於是，本發明的第一RHD標籤中，給予了對使用 者的考慮以至於使用者在直接接觸貼附至該使用者穿戴上 的一物品之RFID標籤時可以不感到不舒服。 此處，本發明的第一RFID標籤中，一最佳範例是‘‘該 晶片加強構件不與該基部、該天線與該電路晶片接觸且其 被埋置於該覆蓋構件中”。 根據該第一RFID標籤之此最佳範例，因為該晶片加強 構件不與該基部或其它成分接觸，所以諸如因該晶片加強 構件所產生之彎折應力的集中的情況被防止。 “此外’本發明的第-RFID賴巾，另一個最佳範例是 “該RFID標籤更包含—底加強構件其被設置⑽該底加強 構件與該晶>{加強構件將該基部夾在中間，魅其被埋置 於該覆蓋構件中而不與該基部接觸’，。 根據該RFID標籤的此最佳範例，對於該電路晶片之保 護係因該底加強構件進—步改善。此外，因為此底加強構 件不與該基部接觸，所以有可能防止諸如因該晶片加強構 件所產生之彎折應力的集中之情況。 另外，根據本發明的該等RFID標籤中，一第二111711)標 籤包含_ -基部；__延伸在該基部上用於通訊的天線；一 電路BB片其係電性連接至該天線而且其經自該天線來執 :無線電通訊；一晶片力口強構件，當該基部係配置為該RFID 仏戴的-底部時’其覆蓋該電路晶片的至少周圍與至少該 =線:部分的二者中的至少上部分；及—邊緣覆蓋構件， 其：蓋該晶片加強構件之邊緣的至少一部分該部分其中 該曰曰片加強構件的邊緣與該天線彼此相交，該邊緣覆蓋構 件係比該晶片加強構件構具彈性。 根據本發明的第二RFID標籤因為該電路晶片的—周 ^其疋執仃無線電通訊的一關鍵成分，係覆蓋有該晶片 強構件’對於㈣路晶#的—彎折應力韻少。此外， 加強件的邊緣與該天線彼此相交的—部分係覆 ^有該可撓的覆蓋構件，所以抑制了在此部份之彎折應力 明=並防止該天線的破裂。換言之，同樣地藉由該本發 — RFlD標籤，對於該電路晶片的-彎折應力被減少 並且同時防止該天線的破裂。 此處，本發明的第一與第二RFID標籤中，一典型的範 例是“該晶片加強構件僅覆蓋該電路晶片的一周圍與該天 線的一部分”。 根據該RFID標籤之此最佳範例，儘管該晶片加強構件 覆盖該電路晶片的一周圍以保護該電路晶片，在此電路晶 片上的開口空間使得該RFID變薄。 此外，本發明的第一與第二RFID標籤中，另一個最佳 範例是該RFID標藏更包含一底加強構件其係設置以致該 底加強構件與該晶片加強構件將該基部失在中間”。 根據該RFID標籤之此最佳範例，該電路晶片的保護係 因該底加強構件而進一步改良。 此外，根據本發明的一種RFID標籤製造方法包含步驟 有：一準備步驟’用於準備一鑲嵌物其包含一基部、一延 伸在該基部上用於通訊的天線、一電路晶片其係電性連接 至該天線且其經由該天線來執行無線電通訊、及一晶片加 強構件，當該基部係於一下側時，其覆蓋至少該電路晶片 的一周圍與至少在該基部之上面的天線之一部分；及一覆 蓋步驟’用於覆蓋該鑲嵌物以致一間隔物係配置在該晶片 加強構件的周圍，該間隔物係比該晶片加強構件更具彈 性’並且該鑲嵌物與該間隔物係被複數由相同如該間隔物 之材料製成且被加熱與加壓而結合的薄片構件夾在中間。 根據本發明的製造方法，其中對該電路晶片的—彎折 應力被減少且該天線的破裂被防止的RFID標籤能被容易地 製造。另外，經由該覆蓋程序其中該間隔物係配置在該晶 片加強構件的周圍且然後該鑲嵌物與該間隔物係被複數薄 片構件夾在中間，可是該RFID標籤的形狀被弄平。 此外，有關根據本發明的RFID標籤製造方法，為了避 5免冗餘的說明僅說明—基本範例。然而，根據本發明之製 造方法包含對應上述之RFID標籤的範例之不同範例以及此 範例。 如以上所述，根據本發明，其中對該電路晶片的一彎 折應力被減少並且同時防止該天線的破裂的RFID標籤能被 10 獲得。 圖式簡單說明 第1圖是一顯示根據本發明之RFID標籤的一第一實施 例之概要圖； 第2圖是一顯示根據本發明之RnD標籤的一第二實施 例之概要圖； 第3圖是一顯示根據本發明iRnD標籤的一第三實施 例之概要圖； 第4圖是一顯示根據本發明之rFID標籤的一第四實施 例之概要圖； 20 第5圖是一流程圖，其顯示一種用於製造第4圖所示之 第四實施例的RHD標籤400的RFID標籤製造方法作為根據 本發明的RFID標籤製造方法的一示範實施例； 第6圖是一顯示第5圖所示之流程圖中的準備步驟（步 驟110)之細節圖； 10 第7圖是一顯 驟120)細節之圖； 第8圖是一顯 例之概要圖； 不第5圖所示之流程圖中的覆蓋步驟（步 不根據本發明之RFID標籤的一第五實施 5 第9圖是—圖，顯-_ ^ 顯不一用於製造第8圖所示之RFID標籤 900的RFID標藏製造方法； 第10圖是一 + 貝不根據本發明之RFID標籤的一第六實 施例之概要圖； 第11圖是一圖，航-也Α Λ Μ 顯不一用於製造第10圖所示之RFID標 10籤丨〇〇〇的RFID標籤製造方法； 第12圖疋—顯示根據本發明之RFID標籤的一第七實 施例之概要圖； 第13圖疋一圖’顯示該製造第12圖所示之RFID標籤 謂的則)賴製造方法的覆蓋步驟之細節； 15 第14圖是一顯示根據本發明之RFID標籤的一第八實 施例之概要圖；及 第15圖是一圖’顯示該製造第14圖所示之RFID標箴 1200的RFID標籤製造方法的覆蓋步驟之細節。 【實施方式3 20 較佳實施例之詳細說明 根據本發明之示範實施例將參考該等附圖來說明。 首先’根本發明之RFID標籤的一第一實施例將被說 明。 第1圖是一顯示根據本發明之RFID標籤的一第一實施 11 1352314 • 係配置以致由於考慮到使用者，此RFID標籤loo禁得住粗糙 . 的環境。 接著，根據本發明的一第二實施例將被說明。 第2圖是一顯示根據本發明之RFID標籤的第二實施例 5 之概要圖。 • 第2圖的部分(a)中，一RFID標籤300的一頂視圖，根據 本發明之RFID標籤的第二實施例，係顯示在該rfID標籤 200的一内部結構被看穿的一狀態。第2圖的部分(b)中，此 ® RFID標籤200的一縱向橫截面被顯示。 10 此外，第2圖中’等於上述第1圖所示的第一實施例之 元件係給予相同如第1圖中的參考文字。在下文中，這些元 件的冗餘說明將被省略。 此實施例之RFID標籤200中’一鑲嵌物21〇包含一晶片 加強構件211，其形狀係異於該第—實施例的晶片加強構件 15的形狀。第2圖所示之鑲嵌物2丨〇與晶片加強構件211分別對 應根據本發明的鑲嵌物與晶片加強構件之範例。 瞻該晶片加強構件211具有-結構係第旧所示之第一實 . 施例的晶片加強構件之頂部分被去掉以便打開在該電路晶 .. 片113上面的空間。同樣地，此晶片加強構件211中，防止 ' 20 了該RFID標籤200的一形狀變化影響該電路晶片113的-周 圍。此外，因為雜著劑115的邊緣與該天線12彼此交叉的 -部分係覆蓋有該可撓的覆蓋構件m，該天線112的破裂 被防止。另外，在該電路晶片113上_開口空間因一對應 U加強構件1Μ的除去頂部之部分而使⑴標藏2〇〇更 14 1352314 薄。 如此，第2圖所示之RHD標籤200被配置以致該RFID標 籤200係變薄同時保護該電路晶片且防止該天線的破裂如 同於該第一實施例的RFID標籤100。 5 接著，根據本發明之RFID標籤的一第三實施例將被說 明。 第3圖是一顯示根據本發明之RHD標籤的第三實施例 之概要圖。 第3圖的部分(a)中’一RHD標籤300的一頂視圖，根據 10本發明之RFID標籤的第三實施例，係顯示在該尺打!)標籤 300的一内部結構被看穿的一狀態。第3圖的部分(b)中，此 RFID標戴300的一縱向橫截面被顯示。 此外，同樣地在第3圖中’等於上述第1圖所示的第一 實施例之元件係給予相同如第丨圖中的參考文字。在下文 15 中，這些元件的冗餘說明將被劣略。 此實施例之RFID標籤300中，一鑲嵌物31〇包含一等於 s玄第二實施例之晶片加強構件211的晶片加強構件31丨、及 一底加強構件312，其係配置以致該晶片加強構件3n與底 加強構件312將該基部丨丨丨夾在中間並且係有關該基部ii 2〇而彼此對立設置。第3圖所示之鑲嵌物21〇與晶片加強構件 311分別對應根據本發明的鑲嵌物與晶片加強構件之範 例。此外，該底加強構件312對應根據本發明之底加強構件 的一範例。 同樣地對於該晶片加強構件3U，該底加強構件卿 15 5 由_加強樹脂製成並且藉由等於該黏著劑115將該晶 片加強構件311膠合在該基部⑴上的熱固黏著劑ιι5之膠 。而被□4在該基部Ul的底部。另外此實施例中該底 加強構件312具有相同如該晶片加強構们11之形狀，除了 一用於容置該電政Β μ 日曰片113之開口並未被提供。 第3圖所不的RFID標籤獅係配置以致該電路晶片的 保沒係由此底加強構件312而被加強，同時保有上述該第二 接著’根據本發明的RFID標籤t第四實施例將被說 10 明。 第4圖疋一顯示根據本發明之RFID標籤的第四實施例 之概要圖。 第4圖的部分⑷中’ —RFID標籤400的一頂視圖，根據 本發明的RHD標籤之第四實施例係顯示在該RFm標藏4〇〇 15的一内部結構被看穿的一狀態。第4圖的部分(b)中，此RFID 標籤400的一縱向橫截面被顯示。 此外’同樣地在第4圖中，等於上述第1圖所示的第一 實施例之元件係給予相同如第1圖中的參考文字。在下文 中，這些元件的冗餘說明將被省略。 20 此實施例之RFID標藏400中，一鑲嵌物410包含一等於 該第二實施例之晶片加強構件211的晶片加強構件411、及 一底加強構件420，其係配置以致該晶片加強構件41丨與底 加強構件420將該基部111夾在中間並且係有關該基部1 η 而彼此對立設置。然而’此實施例的底加強構件420係不同 16 1352314 用於準備該鑲嵌物410的準備步驟（步驟sii〇)、及一用於覆 蓋該鑲嵌物410的覆蓋步驟（步驟si20)。該準備步驟（步驟 S110)與該覆蓋步驟(步驟S120)分別對應根據本發明之準備 步驟與覆蓋步驟之範例。 5 首先’該準備步驟(步驟S110)將被說明。 第6圖是一顯示第5圖所示之流程圖中的準備步驟（步 驟110)細節之圖。 首先’此準備步驟(步驟S110)中，該電路晶片113係架 設在該基部111上，在形成有該天線丨12的表面上。因為架 10 設此電路晶片113係廣為人知，所以此處詳細的說明將被省 略0 該電路晶片113被架設於步驟Sill，並且然後一分配器 45 0將熱固黏著記憶體丨丨5施加至該基部111以致該電路晶 片被埋至於該熱固黏著劑115 (步驟S112)。接著，一架設工 15 具500將該晶片加強構件411運載到正好在該電路晶片113 上面的一位置且將該晶片加強構件411放在該基部111上以 至該電路晶片113被容置於該晶片加強構件411 (步驟 SU3)。然後，一熱源6〇〇加熱該熱固黏著記憶體115以至於 該熱固黏著劑115被硬化且該鑲嵌物400被完成（步驟S114)。 20 接著，第5圖所示之覆蓋步驟(步驟S120)將被說明。 第7圖是一顯示第5圖所示之流程圖中的覆蓋步驟（步 驟120)細節之圖。 此覆蓋步驟（步驟S120)中，覆蓋三件的RFID標籤400 在一個程序中被執行。 18 1352314 加熱。經由此按壓及加熱’該等四個橡膠薄片121至124被 合成一體以致用於三件RHD標籤400的該等底加強構件420 與該等鑲嵌物410被埋置在内部。然後，其中該等底加強構 件420與鑲嵌物410係覆蓋有該橡膠覆蓋構件120的一連串 5 三件RFID標籤400被形成。 跟隨步驟S121之程序，一切割器800下移在各個鑲嵌物 410之間來切割連續的RHD標籤400以便獲得三件分開的 RJFID標籤400 (步驟S122)。 根據上述及第3圖所示之RFID標籤製造方法，是有可 10 能容易製造具有一考慮到使用者禁得住粗縫環境的結構之 RFID標籤400。此外，在此RFID標籤製造方法中，於第7圖 所示之步驟S121中，上述第三橡膠薄片123，其係設有用於 容置該晶片加強構件之開口，被使用並且該晶片加強構件 411的周圍’其形成了該鑲嵌物410的凸出，係填充有此橡 15膠薄片123。於是’該RFID標籤400最後得到的形狀被弄平。 接著’根據本發明之RFID標籤的一第五實施例將被說 明。 第8圖是一顯示根據本發明之RFID標籤的第五實施例 之概要圖。 20 第8圖的部分(a)中，一RFID標籤900的一頂視圖，根據 本發明的RFID標籤之第五實施例係顯示在該rfid標籤9〇〇 的一内部結構被看穿的一狀態。第8圖的部分(b)中，此RFID 標籤900的一縱向橫截面被顯示。 同樣地在第5圖中，等於上述第1圖所示的第一實施例 20 1352314 之元件係給予相同如第1圖中的參考文字。在下文中，^此 元件的冗餘說明將被省略。 此實施例之RFID標織900係不設有由一纖維加強樹月t 製成的晶片加強構件以及該覆蓋構件，其二者係設於第— 5到第四實施例全部。該電路晶片113係覆蓋有一硬式環氧樹 脂罐封材料901 ’並且其整個周邊係覆蓋有一可撓性橡膠點 著劑902。此處’此硬式環氧樹脂罐封材料9〇1對應根據本 發明之晶片加強構件的一範例並且該可撓性橡膠黏著劑 902對應根據本發明之邊緣覆蓋構件的—範例。 1〇 此實施例的111710標籤900中，該電路晶片113係由該硬 式罐封材料901所保護。另外，因為對應根據本發明之“該 晶片加強構件的邊緣’’的一範例之硬式環氧樹脂罐封材料 901的邊緣係完全覆蓋有包含此邊緣與該天線112互相交又 的一部分之可撓性橡膠黏著劑902，此部份中的一彎折應力 15的集中被抑制且因此該天線113的破裂被防止。換言之，同 樣地在第8圖所不之此RFID標藏900中，對於該電路晶片的 一彎折應力被降低並且同時該天線的破裂被防止。 接著，一種用於製造第8圖所示之rfid標籤900的方法 將被說明。此外，在此，第8圖所示之元件將被參考而無‘‘第 20 8圖”的說明。 第9圖是一圖，顯示一用於製造第8圖所示之rfid標籤 900的RFID標籤製造方法。 此製造方法中，首先，該電路晶片113係裝設在該基部 111上，在該基部111表面上該天線112被形成（步驟S201)。 21 因為裝設此電路晶片113係廣為人知，所以其詳細說明將被 省略。 步驟S201中，該電路晶片113被裝設。然後，該分配器 450將該硬式熱固罐封材料901施加在該基部1U中以致該 5電路晶片113被埋於該硬式罐封材料901中（步驟S202)。該熱 源600將該硬式熱固罐封材料9〇丨加熱以硬化該硬式熱固罐 封材料901 (步驟S203)。然後，該熱源600將該可撓性熱固 黏著劑902覆蓋該硬式罐封材料9〇1的一邊緣(步驟S2〇4)。然 後’該熱元600將該可撓性熱固黏著劑9〇2加熱以硬化此可 1〇撓性熱固黏著劑902，並且該RFID標籤900被完成（步驟 S205)。 經由一連串的這些程序，第8圖所示之RHD標籤900係 容易地製造。 接著’根據本發明之RFID標籤的一第六實施例將被說 15明。 第10圖是一顯示根據本發明之RnD標籤的第六實施 例之概要圖。 第10圖的部分(a)中，一RFID標籤1000的一頂視圖，根 據本發明的RFID標籤之第六實施例係顯示在該RFID標籤 2〇 1〇00的一内部結構被看穿的一狀態。第10圖的部分(b)中， 此RFID標籤1000的一縱向橫截面被顯示。 此外’第10圖中’等於上述第2圖所示的第二實施例之 元件係給予相同如第2圖中的參考文字。在下文中，這些元 件的冗餘說明將被省略。 22 1352314 此實施例之RFID標籤1000係不設有包含在上述第二 實施例中的覆蓋構件，該晶片加強構件211沿著邊緣係完全 被一可撓性橡膠黏著劑1〇〇2所覆蓋。此外，該可撓性橡膠 黏著劑1002具有將該晶片加強構件211膠黏並固定至該基 5部111的作用。另外，此RFID標籤1000中，該晶片加強構件 211係填滿有一環氧樹脂硬式罐封材料1〇〇1以致該環氧樹 脂硬式罐封材料901與該可撓性黏著劑1〇〇2對應根據本發 明之晶片加強構件與該邊緣覆蓋構件之範例。 此實施例的RFID標籤1〇〇〇中，該電路晶片113係由該晶 1〇片加強構件211所保護。此外，此電路晶片的保護係藉由填 滿該硬式罐封材料1001而被加強。另外，因為一對應根據 本發明之該晶片加強構件的邊緣，，的一範例之晶片加強 構件211的邊緣係完全f蓋有包含此邊緣麟天線112互相 父叉的-部分之可撓性橡膠點著劑1〇〇2，此部份中的一彎 15折應力的集中被抑制且因此該天線ιΐ3的破裂被防止。換言 之，對於該電路晶片的-彎折應力被降低並且同時該天線 的破裂被防止。 接著，一種用於製造第10圖所示之RFID標籤1〇〇〇的方 法將被說明。此外’在此，第10圖所示之元件將被參考而 20 無“第10圖”的說明。 第11圖是-圖’顯不-用於製造第關所示之刷〇標 籤1000的RF1D標籤製造方法。 同樣地在此製造方法中，首先，該電路晶片113係裝設 在該基部111上，在該基部1U表面上該天線m被形成（步驟 23 1352314 S301)。因為裝設此電路晶片113係廣為人知’所以此處其 詳細說明將被省略。 步驟S301中，該電路晶片113被裝設。然後，該分配器 450將一可撓性熱固罐封材料1002施加至該基部111中以致 5 該可撓性熱固罐封材料1002圍繞該電路晶片113的周圍 (步驟S302)。接著，該架設工具500將該晶片加強構件211 運載至正好在該電路晶片113上面的一位置並將該晶片加 強構件211放在該基部111上，以致該電路晶片113被容置於 該晶片加強構件211中（步驟S303)。然後，該熱源600將該可 10 撓性熱固黏著劑1〇〇2加熱以至於此可撓性熱固黏著劑被硬 化且該晶片加強構件211被膠黏且固定至基部in (步驟 S304)。隨後，該分配器450以該硬式熱故罐封材料1〇〇1填 充該晶片加強構件211，以致該硬式熱故罐封材料1〇〇1覆蓋 在該晶片加強構件211内部的電晶體路晶片（步驟S3〇5)，並 15且該熱元600加熱並硬化該硬式熱固罐封材料1001而完成 該RFID標籤1〇〇〇 (步驟s3〇6)。 經由一連串的這些程序’第10圖所示之RFID標籤 10900係容易地製造。 接著，根據本發明之RFID標籤的一第七實施例將被說 20 明。 第12圖是一顯示根據本發明之RFID標籤的第七實施 例之概要圖。 第12圖的部分⑷中，一RFID標藏11〇〇的-頂視圖，根 據本發明的RFID標籤之第七實施例係顯示在該RFID標藏 24 1352314 1100的一内部結構被看穿的一狀態。第12圖的部分(b)中， 一 RFID標籤1100的一縱向橫截面被顯示。 此外，第12圖中，等於上述第丨圖所示的第一實施例之 元件係給予相同如第1圖中的參考文字。在下文中，這些元 5 件的冗餘說明將被省略。 此實施例之RFID標籤11〇〇中，一鑲嵌物n1〇係設有一 晶片加強構件1111，其形狀係不同於根據該第一實施例的 晶片加強構件之形狀，並且該晶片加強構件丨丨丨丨係埋置於 一覆蓋構件1120中不接觸該基部1Π、該天線U2及該電路 10晶片113。第12圖所示之此鑲嵌物ι11〇、該晶片加強構件 1111及該覆蓋構件1120亦分別對應根據本發明之鑲嵌物、 晶片加強構件與覆蓋構件。 第12圖所示之加強構件iiu，其既不膠合也不固定至 忒基部112，係隔開，像漂浮，在該電路晶片113上。此晶 15片加強構件U11亦防止該RFID標籤11〇〇的形狀變化影響該 電路晶片113的周圍，因此防止該電路晶片112的剝落與破 裂等。此外，此實施例中，因為該晶片加強構件丨丨丨丨不與 忒天線112接觸，所以沒有彎折應力之集中在一限制部分並 且該天線112的破裂被防止。 2〇 接著，用於製造第12圖所示之RFID標籤的方法將被說 明。此外，於此，第12圖所示之元件將被參考而沒有“第 12圖”的說明。 此製造方法中，在該電路晶片113被裝設在該基部U1 上後，在該基部111的表面上該天線112被形成，用於覆蓋 25 1352314 該鑲嵌物1110的覆蓋步驟係與配置該晶片加強構件丨丨^同 時被執行。 第13圖是一圖，顯示該製造第12圖所示之rfID標籤 1100的RFID標紙製造方法的覆蓋步驟之細節。 5 用於一件RFID標籤11〇〇的覆蓋步驟係顯示於第13圖。 在以下將被說明的覆蓋步驟中，相同如第7圖所示之按 壓裝置700的按壓裝置被使用。因此，第13圖中，此按壓裝 置係顯示以相同如第7圖的符號。 首先，該鑲嵌物1110除了該晶片加強構件1U1以外的 10 —部分、形成該覆蓋構件1120的三個橡膠薄片1121至1123 以及該晶片加強構件1111係配置如下（步驟S401)。首先，該 等三個橡膠薄片1121至1123的底橡膠薄片1121被放在該按 壓台710上，然後該鑲嵌物mo的該部分1112被放在該底橡 膠薄片1121。隨後，該第二橡膠薄片1122被覆蓋在該鑲嵌 15物1110的該部分1112上，並且該晶片加強構件1111被放在 一位置其中該晶片加強構件1111與該電路晶片1將該橡 膠薄片1122夾在中間且彼此相對。然後，最後該頂橡膠薄 片1123被覆蓋。 於是’在該鑲嵌物1110之該部分1112、形成該覆蓋構 20件丨120之該等三個橡膠薄片1121至1123以及該晶片加強構 件1111被放在該按壓台710上後，該按壓頭720下移到該頂 橡膠薄片1123上，並且被該按壓台71〇與該按壓頭72〇夾在 中間的該等三個橡膠薄片1121，1122與1123、該鑲嵌物1110 之該部分1112及該晶片加強構件η丨丨被按壓並被加熱成為 26 1352314 一體（步驟S402)。藉此結合，第12圖所示之RFm標藏】· 被完成。 經由一連串的這些程序’第12圖所示之RFID標籤1100 係容易製造。 接著，根據本發明的一第八實施例將被說明。 第14圖是一顯示根據本發明之RFID標籤的第八實施 例之概要圖。IX. INSTRUCTIONS: C TECHNICAL FIELD 3 FIELD OF THE INVENTION The present invention relates to an RFID (Radio_Frequency_Identification) tag that exchanges information with an external device without contacting an external device, among those skilled in the art. The "RFID tag" used in the present invention is also referred to as "a wireless 1C tag". C. Prior Art 3 Background of the Invention In recent years, different RFID tags have been proposed to exchange information by a radio wave by an external device represented by a reader and a writer without contacting the external device (for example, see Japan) Patent Application Gazette Nos. 20, 311, 226, 2000-200332, and 2001-351082). As with one of these RFID tags, a structure is proposed in which an antenna pattern for radio communication and a circuit chip are mounted on a base sheet made of plastic or paper. For this type of RFID tag, different applications are designed. For example, the RF1D tag is attached to an item or the like to exchange information about the item with an external device to identify them. For the application of such RFID tags, a label containing ~111?11) is attached to items whose shape can be easily changed, like clothes. In this application, a major problem is that the base wafer is easily bent by the circuit wafer because the circuit wafer is not easily bent. The circuit crystal g & % bending stress causes the circuit wafer Break or peel off. Conventionally, there has been proposed a technique in which a circuit wafer 1352314 surrounding the periphery of the circuit wafer is covered with a hard reinforcing member to prevent the shape of the RHD label from changing to reach around the periphery of the circuit wafer 5, thereby reducing the application to the circuit wafer. - bending stress. However, with such a technique using the reinforcing member or the like described above, 5 one end of the member or the like crosses the antenna and a bending stress is concentrated at the intersection to cause cracking of the antenna. SUMMARY OF THE INVENTION In view of the above, according to the present invention, there is provided an RFID tag in which the bending stress for the circuit wafer is reduced and at the same time the crack of the antenna is prevented. In the RFID tag according to the present invention, a first RFID tag includes: a base; an antenna extending on the base for communication; and a circuit chip electrically connected to the antenna and via the antenna Performing no 15-wire electrical communication; a wafer stiffening member that covers at least a portion of at least a periphery of the circuit wafer and at least a portion of the antenna when the base is configured as a bottom portion of the RFID tag; A cover member covering the base, the antenna, the circuit wafer, and the wafer reinforcement member, and which is more elastic than the wafer reinforcement member. The first RHD tag according to the present invention, because of the periphery of the circuit chip, which is a key component for performing radio communication, is covered with the wafer reinforcing member, and a bending stress for the circuit wafer is reduced. In addition, since the edge of the wafer reinforcement and the portion where the antennas intersect each other are covered with a flexible covering member that completely covers the circuit wafer and the wafer reinforcing member, the bending stress in this portion is suppressed. Set_ and thus prevent cracking of the antenna. In other words, according to the first RnD label of the present invention, a bending stress for the circuit wafer is reduced and at the same time the crack of the antenna is prevented. Further, a hard plastic is taken as an example in accordance with an example of a material for the wafer reinforcing member. However, in the _RFIEM signature of the present invention, a range covered with the wafer reinforcing member is limited to only a portion of the base. Thus, a typically flexible base allows for a degree of freedom outside of the area protected by the wafer reinforcement member. The first size marker of the present invention roughly changes shape in accordance with an article, such as the shape of a piece of clothing to which the RFID tag is attached. In addition, even in a case where the first RFID tag of the present invention directly contacts the user, since the kRFID tag system is completely covered with the covering member having the sinusibility, it is possible to prevent the hard wafer reinforcing member from directly contacting. user. Further, in the first RFID tag of the present invention, even if the RFID tag is broken, since the covering member is provided, it is possible to prevent the broken RFID tag from being damaged or the like by the user. Thus, in the first RHD tag of the present invention, consideration is given to the user that the user may not feel uncomfortable when directly contacting the RFID tag attached to the article worn by the user. Here, in the first RFID tag of the present invention, a preferred example is ''the wafer reinforcing member is not in contact with the base, the antenna is in contact with the circuit wafer and is embedded in the covering member." A preferred example of an RFID tag, since the wafer reinforcing member is not in contact with the base or other components, such as the concentration of bending stress generated by the wafer reinforcing member is prevented. - RFID sling, another preferred example is "the RFID tag further includes a bottom reinforcing member which is provided (10) the bottom reinforcing member and the crystallization" {reinforcing member sandwiches the base, and is embedded in the enchantment According to this preferred example of the RFID tag, the protection of the circuit chip is further improved by the bottom reinforcing member. Further, since the bottom reinforcing member does not The base is in contact, so it is possible to prevent a concentration such as the bending stress generated by the wafer reinforcing member. Further, in the RFID tag according to the present invention, a second 111711) label package a _-base; __ an antenna extending on the base for communication; a circuit BB is electrically connected to the antenna and is carried by the antenna: radio communication; a wafer force strong member, when The base is configured to cover at least the upper portion of at least the circumference of the circuit wafer and at least the upper portion of the portion of the circuit wafer; and an edge covering member that covers the wafer reinforcement At least a portion of the edge of the member of the portion wherein the edge of the gusset reinforcing member intersects the antenna, the edge covering member being more resilient than the wafer reinforcing member. The second RFID tag according to the present invention is - Zhou ^ 疋 疋 疋 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 仃 仃 仃 仃 仃 仃 仃 仃The flexible covering member is covered, so that the bending stress in this portion is suppressed and the crack of the antenna is prevented. In other words, the same is performed by the present invention - RFlD label The sheet-bending stress is reduced and at the same time prevents cracking of the antenna. Here, a typical example of the first and second RFID tags of the present invention is "the wafer reinforcing member covers only a periphery of the circuit wafer and A portion of the antenna. According to this preferred embodiment of the RFID tag, although the wafer reinforcing member covers a periphery of the circuit wafer to protect the circuit wafer, an open space on the circuit wafer causes the RFID to be thinned. Another preferred example of the first and second RFID tags of the present invention is that the RFID tag further includes a bottom reinforcing member disposed such that the bottom reinforcing member and the wafer reinforcing member are offset from the base. According to this preferred embodiment of the RFID tag, the protection of the circuit chip is further improved by the bottom reinforcing member. In addition, an RFID tag manufacturing method according to the present invention includes the following steps: a preparation step 'for preparing an inlay, comprising a base, an antenna extending on the base for communication, and a circuit chip electrically connected To the antenna and performing radio communication via the antenna, and a wafer reinforcing member covering at least one portion of the periphery of the circuit wafer and at least one portion of the antenna above the base when the base is attached to the lower side; a covering step 'for covering the inlay such that a spacer is disposed around the wafer reinforcing member, the spacer is more elastic than the wafer reinforcing member and the inlay is the same as the spacer A sheet member made of a material of the spacer and bonded by heating and pressurization is sandwiched. According to the manufacturing method of the present invention, an RFID tag in which the bending stress of the circuit wafer is reduced and the crack of the antenna is prevented can be easily manufactured. Further, the shape of the RFID tag is flattened by the covering procedure in which the spacer is disposed around the wafer reinforcing member and then the inlay and the spacer are sandwiched by the plurality of sheet members. Further, with regard to the RFID tag manufacturing method according to the present invention, only a description will be given of a basic example in order to avoid redundancy. However, the manufacturing method according to the present invention includes different examples of the examples corresponding to the above-described RFID tags and this example. As described above, according to the present invention, an RFID tag in which a bending stress of the circuit wafer is reduced and at the same time preventing cracking of the antenna can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a first embodiment of an RFID tag according to the present invention; and FIG. 2 is a schematic view showing a second embodiment of an RnD tag according to the present invention; Figure 1 is a schematic view showing a third embodiment of the iRnD tag according to the present invention; Figure 4 is a schematic view showing a fourth embodiment of the rFID tag according to the present invention; 20 Figure 5 is a flow chart, It shows an RFID tag manufacturing method for manufacturing the RHD tag 400 of the fourth embodiment shown in FIG. 4 as an exemplary embodiment of the RFID tag manufacturing method according to the present invention; FIG. 6 is a view showing FIG. A detailed view of the preparation step (step 110) in the flow chart; 10 Figure 7 is a schematic diagram of the details of the display; Figure 8 is a schematic diagram of an example; The step of covering (the fifth embodiment of the RFID tag not according to the present invention is shown in FIG. 9 is a diagram, and the display is used to manufacture the RFID tag 900 for manufacturing the RFID tag 900 shown in FIG. Method; Figure 10 is a sixth version of a RFID tag not according to the present invention A schematic diagram of an embodiment; Fig. 11 is a diagram showing a method for manufacturing an RFID tag for manufacturing an RFID tag 10 tag shown in Fig. 10; Fig. 12 - A schematic view showing a seventh embodiment of the RFID tag according to the present invention; FIG. 13 is a view showing the details of the step of covering the manufacturing method of the RFID tag shown in FIG. 12; 14 is a schematic view showing an eighth embodiment of an RFID tag according to the present invention; and FIG. 15 is a view showing a step of covering the RFID tag manufacturing method of the RFID tag 1200 shown in FIG. The details. [Embodiment 3] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Exemplary embodiments according to the present invention will be described with reference to the drawings. First, a first embodiment of the radically invented RFID tag will be described. Figure 1 is a first embodiment of an RFID tag in accordance with the present invention 11 1352314. The configuration is such that the RFID tag awn can withstand a rough environment due to the user. Next, a second embodiment according to the present invention will be explained. Fig. 2 is a schematic view showing a second embodiment 5 of the RFID tag according to the present invention. • In part (a) of Fig. 2, a top view of an RFID tag 300, in accordance with a second embodiment of the RFID tag of the present invention, shows a state in which an internal structure of the rfID tag 200 is seen through. In part (b) of Fig. 2, a longitudinal cross section of the ® RFID tag 200 is shown. Further, in Fig. 2, the elements of the first embodiment shown in Fig. 1 are given the same reference numerals as in Fig. 1. In the following, redundant descriptions of these elements will be omitted. In the RFID tag 200 of this embodiment, an inlay 21 〇 includes a wafer reinforcing member 211 having a shape different from that of the wafer reinforcing member 15 of the first embodiment. The inlay 2, shown in Fig. 2, and the wafer intensifying member 211 correspond to the examples of the inlay and the wafer intensifying member according to the present invention, respectively. The wafer reinforcing member 211 has a structure in which the top portion of the wafer reinforcing member of the embodiment is removed to open a space above the circuit 113. Similarly, in the wafer reinforcing member 211, a shape change of the RFID tag 200 is prevented from affecting the circumference of the circuit wafer 113. Further, since the portion where the edge of the hybrid 115 and the antenna 12 cross each other are covered with the flexible covering member m, the crack of the antenna 112 is prevented. Further, on the circuit wafer 113, the opening space is made thin by (1) 2 (1) and 14 1352314 by a portion corresponding to the top portion of the U-reinforced member 1A. Thus, the RHD tag 200 shown in Fig. 2 is configured such that the RFID tag 200 is thinned while protecting the circuit chip and preventing the antenna from being broken as in the RFID tag 100 of the first embodiment. 5 Next, a third embodiment of the RFID tag according to the present invention will be explained. Fig. 3 is a schematic view showing a third embodiment of the RHD label according to the present invention. A top view of a RHD tag 300 in part (a) of Fig. 3, according to a third embodiment of the RFID tag of the present invention, is shown in an internal structure of the ruler 300) status. In part (b) of Fig. 3, a longitudinal cross section of the RFID tag 300 is displayed. Further, in the same manner, in Fig. 3, the elements of the first embodiment shown in Fig. 1 are given the same reference numerals as in the drawings. In the following 15 the redundant description of these components will be omitted. In the RFID tag 300 of this embodiment, an inlay 31 〇 includes a wafer reinforcing member 31 等于 equal to the wafer reinforcing member 211 of the second embodiment, and a bottom reinforcing member 312 configured such that the wafer reinforcing member The 3n and bottom reinforcing members 312 sandwich the base 丨丨丨 and are disposed opposite each other with respect to the base ii 2 。. The inlay 21'' shown in Fig. 3 and the wafer reinforcing member 311 correspond to an example of the inlay and the wafer reinforcing member according to the present invention, respectively. Further, the bottom reinforcing member 312 corresponds to an example of the bottom reinforcing member according to the present invention. Similarly for the wafer reinforcing member 3U, the bottom reinforcing member cleave 15 5 is made of _reinforced resin and is bonded to the heat-adhesive adhesive ιι5 of the wafer reinforcing member 311 on the base (1) by the adhesive 115. . And □ 4 is at the bottom of the base U1. Further, in this embodiment, the bottom reinforcing member 312 has the same shape as the wafer reinforcing member 11, except that an opening for accommodating the electric galvanic sheet 113 is not provided. The RFID tag lion system configuration of FIG. 3 is such that the protection of the circuit chip is reinforced by the bottom reinforcing member 312 while retaining the second embodiment of the second embodiment of the RFID tag t according to the present invention. Say 10 Ming. Fig. 4 is a schematic view showing a fourth embodiment of the RFID tag according to the present invention. In a portion (4) of Fig. 4, a top view of the RFID tag 400, a fourth embodiment of the RHD tag according to the present invention shows a state in which an internal structure of the RFm tag 4〇〇 15 is seen through. In part (b) of Fig. 4, a longitudinal cross section of the RFID tag 400 is shown. Further, in the same manner, in Fig. 4, the elements of the first embodiment shown in Fig. 1 are given the same reference numerals as in Fig. 1. In the following, redundant descriptions of these components will be omitted. In the RFID tag 400 of this embodiment, an inlay 410 includes a wafer reinforcing member 411 equal to the wafer reinforcing member 211 of the second embodiment, and a bottom reinforcing member 420 configured such that the wafer reinforcing member 41 is disposed. The crucible and bottom reinforcing members 420 sandwich the base portion 111 and are disposed opposite to each other with respect to the base portion 1n. However, the bottom reinforcing member 420 of this embodiment is different from 16 1352314 for preparing the inlay 410 (step sii), and a covering step for covering the inlaid 410 (step si20). The preparation step (step S110) and the covering step (step S120) respectively correspond to an example of the preparation step and the covering step according to the present invention. 5 First, the preparation step (step S110) will be explained. Fig. 6 is a view showing the details of the preparation step (step 110) in the flowchart shown in Fig. 5. First, in this preparation step (step S110), the circuit wafer 113 is mounted on the base portion 111 on the surface on which the antenna crucible 12 is formed. Since the circuit board 113 is widely known, the detailed description herein will be omitted. The circuit chip 113 is mounted in the step Sill, and then a dispenser 45 0 applies the thermosetting adhesive memory 5 to the circuit chip 113. The base portion 111 is such that the circuit wafer is buried in the thermosetting adhesive 115 (step S112). Next, a worker 15 carries the wafer reinforcing member 411 to a position just above the circuit wafer 113 and places the wafer reinforcing member 411 on the base 111 so that the circuit wafer 113 is accommodated in the wafer. The reinforcing member 411 (step SU3). Then, a heat source 6 is used to heat the thermosetting adhesive 115 so that the thermosetting adhesive 115 is hardened and the inlay 400 is completed (step S114). 20 Next, the covering step (step S120) shown in Fig. 5 will be explained. Fig. 7 is a view showing details of the covering step (step 120) in the flowchart shown in Fig. 5. In this covering step (step S120), the three-piece RFID tag 400 is executed in one program. 18 1352314 Heating. The four rubber sheets 121 to 124 are thereby integrated by the pressing and heating so that the bottom reinforcing members 420 for the three pieces of the RHD label 400 and the inlays 410 are buried inside. Then, a series of five-piece RFID tags 400 in which the bottom reinforcing members 420 and the inlaid 410 are covered with the rubber covering member 120 are formed. Following the procedure of step S121, a cutter 800 is moved down between the respective inlays 410 to cut the continuous RHD tag 400 to obtain three separate RJFID tags 400 (step S122). According to the RFID tag manufacturing method shown in the above and Fig. 3, it is possible to easily manufacture the RFID tag 400 having a structure in which the user can withstand the rough environment. Further, in the RFID tag manufacturing method, in the step S121 shown in FIG. 7, the third rubber sheet 123 is provided with an opening for accommodating the wafer reinforcing member, and the wafer reinforcing member 411 is used. The surrounding 'which forms the protrusion of the inlay 410 is filled with the rubber 15 sheet 123. Thus, the shape finally obtained by the RFID tag 400 is flattened. Next, a fifth embodiment of the RFID tag according to the present invention will be explained. Fig. 8 is a schematic view showing a fifth embodiment of the RFID tag according to the present invention. In part (a) of Fig. 8, a top view of an RFID tag 900, in accordance with a fifth embodiment of the RFID tag of the present invention, shows a state in which an internal structure of the rfid tag 9A is seen through. In part (b) of Fig. 8, a longitudinal cross section of the RFID tag 900 is displayed. Similarly, in Fig. 5, the elements of the first embodiment 20 1352314 shown in Fig. 1 are given the same reference numerals as in Fig. 1. In the following, a redundant description of this component will be omitted. The RFID label 900 of this embodiment is not provided with a wafer reinforcing member made of a fiber-reinforced tree t and the covering member, both of which are provided in all of the fifth to fourth embodiments. The circuit wafer 113 is covered with a rigid epoxy resin potting material 901 ' and its entire periphery is covered with a flexible rubber dot 902. Here, the rigid epoxy resin sealing material 9〇1 corresponds to an example of the wafer reinforcing member according to the present invention and the flexible rubber adhesive 902 corresponds to an example of the edge covering member according to the present invention. In the 111710 label 900 of this embodiment, the circuit wafer 113 is protected by the hard potting material 901. In addition, since the edge of the hard epoxy encapsulant 901 corresponding to an example of the "edge of the wafer reinforcing member" according to the present invention is completely covered with a flexible portion including the edge and the antenna 112. The rubber adhesive 902, the concentration of a bending stress 15 in this portion is suppressed and thus the cracking of the antenna 113 is prevented. In other words, in the RFID tag 900 not shown in Fig. 8, for A bending stress of the circuit wafer is lowered and at the same time the crack of the antenna is prevented. Next, a method for manufacturing the RFID tag 900 shown in Fig. 8 will be explained. Further, here, FIG. The components will be referred to without the description of '20 Figure 8. Fig. 9 is a view showing a method of manufacturing an RFID tag for manufacturing the RFID tag 900 shown in Fig. 8. In this manufacturing method, first, the circuit wafer 113 is mounted on the base portion 111, and the antenna 112 is formed on the surface of the base portion 111 (step S201). Since the circuit chip 113 is widely known, its detailed description will be omitted. In step S201, the circuit chip 113 is mounted. Then, the dispenser 450 applies the hard thermosetting potting material 901 to the base 1U so that the 5 circuit wafer 113 is buried in the hard potting material 901 (step S202). The heat source 600 heats the hard thermosetting pot sealing material 9 to harden the hard thermosetting potting material 901 (step S203). Then, the heat source 600 covers the edge of the hard potting material 9〇1 with the flexible thermosetting adhesive 902 (step S2〇4). Then, the thermal element 600 heats the flexible thermosetting adhesive 9〇2 to harden the flexible thermosetting adhesive 902, and the RFID tag 900 is completed (step S205). Through a series of these programs, the RHD tag 900 shown in Fig. 8 is easily manufactured. Next, a sixth embodiment of the RFID tag according to the present invention will be described. Fig. 10 is a schematic view showing a sixth embodiment of the RnD tag according to the present invention. In a part (a) of Fig. 10, a top view of an RFID tag 1000, a sixth embodiment of the RFID tag according to the present invention shows a state in which an internal structure of the RFID tag 2〇1〇00 is seen through. . In part (b) of Fig. 10, a longitudinal cross section of the RFID tag 1000 is shown. Further, the elements in the 'fifth diagram' corresponding to the second embodiment shown in Fig. 2 are given the same reference numerals as in Fig. 2. In the following, redundant descriptions of these elements will be omitted. 22 1352314 The RFID tag 1000 of this embodiment is not provided with the covering member included in the second embodiment described above, and the wafer reinforcing member 211 is completely covered by a flexible rubber adhesive 1〇〇2 along the edge system. Further, the flexible rubber adhesive 1002 has a function of adhering and fixing the wafer reinforcing member 211 to the base portion 51. In addition, in the RFID tag 1000, the wafer reinforcing member 211 is filled with an epoxy resin hard potting material 1〇〇1 so that the epoxy resin hard potting material 901 corresponds to the flexible adhesive 1〇〇2. An example of a wafer reinforcing member and the edge covering member according to the present invention. In the RFID tag 1 of this embodiment, the circuit chip 113 is protected by the crystal plate reinforcing member 211. Moreover, the protection of this circuit wafer is enhanced by filling the hard potting material 1001. In addition, since the edge of the wafer reinforcing member 211 according to the present invention corresponds to the edge of the wafer reinforcing member according to the present invention, the edge of the wafer reinforcing member 211 is completely covered with a flexible rubber dot containing a portion of the edge of the edge antenna 112. In the case of the agent 1〇〇2, the concentration of the bending stress of one bend in this portion is suppressed and thus the cracking of the antenna ιΐ3 is prevented. In other words, the bending stress of the circuit wafer is lowered and at the same time the cracking of the antenna is prevented. Next, a method for manufacturing the RFID tag 1A shown in Fig. 10 will be explained. Further, 'the elements shown in Fig. 10 will be referred to and 20 will not be described in the "Fig. 10". Fig. 11 is a diagram showing the method of manufacturing the RF1D label for the manufacture of the brush label 1000 shown in the figure. Also in this manufacturing method, first, the circuit wafer 113 is mounted on the base portion 111, and the antenna m is formed on the surface of the base portion 1U (step 23 1352314 S301). Since the circuit chip 113 is widely known, the detailed description thereof will be omitted. In step S301, the circuit chip 113 is mounted. Then, the dispenser 450 applies a flexible thermoset potting material 1002 to the base 111 such that the flexible thermoset potting material 1002 surrounds the periphery of the circuit wafer 113 (step S302). Next, the erecting tool 500 carries the wafer reinforcing member 211 to a position just above the circuit wafer 113 and places the wafer reinforcing member 211 on the base 111, so that the circuit wafer 113 is accommodated in the wafer reinforcement. In the member 211 (step S303). Then, the heat source 600 heats the 10 flexible thermosetting adhesive 1〇〇2 until the flexible thermosetting adhesive is hardened and the wafer reinforcing member 211 is adhered and fixed to the base in (step S304) . Subsequently, the dispenser 450 fills the wafer reinforcing member 211 with the hard heat sealing material 1〇〇1, so that the hard heat sealing material 1〇〇1 covers the transistor road wafer inside the wafer reinforcing member 211. (Step S3〇5), and 15 and the thermal element 600 heats and hardens the hard thermosetting pot sealing material 1001 to complete the RFID tag 1 (step s3〇6). The RFID tag 10900 shown in Fig. 10 is easily manufactured via a series of these programs. Next, a seventh embodiment of the RFID tag according to the present invention will be described. Fig. 12 is a schematic view showing a seventh embodiment of the RFID tag according to the present invention. In part (4) of Fig. 12, an RFID tag 11-top view, a seventh embodiment of the RFID tag according to the present invention shows a state in which an internal structure of the RFID tag 24 1352314 1100 is seen through . In part (b) of Fig. 12, a longitudinal cross section of an RFID tag 1100 is displayed. Further, in Fig. 12, the elements of the first embodiment shown in the above-mentioned second embodiment are given the same reference numerals as in Fig. 1. In the following, redundant descriptions of these elements will be omitted. In the RFID tag 11A of this embodiment, an inlay n1 is provided with a wafer reinforcing member 1111 having a shape different from that of the wafer reinforcing member according to the first embodiment, and the wafer reinforcing member is The tether is embedded in a cover member 1120 and does not contact the base 1 , the antenna U2, and the wafer 10 of the circuit 10. The inlay ι11, the wafer reinforcing member 1111, and the covering member 1120 shown in Fig. 12 also correspond to the inlay, the wafer reinforcing member, and the covering member, respectively, according to the present invention. The reinforcing member iiu shown in Fig. 12 is neither glued nor fixed to the base portion 112, but is spaced apart, like floating, on the circuit wafer 113. The crystal piece reinforcement member U11 also prevents the shape change of the RFID tag 11A from affecting the periphery of the circuit chip 113, thereby preventing peeling, cracking, and the like of the circuit chip 112. Further, in this embodiment, since the wafer reinforcing member 丨丨丨丨 is not in contact with the 忒 antenna 112, no bending stress is concentrated in a limited portion and cracking of the antenna 112 is prevented. 2 Next, a method for manufacturing the RFID tag shown in Fig. 12 will be explained. Further, here, the elements shown in Fig. 12 will be referred to without the description of "Fig. 12". In the manufacturing method, after the circuit wafer 113 is mounted on the base U1, the antenna 112 is formed on the surface of the base 111 for covering the covering process of the 25 1352314 the inlay 1110 and configuring the wafer. The reinforcement member 丨丨^ is executed at the same time. Fig. 13 is a view showing details of the covering step of the RFID label manufacturing method for manufacturing the rfID label 1100 shown in Fig. 12. 5 The cover step for a piece of RFID tag 11 is shown in Figure 13. In the covering step which will be described below, the pressing means of the pressing device 700 which is the same as that shown in Fig. 7 is used. Therefore, in Fig. 13, the pressing device displays the same symbols as in Fig. 7. First, in place of the wafer reinforcing member 1U1, the inlaid 1110, the three rubber sheets 1121 to 1123 forming the covering member 1120, and the wafer reinforcing member 1111 are arranged as follows (step S401). First, the bottom rubber sheets 1121 of the three rubber sheets 1121 to 1123 are placed on the pressing table 710, and then the portion 1112 of the inlaid mo is placed on the bottom rubber sheet 1121. Subsequently, the second rubber sheet 1122 is overlaid on the portion 1112 of the inlaid 1511, and the wafer reinforcing member 1111 is placed in a position in which the wafer reinforcing member 1111 and the circuit wafer 1 sandwich the rubber sheet 1122 In the middle and opposite each other. Then, finally, the top rubber sheet 1123 is covered. Then, after the portion 1112 of the inlay 1110, the three rubber sheets 1121 to 1123 forming the covering member 20, and the wafer reinforcing member 1111 are placed on the pressing table 710, the pressing head 720 Moving down to the top rubber sheet 1123, and the three rubber sheets 1121, 1122 and 1123 sandwiched by the pressing table 71 and the pressing head 72, the portion 1112 of the inlay 1110, and the wafer The reinforcing member η is pressed and heated to become integral with 26 1352314 (step S402). By this combination, the RFm standard shown in Fig. 12 is completed. The RFID tag 1100 shown in Fig. 12 is easily manufactured via a series of these programs. Next, an eighth embodiment according to the present invention will be explained. Fig. 14 is a schematic view showing an eighth embodiment of the RFID tag according to the present invention.
第14圖的部分(a)中，一RFID標籤1200的-頂視圖，根 據本發明的RFID標籤之第人實施例係顯示在該RnD標鐵 1〇 Π00的-内部結構被看穿的一狀態。第糊的部分㈨中， 一 RFID標籤1200的-縱向橫截面被顯示。 此外，第14圖中，等於上述第12圖所示的第七實施例 之元件係給予相同如第12圖中的參考文字。在下文中，這 些元件的冗餘說明將被省略。 15In part (a) of Fig. 14, a top view of an RFID tag 1200, according to the first embodiment of the RFID tag of the present invention, shows a state in which the internal structure of the RnD target 〇00 is seen through. In the portion (9) of the second paste, a longitudinal cross section of an RFID tag 1200 is displayed. Further, in Fig. 14, the elements of the seventh embodiment shown in Fig. 12 are given the same reference numerals as in Fig. 12. In the following, redundant descriptions of these components will be omitted. 15
20 此實施例之RFID標籤1200中，該鑲嵌物1210具有一結 構其中-底加強構件1121被增加至第12圖所示之第七實施 例的鑲嵌物’以致該底加強構件1121與該晶片加強構件 mi將該基部m爽在中間，並且該底加強構件ιΐ2ι係隔開 該基部111來放置。該鑲嵌物121G與該底加_件⑵i分別 對應根據本發明之鑲嵌物與底加強構件之範I此外此 2例的覆蓋構件mo亦填充該鑲㈣121G與該底加強構 川之間的間隙。此覆蓋構件酬應根 盍構件之範例。 14圖所示之RFID標籤12〇〇具有 一結構其中該電路晶 27 1352314 片的保邊係因該底加強構件1211而被加強，同時維護上塊 第七實施例中所獲得之天線破裂等的防止。 接著’用於製造第Μ圖所示之此RFID標籤1200的方法 將被說明。此外，於此第14圖所示之元件將被參考而無“苐 5 14圖”之說明。 此製造方法中，在該電路晶片113被裝設在該基部Ul 上後，在該基部ill的表面上該天線112被形成，用於覆蓋 該鑲嵌物1220的覆蓋步驟係與配置該晶片加強構件丨⑴同 時被執行。 10 第15圖是一圖，顯示該製造第14圖所示之RFID標織 1200的RFID標籤製造方法的覆蓋步驟之細節。 同樣在第15圖中，用於一件RnD標籤12〇〇的覆蓋步騍 係顯示於第13圖。 在以下將被說明的覆蓋步驟中，相同如第7圖所示之按 15壓裝置700的按壓裝置被使用。因此，第15圖中’此按壓裝 置係顯示以相同如第7圖與第13圖的參考文字β 首先，該鑲嵌物1210除了該晶片加強構件mi與該底 加強構件1211以外的一部分、四個橡膠薄片1221至1224、 s玄晶片加強構件1111、以及該底加強構件1211係配置如下 20 (步驟S501)。首先，該等四個橡膠薄片1221至1224的最底橡 膠薄片1221被放在該按壓台710上’然後該底加強構件1211 被放在該底橡膠薄片1221上。隨後，該第二橡膠薄片1222 係覆蓋在該底加強構件1211上’並且該鑲嵌物121〇的該部 分1212被放在一位置其中該晶片加強構件1211與該電路晶 28 1352314 片113將該第二橡膠薄片1222夾在中間且有關該第二橡膠 薄片1222彼此相對。接著，該第三橡膠薄片1223被覆蓋在 該鑲嵌物1210的該部分1212上’該晶片加強構件llu被放 在一位置其中該晶片加強構件1111與該電路晶片U3將該 5第三橡膠薄片1223夾在中間且彼此相對。然後，最後該頂 橡膠薄片1224被覆蓋。 於是，該鑲嵌物1110除了該晶片加強構件lln與該底 加強構件1211以外之該部分1212、四個橡膠薄片1221至 1224、該晶片加強構件U11、及該底加強構件被放在該按 10壓台710上。然後，該按壓頭720下移到該頂橡膠薄片1224 上，並且該等四個橡膠薄片1221至1224、該鑲嵌物111〇之 該部分1112、該晶片加強構件丨丨丨丨及該底加強構件1211被 該按壓台710與該按壓頭72〇炎在中間並且被按壓且被加熱 成為一體（步驟S502)。藉此結合，第14圖所示之RnD標籤 15 1200被完成。 經由一連宰的這些程序，第14圖所示之RFID標籤12〇〇 係容易製造。 另外，以上說明中，作為根據本發明的晶片加強構件 之範例’由纖維加強樹脂製成的晶片加強構件114被顯示但 20該纖維加強樹脂的類型係不特定。根據本發明的纖維加強 =之可能是’例如，-FRP (纖維加強歸)或__玻璃環氧樹 月日此外，根據本發明之晶片加強構件並不限於此纖維加 強數之並且可能是-熱可塑性塑膠或—熱固樹脂。 此外，在以上說明中，作為一用於將該晶片加強構件 29 膠合與固定至該基部ln的黏著劑該熱固黏著劑被示範， 仁本發明並不限於此一範例。此黏著劑可能是一UV硬化黏 著劑 厭氣黏著劑、一水分硬化黏著劑或一2-部分黏著 劑。 此外，在以上說明中，屬於根據本發明的底加強構件 I由纖維加強樹脂製成的底加強構件312被示範作 為破膠合以便被固定在該鑲嵌物的底面上之底加強構件類 尘的範例，但該纖維加強樹脂的種類係不特定。形成此 類5L的底加強構件的一纖維加強樹脂可能是一 或一玻 10璃環氧樹脂。另外，上述類型的底加強構件並不限於由此 纖維加強數之製成者，並且可能是，例如，一熱塑性塑膠 或一熱固塑膠。 此外，在以上說明中，屬於根據本發明的底加強構件 之範例，作為被安排與該鑲嵌物隔開的底加強構件之類型 的範例，由塑膠薄片製成的底加強構件42〇被示範。但此 發月並不在此限。此類型被安排與該鑲嵌物隔開的底加強 構件可缺-㈣成有-由尼龍卜註冊商標）製成的網。 ~此外，在以上說明中，作為-根據本發明的覆蓋構件 之範例1¾橡膠覆蓋構件12〇被示範，但該橡膠的種類係非 2〇特定。，然而，形成根據本發明之覆蓋構件的—橡膠可能是， 例如，氨基鉀酸酯橡膠，矽橡膠或氟橡膠。 此外，在以上說明中，作為該晶片加強構件的一範例， 其中肖口被形成來容置該晶片之晶片加強構件113被示 範。然而，本發明並不在此限。根據本發明之晶片加強構 30 件可能是，例如，— m打 —無此開口但僅具有一板狀外表並被配 置以=錢路晶片的晶片加強構件。 μ心在U上說明中’作為根據本發明的邊緣覆蓋構 ::，該可撓的橡膠勘著劑被示範，但該橡膠的種 =tMe疋°然而’形成根據本發明之邊緣覆蓋構件的橡 ^月^例如’氨基鉀酸8旨橡穆或石夕橡膠。 件的’料根據本發明的邊緣覆蓋構 兮曰M 、覆硬式罐封材料9G1的可撓黏著劑與 10 15 “曰曰 件破不範。然而，本發明並不在此限。根據 本發月之邊緣覆蓋構件可能只覆蓋，例如，該邊緣與該天 線互相交又的—部分。 【圖式簡單說明】 第1圖疋—顯示根據本發明之RFID標籤的-第-實施 例之概要圖； 第2圖疋—顯示根據本發明之RFID標籤的一第二眚# 例之概要圖； ~貫" 第3圖是一顯示根據本發明之RnD標籤的一第三實施 例之概要圖； 第4圖是一顯示根據本發明之RFID標籤的一第四實施 20 例之概要圖； 第5圖是一流程圖，其顯示一種用於製造第4圖所示之 第四實施例的RHD標籤400的RFID標籤製造方法作為根據 本發明的RFID標戴製造方法的一示範實施例； 第6圖是一顯示第5圖所示之流程圖中的準備步驟（步 31 1352314 驟110)之細節圖； 第7圖疋帛不第5圖所示之流程圖中的覆蓋步驟(步 驟120)細節之圖； 第8圖是一顯示根據本發明之RFID標籤的-第五實施 5 例之概要圖； 第9圖是一圖，干―田μ希卜土 觸不用於製造第8圖所示之RFID標籤 900的RFID標籤製造方法；In the RFID tag 1200 of this embodiment, the inlay 1210 has a structure in which the bottom reinforcing member 1121 is added to the inlay of the seventh embodiment shown in Fig. 12 such that the bottom reinforcing member 1121 is reinforced with the wafer. The member mi saturates the base m in the middle, and the bottom reinforcing member ι 2 2 is placed apart from the base 111. The inlay 121G and the bottoming member (2)i respectively correspond to the inlay and the bottom reinforcing member according to the present invention. Further, the covering member mo of the two examples also fills a gap between the inlay 121G and the bottom reinforcing structure. This overlay component is an example of a component. The RFID tag 12A shown in Fig. 14 has a structure in which the edge of the circuit crystal 27 1352314 is reinforced by the bottom reinforcing member 1211 while maintaining the antenna rupture or the like obtained in the seventh embodiment. prevent. Next, the method for manufacturing the RFID tag 1200 shown in the figure will be explained. Further, the elements shown in Fig. 14 will be referred to without the description of "苐 5 14图". In the manufacturing method, after the circuit wafer 113 is mounted on the base portion U1, the antenna 112 is formed on the surface of the base portion ill, and the covering step for covering the inlay 1220 and the wafer reinforcing member are disposed.丨(1) is executed at the same time. 10 Fig. 15 is a view showing details of the steps of covering the RFID tag manufacturing method of the RFID woven fabric 1200 shown in Fig. 14. Also in Fig. 15, the overlay step for a piece of RnD tag 12 is shown in Fig. 13. In the covering step which will be described below, the pressing device of the pressing device 700 which is the same as that shown in Fig. 7 is used. Therefore, in Fig. 15, the pressing device displays the reference characters β which are the same as those of Figs. 7 and 13 . First, the inlay 1210 is a part of the wafer reinforcing member mi and the bottom reinforcing member 1211, four. The rubber sheets 1221 to 1224, the s-wafer reinforcing member 1111, and the bottom reinforcing member 1211 are disposed as follows (step S501). First, the bottom rubber sheet 1221 of the four rubber sheets 1221 to 1224 is placed on the pressing table 710' and then the bottom reinforcing member 1211 is placed on the bottom rubber sheet 1221. Subsequently, the second rubber sheet 1222 is overlaid on the bottom reinforcing member 1211 and the portion 1212 of the inlay 121 is placed in a position in which the wafer reinforcing member 1211 and the circuit crystal 28 1352314 are 113 The two rubber sheets 1222 are sandwiched and the second rubber sheets 1222 are opposed to each other. Next, the third rubber sheet 1223 is overlaid on the portion 1212 of the inlay 1210. The wafer reinforcing member 11u is placed in a position in which the wafer reinforcing member 1111 and the circuit wafer U3 divide the 5 third rubber sheet 1223. Sandwiched in the middle and opposite each other. Then, finally, the top rubber sheet 1224 is covered. Thus, the portion 1112 of the inlay 1110 other than the wafer reinforcing member 11n and the bottom reinforcing member 1211, the four rubber sheets 1221 to 1224, the wafer reinforcing member U11, and the bottom reinforcing member are placed at the pressing force of 10 On stage 710. Then, the pressing head 720 is moved down onto the top rubber sheet 1224, and the four rubber sheets 1221 to 1224, the portion 11112 of the inlaid 111, the wafer reinforcing member and the bottom reinforcing member The pressing portion 710 is pressed by the pressing table 710 and the pressing head 72, and is pressed and heated to be integrated (step S502). By this combination, the RnD tag 15 1200 shown in Fig. 14 is completed. Through these continuous programs, the RFID tag 12 shown in Fig. 14 is easy to manufacture. Further, in the above description, as an example of the wafer reinforcing member according to the present invention, the wafer reinforcing member 114 made of a fiber-reinforced resin is shown but the type of the fiber-reinforced resin is not specific. The fiber reinforcement according to the present invention may be 'for example, -FRP (Fiber Reinforced) or __Glass Epoxy Tree. Further, the wafer reinforcing member according to the present invention is not limited to this fiber-reinforced number and may be - Thermoplastic plastic or thermosetting resin. Further, in the above description, the thermosetting adhesive is exemplified as an adhesive for bonding and fixing the wafer reinforcing member 29 to the base ln, and the present invention is not limited to this example. This adhesive may be a UV hardening adhesive, an anaerobic adhesive, a moisture hardening adhesive or a 2-part adhesive. Further, in the above description, the bottom reinforcing member 312 which is a base reinforcing member 1 according to the present invention made of a fiber-reinforced resin is exemplified as an example of the bottom reinforcing member dust which is broken and glued to be fixed on the bottom surface of the inlay. However, the type of the fiber-reinforced resin is not specific. A fiber-reinforced resin forming such a 5L bottom reinforcing member may be one or one glass epoxy resin. Further, the bottom reinforcing member of the above type is not limited to the manufacturer of the fiber reinforcing number, and may be, for example, a thermoplastic or a thermosetting plastic. Further, in the above description, an example of the type of the bottom reinforcing member according to the present invention, as an example of the type of the bottom reinforcing member which is arranged to be spaced apart from the inlay, the bottom reinforcing member 42 made of a plastic sheet is exemplified. However, this month is not limited to this. This type of bottom reinforcing member, which is arranged to be spaced apart from the inlay, may be deficient - (d) into a net made of - a registered trademark of Nylon. Further, in the above description, as an example of the covering member according to the present invention, the rubber covering member 12 is exemplified, but the kind of the rubber is not specific. However, the rubber forming the covering member according to the present invention may be, for example, a urethane rubber, a ruthenium rubber or a fluororubber. Further, in the above description, as an example of the wafer reinforcing member, the wafer reinforcing member 113 in which the opening is formed to accommodate the wafer is shown. However, the invention is not limited thereto. The wafer reinforcement member according to the present invention may be, for example, a wafer-strength member having no such opening but having only a plate-like appearance and configured to be a wafer. The μ core is described in U' as the edge covering according to the invention:: the flexible rubber marking agent is exemplified, but the rubber species = tMe疋° however 'forms the edge covering member according to the invention Rubber ^ month ^ For example, 'amino potassium acid 8 is intended to be rubber or stone. According to the present invention, the edge covering structure M, the flexible adhesive covering the hard potting material 9G1 and the 10 15 "pieces are not broken. However, the present invention is not limited thereto. According to this month The edge covering member may only cover, for example, a portion of the edge that intersects the antenna. [Simplified Schematic] FIG. 1 is a schematic view showing a first embodiment of the RFID tag according to the present invention; FIG. 2 is a schematic view showing a second example of an RFID tag according to the present invention; FIG. 3 is a schematic view showing a third embodiment of the RnD tag according to the present invention; 4 is a schematic view showing a fourth embodiment of the RFID tag according to the present invention; FIG. 5 is a flow chart showing a RHD tag 400 for manufacturing the fourth embodiment shown in FIG. An RFID tag manufacturing method as an exemplary embodiment of the RFID tag manufacturing method according to the present invention; FIG. 6 is a detailed view showing a preparation step (step 31 1352314 step 110) in the flowchart shown in FIG. 5; Figure 7 is not in the flow chart shown in Figure 5. FIG. 8 is a schematic view showing a fifth example of the fifth embodiment of the RFID tag according to the present invention; and FIG. 9 is a view showing that the dry-field 希μb soil is not used for Manufacturing an RFID tag manufacturing method of the RFID tag 900 shown in FIG. 8;
第1〇圖是一顯示根據本發明之RFID標籤的一第六實 施例之概要圖； 10 第丨旧是®，顯示-用於製造第1G圖所示之RFID標 籤1000的RFID標籤製造方法； 第12圖是一顯示根據本發明之RFID標籤的一第七實 施例之概要圖； 第13圖疋圖，顯示該製造第12圖所示之rfid標籤 15 110G的RFID標籤製造方法的覆蓋步驟之細節； 第14圖是一顯示根據本發明之RFID標籤的一第八實 施例之概要圖；及 第15圖疋—圖，顯示該製造第14圖所示之RFID標籤 1200的RFID標籤製造方法的覆蓋步驟之細節。 20【主要元件符號說明】 100... RFID標籤 113…電路晶片 110.. .鑲嵌物 111.. .基部 112…天線 114.. .晶片加強構件 115…熱固黏著劑 120.. .橡膠覆蓋構件 32 1352314 Π1-124...橡膠薄片 901...硬式環氧樹脂罐封材料 200…RFID標籤 902…可撓性橡膠黏著劑 210...鑲嵌物 1000.· .RFID 標籤 211...晶片加強構件 1001…環氧樹脂硬式罐封材料 300...RFID 標籤 1002…可撓性橡膠黏著劑 310…鑲嵌物 1100· 311...晶片加強構件 1110...鑲嵌物 312...底加強構件 1111...晶片加強構件 400...RFID 標籤 1112...部分 410…鑲嵌物 1120...覆蓋構件 411...晶片加強構件 1121-1123·.·橡膠薄片 420...底加強構件 1200...RFID 標籤 450...分配器 1210...鑲嵌物 500...架設工具 1211…底加強構件 600...熱源 1220…覆蓋構件 700...按壓裝置 1221-1224·.·橡膠薄片 Ή0...按壓台 S110，S120···步驟 720...按壓頭 S111-S114...步驟 800...切割器 S201-205…步驟 900...RFID 標籤 S301-306...步驟 331 is a schematic view showing a sixth embodiment of an RFID tag according to the present invention; 10 丨 Old is ®, showing - an RFID tag manufacturing method for manufacturing the RFID tag 1000 shown in FIG. 1G; Figure 12 is a schematic view showing a seventh embodiment of the RFID tag according to the present invention; and Figure 13 is a view showing the step of covering the RFID tag manufacturing method for manufacturing the RFID tag 15 110G shown in Figure 12 14 is a schematic view showing an eighth embodiment of an RFID tag according to the present invention; and FIG. 15 is a view showing the method of manufacturing the RFID tag of the RFID tag 1200 shown in FIG. Cover the details of the steps. 20 [Description of main component symbols] 100... RFID tag 113... Circuit chip 110.. Inlay 111.. Base 112... Antenna 114.. Wafer reinforcing member 115... Thermosetting adhesive 120.. Rubber covering Member 32 1352314 Π 1-124...rubber sheet 901...hard epoxy encapsulant material 200...RFID tag 902...flexible rubber adhesive 210...inlay 1000.·.RFID tag 211... Wafer reinforcing member 1001...epoxy hard potting material 300...RFID label 1002...flexible rubber adhesive 310...inlay 1100·311...wafer reinforcing member 1110...inlay 312...bottom Reinforcing member 1111...wafer reinforcing member 400...RFID tag 1112...part 410...inlay 1120...covering member 411...wafer reinforcing member 1121-1123·.·rubber sheet 420...bottom Reinforcing member 1200...RFID tag 450...distributor 1210...inlay 500...suspension tool 1211...bottom reinforcing member 600...heat source 1220...covering member 700...pressing device 1221-1224· .. Rubber sheet Ή 0... Pressing table S110, S120 · Step 720... Pressing head S111-S114... Step 800... Cutter S201-2 05...Step 900...RFID Tag S301-306...Step 33