TWI350558B - Reflow processing apparatus and reflow processing method - Google Patents

Reflow processing apparatus and reflow processing method

Info

Publication number
TWI350558B
TWI350558B TW097101231A TW97101231A TWI350558B TW I350558 B TWI350558 B TW I350558B TW 097101231 A TW097101231 A TW 097101231A TW 97101231 A TW97101231 A TW 97101231A TW I350558 B TWI350558 B TW I350558B
Authority
TW
Taiwan
Prior art keywords
reflow processing
processing apparatus
processing method
reflow
processing
Prior art date
Application number
TW097101231A
Other languages
Chinese (zh)
Other versions
TW200839848A (en
Inventor
Yutaka Asou
Masatoshi Shiraishi
Shinobu Tanaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200839848A publication Critical patent/TW200839848A/en
Application granted granted Critical
Publication of TWI350558B publication Critical patent/TWI350558B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3092—Recovery of material; Waste processing
TW097101231A 2007-01-12 2008-01-11 Reflow processing apparatus and reflow processing method TWI350558B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007005156A JP2008172104A (en) 2007-01-12 2007-01-12 Reflow processing system and reflow processing method

Publications (2)

Publication Number Publication Date
TW200839848A TW200839848A (en) 2008-10-01
TWI350558B true TWI350558B (en) 2011-10-11

Family

ID=39631643

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097101231A TWI350558B (en) 2007-01-12 2008-01-11 Reflow processing apparatus and reflow processing method

Country Status (4)

Country Link
JP (1) JP2008172104A (en)
KR (1) KR20080066600A (en)
CN (1) CN101221900B (en)
TW (1) TWI350558B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016657A (en) * 2007-07-06 2009-01-22 Tokyo Electron Ltd Method for re-forming resist pattern
CN102150234B (en) 2008-11-05 2014-11-05 株式会社东芝 Film-forming apparatus, film-forming method and semiconductor device
JP4748742B2 (en) * 2009-02-13 2011-08-17 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP5704093B2 (en) * 2011-03-01 2015-04-22 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and storage medium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3886424B2 (en) * 2001-08-28 2007-02-28 鹿児島日本電気株式会社 Substrate processing apparatus and method
JP2003129279A (en) * 2001-10-23 2003-05-08 Kawasaki Steel Corp Pre-heating device and reflow treatment device for tin- electroplated steel plate
JP4810076B2 (en) * 2003-09-18 2011-11-09 日本電気株式会社 Substrate processing method and chemical used therefor
JP2006245110A (en) * 2005-03-01 2006-09-14 Tokyo Electron Ltd Heat-treating apparatus
JP2006310682A (en) * 2005-05-02 2006-11-09 Dainippon Screen Mfg Co Ltd Substrate processing apparatus

Also Published As

Publication number Publication date
CN101221900A (en) 2008-07-16
KR20080066600A (en) 2008-07-16
TW200839848A (en) 2008-10-01
CN101221900B (en) 2011-11-09
JP2008172104A (en) 2008-07-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees