TWI349990B - Shielded via - Google Patents

Shielded via

Info

Publication number
TWI349990B
TWI349990B TW096123328A TW96123328A TWI349990B TW I349990 B TWI349990 B TW I349990B TW 096123328 A TW096123328 A TW 096123328A TW 96123328 A TW96123328 A TW 96123328A TW I349990 B TWI349990 B TW I349990B
Authority
TW
Taiwan
Prior art keywords
shielded via
shielded
Prior art date
Application number
TW096123328A
Other languages
English (en)
Other versions
TW200814277A (en
Inventor
Bram Leader
Richard F Doersch
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200814277A publication Critical patent/TW200814277A/zh
Application granted granted Critical
Publication of TWI349990B publication Critical patent/TWI349990B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09636—Details of adjacent, not connected vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW096123328A 2006-06-29 2007-06-27 Shielded via TWI349990B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/477,703 US7781889B2 (en) 2006-06-29 2006-06-29 Shielded via

Publications (2)

Publication Number Publication Date
TW200814277A TW200814277A (en) 2008-03-16
TWI349990B true TWI349990B (en) 2011-10-01

Family

ID=38846532

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123328A TWI349990B (en) 2006-06-29 2007-06-27 Shielded via

Country Status (4)

Country Link
US (1) US7781889B2 (zh)
CN (1) CN101455129B (zh)
TW (1) TWI349990B (zh)
WO (1) WO2008003021A2 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069020A1 (en) * 2007-11-27 2009-06-04 Nxp B.V. Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
CN101945537A (zh) * 2009-07-10 2011-01-12 英华达(上海)电子有限公司 一种具有过孔结构的印刷电路板及其制造方法
CN102480838A (zh) * 2010-11-24 2012-05-30 鸿富锦精密工业（深圳）有限公司 设有复合式过孔的印刷电路板
US9406587B2 (en) * 2012-06-26 2016-08-02 Intel Corporation Substrate conductor structure and method
CN104519658B (zh) * 2013-09-30 2017-09-29 北大方正集团有限公司 一种电路板跳层盲孔的制作方法及电路板
US9666544B2 (en) 2015-06-02 2017-05-30 Sarcina Technology LLC Package substrate differential impedance optimization for 25 GBPS and beyond
US10276519B2 (en) 2015-06-02 2019-04-30 Sarcina Technology LLC Package substrate differential impedance optimization for 25 to 60 Gbps and beyond
US10410984B1 (en) 2015-06-02 2019-09-10 Sarcina Technology LLC Package substrate differential impedance optimization for 25 to 60 GBPS and beyond
CN105517372A (zh) * 2016-01-01 2016-04-20 广州兴森快捷电路科技有限公司 同轴单端过孔的制作方法以及阻抗的计算方法
CN105472907A (zh) * 2016-01-01 2016-04-06 广州兴森快捷电路科技有限公司 屏蔽式差分过孔的制作方法以及阻抗计算方法
US10231325B1 (en) 2016-12-20 2019-03-12 Juniper Networks, Inc. Placement of vias in printed circuit board circuits
US10405418B2 (en) 2016-12-21 2019-09-03 Industrial Technology Research Institute Differential signal transmitting circuit board
CN107318221A (zh) * 2017-08-25 2017-11-03 郑州云海信息技术有限公司 一种过孔及其制造方法和印制电路板
CN107969065B (zh) * 2017-11-02 2020-12-08 四川九洲电器集团有限责任公司 一种印刷电路板
CN108541139B (zh) * 2018-03-31 2020-04-17 深圳市实锐泰科技有限公司 一种pcb导通孔制作方法及pcb
CN110958757B (zh) * 2018-09-26 2023-01-20 中兴通讯股份有限公司 电路板及信号串扰抑制方法、存储介质、电子装置
US11564316B2 (en) 2018-11-29 2023-01-24 Lockheed Martin Corporation Apparatus and method for impedance balancing of long radio frequency (RF) via

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4924236A (en) * 1987-11-03 1990-05-08 Raytheon Company Patch radiator element with microstrip balian circuit providing double-tuned impedance matching
GB2237451B (en) * 1989-10-14 1993-04-28 Stc Plc Multilayer through hole connections
US5039965A (en) * 1990-08-24 1991-08-13 Motorola, Inc. Radio frequency filter feedthrough structure for multilayer circuit boards
US5421083A (en) * 1994-04-01 1995-06-06 Motorola, Inc. Method of manufacturing a circuit carrying substrate having coaxial via holes
US5774340A (en) * 1996-08-28 1998-06-30 International Business Machines Corporation Planar redistribution structure and printed wiring device
KR19980044871A (ko) * 1996-12-09 1998-09-15 김영귀 휠너트 분리장치
US5949030A (en) * 1997-11-14 1999-09-07 International Business Machines Corporation Vias and method for making the same in organic board and chip carriers
US6388206B2 (en) * 1998-10-29 2002-05-14 Agilent Technologies, Inc. Microcircuit shielded, controlled impedance “Gatling gun”via
TW525417B (en) 2000-08-11 2003-03-21 Ind Tech Res Inst Composite through hole structure
US6605551B2 (en) * 2000-12-08 2003-08-12 Intel Corporation Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
US6617526B2 (en) * 2001-04-23 2003-09-09 Lockheed Martin Corporation UHF ground interconnects
US7230318B2 (en) * 2003-12-24 2007-06-12 Agency For Science, Technology And Research RF and MMIC stackable micro-modules
US20060091495A1 (en) * 2004-10-29 2006-05-04 Palanduz Cengiz A Ceramic thin film on base metal electrode
US20060237227A1 (en) * 2005-04-26 2006-10-26 Shiyou Zhao Circuit board via structure for high speed signaling
US7361994B2 (en) * 2005-09-30 2008-04-22 Intel Corporation System to control signal line capacitance
US7892972B2 (en) * 2006-02-03 2011-02-22 Micron Technology, Inc. Methods for fabricating and filling conductive vias and conductive vias so formed
TWI272886B (en) * 2006-02-27 2007-02-01 Advanced Semiconductor Eng Substrate with multi-layer PTH and method for forming the multi-layer PTH
US20090200682A1 (en) * 2008-02-08 2009-08-13 Broadcom Corporation Via in via circuit board structure

Also Published As

Publication number Publication date
US7781889B2 (en) 2010-08-24
US20080001286A1 (en) 2008-01-03
WO2008003021A3 (en) 2008-02-21
CN101455129B (zh) 2012-06-13
TW200814277A (en) 2008-03-16
CN101455129A (zh) 2009-06-10
WO2008003021A2 (en) 2008-01-03

Similar Documents

Publication Publication Date Title
TWI349990B (en) Shielded via
HK1136877A1 (en) Sports-specific shield
DE602007002700D1 (en) Interventionsfreies frac-system
EP2078282A4 (en) ELECTRONIC COUPONS
EP2033216A4 (en) ELEKTROADHÄSION
DE602007008085D1 (en) Dihydropyrazolopyrimidinonderivate
DE602007014031D1 (en) Luftreifensatz
DE602007002070D1 (en) 2-pyrazincarboxamidderivate
DE602007003855D1 (en) Isothermer reaktor
EP1983992A4 (en) 2-IMINO-BENZIMIDAZOLES
DE602007001601D1 (en) Glasuntersuchung
DE602007006989D1 (en) Spiropiperidinderivate
ZA200807349B (en) Thiazolyl-dihydroquinazolines
AP2008004724A0 (en) Substituted1-yl)-azolin-2-aryl-1-hetaryl-ethane
DE602007011622D1 (en) Penem-prodrugs
EP2084019A4 (en) PAINT SCRAPER
EP2024567A4 (en) TONTAPETE
EP2007388A4 (en) OPIOPATHIEN
GB2437173B (en) Electrical-cable shielding
DK1989111T3 (en) Satellitluftbremseapparat
EP1974618A4 (en) UNDERWEAR
GB0615248D0 (en) Adaptable shield unit
GB0617223D0 (en) Complex
DE502007001126D1 (en) Eiten
GB0621955D0 (en) Electrical-cable shielding

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees