TWI349397B - Printed circuit board unit and socket - Google Patents

Printed circuit board unit and socket

Info

Publication number
TWI349397B
TWI349397B TW096139835A TW96139835A TWI349397B TW I349397 B TWI349397 B TW I349397B TW 096139835 A TW096139835 A TW 096139835A TW 96139835 A TW96139835 A TW 96139835A TW I349397 B TWI349397 B TW I349397B
Authority
TW
Taiwan
Prior art keywords
socket
circuit board
printed circuit
board unit
unit
Prior art date
Application number
TW096139835A
Other languages
English (en)
Other versions
TW200919832A (en
Inventor
Akira Tamura
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200919832A publication Critical patent/TW200919832A/zh
Application granted granted Critical
Publication of TWI349397B publication Critical patent/TWI349397B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
TW096139835A 2007-10-24 2007-10-24 Printed circuit board unit and socket TWI349397B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/070712 WO2009054053A1 (ja) 2007-10-24 2007-10-24 プリント基板ユニットおよびソケット

Publications (2)

Publication Number Publication Date
TW200919832A TW200919832A (en) 2009-05-01
TWI349397B true TWI349397B (en) 2011-09-21

Family

ID=40579163

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139835A TWI349397B (en) 2007-10-24 2007-10-24 Printed circuit board unit and socket

Country Status (5)

Country Link
US (1) US7980861B2 (zh)
JP (1) JP4985779B2 (zh)
CN (1) CN101836513B (zh)
TW (1) TWI349397B (zh)
WO (1) WO2009054053A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM377746U (en) * 2009-09-30 2010-04-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP5564328B2 (ja) * 2010-05-19 2014-07-30 新光電気工業株式会社 ソケット
JP5960383B2 (ja) 2010-06-01 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー 接触子ホルダ
JP2012078222A (ja) * 2010-10-01 2012-04-19 Fujifilm Corp 回路基板接続構造体および回路基板の接続方法
JP6157047B2 (ja) * 2011-02-01 2017-07-05 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
US8808009B2 (en) * 2012-04-02 2014-08-19 Tyco Electronics Corporation Electrical interconnect device
JP6003270B2 (ja) * 2012-06-14 2016-10-05 富士通株式会社 電子機器、および、電子機器の製造方法
US9818669B2 (en) * 2014-08-06 2017-11-14 Honeywell International Inc. Printed circuit board assembly including conductive heat transfer
JP6421491B2 (ja) * 2014-08-13 2018-11-14 富士通株式会社 電子機器
ES2688029T3 (es) * 2015-03-27 2018-10-30 Franke Technology And Trademark Ltd Sistema de tratamiento de aire de extracción
US20220149555A1 (en) * 2018-12-31 2022-05-12 Micro Friend Co., Ltd Contactor block of self-aligning vertical probe card and manufacturing method therefor
US20220102889A1 (en) * 2020-09-25 2022-03-31 Intel Corporation Compression mounted technology (cmt) socket system retention mechanisms designs for shipping reliability risk mitigation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968187A (ja) 1982-10-13 1984-04-18 富士通株式会社 端子構造
GB9027858D0 (en) * 1990-12-21 1991-02-13 Amp Holland Stamped and formed electrical tab
JP2857838B2 (ja) * 1994-12-01 1999-02-17 日本航空電子工業株式会社 パッケージ用ソケットコネクタ
JPH08250242A (ja) 1995-03-10 1996-09-27 Hosiden Corp フローティング式コネクタ
JP3323449B2 (ja) * 1998-11-18 2002-09-09 日本碍子株式会社 半導体用ソケット
WO2003007435A1 (fr) * 2001-07-13 2003-01-23 Nhk Spring Co., Ltd. Contacteur
JP4162142B2 (ja) * 2004-01-30 2008-10-08 ヒロセ電機株式会社 中間電気コネクタ装置及びその接続構造
KR20060016726A (ko) 2004-08-18 2006-02-22 에스에무케이 가부시키가이샤 커넥터
JP4886997B2 (ja) * 2005-04-06 2012-02-29 株式会社エンプラス 電気部品用ソケット

Also Published As

Publication number Publication date
CN101836513A (zh) 2010-09-15
CN101836513B (zh) 2013-01-23
US7980861B2 (en) 2011-07-19
JPWO2009054053A1 (ja) 2011-03-03
JP4985779B2 (ja) 2012-07-25
WO2009054053A1 (ja) 2009-04-30
US20100200280A1 (en) 2010-08-12
TW200919832A (en) 2009-05-01

Similar Documents

Publication Publication Date Title
TWI349397B (en) Printed circuit board unit and socket
GB2453083B (en) Printed circuit boards
TWI341167B (en) Printed circuit board unit and electronic apparatus
EP2034554A4 (en) PCB PLATE CONNECTOR AND INJECTION DEVICE
GB2469242B (en) Insulating aperture in printed circuit boards
TWI369164B (en) Electromagnetic bandgap structure and printed circuit board
TWI368357B (en) Plug-type printed circuit board connector
TWI315658B (en) Warp-proof circuit board structure
TWI372008B (en) Printed circuit board
EP1887845A4 (en) CIRCUIT BOARD
EP1863326A4 (en) CIRCUIT BOARD
TWI370710B (en) Electromagnetic bandgap structure and printed circuit board
EP2080057A4 (en) LIGHTING DEVICE, BACKLIGHT UNIT, AND CIRCUIT BOARD ASSOCIATED WITH THE SAME
EP2007180A4 (en) PCB, ELECTRONIC CIRCUIT ARRANGEMENT AND DISPLAY
EP2218143A4 (en) ELECTRICAL CONNECTOR FOR A FLEXIBLE CONDUCTOR PLATE
EP1975948A4 (en) CONDUCTIVE PASTE AND CONNECTION BOARD USING THE SAME
TWI351209B (en) Electronic apparatus and flexible printed circuit board thereof
EP2007176A4 (en) CIRCUIT BOARD AND CONNECTING SUBSTRATE
EP2091307A4 (en) PCB CONNECTING STRUCTURE AND PCB
GB0806424D0 (en) Quasi-waveguide printed circuit board structure
GB0815096D0 (en) Printed circuit boards
GB0808869D0 (en) Printed circuit board including anti-countefeiting means
TWI373293B (en) Printed circuit board and fabrication method thereof
TWI367058B (en) Circuit board
TWI368469B (en) Printed circuit board and method for manufacturing the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees