TWI349164B - Positive photoresist composition for forming thick resist film, thick resist laminate and method for forming resist pattern - Google Patents

Positive photoresist composition for forming thick resist film, thick resist laminate and method for forming resist pattern

Info

Publication number
TWI349164B
TWI349164B TW096105110A TW96105110A TWI349164B TW I349164 B TWI349164 B TW I349164B TW 096105110 A TW096105110 A TW 096105110A TW 96105110 A TW96105110 A TW 96105110A TW I349164 B TWI349164 B TW I349164B
Authority
TW
Taiwan
Prior art keywords
forming
thick resist
resist
thick
photoresist composition
Prior art date
Application number
TW096105110A
Other languages
Chinese (zh)
Other versions
TW200745760A (en
Inventor
Hiroshi Shimbori
Masahiro Masujima
Toshihiro Yamaguchi
Sachiko Yoshizawa
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200745760A publication Critical patent/TW200745760A/en
Application granted granted Critical
Publication of TWI349164B publication Critical patent/TWI349164B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
TW096105110A 2006-03-15 2007-02-12 Positive photoresist composition for forming thick resist film, thick resist laminate and method for forming resist pattern TWI349164B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006070927A JP4954576B2 (en) 2006-03-15 2006-03-15 Thick film resist laminate, manufacturing method thereof, and resist pattern forming method

Publications (2)

Publication Number Publication Date
TW200745760A TW200745760A (en) 2007-12-16
TWI349164B true TWI349164B (en) 2011-09-21

Family

ID=38522290

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105110A TWI349164B (en) 2006-03-15 2007-02-12 Positive photoresist composition for forming thick resist film, thick resist laminate and method for forming resist pattern

Country Status (3)

Country Link
JP (1) JP4954576B2 (en)
TW (1) TWI349164B (en)
WO (1) WO2007108253A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018061512A1 (en) * 2016-09-30 2019-06-24 富士フイルム株式会社 Method of forming a pattern, method of manufacturing an electronic device, and actinic ray-sensitive or radiation-sensitive composition
SG11201900622UA (en) 2016-10-12 2019-04-29 Ridgefield Acquisition Chemically amplified positive photoresist composition and pattern forming method using same
CN110914757B (en) 2017-08-31 2023-12-22 富士胶片株式会社 Photosensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing solid-state imaging element
KR20200036899A (en) 2017-09-29 2020-04-07 후지필름 가부시키가이샤 Pattern formation method, ion implantation method, manufacturing method of solid-state imaging element, multilayer resist film, actinic ray-sensitive or radiation-sensitive resin composition
WO2021199823A1 (en) 2020-03-30 2021-10-07 富士フイルム株式会社 Method for manufacturing actinic ray-sensitive or radiation-sensitive resin composition, pattern formation method, and method for manufacturing electronic device
KR20240014535A (en) * 2021-05-28 2024-02-01 메르크 파텐트 게엠베하 Thick film resist composition and method for producing a resist film using the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3798552B2 (en) * 1998-04-23 2006-07-19 東京応化工業株式会社 Chemically amplified photoresist
JP3934816B2 (en) * 1999-03-18 2007-06-20 東京応化工業株式会社 Defect suppression positive resist coating solution
JP3929648B2 (en) * 1999-07-26 2007-06-13 富士フイルム株式会社 Positive photoresist composition for deep ultraviolet exposure
JP3963624B2 (en) * 1999-12-22 2007-08-22 富士フイルム株式会社 Positive photoresist composition for deep ultraviolet exposure
JP4310028B2 (en) * 2000-06-12 2009-08-05 富士フイルム株式会社 Positive photoresist composition and pattern forming method using the same
JP3963724B2 (en) * 2002-01-10 2007-08-22 ダイセル化学工業株式会社 Method for producing polymer compound for photoresist and resin composition for photoresist
JP2005091433A (en) * 2003-09-12 2005-04-07 Mitsui Chemicals Inc Positive photosensitive resin composition and its use
JP4549911B2 (en) * 2004-03-31 2010-09-22 東京応化工業株式会社 Positive resist composition for lift-off
JP4545500B2 (en) * 2004-07-01 2010-09-15 東京応化工業株式会社 Chemically amplified resist composition and resist pattern forming method

Also Published As

Publication number Publication date
JP2007248727A (en) 2007-09-27
WO2007108253A1 (en) 2007-09-27
TW200745760A (en) 2007-12-16
JP4954576B2 (en) 2012-06-20

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