TWI348538B - Method for measurement of straightness of metallic wire and measuring equipment of same - Google Patents
Method for measurement of straightness of metallic wire and measuring equipment of sameInfo
- Publication number
- TWI348538B TWI348538B TW096146410A TW96146410A TWI348538B TW I348538 B TWI348538 B TW I348538B TW 096146410 A TW096146410 A TW 096146410A TW 96146410 A TW96146410 A TW 96146410A TW I348538 B TWI348538 B TW I348538B
- Authority
- TW
- Taiwan
- Prior art keywords
- straightness
- measurement
- same
- measuring equipment
- metallic wire
- Prior art date
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/012—Semiconductor purity grades
- H01L2924/01204—4N purity grades, i.e. 99.99%
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006335034A JP4050772B1 (ja) | 2006-12-12 | 2006-12-12 | 金属細線の真直性の測定方法及び測定装置 |
Publications (2)
Publication Number | Publication Date |
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TW200825370A TW200825370A (en) | 2008-06-16 |
TWI348538B true TWI348538B (en) | 2011-09-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW096146410A TWI348538B (en) | 2006-12-12 | 2007-12-05 | Method for measurement of straightness of metallic wire and measuring equipment of same |
Country Status (5)
Country | Link |
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JP (1) | JP4050772B1 (zh) |
CN (1) | CN101201242B (zh) |
MY (1) | MY144721A (zh) |
SG (1) | SG144047A1 (zh) |
TW (1) | TWI348538B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101748582B1 (ko) | 2016-05-13 | 2017-06-21 | 크루셜머신즈 주식회사 | 프로브핀의 직진도 검사 장치 및 방법 |
CN109099845B (zh) * | 2018-07-06 | 2020-07-10 | 江西洪都航空工业集团有限责任公司 | 一种高速摄影测量三维位移的方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4147923B2 (ja) * | 2002-12-03 | 2008-09-10 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
-
2006
- 2006-12-12 JP JP2006335034A patent/JP4050772B1/ja not_active Expired - Fee Related
-
2007
- 2007-12-05 TW TW096146410A patent/TWI348538B/zh not_active IP Right Cessation
- 2007-12-06 SG SG200718388-2A patent/SG144047A1/en unknown
- 2007-12-10 MY MYPI20072208A patent/MY144721A/en unknown
- 2007-12-11 CN CN2007101989800A patent/CN101201242B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101201242A (zh) | 2008-06-18 |
MY144721A (en) | 2011-10-31 |
JP4050772B1 (ja) | 2008-02-20 |
JP2008147523A (ja) | 2008-06-26 |
SG144047A1 (en) | 2008-07-29 |
TW200825370A (en) | 2008-06-16 |
CN101201242B (zh) | 2010-06-02 |
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