TWI348077B - A method and apparatus for immersion lithography - Google Patents

A method and apparatus for immersion lithography

Info

Publication number
TWI348077B
TWI348077B TW095136760A TW95136760A TWI348077B TW I348077 B TWI348077 B TW I348077B TW 095136760 A TW095136760 A TW 095136760A TW 95136760 A TW95136760 A TW 95136760A TW I348077 B TWI348077 B TW I348077B
Authority
TW
Taiwan
Prior art keywords
immersion lithography
lithography
immersion
Prior art date
Application number
TW095136760A
Other languages
English (en)
Other versions
TW200715070A (en
Inventor
Ching Yu Chang
Chin Hsiang Lin
Burnjeng Lin
Dingchung Lu
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200715070A publication Critical patent/TW200715070A/zh
Application granted granted Critical
Publication of TWI348077B publication Critical patent/TWI348077B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095136760A 2005-10-14 2006-10-03 A method and apparatus for immersion lithography TWI348077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/251,330 US7420188B2 (en) 2005-10-14 2005-10-14 Exposure method and apparatus for immersion lithography

Publications (2)

Publication Number Publication Date
TW200715070A TW200715070A (en) 2007-04-16
TWI348077B true TWI348077B (en) 2011-09-01

Family

ID=37947309

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136760A TWI348077B (en) 2005-10-14 2006-10-03 A method and apparatus for immersion lithography

Country Status (6)

Country Link
US (1) US7420188B2 (zh)
JP (1) JP4642726B2 (zh)
KR (1) KR100823633B1 (zh)
CN (1) CN1949082B (zh)
NL (1) NL1032675C2 (zh)
TW (1) TWI348077B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10418316B1 (en) 2018-04-04 2019-09-17 Advanced Semiconductor Engineering, Inc. Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5125505B2 (ja) * 2005-04-25 2013-01-23 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
NL1036187A1 (nl) * 2007-12-03 2009-06-04 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5482784B2 (ja) 2009-03-10 2014-05-07 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
WO2011155529A1 (ja) * 2010-06-10 2011-12-15 株式会社ニコン 計測部材、ステージ装置、露光装置、露光方法、及びデバイス製造方法
US8937703B2 (en) * 2010-07-14 2015-01-20 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
JP5740287B2 (ja) * 2011-11-09 2015-06-24 富士フイルム株式会社 パターン形成方法、及び、電子デバイスの製造方法
CN104181776B (zh) * 2014-07-28 2016-04-13 浙江大学 浸没式光刻机流体控制系统的模块化工作流程控制方法
US9588446B2 (en) 2015-05-29 2017-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Calibration apparatus and an adjustment method for a lithography apparatus
CN109690406A (zh) * 2016-09-09 2019-04-26 Asml控股股份有限公司 光刻设备和支撑结构背景
CN110231725B (zh) * 2019-05-20 2022-03-08 深圳市华星光电半导体显示技术有限公司 一种微影玻璃薄化的方法及其控制系统
WO2021094057A1 (en) * 2019-11-14 2021-05-20 Asml Netherlands B.V. Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
US6507474B1 (en) * 2000-06-19 2003-01-14 Advanced Micro Devices, Inc. Using localized ionizer to reduce electrostatic charge from wafer and mask
JP2005101498A (ja) * 2003-03-04 2005-04-14 Tokyo Ohka Kogyo Co Ltd 液浸露光プロセス用浸漬液および該浸漬液を用いたレジストパターン形成方法
US7317504B2 (en) * 2004-04-08 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI245163B (en) * 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
KR101443001B1 (ko) * 2003-09-29 2014-09-22 가부시키가이샤 니콘 투영 노광 장치, 투영 노광 방법 및 디바이스 제조 방법
JP4323946B2 (ja) * 2003-12-19 2009-09-02 キヤノン株式会社 露光装置
US7304715B2 (en) * 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7327439B2 (en) * 2004-11-16 2008-02-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101220613B1 (ko) * 2004-12-01 2013-01-18 가부시키가이샤 니콘 스테이지 장치 및 노광 장치
SG155256A1 (en) * 2005-02-10 2009-09-30 Asml Netherlands Bv Immersion liquid, exposure apparatus, and exposure process
US7291569B2 (en) * 2005-06-29 2007-11-06 Infineon Technologies Ag Fluids for immersion lithography systems

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10418316B1 (en) 2018-04-04 2019-09-17 Advanced Semiconductor Engineering, Inc. Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
US20070085034A1 (en) 2007-04-19
JP4642726B2 (ja) 2011-03-02
NL1032675C2 (nl) 2008-05-27
CN1949082A (zh) 2007-04-18
KR100823633B1 (ko) 2008-04-21
NL1032675A1 (nl) 2007-04-17
CN1949082B (zh) 2012-03-28
TW200715070A (en) 2007-04-16
US7420188B2 (en) 2008-09-02
JP2007165852A (ja) 2007-06-28
KR20070041352A (ko) 2007-04-18

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees