TWI347873B - Polishing pad with reduced stress window - Google Patents

Polishing pad with reduced stress window

Info

Publication number
TWI347873B
TWI347873B TW094115831A TW94115831A TWI347873B TW I347873 B TWI347873 B TW I347873B TW 094115831 A TW094115831 A TW 094115831A TW 94115831 A TW94115831 A TW 94115831A TW I347873 B TWI347873 B TW I347873B
Authority
TW
Taiwan
Prior art keywords
polishing pad
reduced stress
stress window
window
reduced
Prior art date
Application number
TW094115831A
Other languages
English (en)
Other versions
TW200539987A (en
Inventor
Kyle W David
Robert T Gamble
Leslie A Haschak
George E Lamborn Iii
Jason M Lawhorn
John V H Roberts
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200539987A publication Critical patent/TW200539987A/zh
Application granted granted Critical
Publication of TWI347873B publication Critical patent/TWI347873B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW094115831A 2004-06-10 2005-05-16 Polishing pad with reduced stress window TWI347873B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/865,121 US7018581B2 (en) 2004-06-10 2004-06-10 Method of forming a polishing pad with reduced stress window

Publications (2)

Publication Number Publication Date
TW200539987A TW200539987A (en) 2005-12-16
TWI347873B true TWI347873B (en) 2011-09-01

Family

ID=35459706

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115831A TWI347873B (en) 2004-06-10 2005-05-16 Polishing pad with reduced stress window

Country Status (3)

Country Link
US (1) US7018581B2 (zh)
JP (1) JP4834887B2 (zh)
TW (1) TWI347873B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804493B (zh) * 2017-04-19 2023-06-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 脂族聚胺基甲酸酯光學終點偵測窗口及含其之cmp拋光墊

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
KR100949560B1 (ko) 2005-05-17 2010-03-25 도요 고무 고교 가부시키가이샤 연마 패드
US20060291530A1 (en) * 2005-06-23 2006-12-28 Alexander Tregub Treatment of CMP pad window to improve transmittance
US8129278B2 (en) * 2005-11-14 2012-03-06 United Microelectronics Corp. Chemical mechanical polishing process
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5078000B2 (ja) * 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP4968912B2 (ja) * 2007-03-30 2012-07-04 東洋ゴム工業株式会社 研磨パッドの製造方法
US20090137187A1 (en) * 2007-11-21 2009-05-28 Chien-Min Sung Diagnostic Methods During CMP Pad Dressing and Associated Systems
US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
TWI396602B (zh) 2009-12-31 2013-05-21 Iv Technologies Co Ltd 具有偵測窗之研磨墊的製造方法及具有偵測窗之研磨墊
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
KR101942100B1 (ko) * 2010-07-07 2019-01-24 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 저결함성 창을 갖는 화학 기계 연마 패드
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8257545B2 (en) * 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
JP5732354B2 (ja) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
TWI593511B (zh) * 2016-06-08 2017-08-01 智勝科技股份有限公司 研磨墊及研磨方法
US10207388B2 (en) * 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
CN115029786B (zh) * 2022-06-24 2024-04-30 云南北方光学科技有限公司 一种红外用薄形硅窗口的加工方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
EP1224060B1 (en) * 1999-09-29 2004-06-23 Rodel Holdings, Inc. Polishing pad
JP2002212551A (ja) * 2001-01-23 2002-07-31 Fuji Photo Film Co Ltd 輝尽性蛍光体の製造方法
US6623331B2 (en) 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
EP1252973B1 (en) * 2001-04-25 2008-09-10 JSR Corporation Polishing pad for a semiconductor wafer which has light transmitting properties
JP3826728B2 (ja) * 2001-04-25 2006-09-27 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
US6702866B2 (en) * 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US6875077B2 (en) 2002-03-18 2005-04-05 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US20030207661A1 (en) * 2002-05-01 2003-11-06 Alexander Tregub Annealing of CMP polishing pads
US6752690B1 (en) * 2002-06-12 2004-06-22 Clinton O. Fruitman Method of making polishing pad for planarization of semiconductor wafers
US6806100B1 (en) * 2002-12-24 2004-10-19 Lam Research Corporation Molded end point detection window for chemical mechanical planarization
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804493B (zh) * 2017-04-19 2023-06-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 脂族聚胺基甲酸酯光學終點偵測窗口及含其之cmp拋光墊

Also Published As

Publication number Publication date
TW200539987A (en) 2005-12-16
US20050275135A1 (en) 2005-12-15
US7018581B2 (en) 2006-03-28
JP2005354077A (ja) 2005-12-22
JP4834887B2 (ja) 2011-12-14

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