TWI347644B - Flip-chip bonding process - Google Patents

Flip-chip bonding process

Info

Publication number
TWI347644B
TWI347644B TW096129151A TW96129151A TWI347644B TW I347644 B TWI347644 B TW I347644B TW 096129151 A TW096129151 A TW 096129151A TW 96129151 A TW96129151 A TW 96129151A TW I347644 B TWI347644 B TW I347644B
Authority
TW
Taiwan
Prior art keywords
flip
bonding process
chip bonding
chip
bonding
Prior art date
Application number
TW096129151A
Other languages
Chinese (zh)
Other versions
TW200908171A (en
Inventor
Chau Chin Yang
Yu Wen Chen
Ryan Huang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW096129151A priority Critical patent/TWI347644B/en
Publication of TW200908171A publication Critical patent/TW200908171A/en
Application granted granted Critical
Publication of TWI347644B publication Critical patent/TWI347644B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
TW096129151A 2007-08-08 2007-08-08 Flip-chip bonding process TWI347644B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096129151A TWI347644B (en) 2007-08-08 2007-08-08 Flip-chip bonding process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096129151A TWI347644B (en) 2007-08-08 2007-08-08 Flip-chip bonding process

Publications (2)

Publication Number Publication Date
TW200908171A TW200908171A (en) 2009-02-16
TWI347644B true TWI347644B (en) 2011-08-21

Family

ID=44723600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096129151A TWI347644B (en) 2007-08-08 2007-08-08 Flip-chip bonding process

Country Status (1)

Country Link
TW (1) TWI347644B (en)

Also Published As

Publication number Publication date
TW200908171A (en) 2009-02-16

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