TWI346524B - Method for fabricating heat-dissipating base structure - Google Patents

Method for fabricating heat-dissipating base structure

Info

Publication number
TWI346524B
TWI346524B TW096115812A TW96115812A TWI346524B TW I346524 B TWI346524 B TW I346524B TW 096115812 A TW096115812 A TW 096115812A TW 96115812 A TW96115812 A TW 96115812A TW I346524 B TWI346524 B TW I346524B
Authority
TW
Taiwan
Prior art keywords
base structure
dissipating base
fabricating heat
fabricating
heat
Prior art date
Application number
TW096115812A
Other languages
Chinese (zh)
Other versions
TW200845876A (en
Inventor
Pai Yi Huang
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW096115812A priority Critical patent/TWI346524B/en
Publication of TW200845876A publication Critical patent/TW200845876A/en
Application granted granted Critical
Publication of TWI346524B publication Critical patent/TWI346524B/en

Links

TW096115812A 2007-05-04 2007-05-04 Method for fabricating heat-dissipating base structure TWI346524B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096115812A TWI346524B (en) 2007-05-04 2007-05-04 Method for fabricating heat-dissipating base structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096115812A TWI346524B (en) 2007-05-04 2007-05-04 Method for fabricating heat-dissipating base structure

Publications (2)

Publication Number Publication Date
TW200845876A TW200845876A (en) 2008-11-16
TWI346524B true TWI346524B (en) 2011-08-01

Family

ID=44822966

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096115812A TWI346524B (en) 2007-05-04 2007-05-04 Method for fabricating heat-dissipating base structure

Country Status (1)

Country Link
TW (1) TWI346524B (en)

Also Published As

Publication number Publication date
TW200845876A (en) 2008-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees