TWI346354B - Device and method for liquid treating disc-like articles - Google Patents

Device and method for liquid treating disc-like articles

Info

Publication number
TWI346354B
TWI346354B TW096104431A TW96104431A TWI346354B TW I346354 B TWI346354 B TW I346354B TW 096104431 A TW096104431 A TW 096104431A TW 96104431 A TW96104431 A TW 96104431A TW I346354 B TWI346354 B TW I346354B
Authority
TW
Taiwan
Prior art keywords
articles
liquid treating
treating disc
disc
liquid
Prior art date
Application number
TW096104431A
Other languages
English (en)
Other versions
TW200739709A (en
Inventor
Passegger Thomas
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of TW200739709A publication Critical patent/TW200739709A/zh
Application granted granted Critical
Publication of TWI346354B publication Critical patent/TWI346354B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
TW096104431A 2006-02-28 2007-02-07 Device and method for liquid treating disc-like articles TWI346354B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT3372006 2006-02-28

Publications (2)

Publication Number Publication Date
TW200739709A TW200739709A (en) 2007-10-16
TWI346354B true TWI346354B (en) 2011-08-01

Family

ID=37943621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104431A TWI346354B (en) 2006-02-28 2007-02-07 Device and method for liquid treating disc-like articles

Country Status (7)

Country Link
US (1) US8147618B2 (zh)
EP (1) EP1992008A1 (zh)
JP (1) JP4953472B2 (zh)
KR (1) KR101273604B1 (zh)
CN (1) CN101395698B (zh)
TW (1) TWI346354B (zh)
WO (1) WO2007099021A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5844092B2 (ja) * 2011-08-26 2016-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
NZ628969A (en) * 2012-02-17 2017-03-31 Millennium Pharm Inc Pyrazolopyrimidinyl inhibitors of ubiquitin-activating enzyme
JP5967519B2 (ja) * 2012-03-08 2016-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
US10490426B2 (en) 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles
EP3015434B1 (en) 2014-10-31 2020-06-03 ABS Apparate, Behälter- und Sonderanlagenbau GmbH Cavitation generation mechanism and their use in fermentation and wastewater and sands cleaning processes
KR102447277B1 (ko) * 2017-11-17 2022-09-26 삼성전자주식회사 스핀 코터 및 이를 구비하는 기판처리 장치와 기판처리 시스템
KR20210060259A (ko) 2019-11-18 2021-05-26 엘지전자 주식회사 로봇

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5238500A (en) * 1990-05-15 1993-08-24 Semitool, Inc. Aqueous hydrofluoric and hydrochloric acid vapor processing of semiconductor wafers
JPH08316190A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板処理装置
US6143081A (en) 1996-07-12 2000-11-07 Tokyo Electron Limited Film forming apparatus and method, and film modifying apparatus and method
JP3500050B2 (ja) 1997-09-08 2004-02-23 東京エレクトロン株式会社 不純物除去装置、膜形成方法及び膜形成システム
JP3745140B2 (ja) 1998-03-16 2006-02-15 大日本スクリーン製造株式会社 基板処理装置
JP3717671B2 (ja) 1998-07-23 2005-11-16 大日本スクリーン製造株式会社 基板乾燥装置
JP3616732B2 (ja) * 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
JP3826719B2 (ja) * 2001-03-30 2006-09-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2003145014A (ja) 2001-10-31 2003-05-20 Applied Materials Inc 回転塗布装置
US7118781B1 (en) 2003-04-16 2006-10-10 Cree, Inc. Methods for controlling formation of deposits in a deposition system and deposition methods including the same
JP2005166957A (ja) 2003-12-02 2005-06-23 Ses Co Ltd 基板処理法及び基板処理装置
JP4357943B2 (ja) 2003-12-02 2009-11-04 エス・イー・エス株式会社 基板処理法及び基板処理装置
JP2006066501A (ja) * 2004-08-25 2006-03-09 Tokyo Seimitsu Co Ltd スピン洗浄乾燥装置及びスピン洗浄乾燥方法

Also Published As

Publication number Publication date
CN101395698B (zh) 2010-06-09
JP2009528686A (ja) 2009-08-06
WO2007099021A1 (en) 2007-09-07
CN101395698A (zh) 2009-03-25
KR20090003197A (ko) 2009-01-09
US8147618B2 (en) 2012-04-03
US20090000645A1 (en) 2009-01-01
JP4953472B2 (ja) 2012-06-13
TW200739709A (en) 2007-10-16
KR101273604B1 (ko) 2013-06-11
EP1992008A1 (en) 2008-11-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees