TWI345632B - - Google Patents

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TWI345632B
TWI345632B TW96124536A TW96124536A TWI345632B TW I345632 B TWI345632 B TW I345632B TW 96124536 A TW96124536 A TW 96124536A TW 96124536 A TW96124536 A TW 96124536A TW I345632 B TWI345632 B TW I345632B
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Taiwan
Prior art keywords
light
light source
parallel light
sensing component
impurity
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TW96124536A
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Chinese (zh)
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TW200902956A (en
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Frank Wang
Ist Tseng
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Chroma Ate Inc
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Description

1345632 九、發明說明: 【發明所屬之技術領域】 本發明是關於一種檢測方法及裝置,尤其是一種光感 測元件之污染雜質檢測方法及裝置。 5【先前技術】 光感測元件已經成為絕大部分光學電子設備中不可 或缺的核心,例如數位相機、具攝影功能之行動電話、互 動性電子玩具、條碼讀取機、網路攝影機、保全系統、汽 車電子設備及個人數位助理PDA(Personal Digital i〇 Assistants)等内部配置之 CMOS 元件(Complementary Metal-Oxide Semiconductor,互補性氧化金屬半導體)、 或CCD(電耦合元件),藉由感測光訊號擷取影像、進而判 讀運用。若在光感測元件中之感光晶粒前方出現污染.雜 質,無論是灰塵、封裝表面瑕疵、或封裝表面污染,任何 15影響感光途徑之潔淨度的因素,無疑都將成為限制感測精 密度的重要關卡。 本例中係舉一 CMOS元件為例’為清楚說明該元件 之構件組成關係及封裝過程,請參考圖1之分解圖,所示 虛線箭頭為組合方向。其中’以例如一印刷電路板之電路 20基板10為搭載母體,電路基板10佈設複數接點12作為 搭載應用之電連接接點;電路基板1 〇上設有作為光感測 器16之晶粒;為固定光感測器16,將其以耐熱膠體14 固著於電路基板10,至此已大致完成光感測元件之架構; 然光感測器16極其脆弱,易受外力到傷破壞且受外在環 1345632 境如溼度、污染物影響,故於外側封以—透光封蓋2〇, 讓光線可人射至光感測H 16,並保護所涵蓋腔室内之晶 粒。當然’此處電路基板未必需為硬式電路板亦可為軟 板’甚至僅是可供内部晶粒電性導接至外部之—般基㈣ 可。1345632 IX. Description of the Invention: [Technical Field] The present invention relates to a detecting method and apparatus, and more particularly to a method and apparatus for detecting contaminated impurities of a light sensing element. 5 [Prior Art] Light sensing components have become an indispensable core in most optical electronic devices, such as digital cameras, mobile phones with photography functions, interactive electronic toys, barcode readers, webcams, and security. Internally configured CMOS components (Complementary Metal-Oxide Semiconductor) or CCD (Electrically Coupled Components), such as systems, automotive electronics, and personal digital assistants (PDAs), by sensing optical signals Capture images and read them. If there is contamination or impurities in front of the photosensitive grains in the light sensing element, whether it is dust, package surface defects, or packaging surface contamination, any factor that affects the cleanliness of the photosensitive path will undoubtedly become the limit of sensing precision. Important level. In this example, a CMOS device is taken as an example. To clearly illustrate the component composition relationship and packaging process of the device, please refer to the exploded view of Fig. 1, and the dotted arrow is the combined direction. The substrate 10 of the circuit 20 is, for example, a printed circuit board, and the circuit board 10 is provided with a plurality of contacts 12 as electrical connection contacts for mounting applications; the circuit substrate 1 is provided with a die as the photo sensor 16 For fixing the photo sensor 16, it is fixed on the circuit substrate 10 with the heat-resistant colloid 14, and thus the structure of the photo-sensing element has been substantially completed; however, the photo-sensing device 16 is extremely fragile and vulnerable to external force and damage. The outer ring 1345632 is affected by humidity and pollutants. Therefore, the outer cover is sealed with a light-transmissive cover 2〇, so that the light can be incident on the light sensing H 16, and the crystal grains in the covered chamber are protected. Of course, the circuit substrate here does not have to be a hard circuit board or a soft board, or even a basic base (4) for electrically guiding the inner die to the outside.

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圖2為習知光感測元件基本結構示意圖,亦即圖]之 組合完成圖,各構件組合後構成光感測元件彳,且透光封 a 20與週壁間更形成有一腔體18,通常腔體忉以抽真 二、填膠或充填惰性氣體以維持光感測器16不受氧化。 封裝的過程如熟於此技術領域者所知,均在無塵室内 進订’然#塵室並非真正&「無塵」,i能依無塵室之通 風配置、所能控制之異物量等來區分無塵室的等級,盡量 減少變異因素而已’―般無塵室内需遵守—不攜入(需維 持正壓等)、不發生(需穿工作衣等)、不堆積(需維持清掃 等)及排除(進行換氣動作等),都為使產品受異物影響之不 良率降至最低。 即便已運用自動化生產設備進行製造及封裝作業,並 利用各種^潔手段維持在接近無塵環境中封裝光感測元 件’但百密總有一疏,因操作人員及現實的環境,雜質依 2〇然可能存在於光感測元件之表面及構造中;如圖3所示之 光感測元件1可能遭受污染區域示意圖,依然可能有如工 作人員毛髮之污染物一 22存在於光感測元件]之表面, 或如塵粒之污染物二24留置於光感測器16上方;對光感 測兀件1來說,這種污染直接損及設計效能並影響搭載該 丄:>4:)〇:5:Ζ 感測70件1產品之後續運用;當然,如進行清理動作即 可排除污染物—22,但污染物二24係被封裝於光感測元 件1之内部,無法藉由簡單之清理而移除,並將造成感測 錯誤、影響影像掏取等不良效應。當然,每種設備對光感 5測7C件的精度需求不同,或可接受不同程度的瑕症存在, 亦不必-味剔除所有僅受輕微污染之光感測元件。 八因此,若能提供-種可自動化、有效率且檢測數據可 分別建立並留存運用之光感測㈣之污染雜質檢測方法 及裝置,無疑地,可在檢測階段確實發現前述所顧慮之污 1染影響範圍及程度,不必扼殺所有夾帶雜質之光感測元件 而將其清理或分類運用,應為—最佳解決 【發明内容】 ” 15 因此’本發明之一目的,在提供一種能精確檢測污染 雜貝相對位置之光感測元件污染雜質檢測裝置。 本發明另-目的,在提供一種發揮光感測元件本身感 測性能,簡化檢測設備之光感測元件污染雜質檢測裝置。 20 本發明之再-目的,在提供一種利用複數道相旦立體 角度平行光源在不同時間投射,可確實分辨污染物、亦或 光感測器本身瑕庇之光感測元件之污染雜質檢測裝置。 本發明之又-目的,在提供—種能精確檢測污染雜質 相對位置之光感測元件污染雜質檢測方法。 —本發明之又另-目的’在提供一種可同時讓該元件進 行貫境效能測試之光感測元件污染雜質檢測方法。 本發明之又再-目的,在提供一種檢測迅速且可經由 7 1345632 檢測結果予以進行不良品等級分類之光感測元件之污染 雜質檢測方法。 . 因此,本發明為一種光感測元件之污染雜質檢測梦 置’其中’該光感測元件具有一光感測器、設有複數導接 5該光感測器之接點的電路基板、及與該電路基板共同形成 一包封該光感測器之腔體的透光封蓋,該檢測裝置包含: 一供電性連接該待測光感測元件複數接點的測試座;一供 • 以複數相異立體角度至少部分涵蓋並照射該測試座位置 之平行光源;及一控制該平行光源、並電連接該等接點而 10接收來自該光感測元件檢測訊號之處理裝置;藉此,獲得 污染雜質相對該待測元件之正確位置。 藉由本發明,可巧妙運用平行光作為光源,同時妥善 利用待測之光感;則元件本身的感測功㉟,一方面簡化檢測 a備、降低設備之製造成本,另方面提升檢驗精密度;而 15在處理裝置運算後,立即獲知雜質之所在位置及影響範 圍’當‘然依檢測結果除可以建立該受測元件之專有記錄 外’更可依此將產品做等級的分類,例如清理、剔退、以 其他軟體加以補償、或用於需求精度不同之產品。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效,在 以下配合參考圖式之較佳實施例的詳細說明中,將可清楚 的呈現。 敬請參考圖4,為本發明笛 ^ 货月第一具體貫施例之立體示意 圖,本發明之檢測裝置3合合 匕3供電性連接待測光感測元件 “45632 .硬數接點的測試座4 ; -供以複數相異立體角度至少部分 涵蓋並照射測試座4位置之平行光源5及一控制該平二光 源5並電連接該等接點而接收來自光感測元件^測訊號 之處理裝置6。 5 進一步說明平行光源的相關結構,本實施例中,平行 光源5主要包括一雷射(Laser)元件52(例如雷射二極體, 以下簡稱LD),利用其發光角度極窄、波長單一的特性, 使雷射元件52所發光束在被照射至測試座4前,先行經 一擴散透鏡組54 ,以擴散為一具預定幅照面積、可大致 1〇籠罩待測元件整體之平行光束;且為提供不同的立體照射 角度,檢測裝置3中,更設置有驅動雷射元件52變換位 置之驅動裝置56 » ¥然’如熟悉光學工程領域者可輕易理解,上述L 〇 亦可改採發光二極體(以下簡稱LED);且上述驅動裝置並 15非必須,如圖5本發明第二具體實施例之立體示意圖所 示’檢測裝置3’除同樣包含測試座4’及處理裝置6,外,本 例中之平行光源5’,更包含複數個發光照射方向至少部分 涵蓋測試座4’位置之雷射元件。本實施例中,係採用五組 所發光束方向分別與該測試座4’夾相異立體角度之雷射 20元件52a、52b、52c、52d及52e,並對應配置放大幅照 面的擴散透鏡組54a、54b、54c、54d及54e,以組成平 行光源5、 另如圖6所示為本發明第三具體實施例之立體示意 圖,檢測裝置3n包含與前二實施例相仿的測試座4"、處 1345632 理裝置6”、及提供垂直與偏斜照射角度之平行光源5”, 尤其為說明上述測試座與光源間之立體角度變換之相對 性,本例中平行光源5”之照射位置不變,而檢測裝置3” 則包括一驅動裝置56",藉以驅動測試座4”相對平行光源 5”旋轉運動’使測試座4"可以相異相對立體角度受平行光 源5”之照射。亦即,無論光源運動、測試座運動、或兩者 同時相對運動’只要能達到本發明所需之相對運動即可。2 is a schematic diagram of a basic structure of a conventional light sensing element, that is, a combination of the drawings, the components are combined to form a light sensing element 彳, and a cavity 18 is formed between the light transmitting cover a 20 and the peripheral wall, usually a cavity The body is filled with a second gas, filled or filled with an inert gas to maintain the photosensor 16 from oxidation. The process of encapsulation, as is well known to those skilled in the art, is to be ordered in a clean room. However, the dust chamber is not really & "dust-free", i can be configured according to the ventilation of the clean room, and the amount of foreign matter that can be controlled. Wait to distinguish the level of the clean room, try to reduce the variation factor and have been 'normally clean room to be observed' - do not carry (need to maintain positive pressure, etc.), do not occur (need to wear work clothes, etc.), do not pile up (need to maintain cleaning Etc.) and exclusion (for ventilation, etc.) are to minimize the rate of defects in the product affected by foreign matter. Even if automated manufacturing equipment has been used for manufacturing and packaging operations, and various light-cleaning components are used to maintain the light-sensing components in a near-dust-free environment, but there is always a sparseness, due to the operator and the real environment, the impurities depend on 2〇 However, it may exist in the surface and structure of the light sensing element; as shown in FIG. 3, the light sensing element 1 may be subjected to a schematic diagram of a contaminated area, and there may still be a pollutant such as a worker's hair present in the light sensing element] The surface, or the dust-like contaminant 2 is left above the photo sensor 16; for the photo-sensing element 1, the contamination directly impairs the design performance and affects the carrying of the crucible: >4:)〇 :5:Ζ Sensing the subsequent use of 70 pieces of 1 product; of course, if the cleaning action is carried out, the contaminant-22 can be eliminated, but the contaminant 24 is packaged inside the light sensing element 1 and cannot be simply Removal and removal will cause adverse effects such as sensing errors and image capture. Of course, each device has different requirements for the accuracy of the light sensing 5C, or can accept different degrees of hysteria, and does not need to eliminate all light sensing components that are only slightly contaminated. 8. Therefore, if it is possible to provide a method and a device for detecting contamination impurities that can be automated and efficient, and the test data can be separately established and retained for use in light sensing (4), it is undoubtedly possible to find the aforementioned concerns in the detection stage. To influence the extent and extent of the effect, it is not necessary to kill all the light sensing elements with impurities and clean them up or classify them. It should be - the best solution [invention]] 15 Therefore, one of the objects of the present invention is to provide an accurate detection. The light sensing component polluting impurity detecting device for the relative position of the contaminated shells. The present invention further provides a light detecting component polluting impurity detecting device that simplifies the sensing performance of the light sensing component itself. Further, the present invention provides a contaminant impurity detecting device that can detect a contaminant or a light sensing element that is occluded by a photosensor itself by projecting a plurality of parallel solid-state parallel light sources at different times. The purpose of the present invention is to provide a method for detecting contamination of a light sensing component capable of accurately detecting the relative position of contaminated impurities. Still another object of the present invention is to provide a method for detecting a contaminated impurity of a light sensing element which can simultaneously perform a component performance test. The present invention is again and again aimed at providing a rapid detection and detection via 7 1345632 As a result, a method for detecting a contaminated impurity of a light sensing element classified by a defective product level is provided. Therefore, the present invention is a light sensing element for detecting a contaminated impurity, wherein the light sensing element has a light sensor, a circuit board having a plurality of contacts connecting the photosensors, and a light transmissive cover forming a cavity enclosing the photosensor together with the circuit substrate, the detecting device comprising: a power supply a test socket connecting the plurality of contacts of the light sensing component to be tested; a parallel light source for at least partially covering and illuminating the test seat position by a plurality of different solid angles; and controlling the parallel light source and electrically connecting the contacts And 10 receives the processing device from the photo sensing element detection signal; thereby obtaining the correct position of the contaminating impurity relative to the device to be tested. Parallel light is used as the light source, and the light sense to be measured is properly utilized; then the sensing work 35 of the component itself simplifies the detection of the device, reduces the manufacturing cost of the device, and improves the precision of the inspection; Immediately know where the impurity is located and the scope of influence 'When', depending on the test results, the patent can be used to classify the product, such as cleaning, stripping, and other software. It is to be compensated or used for products with different requirements. [Embodiment] The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments with reference to the drawings. Please refer to FIG. 4 , which is a perspective view of the first specific embodiment of the flute month of the present invention. The detecting device 3 of the present invention is combined with the power supply connection of the light sensing component to be tested “45632 . Hard contact Test stand 4; - a parallel light source 5 for at least partially covering and illuminating the test stand 4 at a plurality of different solid angles, and a control of the flat light source 5 and electrically connecting the same The processing device 6 from the photo sensing element ^ signal is received at a point. 5 further explaining the related structure of the parallel light source. In this embodiment, the parallel light source 5 mainly includes a laser element 52 (for example, a laser diode, hereinafter referred to as LD), and the light-emitting angle is extremely narrow and the wavelength is single. The feature is such that the illuminating beam of the laser element 52 passes through a diffusing lens group 54 before being irradiated to the test pedestal 4 to diffuse into a predetermined illuminating area, which can substantially cover a parallel beam of the entire component to be tested; In order to provide different stereo illumination angles, the detecting device 3 is further provided with a driving device for driving the laser element 52 to change the position. 56. However, as can be easily understood by those skilled in the optical engineering field, the above L 〇 can also be changed to emit light. a diode (hereinafter referred to as LED); and the above-mentioned driving device 15 is not necessary, as shown in the perspective view of the second embodiment of the present invention, the detecting device 3' includes the test stand 4' and the processing device 6, In addition, the parallel light source 5' in this example further includes a plurality of laser elements whose illumination illumination direction at least partially covers the position of the test stand 4'. In this embodiment, five sets of laser 20 elements 52a, 52b, 52c, 52d and 52e respectively having different beam angles from the test stand 4' are used, and the diffusing lens group of the enlarged image surface is correspondingly arranged. 54a, 54b, 54c, 54d, and 54e, to form a parallel light source 5, and FIG. 6 is a perspective view of a third embodiment of the present invention. The detecting device 3n includes a test stand 4" similar to the previous two embodiments; The 1345332 device 6", and the parallel light source 5" providing the vertical and oblique illumination angles, especially to illustrate the relative angle between the test stand and the light source, the position of the parallel light source 5" is unchanged in this example And the detecting device 3" includes a driving device 56", thereby driving the test seat 4" to rotate relative to the parallel light source 5" so that the test socket 4" can be illuminated by the parallel light source 5" at different relative solid angles. Whether the light source is moving, the test seat is moving, or both are relatively moving 'as long as the relative motion required by the present invention is achieved.

1010

圖7顯示入射光照射至作用面後之折射與反射,入射 光原本行經折射率為…的第一介質、並於經過作用面後 進入折射率h的第二介質,當光u於法線fl之垂線位 置由第一介質…入射進第二介質na時,會產生不同程度 的反射光L3及折射光L2,此三道光分別與法線FL夾入 射角為Θ1、反射角Θ3、及折射角θ2;依反射定律,θι = θ^。 進一步,因本發明所檢測對象為光感測元件,其反射 光量微乎其微,可忽略不計,故入射光L彳以h角入射後 絕大部分光能將以I角沿L2方向折射, ηθΐηθρί^ΐηθ2,當…介質為空氣時,〜=1,亦即Figure 7 shows the refraction and reflection after the incident light is irradiated to the active surface. The incident light originally passes through the first medium having a refractive index of ... and enters the second medium having the refractive index h after passing through the active surface, when the light u is at the normal line fl When the vertical line position is incident on the second medium na by the first medium, different degrees of reflected light L3 and refracted light L2 are generated, and the incident angles of the three paths of light with the normal line FL are respectively Θ1, the reflection angle Θ3, and the angle of refraction. Θ2; according to the law of reflection, θι = θ^. Further, since the object to be detected by the present invention is a light sensing element, the amount of reflected light is negligible, so that most of the light energy will be refracted along the L2 direction at the incident angle L 彳, ηθΐηθρί^ΐηθ2. When the medium is air, ~=1, that is,

SinG^r^SinGz。 關於本發明實際的運用流程,圖8a為一光感測元件 20之關鍵結構,透光封蓋20,的厚度為%、光感測器16,與該 透光封蓋之空間厚度為h,在8b、8c、8d中將沿用相同 編號代表透光封蓋20,、光感測器16,與厚度%、值之關 係;圖8a中污染物70之位置在透光封蓋20,上方,大小 為d〇,若將平行光源丨〇以入射角θ=〇亦即垂直於透光封 1345632 蓋20’之方向照射,則在光感測器16’上,污染物中心位置 為x’其影像的寬度亦為d0;在圖8b中,若以另_道平 行光源h以入射角θχ(θχ关0)照射,則污染物的大j 不變,但中心點將落在光感測器16’之X1處,相較於原位 5 置X’相差的位移值為ΔΧ1’利用前述光學定理可以求出. △ XiMUsinexVv^r^-sinqxn+t^tanex··,(式” 其中η為透光封蓋20’的折射率。 # 在圖8c中,污染物74位於透光封蓋20’的下方,若 以一道平行光源11以入射角θχ(θχ关0)照射,則污染物 10 的大小不變,但中心點將落在光感測器16’之X2處,相較 於原位置X,相差的位移值為△ χ2,可得: △ X2=t2*tan0x.._ (式 2) 在圖8d中’污染物76位於光感測器16,的上方,若 以平行光源丨!以入射角θχ(θχ关0)照射,則污染物76的 15大小不變’但中心點將落在光感測器16,之X3處,相較於 鲁 原位置X,中心點不會改變,故位移值 △ Χ3 =0.·.(式 3) 由此,當從光感測器處取得影像資料後,即可判斷其 中心點位移值究竟符合式1、式2、或式3,從而判斷= 20 污染物的所在位置。 當然,以上分析係假設污染物的高度遠小於其截面積 大小,因此將高度的陰影效應忽略不計;但如果污染物的 高度與其大小相當或更大而不可忽略時,則以上狀況都將 產生額外效應’而需要進行如下之進—步討論。 1345632SinG^r^SinGz. Regarding the actual application flow of the present invention, FIG. 8a is a key structure of a light sensing component 20, the transparent cover 20 has a thickness of %, the light sensor 16, and the space thickness of the light-transmissive cover is h, In 8b, 8c, 8d, the same number will be used to represent the relationship between the transparent cover 20, the photosensor 16, and the thickness % and value; the position of the contaminant 70 in Fig. 8a is above the light transmissive cover 20, If the size is d〇, if the parallel light source 照射 is irradiated in the direction perpendicular to the cover of the light-transmissive cover 1345263, the incident center θ=〇, that is, the position of the contaminant center is x' The width of the image is also d0; in Fig. 8b, if the parallel light source h is irradiated with the incident angle θ χ (θ χ off 0), the large j of the contaminant does not change, but the center point will fall on the photo sensor 16 'X1', the displacement value of ΔΧ1' is different from the in-situ 5' X' difference. △ XiMUsinexVv^r^-sinqxn+t^tanex··, (where η is transparent The refractive index of the light-sealing cover 20'. # In Figure 8c, the contaminant 74 is located below the light-transmissive cover 20', if illuminated by a parallel light source 11 at an angle of incidence θ χ (θ χ off 0) , the size of the contaminant 10 does not change, but the center point will fall at the X2 of the photosensor 16'. Compared with the original position X, the displacement value of the phase difference is Δ χ 2, which can be obtained: △ X2 = t2 * tan0x. ._ (Formula 2) In Figure 8d, 'contaminant 76 is located above the light sensor 16, if it is illuminated by a parallel light source 以! at an incident angle θ χ (θ χ off 0), the size of the contaminant 76 is unchanged. 'But the center point will fall at the X3 of the light sensor 16, compared to the Luyuan position X, the center point will not change, so the displacement value △ Χ3 =0.. (Expression 3) Thus, when from the light After obtaining the image data at the sensor, it can be judged whether the displacement value of the center point conforms to Equation 1, Equation 2, or Equation 3, thereby judging the location of the contaminant = 20. Of course, the above analysis assumes that the contaminant is highly distant. Less than the size of its cross-sectional area, so the shadow effect of the height is negligible; but if the height of the contaminant is equal or larger than its size and cannot be ignored, then the above conditions will have additional effects' and need to proceed as follows - 1345632

圖9a為一光感測元件之主要結構示意圖,透光封蓋 2〇”的厚度為%、光感測器16"與該透光封蓋之空間厚戶為 h,在9b、9c中仍將沿用相同編號代表透光封蓋2〇"、光 感測器16”與厚度I、h值之關係;圖9a中污染物8〇之 位置在透光封蓋20”上方’大小為d0且高度為h,當平行 光源丨1以入射角θ = 0亦即垂直於透光封蓋2〇”之方白日„ 射’則在光感測器16”上,污染物中心位置為X,,a •v 、 S 另一 道平行光源丨1以入射角0y(0y关0)照射》污染物8〇的3 像大小為 dM= d〇+h*tan0y.··(式 4) 而中心點將落在光感測器16”之X1,,處,相較於原位 置X’ ’相差的位移值為△ X1 ·,利用光學定理可以求出 Δ Xi-iti^sinGy)//· (n2-sin2ey))+t2*tan0y+h/2*(tan0y). ( ^ 5) " 其中η為透光封蓋20”的折射率,利用式4可得. h = (dM-cl〇)*cotey…(式 6) 至此可以求得污染物之高度h。 而圖9b中污染物82之位置在透光封蓋2〇”下方,大 小為d〇且咼度為h ’若平行光源丨〇'以入射角6=〇之方向 20 照射,則在光感測器16”上,污染物中心位置為X,;另一 平行光源丨1 ’以入射角6y(8y关0)照射,污染物82的影像 大小為叱2= d〇+h*taney...(式7) ’而中心點會落在光或測 器16”之X2”處,與原位置X’相差的位移值 △ X2’=t2*(taney)-h/2*taney··.(式 8) 12 其中η為透光封蓋20"的折射率,利用式7可以計算 h = (dj2-d〇)* cot0y...(式 9) 本例中污染物影像會變大,影像中心偏移量反而變 】利用式9可以求得污染物之高度卜。 5 在圖9c中,污染物84之位置恰在光感測器16”上方, 大小為d〇且高度為h,入射角θ = 0時,在光感測器16" 上,污染物中心位置為Χ,,另一平行光源丨彳I以入射角θ y (θ y 关0)照射,污染物84的影像大小di3=d〇+h*taney (式 1 〇),而影像中心點將落在光感測器16,,之X3”處,與原位 10置X’相差的位移值為 △ x3’ = h/2*taney··.(式 11) η為透光封蓋20”的折射率,利用式1〇求得 h = ( di3- d〇)*cotey...(式 12) 從而求出污染物84之高度h。 利用以上分析可知,如本發明配置之一實用架構,可 :置5個*同方向的平行光源照射,其中一道為垂直照射 光;原’另兩道平行光源為X軸方向,以角度+Θ、-Θ角方 向射,再兩道平行光源為Y軸方向,以角度+Θ、-Θ角 2〇方向照射,此5道平行光源以順序投射,利用光感測器感 0測=得的5張不同的污點影像,利用垂直照射的平行光源 广各個表面污染物的截面大小’再利用X軸方向的兩道 斜…、平仃光源,取得x軸方向的投影影像,後利用丫軸 了向的兩道斜照平行光源,取得Y軸方向的投影影像,便 可以利用二角函數的計算,回推獲得污染物的位置、大小 13 1345632 及南度,進而確認待測光感測元件的品質與受污染範圍。 5 10 15 例如,無論光線如何投射,感測所得始終為單一線型 =,即可確認為光感測器本身贼,亦即實境檢測所欲 界疋之瑕庇品;若推得污染區域在透光封蓋2〇,、2〇”上表 面處,只要清理即可;倘若污染區域在透光封蓋n ;側或光感測器16,、16,’表面而無法清除,就必須依品管 要求分類進行補償、作為次級品使用或剔退為不良品。 本發明之檢測方法可詳述步驟如圖1〇所示:起始步 驟90中需經測試座4致能待測光感測元件,,使盆啟動 感測機能;並於步驟92驅動平行光源5,以例如正上方 之第-默立體角度投射平行光束至待測光感測元件, ^有該透光封蓋20側;隨後,於步驟94驅動平行光源5 肩座相對移動’而以一相異於第一預定立體角度之第 —預定立體角度(例如偏斜X度)投射光束至待測光感測元 件1 ’接續兩次於步驟96以處理裝置6接收來自待測光 _元件1經測試座4傳輸之測得訊號’藉以取得來自相 異立體角度人射光之影像資訊;運用前述公式,於步驟 98處理該等訊號而得污染雜質相對待測光感測元件,之 相對位置。 當然,越多道光源投射,感測而得數據更有助於運算 =斷,至此,已獲得該待測污染元件遭污染區域及程度, 最、、步驟10G即將將污染雜質位於該透光封蓋外者,與污 :雜貝位於该腔體内者加以區別,如表面遭受污染者進行 月冰即可,若内部遭文污染輕微,則依品管要求分類,作 14 1345632 .為人、及°σ或以軟體補償修飾運用,至於測得光感測器損壞 或污染程度嚴重,即進行剔退以排除不良品。 依照上述之方法,可藉由本發明於待測光感測元件進 a測試程序時,啟動元件與生俱來之感測功能,此時即可 5同時進行該光感測元件之實境測試;以平行光源經放大、 投射、折射之步驟,再經由處理裝置之運算,即能讓製造 或封裝過私中乘隙而入之雜質—現形,得知雜質對此待 • 光感測元件影響之程度,採取清理後運用或無法清理但 可應用於其他產品甚至直接剔退之選擇,每一元件得以建 ίο立個別紀錄並物盡其用,因此藉由本發明確實可以有效達 成本案之所有上述目的。 惟以上所述者,僅為本發明之較佳實施例而已,當不 能以此限定本發明實施之範圍,即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾,皆 15應仍屬本發明專利涵蓋之範圍内。 白 【圖式簡單說明】 圖1是習知光感測元件基本結構分解示意圖; 圖2是是1光感測元件基本結構組合示意圖; 20 圖3是光感測元件可能遭受污染區域示意圖; 圖4疋本發明第一具體實施例之立體示意圖; 圖5是本發明第二具體實施例之立體示意圖; 圖6疋本發明第三具體實施例之立體示意圖; 圖7是光學折射與反射原理示意圖; 15 ^45632 圖8a、8b、8c、8d是本發明求取污染物位置示意圖; 圖9a、9b、9c是本發明求取污染物高度示意圖;及 圖1 〇疋本發明檢測方法之運作流程圖。 【主要元件符號說明】Figure 9a is a schematic diagram of the main structure of a light sensing element. The thickness of the light-transmissive cover 2〇 is %, the light sensor 16" is thicker than the space of the light-transmissive cover, and is still in 9b, 9c The same number will be used to represent the relationship between the light-transmissive cover 2〇, “photosensor 16” and the thickness I and h; the position of the contaminant 8〇 in FIG. 9a is above the light-transmissive cover 20”, and the size is d0. And the height is h. When the parallel light source 丨1 is at an incident angle θ = 0, that is, perpendicular to the light-transmitting cover 2 〇", the light is on the light sensor 16", and the center position of the pollutant is X. , a • v , S Another parallel light source 丨 1 is illuminated at an incident angle of 0 y (0 y off 0). The size of the 3 image of the pollutant 8 为 is dM = d 〇 + h * tan 0 y. (Expression 4) and the center The point will fall on the X1 of the photo sensor 16", and the displacement value of the difference from the original position X' ' is Δ X1 ·, and the optical theorem can be used to find Δ Xi-iti^sinGy)//· (n2 -sin2ey))+t2*tan0y+h/2*(tan0y). (^ 5) " where η is the refractive index of the light-transmissive cover 20", which can be obtained using Equation 4. h = (dM-cl〇) *cotey... (Formula 6) The height h of the contaminant can be determined so far. The position of the contaminant 82 in FIG. 9b is below the light-transmissive cover 2〇”, and the size is d〇 and the twist is h′. If the parallel light source 丨〇′ is irradiated in the direction of the incident angle 6=〇, the light is sensed. On the detector 16", the center of the contaminant is X, and the other parallel source 丨1' is illuminated by the incident angle of 6y (8y off 0). The image size of the contaminant 82 is 叱2=d〇+h*taney.. (Expression 7) 'And the center point will fall at X2" of the light or detector 16", and the displacement value △ X2' = t2 * (taney) - h / 2 * taney · ·. (Formula 8) 12 where η is the refractive index of the light-transmissive cover 20", and Equation 7 can be used to calculate h = (dj2-d〇)* cot0y... (Formula 9) In this example, the contaminant image becomes larger, The image center offset is reversed. The height of the contaminant can be obtained by using Equation 9. 5 In Figure 9c, the contaminant 84 is located just above the photosensor 16", the size is d〇 and the height is h. When the incident angle θ = 0, the contaminant center position on the photo sensor 16" For Χ, another parallel light source 丨彳I is illuminated at an incident angle θ y (θ y off 0), and the image size of the contaminant 84 is di3=d〇+h*taney (Formula 1 〇), and the image center point will fall on At the X3" of the photo sensor 16, the displacement value which is different from the in-situ 10 X' is Δx3' = h/2*taney·(.11) η is the refraction of the light-transmissive cover 20" The rate is obtained by using Equation 1 to obtain h = (di3-d〇)*cotey (Expression 12) to determine the height h of the contaminant 84. From the above analysis, it can be seen that, as one of the configurations of the present invention, : Set 5 * parallel light sources in the same direction, one of which is vertical illumination; the original 'the other two parallel light sources are X-axis direction, angle + Θ, - Θ angle direction, then two parallel light sources are Y axis Direction, in the direction of angle + Θ, - Θ angle 2 照射, the five parallel light sources are projected in sequence, using the light sensor sense 0 to measure the 5 different stain images, using the vertical illumination of the parallel light source The cross-sectional size of the surface contaminants is re-used by the two oblique directions in the X-axis direction, and the horizontal light source is used to obtain the projected image in the x-axis direction, and then the two oblique oblique light sources in the direction of the x-axis are used to obtain the Y-axis direction. By projecting the image, you can use the calculation of the two-angle function to push back the position and size of the contaminant 13 1345632 and the south degree, and then confirm the quality and contamination range of the light sensing component to be tested. 5 10 15 For example, no matter how the light is projected The sensory income is always a single line type =, it can be confirmed as a thief of the light sensor itself, that is, the physical detection of the desired boundary; if the contaminated area is pushed in the light-transmissive cover 2, 2 〇" at the upper surface, as long as it can be cleaned; if the contaminated area is on the light-transmissive cover n; side or the light sensor 16, 16, "the surface can not be removed, it must be classified according to quality requirements for compensation, as a secondary The grade is used or rejected as a defective product. The detection method of the present invention can be described in detail as shown in FIG. 1A. In the initial step 90, the test strip 4 is required to enable the light sensing element to be tested, so that the pot starts the sensing function; and in step 92, the parallel light source 5 is driven. Projecting a parallel beam to the light sensing element to be tested, for example, at a first-one-dimensional angle, directly above, with the light-transmissive cover 20 side; then, in step 94, the parallel light source 5 is driven to move relative to each other' Projecting a light beam to the light-measuring sensing element 1 ' at a first predetermined stereo angle (for example, a skewed X degree) is successively performed twice in step 96 to receive the light from the light-measuring element 1 through the test socket 4 The measured signal transmitted 'to obtain image information from different stereoscopic human eyes; using the above formula, the signal is processed in step 98 to obtain the relative position of the contaminated impurity relative to the light sensing component to be tested. Of course, the more the light source is projected, the data obtained by the sensing is more conducive to the operation = break. At this point, the contaminated area and degree of the contaminated component to be tested have been obtained, and most, in step 10G, the contaminated impurity is located in the transparent seal. Cover the outside, and the pollution: the miscellaneous shells are located in the cavity to distinguish, such as the surface of the polluted person to carry out the monthly ice, if the internal text is slightly polluted, according to the quality control requirements classification, for 14 1345632. And ° σ or the use of software compensation modification, as the measured light sensor damage or pollution is serious, that is, to retire to eliminate defective products. According to the above method, the sensing function of the component and the intrinsic sensing function can be activated when the test component of the light sensing component is tested by the present invention. At this time, the physical testing of the optical sensing component can be performed simultaneously; The steps of amplifying, projecting, and refracting the parallel light source, through the operation of the processing device, enable the manufacturing or packaging of the impurities in the private space, the shape, and the extent to which the impurity affects the light sensing component. With the option of cleaning up or not being cleaned but applicable to other products or even directly squeezing, each component can be built and used to the best of its ability, so that the above objects of the present invention can be effectively achieved by the present invention. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All 15 should still be within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic exploded view of a conventional light sensing element; FIG. 2 is a schematic diagram of a basic structure of a light sensing element; 20 FIG. 3 is a schematic view of a light sensing element that may be contaminated; FIG. Figure 3 is a perspective view of a second embodiment of the present invention; Figure 6 is a perspective view of a third embodiment of the present invention; Figure 7 is a schematic diagram of optical refraction and reflection; ^45632 Figures 8a, 8b, 8c, and 8d are schematic views of the position of the present invention for obtaining contaminants; Figures 9a, 9b, and 9c are schematic diagrams showing the height of the contaminant of the present invention; and Figure 1 is a flow chart showing the operation of the detection method of the present invention. [Main component symbol description]

1…光感測元件 12…複數接點 16、16’、16"…光感測器 20、20’、20"…透光封蓋 10…電路基板 14…耐熱膠體 18...腔體 22…污染物— 10 24…污染物二 4、4’、4”··.測試座 52、52a、52b、52c、52d ' 3'1、3”···檢測裝置 5 ' &、5”.··平行光源 52e.·雷射元件 54、54a ' 54b、54c ' 54d、54e…擴散透鏡組 151...light sensing element 12...plural contacts 16,16',16"...light sensor 20,20',20"...transparent cover 10...circuit substrate 14...heat resistant colloid 18...cavity 22 ...contaminant - 10 24...contaminant two 4,4',4"·.. test socket 52, 52a, 52b, 52c, 52d '3'1, 3"···detection device 5 ' &, 5" Parallel light source 52e.·Laser element 54, 54a ' 54b, 54c ' 54d, 54e... diffusion lens group 15

56、56"…驅動裝置 6、6,、6,,··.處理裝置 70、72、74、76、80、82、84··.污染物 θι、θ2、θ3、Θ、θχ、θγ…角度 Πι、门2·..介質 h...高度 L1、L2、L3、l〇、h、|0,、I,…光 FI____法線 d〇、di1、d丨2、di3···寬度 20 X、X,、X2、X3、X,、X!,、x2’、x3,·..位置 I、t2·.·厚度 90〜100··.步驟 1656, 56 "... drive devices 6, 6, 6, 6, ..... processing devices 70, 72, 74, 76, 80, 82, 84.. Contaminants θι, θ2, θ3, Θ, θ χ, θ γ... Angle Πι, door 2·..media h...height L1, L2, L3, l〇, h, |0,, I,... light FI____ normal d〇, di1, d丨2, di3··· Width 20 X, X, X, X3, X, X!, x2', x3, ·.. Position I, t2 ··· Thickness 90~100··. Step 16

Claims (1)

十、申請專利範圍: | 100#· 3月24日修正替換頁 1 · 種光感測元件之污毕雜暂必· ·ΒΙ St _ 朵雜質檢測裝置,其中,該光感測 元件具有一光感測器、 又有複數導接該光感測器之接點 的電路基板、及與該雷路其iC4+n w ^路基板共同形成-包封該光感測 咨之腔體的透光封蓋,該檢測裝置包含: 供電f生連接該待測光感測元件複數接點的測試 座; • 一供以複數相異相對立體角度至少部分涵蓋並照射 該測試座位置之平行光源,該平行光源係為五個 同方向的平行光源,其中一道為垂直照射光 、原另兩道平行光源為X轴方向,以角度+0、·9 角方向照射,再兩道平行光源為Υ軸方向,以角 度+Θ、-Θ角方向照射;及 一控制該平行光源、並電連接該等接點而接收來自 該光感測元件檢測訊號之處理裝置;藉此,獲得 ® 污染雜質相對該待測元件之正確位置。 2·依申請專利範圍第,項所述光感測元件之污染雜質檢測 裝置,其中該平行光源包括一雷射元件。 3.依申請專利範圍第2項所述光感測元件之污染雜質檢測 裝置,其中該平行光源更包括一使該雷射元件所發光束 在被照射至該測試座前,係被擴散為一具大幅照面之平 行光束的擴散透鏡組。 4_依申請專利範圍第2項所述光感測元件之污染雜質檢測 裝置’更包含一驅動該雷射元件變換位置之驅動裝置。 17 1345632 100年3月24日修正替換頁^ 5.依申請專利範圍第1項所述光感測元件之污染雜質檢測 裝置’其中該平行光源包括複數所發光束方向分別與該 測試座夾相異立體角度之發光元件。 6 _依申請專利範圍第1項所述光感測元件之污染雜質檢測 裝置’更包括一驅動該測試座相對該平行光源運動,致 使該平行光源係可以至少二相異相對立體角度照射至該 測試座之驅動裝置。 7. —種光感測元件之污染雜質檢測方法,係利用一檢測裝 ' ! 置檢測位於該光感測元件處之污染雜質,其中,該光感 測元件具有一光感測器、設有複數導接該光感測器之接 點的電路基板、及與該電路基板共同形成一包封該光感 測器之腔體的透光封蓋,且該檢測裝置包含:一供電性 連接該待測光感測元件複數接點的測試座、一組五個不 同方向的平行光源、及一處理裝置,該檢測方法包含下 列步驟: a) 經該測試座致能該待測光感測元件; b) 驅動該平行光源以一第一預定相對立體角度投射光 束至該待測光感測元件具有該透光封蓋側; c) 驅動該平行光源以一相異於該第一預定相對立體角 度之第二預定相對立體角度投射光束至該待測光感測 元件;及 d) 以該處理裝置接收步驟b)及c)中,來自該待測光感測 元件經該測試座傳輸之測得訊號。 8·依申請專利範圍第7項所述之污染雜質檢測方法,更包 18 1345632X. Patent application scope: | 100#· March 24th Revision Replacement Page 1 · The light sensing component is dirty and must be · · ΒΙ St _ impurity detection device, wherein the light sensing component has a light a sensor, a circuit board for connecting a plurality of contacts of the photo sensor, and a light-transmissive seal formed together with the iC4+nw circuit substrate of the lightning path to encapsulate the cavity of the photo-sensing cavity Cover, the detecting device comprises: a test socket for supplying a plurality of contacts of the light sensing component to be tested; and a parallel light source for at least partially covering and illuminating the position of the test socket by a plurality of different relative solid angles, the parallel light source It is a parallel light source with five directions in the same direction. One of them is vertical illumination light, the other two parallel light sources are X-axis direction, and the angle is +0,·9 angle, and the two parallel light sources are the axis direction. An angle + Θ, - Θ angle direction illumination; and a processing device that controls the parallel light source and electrically connects the contacts to receive a detection signal from the light sensing element; thereby obtaining a contamination impurity relative to the device to be tested The correct location. 2. The contaminated impurity detecting device of the photo sensing element according to the above patent application, wherein the parallel light source comprises a laser element. 3. The contamination impurity detecting device of the photo sensing device according to claim 2, wherein the parallel light source further comprises a beam that causes the laser beam to be diffused into a beam before being irradiated to the test socket. A diffusing lens group with parallel beams of large illumination. 4) The contaminated impurity detecting device of the photo sensing element according to item 2 of the patent application scope further includes a driving device for driving the position of the laser element to be changed. 17 1345632 Revision No. 5 of March 24, 2014. 5. Contaminant impurity detecting device of the photo sensing element according to claim 1, wherein the parallel light source includes a plurality of light beam directions respectively and is opposite to the test socket Light-emitting elements of different stereo angles. 6 _ The contaminated impurity detecting device of the photo sensing element according to claim 1 further comprises: driving the test stand to move relative to the parallel light source, so that the parallel light source can be irradiated to the The drive of the test stand. 7. A method for detecting a contaminated impurity of a light sensing component, wherein a detecting device is used to detect a contaminating impurity located at the light sensing component, wherein the light sensing component has a light sensor and is provided a plurality of circuit substrates that are connected to the contacts of the photosensor, and a light transmissive cover that forms a cavity enclosing the photosensor together with the circuit substrate, and the detecting device includes: a power connection a test socket of a plurality of contacts of the light sensing component to be tested, a set of five parallel light sources of different directions, and a processing device, the detection method comprising the following steps: a) enabling the light sensing component to be tested via the test socket; b Driving the parallel light source to project a light beam at a first predetermined relative solid angle to the light sensing cover member having the light transmissive cover side; c) driving the parallel light source to be different from the first predetermined relative solid angle And (2) receiving, by the processing device, the measured signals transmitted from the light sensing component to be tested through the test socket in steps b) and c). 8. According to the method for detecting pollution impurities mentioned in item 7 of the patent application scope, further include 18 1345632 含於該步驟d)後之運算步错 染雜質相對該待測光感挪元件之相^^訊號而得該污 9.依申請專利第8項所収污染㈣檢财法 含於該步驟_之分類步驟f),以該處料置區別該: 染雜質係位於該透光封蓋外、或位於該腔趙内者。 19The step of dyeing impurities included in the step d) is opposite to the phase signal of the light sensing component to be measured. The pollution is obtained according to the eighth item of the patent application. (4) The method of checking money is included in the classification of the step _ In step f), the material is distinguished by the material: the dye is located outside the light-transmissive cover or in the cavity. 19
TW96124536A 2007-07-05 2007-07-05 Method of inspecting contaminative impurities in optical sensing components and device used thereby TW200902956A (en)

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