200902956 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種檢測方法及裝置，尤其是—種光减 測元件之污染雜質檢測方法及裝置。 5【先前技術】 光感測元件已經成為絕大部分光學電子設備中不可 或缺的核心，例如數位相機、具攝影功能之行動電話、互 動性電子玩具、條碼讀取機、網路攝影機、保全系統、汽 車電子設備及個人數位助理PDA(Pers〇na| Djgita丨 10 Assistants)等内部配置之 CM0S 元件（c〇mp|ementa「y200902956 IX. Description of the Invention: [Technical Field] The present invention relates to a detecting method and apparatus, and more particularly to a method and apparatus for detecting contaminated impurities of a light-reducing element. 5 [Prior Art] Light sensing components have become an indispensable core in most optical electronic devices, such as digital cameras, mobile phones with photography functions, interactive electronic toys, barcode readers, webcams, and security. Internally configured CM0S components such as systems, automotive electronics, and personal digital assistant PDAs (Pers〇na| Djgita丨10 Assistants) (c〇mp|ementa"y
Meta卜Oxide Semiconductor ’互補性氧化金屬半導體）、 或CCD(電耦合元件），藉由感測光訊號擷取影像、進而判 讀運用。若在光感測元件中之感光晶粒前方出現污染雜 質，無論是灰塵、封裝表面瑕疵、或封裝表面污染，任何 15影響感光途徑之潔淨度的因素，無疑都將成為限制感測精 密度的重要關卡。 本例中係舉一 CMOS元件為例，為清楚說明該元件 之構件組成關係及封裝過程，請參考圖1之分解圖，所示 虛線箭頭為組合方向。其中，以例如一印刷電路板之電路 20基板10為搭載母體’電路基板10佈設複數接點12作為 搭載應用之電連接接點；電路基板10上設有作為光感測 益16之晶粒；為固定光感測器16，將其以耐熱膠體14 固著於電路基板10，至此已大致完成光感測元件之架構； 、光感測器16極其脆弱，易受外力刮傷破壞且受外在環 200902956 „、污染物影響’故於外側封以一透光封蓋2〇, 讓光線可人射至光感㈣16，並保護所涵蓋腔室内之曰 粒。當^’此處電路基板未必以硬式電路板，亦可為: =’。甚至僅是可供内部晶粒電料接至外部之—般基材亦 圖2為習知光感測元件基本結構示意圖，亦即圖^之 組合完成圖’各構件組合後構成光感測元件]，且透光封 蓋2〇與週壁間更形成有一腔體18，通常腔體18以抽直 10 15 空、填膠或充填惰性氣體以維持光感測器16不受氧化Γ …封裝的過程如熟於此技術領域者所知，均在無塵室内 進行，然無塵室並非真正的「無塵」，僅能依無塵室之通 風配置、所能控制之異物量等來區分無塵室的等級，盡量 減少變異因素而已’―般無塵室内需遵守—不攜入（需維 持正壓等）、不發生（需穿工作衣等）、不堆積（需維持清掃 等）及排除（進行換氣動作等），料使產品受異物影響之不 良率降至最低。 即便已運用自動化生產設備進行製造及封褒作業，並 利用各種清潔手段維持在接近無塵環境巾封裝光感測元 件’但百密總有-疏，因操作人員及現實的環境，雜質依 2〇然可能存在於光感測元件之表面及構造中；如圖3所示之 光感測7G件1可能遭受污染區域示意圖，依然可能有如工 作人員毛髮之污染物一 22存在於光感測元件彳之表面， 或如塵粒之污染物二24留置於光感測器16上方；對光感 測兀件1來說，這種污染直接損及設計效能並影響搭載該 200902956 光感測元件彳產品之後續去 可排除污毕物一 22，作、_立田；，、”如進行清理動作即 祙, 4係被封裳於光感測元 件之内部，無法藉由簡單之清理 Ί平叉π理而移除，並將造成感測 錯誤、影響影像擷取等不良效#。去 卜 , 又應田然，母種設備對光感 測兀件的精度需求不同，哎 次了接欠不同程度的瑕疵存在， 亦不必-味剔除所有僅受輕微污染之光感心件。 八 右&提供"'種可自動化、有效率且檢測數據可 立並留存運用之光感測元件之污染雜質檢測方法 10 疑地，可在檢測階段確實發現前述所顧慮之污 木衫響祀圍及程度，不必扼殺所有夹帶雜質之光感測元件 而將其清理或分類運用，應 【發明内容】 “解决方案 因此，本發明之_ θ μ ., 的，在提供一種能精確檢測污染 15 "貝相對位置之光感測元件污染雜質檢測裝置。” 本發明另' ^目的，右蔣At -rC- 在徒供一種發揮光感測元件本身 測性能，簡化檢測設備之光感測元件污染雜質檢測裝置' 本發明之再一目的，在提供一種利用複數道相異立體 角度平行光源在不同時間投射’可確實分辨污染物、亦或 先感測器本身瑕窥之光感測元件之污染雜質檢測裝置。 本發明之又-目的，在提供一種能精喊檢測污染雜 相對位置之光感測元件污染雜質檢測方法。 〜本發明之又另-目的，在提供一種可同時讓該元件進 仃實境效能測試之光m件污染雜質檢測方法。 本發明之又再一目的’在提供一種檢測迅速且可經由 20 200902956 良品等級分類之光感測元件之污染 檢測結果予以進行不 雜質檢測方法。 因此本發明為一種光感測元件之污染雜質檢測裝 置，其中，該光感測元件具有一光感測器、設有複數導接 5該光感測器之接點的電路基板、及與該電路基板共同形成 -包封該光感測器之腔體的透光封蓋，該檢測裝置包含. 一供電性連接該待測光感測元件複數接點的測試座；一供 以複數相異立體角度至少部分涵蓋並照射該測試座位置 之平行光源；及-控制該平行光源、並電連接該等接點而 接收來自該光感測元件檢測訊號之處理裝置；藉此，獲得 巧·染雜質相對該待測元件之正確位置。 精由本發明，可巧妙運用平行光作為光源，同時妥善 2用待測之光感測元件本身的感測功能，—方面簡化檢; °又備、降低設備之製造成本，另方面提升檢驗精密度；而 15在處理裝置運算後，立即獲知雜f之所在位置及影響範 圍，當然依檢測結果除可以建立該受測元件之專有記錄 外，更可依此將產品做等級的分類，例如清理、剔退、以 其他軟體加以補償、或用於需求精度不同之產品。 【實施方式】 20 有關本發明之前述及其他技術内容、特點與功效，在 、下配&參考圖式之較佳實施例的詳細說明中，將可清楚 的呈現。 敬請參考圖4，為本發明第一具體實施例之立體示意 圖，本發明之檢測裝置3包含供電性連接待測光感測元件 200902956 複數接點的測試座4 ; 一供以複數相異立體角度至少部分 涵蓋並照射測試座4位置之平行光源5及一控制該平行光 源5並電連接該等接點而接收來自光感測元件彳檢測訊號 之處理裝置6。 5 進一步說明平行光源的相關結構，本實施例中，平行 光源5主要包括一雷射（Laser)元件52(例如雷射二極體， 以下簡稱LD)，利用其發光角度極窄、波長單一的特性， 使雷射元件52所發光束在被照射至測試座4前，先行經 一擴散透鏡組54，以擴散為一具預定幅照面積、可大致 1〇籠罩待測元件整體之平行光束；且為提供不同的立體昭射 角度，檢測裝置3中，更設置有驅動雷射元件52 = 置之驅動裝置56。 15 當然，如熟悉光學工程領域者可輕易理解，上述LD 亦可改採發光二極體（以下簡稱LED);且上述驅動裝置並 非必須如圖5本發明第二具體實施例之立體示意圖所 示，檢測裝置3,除同樣包含測試座4,及處理裝置6，外本 例中之平行光源5,，更包含複數個發光照射方向至少部分 涵蓋測試座4，位置之雷射元件。本實施例中，係採用五組 所發光束方向分別與該測試座4，夾相異立體角度之雷射 凡件52a、52b、52c、52d及52e ,並對應配置放大幅照 面的擴散透鏡組54a、54b、54c、5化及54e，以組成平 行光源5’。 另如圖6所示為本發明第三具體實施例之立體示意 圖檢'則裝置3包含與前二實施例相仿的測試座4„、處 200902956 5 10 15 理裝置6”、及提供垂直與偏斜照射角度之平行光源5”， 尤其為說明上述測試座與光源間之立體角度變換之相對 性，本例中平行光源5，，之照射位置不變，而檢測裝置3,， 則包括一驅動裝置56”，藉以驅動測試座4，，相對平行光源 5”旋轉運動，使測試座4”可以相異相對立體角度受平行光、 源5”之照射。亦#，無論光源運冑、測試座運動、或兩者 同時相對運動，只要能達到本發明所需之相對運動即可。 圖7顯示入射光照射至作用面後之折射與反射，入射 光原本行經折射率& Π1的第—介質、並於經過作用面後 進入折射率n2的第二介質’當光u於法線FL之垂線位 置由第-介質1入射進第二介質㈣，會產生不同程度 的反射光L3及折射光L2，此三道光分別與法線fl爽入 射角為θ1、反射角θ3、及折射角θ2;依反射定律，θι = θ3。 進一步，因本發明所檢測對象為光感測元件，其反射 光量微乎其微，可忽略不計，故人射光L1以0,角入射後 絕大部分光能將以h角沿L2方向折射， ’當…介質為空氣時，^ = 1，亦即Meta Bux Oxide Semiconductor 'Complementary Oxidized Metal Semiconductors', or CCD (Electrically Coupled Components), which captures images by sensing optical signals and then interprets them. If there are polluting impurities in front of the photosensitive grains in the light sensing element, whether it is dust, packaging surface defects, or packaging surface contamination, any factor that affects the cleanliness of the photosensitive path will undoubtedly become a limit of sensing precision. Important level. In this example, a CMOS device is taken as an example. To clearly illustrate the component composition relationship and packaging process of the device, please refer to the exploded view of Fig. 1, and the dotted arrow is the combined direction. For example, the substrate 10 of the circuit 20 of a printed circuit board is used as the mounting substrate 'the circuit board 10 is provided with a plurality of contacts 12 as electrical connection contacts for mounting applications; and the circuit substrate 10 is provided with crystal grains as the optical sensing 16; In order to fix the photo sensor 16, it is fixed on the circuit substrate 10 with the heat-resistant colloid 14. Thus, the structure of the photo-sensing element has been substantially completed; the photo sensor 16 is extremely fragile and vulnerable to external force scratches and damage. In the ring 200002956 „, the influence of the pollutants, the outer cover is sealed with a light-transmissive cover 2〇, so that the light can be emitted to the light sense (4) 16 and protect the particles in the covered chamber. When the circuit board is not necessarily The hard circuit board can also be: = '. Even the base material for the internal die electric material to be connected to the outside is also the basic structure diagram of the conventional light sensing element, that is, the combination of the figure ^ 'The components are combined to form a light sensing element', and a cavity 18 is formed between the light-transmissive cover 2 and the peripheral wall. Usually, the cavity 18 is evacuated, filled or filled with an inert gas to maintain the light. The sensor 16 is not subject to ruthenium oxide ... the process of encapsulation is as familiar As far as the technical field knows, it is carried out in a clean room, but the clean room is not really "dust-free", and can only distinguish the level of the clean room according to the ventilation configuration of the clean room, the amount of foreign matter that can be controlled, and the like. Minimize the variation factor and have to do it in the “clean room”—do not carry it (need to maintain positive pressure, etc.), do not occur (need to wear work clothes, etc.), do not accumulate (maintain cleaning, etc.) and eliminate (to perform ventilation) Etc.), the material is expected to be less affected by foreign matter. Even if automated manufacturing equipment has been used for manufacturing and sealing operations, and various cleaning methods are used to maintain the light-sensing components in the near-dust-free environment, but there is always a small amount of water, due to the operator and the actual environment, the impurities are 2 Although it may exist in the surface and structure of the light sensing element; as shown in Figure 3, the light sensing 7G piece 1 may be subjected to a schematic view of the contaminated area, and there may still be a pollutant such as a worker's hair present in the light sensing element. The surface of the crucible, or the contaminant 2 such as dust particles, is left above the photo sensor 16; for the photo sensing element 1, the contamination directly impairs the design performance and affects the mounting of the 200902956 light sensing element. The follow-up of the product can eliminate the pollution of a 22, made, _ Litian;,, "If the cleaning action is carried out, the 4 series is sealed inside the light sensing component, and can not be cleaned by simple cleaning π Remove it, and it will cause errors such as sensing errors and affecting image capture. In addition, it should be Tian Ran. The accuracy requirements of the light sensing components of the mother equipment are different.瑕疵 exists, It is not necessary to eliminate all light-sensitive parts that are only slightly polluted. Eight Right & Provides a kind of pollution impurity detection method that can be automated, efficient, and can be used to detect and retain data. In the detection stage, it is possible to find out the above-mentioned concerns about the degree and extent of the smear of the smocked wood, and it is not necessary to kill all the light-sensing components with impurities and clean it or classify it, which should be [invention] The invention _ θ μ., provides a light sensing element contamination detecting device capable of accurately detecting the relative position of the pollution 15 " Another object of the present invention is to provide a light sensing component for detecting the performance of a light sensing component and simplifying the detection device for polluting impurities. The use of a plurality of mutually different stereoscopic parallel light sources to project a contaminated impurity detecting device that can accurately distinguish a contaminant or a light sensing element that is first gleaned by the sensor itself. Further, the present invention provides a The method for detecting the contamination impurity of the light sensing component for detecting the relative position of the pollution is further disclosed. The invention further provides a method for detecting the impurity impurity of the light m component which can simultaneously test the component. Still another object of the present invention is to provide a non-contaminant detection method for providing a detection result of a light sensing element which is quickly detected and can be classified by a quality classification of 20 200902956. Therefore, the present invention is a contamination detecting component for a light sensing element. The device, wherein the light sensing device has a photo sensor, a circuit substrate provided with a plurality of contacts of the photo sensor, and The circuit substrate collectively forms a light-transmissive cover enclosing the cavity of the photo sensor, the detecting device comprises: a test socket electrically connected to the plurality of contacts of the light-sensing component to be tested; and a plurality of different stereos The angle at least partially covers and illuminates the parallel light source of the test stand position; and - the parallel light source is controlled, and the contacts are electrically connected to receive the processing device from the light sensing element detecting signal; thereby obtaining the impurity Relative to the correct position of the component to be tested. According to the invention, the parallel light can be skillfully used as the light source, and at the same time, the sensing function of the light sensing component itself to be tested is properly used, and the detection is simplified in the aspect of the device; Manufacturing cost, on the other hand, the inspection precision is improved; and 15 after the processing device is operated, the position and influence range of the miscellaneous f are immediately known. Of course, according to the detection result, the proprietary record of the tested component can be established, and Classification of products, such as cleaning, culling, compensation with other software, or for products with different requirements. [Embodiment] 20 Related to the present invention The foregoing and other technical contents, features, and advantages will be apparent from the detailed description of the preferred embodiments of the present invention. Referring to FIG. 4, it is a first embodiment of the present invention. Stereoscopic diagram, the detecting device 3 of the present invention comprises a test socket 4 electrically connected to a plurality of contacts of the light sensing component to be measured 200902956; a parallel light source 5 and a portion for at least partially covering and illuminating the position of the test socket 4 with a plurality of different solid angles Controlling the parallel light source 5 and electrically connecting the contacts to receive the processing device 6 from the light sensing element detecting signal. 5 Further describing the related structure of the parallel light source, in this embodiment, the parallel light source 5 mainly includes a laser ( The component 52 (for example, a laser diode, hereinafter referred to as LD) utilizes a characteristic that the light-emitting angle is extremely narrow and the wavelength is single, so that the light-emitting beam of the laser element 52 is diffused before being irradiated to the test seat 4. The lens group 54 is diffused into a predetermined irradiation area, and can substantially cover a parallel beam of the entire component to be tested; and in order to provide different stereoscopic angles, the detecting device 3 More drive is provided opposite the driving device 52 = laser element 56. Of course, as can be easily understood by those skilled in the art of optical engineering, the above-mentioned LD can also adopt a light-emitting diode (hereinafter referred to as LED); and the above-mentioned driving device is not necessarily shown in the perspective view of the second embodiment of the present invention. The detecting device 3, in addition to the test stand 4 and the processing device 6, also includes the parallel light source 5 in the present example, and further includes a plurality of laser elements in which the illumination illumination direction at least partially covers the test stand 4 and the position. In this embodiment, five sets of laser beams are respectively arranged with the test stand 4, and the laser elements 52a, 52b, 52c, 52d, and 52e are formed at different stereo angles, and the diffusing lens group of the enlarged image surface is correspondingly disposed. 54a, 54b, 54c, 5 and 54e to form a parallel light source 5'. FIG. 6 is a perspective view of a third embodiment of the present invention. The apparatus 3 includes a test stand 4′′, a structure of a new structure, and a vertical and partial bias. The parallel light source 5" obliquely illuminating the angle, in particular, the relative angle between the test stand and the light source is changed. In this example, the parallel light source 5, the irradiation position is unchanged, and the detecting device 3 includes a driving The device 56" drives the test socket 4 to rotate relative to the parallel light source 5" so that the test socket 4" can be illuminated by the parallel light and the source 5" at different relative solid angles. Also #, regardless of the light source, the test socket The motion, or both, can be moved at the same time as long as the relative motion required by the present invention can be achieved. Figure 7 shows the refraction and reflection of the incident light after it has been irradiated to the active surface, and the incident medium is originally subjected to the refractive index & And entering the second medium of the refractive index n2 after passing through the active surface. When the light u is incident on the second medium (4) from the first medium 1 at the perpendicular position of the normal line FL, different degrees of reflected light L3 and refracted light L2 are generated. , The incident angles of the three channels of light and the normal fl are respectively θ1, the reflection angle θ3, and the refraction angle θ2; according to the law of reflection, θι = θ3. Further, since the object to be detected by the present invention is a light sensing element, the amount of reflected light is minimal. Ignore it, so the person emits light L1 at 0. After the angle is incident, most of the light energy will be refracted in the L2 direction at the h angle. When the medium is air, ^ = 1, that is,
Sin01 = n2Sin02 ° 關於本發明實際的運用流程，圖83為一光感測元件 之關鍵結構，透光封蓋2〇,的厚度為（彳、光感測器16，的 透光封蓋之空間厚度為12，在8b、8c、8d中將沿用相同 編號代表透光封蓋2Q，、光感測ϋ 16,與厚度tl、t2值之關 係；圖8a中污染物70之位置在透光封蓋2〇，上方，大小 為do’若將平行光源|〇以入射肖θ = 〇亦即垂直於透光封 20 200902956 蓋20’之方向照射’則在光感測器16’上，污染物中心 。位置 為X，其影像的寬度亦為d〇 ;在圖8b中，若以另—、、，、 力道平 行光源丨1以入射角θχ(θχ# 〇)照射，則污染物的大】 不變，但中心點將落在光感測器16，之X1處，相較於原位 置X ’相差的位移值為Δ X1，利用前述光學定理可以求出· △ XimsinexVv^^ksir^exD+t/tanex.·.(式” 其中η為透光封蓋20’的折射率。 在圖8c中，污染物74位於透光封蓋20’的下方，若 以一道平行光源丨1以入射角θχ(θχ^〇)照射，則污染物Μ 10的大小不變，但中心點將落在光感測器16，之&處，相較 於原位置X，相差的位移值為△ χ2，可得： , △ X2=t2*tanex".(式 2) 在圖8d中，污染物76位於光感測器16’的上方，若 以平行光源h以入射角θχ(θχ关〇)照射，則污染物76的 b大小不變，但中心點將落在光感測器16，之&處，相較於 原位置X，中心點不會改變，故位移值 △ X 3 = 0 · · ·(式 3) 由此，當從光感測器處取得影像資料後，即可判斷其 中心點位移值究竟符合式1、式2、或式3，從而判斷^ 20 污染物的所在位置。 當然，以上分析係假設污染物的高度遠小於其截面積 大小，因此將高度的陰影效、略*計；但如果 高度與其大小相當或更大而不可忽略時，則以上狀況2 產生額外效應’而需要進行如下之進—步討論。 200902956 •，，圖9a為―^感測元件之主要結構示意圖，透光封蓋 20”的厚度為tl、光感測器16”與該透光封蓋之空間厚产: t2’在9b、9c中仍將沿用相同編號代表透光封蓋扣^光 感測器他與厚度ti、t2值之關係；圖如中污染物8〇之 5位置在透光封蓋20”上方，大小為〜且高度為h，當平行 光源丨V以入射角θ=0亦即垂直於透光封蓋2〇，，之方向照 射，則在光感測器1 6上，污染物中心位置為X，，當另一 〔 道平行光源丨1’以入射角ey(ey尹〇)照射，污染物80的影 像大小為 10 dM= d〇+h*tan0y··.(式 4) 而中心點將落在光感測器16”之X1”處，相較於原位 置X，相差的位移值為△ X11，利用光學定理可以求出 Δ Xi,=(t1*(sin9y)/vr(n2-sin20y))+t2*tan0y+h/2*(tan6y).. 5) " 15 其中η為透光封蓋20’’的折射率，利用式4可得： I* h = (dii-d〇)*cotey_·.(式 6) 至此可以求得污染物之高度h。 而圖9b中污染物82之位置在透光封蓋20”下方，大 小為do且高度為h，若平行光源|0’以入射角θ=〇之方向 20 照射，則在光感測器16”上，污染物中心位置為X，；另— 平行光源丨1’以入射角ey(0y关0)照射，污染物82的影像 大小為dp d〇+h*tan0y.._(式7)，而中心點會落在光感測 器16”之X2”處，與原位置X’相差的位移值 △ X2，=t2*(taney)-h/2*taney.._ (式 8) 12 200902956 其中η為透光封蓋2 0”的折射率，利用式7可以計算 h = (di2-d〇r cotey...(式 9) 本例中污染物影像會變大，影像中心偏移量反而變 小，利用式9可以求得污染物之高度h。 5 在圖9c中，污染物84之位置恰在光感測器】6，，上方， 大小為d0且高度為h，入射角θ=〇時，在光感測器16” 上，污染物中心位置為X’，另一平行光源丨1,以入射角θγ(θγ 尹〇)照射，污染物84的影像大小di3 = d〇 + h*taney (式 1 〇)，而影像中心點將落在光感測器i6，，之"處，與原位 10置X’相差的位移值為 Δ X： taney..·(式杓） η為透光封盍20”的折射率，利用式彳〇求得 h = ( di3- d0)*cotey...(式 12) 從而求出污染物84之高度h。 15 20 <利用以上分析可知’如本發明配置之-實用架構，月 :置5個不同方向的平行光源照射，其中一道為垂直照專 光另兩道平行光源為X軸方向，以角度+Θ、-Θ角；5 向照射，再兩道平行光源為Y軸方向，以角度+θ、 2，射；此5料行光源明序投射，制 測所得的5犋 g ® 取得各個^… 點影像，制垂直照射的平行光揭 、巧染物的截面大小，再利用X軸方向 斜照平行光泝，％^ v 平乃间的兩择 ’、取侍X軸方向的投影影像，後利用丫 方向的兩道斜照平杆 卑 可以利用三角函=γ軸方向的投影影像，值 角函數的h，回推獲得污染物的位置、 13 200902956 及高度，進而確認待測光感測元件的品質 5 例如，無論光線如何投射，感測所得始;^ 即可確認為光感測器本身…即實境= 界定之瑕疲品；若推得污染區域在透光封蓋2〇= 面處，只要清理即可；偶若污染區域在透光封蓋2〇,、= =:測:;6’、16”表面而無法清除，就必須依品管 要求^騎補償、作為次級品使用或剔退為不良品。 本發明之檢測方法可詳述步驟如圖1〇所示起μ 10 I 90中需經測試座4致能待測光感測元件 動 並於步驟92驅動平行光源5,以例如= 之第一預疋立體角度投射平行光—Sin01 = n2Sin02 ° Regarding the actual application flow of the present invention, FIG. 83 is a key structure of a light sensing component, and the thickness of the light-transmissive cover 2 is (彳, the light sensor 16, the space of the light-transmissive cover) The thickness is 12, in 8b, 8c, 8d, the same number will be used to represent the light transmissive cover 2Q, the light sensing ϋ 16, and the relationship between the thickness tl, t2; the position of the contaminant 70 in Fig. 8a is in the transparent seal Cover 2〇, above, the size is do' if the parallel light source | 〇 is incident on the angle θ = 〇, that is, perpendicular to the transparent seal 20 200902956 cover 20' direction 'on the light sensor 16', the pollutant The position is X, and the width of the image is also d〇; in Fig. 8b, if the parallel light source 丨1 is irradiated with the incident angle θχ(θχ# 〇), the contaminant is large. It does not change, but the center point will fall at the X1 of the photo sensor 16, and the displacement value of the difference from the original position X' is ΔX1, which can be obtained by using the above optical theorem. △ XimsinexVv^^ksir^exD+t /tanex. (wherein η is the refractive index of the light transmissive cover 20'. In Figure 8c, the contaminant 74 is located below the light transmissive cover 20', If a parallel light source 丨1 is irradiated with an incident angle θχ(θχ^〇), the size of the contaminant Μ 10 does not change, but the center point will fall at the photo sensor 16, at & compared to the original position X. The difference value of the phase difference is Δ χ2, and: △ X2=t2*tanex" (Formula 2) In Fig. 8d, the contaminant 76 is located above the photo sensor 16', if incident with the parallel light source h When the angle θχ(θχχ〇) is irradiated, the b-size of the contaminant 76 does not change, but the center point will fall at the photo sensor 16, and the center point will not change compared with the original position X, so the displacement The value △ X 3 = 0 · · · (Expression 3) Thus, when the image data is obtained from the photo sensor, it can be judged whether the center point displacement value conforms to Equation 1, Equation 2, or Equation 3, thereby judging ^ 20 The location of the contaminant. Of course, the above analysis assumes that the height of the contaminant is much smaller than the cross-sectional area, so the height of the shadow is slightly, but if the height is equal or larger than the size, it cannot be ignored. Then the above situation 2 has an additional effect' and needs to be discussed as follows. 200902956 •,, Figure 9a is ^ The main structure of the sensing element, the thickness of the light-transmissive cover 20" is tl, the light sensor 16" and the space of the light-transmissive cover are thick: t2' will still be represented by the same number in 9b, 9c Light-transfer cover buckle ^ light sensor his relationship with the thickness ti, t2 value; Figure 5, the position of the pollutant 8 〇 5 above the light-transmissive cover 20", the size is ~ and the height is h, when the parallel light source丨V is irradiated in the direction of the incident angle θ=0, that is, perpendicular to the transparent cover 2〇, then the center position of the contaminant is X on the photosensor 16, and the other parallel source 丨1' is illuminated by the incident angle ey (ey Yin), the image size of the contaminant 80 is 10 dM = d〇 + h * tan0y · (. 4) and the center point will fall on the X1 of the photo sensor 16" At the position, compared with the original position X, the displacement value of the phase difference is Δ X11, and the optical theorem can be used to find Δ Xi,=(t1*(sin9y)/vr(n2-sin20y))+t2*tan0y+h/2* (tan6y).. 5) " 15 where η is the refractive index of the light-transmissive cover 20'', which can be obtained by using Equation 4: I* h = (dii-d〇)*cotey_·. (Equation 6) Find the height h of the pollutant. The position of the contaminant 82 in FIG. 9b is below the light-transmissive cover 20", the size is do and the height is h. If the parallel light source |0' is illuminated in the direction 20 of the incident angle θ=〇, then the photo sensor 16 is used. "On, the center of the contaminant is X, and the other - parallel light source 丨1' is illuminated by the incident angle ey (0y off 0). The image size of the contaminant 82 is dp d〇+h*tan0y.._(Formula 7) , and the center point will fall at the X2" of the photo sensor 16", and the displacement value Δ X2 which is different from the original position X', = t2 * (taney) - h / 2 * taney.. _ (Equation 8) 12 200902956 where η is the refractive index of the light-transmissive cover 20", and can be calculated by Equation 7 h = (di2-d〇r cotey... (Formula 9) In this example, the image of the contaminant becomes larger, and the center of the image is shifted. The amount is reduced, and the height h of the contaminant can be obtained by using Equation 9. In Figure 9c, the contaminant 84 is located just above the photosensor, 6, above, the size is d0 and the height is h, the angle of incidence When θ=〇, on the photo sensor 16”, the center position of the contaminant is X′, and the other parallel light source 丨1 is irradiated with the incident angle θγ (θγ 尹〇), and the image size of the contaminant 84 is di3 = d〇 + h*taney (style 1 〇), and the image center The displacement value that will fall on the photosensor i6, the ", and the in-situ 10 set X' is Δ X: taney.. (Expression 杓) η is the refractive index of the light-transmissive package 20", Using the formula, h = ( di3- d0) * cotey (Expression 12) is obtained to find the height h of the contaminant 84. 15 20 < Using the above analysis, it is known that the configuration of the present invention is practical. Month: 5 parallel light sources in different directions are illuminated, one of which is vertical illumination and the other two parallel light sources are X-axis direction, with angles +Θ, -Θ angle; 5 directions illumination, then two parallel light sources are Y-axis Direction, angle + θ, 2, shot; this 5 material line light source projection, the measured 5犋g ® to obtain each ^ ... point image, the vertical illumination of the parallel light, the size of the cross section of the dye, and then Using the X-axis direction to slant parallel light trace, %^ v is the choice between the two, to take the projection image in the X-axis direction, and then use the two oblique slanting rods in the 丫 direction to use the triangle function = γ-axis direction Projection image, h of the value angle function, push back to obtain the position of the contaminant, 13 200902956 and height, and then confirm the light sensing component to be tested Quality 5 For example, no matter how the light is projected, the beginning of the sensing; ^ can be confirmed as the photosensor itself... that is, the real = the defined fatigue; if the contaminated area is pushed at the transparent cover 2〇 = face As long as the cleaning can be done; even if the contaminated area is in the light-transmissive cover 2〇, = =: measured:; 6', 16" surface can not be removed, it must be compensated according to quality control requirements, as a secondary product Or retire as a defective product. The detection method of the present invention can be described in detail as shown in FIG. 1A. The μ 10 I 90 is required to pass the test socket 4 to enable the light sensing element to be sensed, and in step 92, the parallel light source 5 is driven to, for example, the first pre-投射Three-dimensional angle projection parallel light—
具有該透光封蓋20側；隨後，於步驟^驅I 15 20 與測試座相對移動，而以一相異於第一預定立體度之原第 =體角·^ ❹广…*於步驟96以處理裝置6接收來自待測光 試座1傳輸之測得訊號，藉以取得來自相 9 又广f光之影像貧訊；運用前述公式，於步驟 相=等訊號而得污染雜f相對㈣光感測元件1之 當然’越多道光源投射，感測而得數據更有助於運算 、夂+至此’已獲得該待測污染元件遭污染區域及程度， 100即將將污染雜質位於該透光封蓋外者，與污 =二，區別’如表面遭受污染者進行 /、卜右内部遭受污染輕微，則依品管要求分類，作 14 200902956 為次級品或以軟體補償修飾 主於測得光感測器損壞 m 或污染程度嚴重，即進行剔退以排除不良品。 10 依照上述之方法’可藉由本發明於待測光感測元件進 入測試程料，啟動元件與生俱來之❹彳功能，此時即可 同時進行該光感測元件之實境測試；以平行光源經放大、 投射、折射之步驟，再經由處理裝置之運算，即能讓製造 或封裝過程中乘隙而人之雜質—現形，得知雜質對此待 測先感測讀料絲度，採取清理後運㈣無法清理但 可應用於其他產品甚至直接剔退之選擇，每一元件得以建 立個別紀錄並物盡其用，因此藉由本發明確實可以有效達 成本案之所有上述目的。 &惟以上所述者，僅為本發明之較佳實施例而已，當不 ^以此限定本發明實施之範圍，即纽依本發明巾請專利 範圍及發明說明書内容所作之簡單的等效變化與修倚，皆 15應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是習知光感測元件基本結構分解示意圖 圖2疋疋1光感測元件基本結構組合示意圖 圖3是光感測元件可能遭受污染區域示意圖 圖4是本發明第一具體實施例之立體示意圖 圖5是本發明第二具體實施例之立體示意圖 圖6是本發明第三具體實施例之立體示意圖 圖7是光學折射與反射原理示意圖； 15 200902956 圖 h、8b、8c、8d 圖9a、9b、θ 本發明求取污染物位置示意圖； 圖10是本發明C =發明求取污染物高度示意圖；及 【主要元件符二7法之運作流程圖。 f ίο 1 _.，光感測元件 12…複數接點 16、16、16'..光感测器 2〇、20，、20，，·..透光封蓋 24…污染物二 4、4’、4”…測試座 10…電路基板 14...耐熱膠體 18…腔體 22…污染物一 3、1、3”…檢測裝置 5、i、5”…平行光源 52、52a、52b、52c、52d、52e..雷射元件 54、54a、54b、54c、54d、54e…擴散透鏡組 56、56"…驅動裝置 6、6’、6，，·.·處理裝置 15 i \. 20 7〇、72、74、.76、80、82、84...污染物 01 、02、Θ3、Θ、θχ、0y···角度 ηι、n2…介質 h,·.高度 L1、L2、L3、丨〇、h、|0,、I!，…光 FL·，·法線 d〇、、di2、di3…寬度 X、Xl、X2、X3、X’、Xi’、X2’、X3’…位置 ti、t2...厚度 90 〜100...步驟 16Having the light transmissive cover 20 side; subsequently, in the step of driving I 15 20 relative to the test seat, and in a different from the first predetermined degree of the original body angle = ^ ❹ ... ... * in step 96 The processing device 6 receives the measured signal transmitted from the optical test stand 1 to obtain the image poor information from the phase 9 and the wide light; using the foregoing formula, the pollution phase is obtained in the step phase = equal signal (four) light perception Of course, the more components of the measuring element 1 are projected, the data obtained by the sensing is more conducive to the operation, and the 区域+to this has obtained the contaminated area and extent of the contaminated component to be tested, and 100 is about to place the contaminating impurities in the transparent sealing. Covering the outside, with the pollution = two, the difference 'if the surface is polluted by the person /, the right inside is slightly polluted, then classified according to the quality control requirements, for 14 200902956 for the secondary product or with the soft body compensation modified to the measured light The sensor is damaged by m or the degree of contamination is serious, that is, it is rejected to eliminate defective products. 10 According to the above method, the invention can be used to enter the test material in the light sensing component to be tested, and the function of the component is activated. At this time, the physical testing of the light sensing component can be performed simultaneously; The steps of amplifying, projecting, and refracting the light source, and then operating through the processing device, can make the impurities in the manufacturing or packaging process and the impurities, the shape, and the impurities are detected. After the shipment (4) can not be cleaned but can be applied to other products or even directly retire the choice, each component can be set up to make individual use and make the best use of it, so all the above purposes of the case can be effectively achieved by the present invention. The above is only the preferred embodiment of the present invention, and does not limit the scope of the practice of the present invention, that is, the simple equivalent of the patent scope and the contents of the invention specification of the invention. Changes and modifications should be within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing the basic structure of a conventional light sensing element. FIG. 2 is a schematic diagram showing a basic structure of a light sensing element. FIG. 3 is a schematic diagram of a light sensing element that may be contaminated. FIG. 3 is a perspective view of a second embodiment of the present invention. FIG. 6 is a perspective view of a third embodiment of the present invention. FIG. 7 is a schematic diagram of optical refraction and reflection; 15 200902956 FIGS. h, 8b, 8c, 8d Figures 9a, 9b, θ The schematic diagram of the position of the contaminant is obtained by the present invention; Fig. 10 is a schematic diagram of the C=invention for obtaining the height of the contaminant according to the invention; and [the operation diagram of the main component symbol 2-7 method. f ίο 1 _., light sensing element 12...multiple contacts 16, 16, 16'.. photosensors 2〇, 20, 20, ..., light transmissive cover 24... contaminants 2 4', 4"... test stand 10... circuit board 14... heat-resistant colloid 18... cavity 22... contaminants-3, 1, 3"... detecting means 5, i, 5"... parallel light sources 52, 52a, 52b , 52c, 52d, 52e.. laser elements 54, 54a, 54b, 54c, 54d, 54e... diffusion lens group 56, 56 " ... drive device 6, 6', 6, ..., processing device 15 i \. 20 7〇, 72, 74, .76, 80, 82, 84... Pollutants 01, 02, Θ3, Θ, θχ, 0y···angle ηι, n2...media h,·.height L1, L2 L3, 丨〇, h, |0,, I!, ... light FL·, · normal d〇, di2, di3...width X, Xl, X2, X3, X', Xi', X2', X3' ...position ti, t2...thickness 90 〜100...step 16