1344869 九、發明說明： 【發明所屬之技術領域】 本發明係關於真空幫浦之領域。具體而言，本發明係關 於（但並不嚴格限於）具有一螺旋型構造之真空幫浦。 【先前技術】 螺旋式幫浦通常包括兩個隔開之平行轴，每一軸帶有若 干外螺紋轉子，該等軸安裝在幫浦殼體内以使該等轉子之 螺紋互相嚙合^轉子螺紋於互相嚙合點處及與幫浦本體内 表面（幫浦本體通常用作定子）之間的緊密公差，使於入口與 出口之間抽取之氣體被捕集於轉子螺紋與内表面之間，由 此當轉子旋轉時迫使氣體經過幫浦。 於多種製程中，人們普遍將螺旋式幫浦視爲一用於産生 真空條件之可靠構件。因此，其正應用於愈來愈多之工業 製程中。該等應用可涉及具有「蝶質」特性或「脂肪」特 性，材料，例如以動物脂爲主之塑化劑。於幫浦之運行中， 該等產物會於幫浦之表面上形成沈積物。一旦關停幫浦， 〆等表面冷部，且幫浦内之沈積物亦冷卻並凝固。若該等 ，’.牛之間的間隙區域，則其會導致幫浦卡 /ψ 而使再啓動受到抑制或甚至受阻。 於諸多使用真空幫浦之半導體製程中 氣相沈積類型之製程中皆合丨&y 嵌等化于 W中白會遇到類似問題。該等製程可產1344869 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to the field of vacuum pumps. In particular, the invention relates to, but not strictly limited to, a vacuum pump having a helical configuration. [Prior Art] A spiral pump usually includes two spaced parallel shafts, each shaft having a plurality of externally threaded rotors mounted in the pump housing to allow the threads of the rotors to mesh with each other. The tight tolerance between the point of intermeshing and the inner surface of the pump body (usually used as a stator for the pump body) causes gas extracted between the inlet and the outlet to be trapped between the rotor thread and the inner surface, thereby The gas is forced through the pump as the rotor rotates. In many processes, the spiral pump is generally regarded as a reliable component for generating vacuum conditions. Therefore, it is being applied to more and more industrial processes. Such applications may involve "butterfly" or "fat" properties, such as plasticizers based on tallow. In the operation of the pump, these products form deposits on the surface of the pump. Once the pump is shut down, the surface is cold, and the sediment in the pump is cooled and solidified. If so, the gap area between the cows, it will cause the card to be stuck/ψ and the restart will be suppressed or even blocked. In the process of vapor deposition type in many semiconductor processes using vacuum pumps, the combination of &y embedding in W-white will encounter similar problems. These processes can be produced
里之田j產品材料。# -sr ο M ^ , ^ n t " 了呈鬆放或壓實之粉末或粉塵形 飞次呈硬固體形式，在盥藉洛舯认私μ 凝結或可昇華父低溫度之表面上可 月兄下尤其如此。該材料可形成於製程 96325.doc 1344869 室、製程室與幫浦之間的前級管路、及/或真空幫浦自身 内。若該材料於幫浦運作時聚積於其内表面上，則其合顯 著地填充幫浦上轉子元件與定子元件之間的運行間隙：並 亦可引起真空幫浦馬達之電流需求尖峰。若此情況持續得 不到改善’則㈣材料之聚積最終會導致馬達超载，從而 引起控制系統關停該真空幫浦。假若允許幫浦冷卻至環境 溫度，則聚積之材料會壓縮於轉子元件與定子元件之間^ 因爲此可於轉子元件衫子元件之間產生較大之潛錢觸 表面面積，該副產品材料之壓縮會增加阻止旋轉之摩擦力 達一數置級，以至於在幫浦再啓動時其旋轉受阻。 _爲釋放切技術幫浦中之轉子，提供—設備，藉此可將 一棒經由-檢視板插人附裝至轉子絲的承窩心該棒可 用作-槓桿嘗試旋轉該軸並釋放該機#，以使機器可再啓 動。該槓桿系統允許在内部組件上施加較馬達更大之旋轉 力°玄力會傳遞至轉子葉片，且伴隨之應力證明會對轉子 構造成傷害。若該系統不能釋放該機構，則必須拆開 該袭置，以向幫浦殼體内灌注液體溶劑，將殘留物溶解至 7動旋轉該軸之程度。裝置之拆卸不僅會使幫浦離線— π門而且必須再試車及再測試以保證與周圍裝置之連 接之可靠性。 申請人之待決國際申請案第wo 2〇〇4/〇36〇47號說明在幫 满運作期間如何，例如，使用電磁閥控制以預定之時間間 隔啓動清洗液之輸送。該幫浦之性能藉由量測轉子速度、 功率消耗〗氣體體積流率之群組中至少之一來監視。隨 96325.doc 1344869 f ,用該等所測得參數確定幫浦之内工作面上沈積物之 备："又後，計异清洗流體之流率，該流率係足以補 ^聚積之沈積物量之傳輸流體之流率。以此種方式，可連 續調整輸送至轉子之清洗流體之流率以反映新計算值。 本發月之目的係尋求對上述過程之進一步改良。 【發明内容】 本發明提供—種藉由引人適於溶解、稀釋或以其他方式 除去幫浦内工作表面上聚積之沈積物之流體來處理幫浦機 構内沈積物之方法，該方法包括以下步驟： ⑷藉由，例如’記錄幫浦排氣口之壓力及馬達電流之 群組中至少之一來監視幫浦之性能； (b)接收來自一由幫浦抽真空工具或與其相關之過程 資料； (C)基於該所監視之性能及該過程資料計算補償該幫 浦之内工作面上沈積物聚積所需之流體流動特性；及 (d)根據該經計算之特性向唧送機構内引入流體。 當該沈積物呈固體形式時，流體通常爲卣素，諸如氟化 流體或氟化氣體。或者，尤其當該沈積物爲粉末形式時， 該流體可爲惰性沖洗氣體，諸如氮，具體而言，可於高壓（例 如2000 mbar以上）下輸送該氣體。 當該流體爲一鹵素時，亦可向幫浦内引入—第二流體’ 該第二流體爲惰性沖洗氣體。爲獲得局部效應，該兩種产 體可於不同位置引入幫浦内。舉例而言，第—流體可直= 瞄準幫浦之内工作表面以將流體集中於聚積沈積物之區 96325.doc 1344869 域此外，第一流體（通常爲一惰性沖洗氣體）可同時對準幫 廣之役封組件，以防止_素流體對其産生之腐钱效應。 去若使用-第二流體，可於第一流體注入終止後引入第二 机體’以將腐蝕性鹵素材料及任何除去之沈積物沖洗出幫 廣’從而最大限度減小幫浦之内表面與腐#性材料之接觸 蛉間。以此方式，可將幫浦組件之腐蝕降至最小。 流體流動特性可至少爲下列群組中之一：流率、溫度、 壓力及注入持續時間。 可於幫浦正常運作期間引人流體；當該流體爲_高壓沖 ，氣體時，若正發生一製程，則可將該流體引入幫浦之排 氣P刀# it擇爲’可在幫浦離線且當前無製程運行時 引入流體；於該實施例中，·^關閉製程室與真空幫浦之間 的前級管路閥門以防止來自幫浦之流體流回製程室。 根據本發明之另一實施例，提供一唧送佈置，該佈置包 括‘-具有-轉子兀件及一定子元件之真空幫浦、至少— 机體埠、用於監視幫浦性能之構件、用於接收來自一幫浦 抽真空之JL具或與該I具相關之過程資料之構件、用於依 據所監視特性及過程資料計算補㈣浦之内卫作表面上沈 積物聚積所需流體流動特性之構件、及用於根據經計算之 特性經由該至少一個淳向幫浦内引入流體以使其作用於元 件表面上之沈積物並除去該沈積物之構件。 乾式幫浦裝置之控制器可包括一微處理器，該微處理器 可包含於一電腦中，該電腦視需要可由一電腦軟體程式 化，當該電腦軟體安裝上時，其可使電腦執行上述方法步 96325.doc 1344869 驟⑷至⑷。該程式之載體可選自（但並不嚴格限於）軟磁 碟、CD、逑你光碟或數位磁帶。 現在參考附圖說明本發明之一實例·· 【實施方式】 雖然圖1及圖2中顯示之實例幫浦爲螺旋式幫浦，但可思 及本發明係可應用於任何類型之0幫浦，尤其·係爪^ (cl aw)幫浦。 於圖1之實例中，用作為該幫浦之定子的外殼5内具有兩 個轉子1。該兩個反方向旋轉且互相嚙合之轉子丨係定位成 使其中心軸線互相平行。該等轉子係安裝於軸承内並由 馬達11驅動（顯示於圖2中沿轉子之長度設有若干注入蜂 2 ’於圖1及圓2之實例中’該等埠2(於圖3中顯示爲實線）於 幫浦内在轉子之相對側上呈橫向於轉子之互相嚙合區域而 疋位。然而，該等埠亦可被定位於環繞定子5之任何徑向位 置。某些該等位置以虛線顯示於圖3中。 埠2可設有若干噴射流體之噴嘴（未圖示），該等埠較佳地 係沿疋子π件5之長度而分佈，以使溶劑或蒸汽易於噴施至 整個轉子1上。或者，埠2之分佈允許流體能夠易於集中至 會發生問題之特定區域。爲限制對幫浦性能之影響，於幫 廣運作期間嗔射溶劑尤其重要。舉例而言，若在幫浦之入 口 3處使用—單一埠，則會對藉由幫浦而可自真空室（未圖 不）輸送出之副産品的產能產生一有害效應。藉由使轉子^ 之螺紋先旋轉幾圈後再使溶劑接觸轉子1，可減小溶劑倒流 入衣程至内造成污染之可能性。 96325.doc 另外，若將溶劑引入幫浦之入口區域3 ,則入口處之壓力 马增加/谷劑閃蒸（flash)之危險。於必須使溶劑保持在液相 之製程中，須將溶劑引入至靠近壓力將會升高之幫浦排氣 區域。當經由沿疋子5之長度分佈之多個埠2而引入溶劑 柑，其整體效應係逐漸增加存在之溶劑量，其原因在於殘 留物於轉子1上之聚積在排氣末級區可能會增加。於某些構 造中可看到之另一優點係：在轉子〗.最後若干圈螺紋内添加 液體將會有助於密封住幫浦之該區域内轉子丨與定子5之間 的空隙。由此會實質性減少漏氣，並改良幫浦之性能。 於某些製程中，不宜於幫浦運作期間引入溶劑，其原因 在於來自真空室之廢産物由於一特定目的而聚積於幫浦之 出口 4且不應又到污染。其他應用可能不會産生必須於運作 期間恒量注入溶劑之殘留物程度。於該等情況下且若發生 幫浦非計劃關停以至於無法隨之實施沖洗等標準常例作 業，則來自製程之殘留物會隨著裝置之降溫而冷卻。於該 等情況下，當沈積物聚積並變得更黏稠或凝固時，即會發 生機構滯塞。於本發明之一系統中，可使用注入埠2以一分 佈式方式將溶劑引入定子空腔6中，而無需因拆卸裝置而勞 神傷財。一旦溶劑作用於沈積物使其軟化或溶解，即可使 用馬達或手動對軸進行旋轉，以釋放各元件，而無需向轉 子1上施加會對轉子造成潛在破壞之過大之力。 s經由殼體中一孔滴注液體時，可經由簡單之埠2實施流 體之輸送，或可設置藉以喷射流體之噴嘴。可引入控制系 、’先以響應幫浦裝置範圍内正經受之改變條件實施溶劑之 96325.doc •10· 1344869 f送。舉例而言，於圖5所示佈£中，一控制系統2〇將清洗 流體，例如，經由供應管道22逐級提供至幫浦21之埠2。 如24所指示，亦可提供一沖洗氣體系統用於向幫浦以供 應諸如氮氣等沖洗氣體。 若製程材料爲蠟質或脂肪，則需引入相容之溶劑以實施 稀釋/清洗功能。該等溶劑可以液體或蒸氣形式提供。可使 用任何相容且有效之清洗介質，例如於碳氫化合物爲主/可 溶性産物之情況中’引吏用二甲苯，而於水基/可溶性産物 之情況中，可使用水，另一種選擇爲可使用清潔劑。 若製程材料爲CVD製程之副產品，則清洗流體可包括一 氟化氣體。該清洗流體之實例包括但不限於cIF3、f2、NF3 ^ 氟之高反應性意味著該等氣體會與幫浦機構上之固體副産 m反應，使固體副産品隨後能夠被排出氣體自幫浦上沖洗 下來。爲避免氟化氣體腐蝕幫浦之内部組件，需仔細選擇 用於構成幫浦内與清洗氣體接觸之組件之材料，諸如元件 轉子1及元件定子5及任何彈性密封件。 圖4中所示殼體5係構造爲雙層外皮結構：一内層12及一 外層9。内層12用作幫浦之定子。於殼體5之層12及層9之間 設置一空腔7’使諸如水等冷卻液能夠圍繞定子循環，以將 熱置自幫浦之工作部分傳導出去。轉子之整個長度上皆設 有空腔7，亦即在整個輸入區域3及排氣區域4皆設有空腔 7。於在因轉子之冷卻使轉子與定子之間表面上之殘留物凝 固而致使幫浦卡滯之情況下，可加熱殼體5之空腔7中之冷 卻液使轉子1之溫度升高。此可增加殘留物之柔順性，並可 96325.doc 11 1344869 在设體5之整個空腔7内設置有由固Lizhitian j product materials. # -sr ο M ^ , ^ nt " The loose or compacted powder or dust-like fly is in the form of a hard solid, which can be used on the surface of the 低 舯 舯 或 或 或 或 或This is especially true under the brother. This material can be formed in the process chamber 96325.doc 1344869, the pre-stage between the process chamber and the pump, and/or the vacuum pump itself. If the material accumulates on its inner surface during operation of the pump, it significantly fills the running clearance between the rotor element and the stator element on the pump: it can also cause a spike in the current demand of the vacuum pump motor. If this situation continues to improve, then (4) the accumulation of material will eventually cause the motor to overload, causing the control system to shut down the vacuum pump. If the pump is allowed to cool to ambient temperature, the accumulated material will be compressed between the rotor element and the stator element. ^This creates a large potential surface area between the rotor element and the compression of the by-product material. It will increase the friction that prevents the rotation from reaching a certain level, so that its rotation is blocked when the pump is restarted. _In order to release the rotor of the cutting technology, a device is provided, whereby a rod can be attached to the socket core of the rotor wire via the inspection panel. The rod can be used as a lever to attempt to rotate the shaft and release the machine. #, so that the machine can be restarted. This lever system allows a greater rotational force to be applied to the internal components than the motor. The force is transmitted to the rotor blades and the accompanying stresses prove to be harmful to the rotor. If the system is unable to release the mechanism, the attack must be disassembled to infuse the pump housing with liquid solvent to dissolve the residue to the extent that the shaft is rotated. Disassembly of the unit will not only take the pump offline – the π door and must be re-tested and retested to ensure reliable connection to the surrounding equipment. Applicant's pending International Application No. WO 2〇〇4/〇36〇47 describes how to initiate the delivery of cleaning fluid at predetermined intervals, for example, using solenoid valves to control the full operation. The performance of the pump is monitored by at least one of a group measuring rotor speed, power consumption, and gas volume flow rate. With the measured parameters of 96325.doc 1344869 f, the deposits on the working surface of the pump are determined: " and then, the flow rate of the cleaning fluid is calculated, which is sufficient to compensate for the deposition of the deposit The flow rate of the volume of the transport fluid. In this way, the flow rate of the cleaning fluid delivered to the rotor can be continuously adjusted to reflect the new calculated value. The purpose of this month is to seek further improvements to the above process. SUMMARY OF THE INVENTION The present invention provides a method of treating deposits in a pumping mechanism by introducing a fluid suitable for dissolving, diluting, or otherwise removing deposits accumulated on a working surface within the pump, the method comprising the following Steps: (4) Monitoring the performance of the pump by, for example, 'recording at least one of the pressure of the exhaust port of the pump and the motor current; (b) receiving the process from or associated with the pumping tool (C) calculating, based on the monitored performance and the process data, the fluid flow characteristics required to compensate for the accumulation of deposits on the working surface within the pump; and (d) directing the calculated characteristics to the delivery mechanism Introduce fluid. When the deposit is in solid form, the fluid is typically a halogen, such as a fluorinated fluid or a fluorinated gas. Alternatively, especially when the deposit is in powder form, the fluid can be an inert flushing gas, such as nitrogen, and in particular, can be delivered at a high pressure (e.g., above 2000 mbar). When the fluid is a halogen, a second fluid can also be introduced into the pump. The second fluid is an inert flushing gas. To achieve local effects, the two products can be introduced into the pump at different locations. For example, the first fluid can be straight = aiming at the working surface within the pump to concentrate the fluid in the area where the deposit is accumulated 96325.doc 1344869. In addition, the first fluid (usually an inert flushing gas) can be aligned at the same time. The Guangshi service seals the components to prevent the rot effect of the _-liquid fluid. If the second fluid is used, the second body can be introduced after the first fluid injection is terminated to flush out the corrosive halogen material and any removed deposits to minimize the inner surface of the pump. Corruption #性材料 contact between the daytime. In this way, corrosion of the pump assembly can be minimized. The fluid flow characteristics can be at least one of the following groups: flow rate, temperature, pressure, and injection duration. It can introduce fluid during the normal operation of the pump; when the fluid is _ high pressure rush, gas, if a process is occurring, the fluid can be introduced into the pump of the pump P knife # it is selected as 'can be in the pump The fluid is introduced offline and currently in the absence of process; in this embodiment, the front line valve between the process chamber and the vacuum pump is closed to prevent fluid from the pump from flowing back to the process chamber. According to another embodiment of the present invention, a feed arrangement is provided, the arrangement comprising a vacuum pump having a - rotor element and a certain sub-component, at least - a body 埠, a member for monitoring the performance of the pump, A component for receiving a JL tool from a pump or a process data associated with the tool, for calculating the fluid flow characteristics required for the accumulation of deposits on the surface of the internal coolant according to the monitored characteristics and process data. And a member for introducing a fluid into the pump via the at least one weir according to the calculated characteristic to act on the deposit on the surface of the component and to remove the deposit. The controller of the dry pump device may include a microprocessor, which may be included in a computer, which may be programmed by a computer software as needed, and when the computer software is installed, the computer may perform the above Method step 96325.doc 1344869 (4) to (4). The program's carrier can be selected from, but not strictly limited to, a floppy disk, a CD, a CD or a digital tape. An example of the present invention will now be described with reference to the accompanying drawings. [Embodiment] Although the example pump shown in FIGS. 1 and 2 is a spiral pump, it is contemplated that the present invention can be applied to any type of 0 pump. Especially, the claws ^ (cl aw) pump. In the example of Fig. 1, the outer casing 5 serving as the stator of the pump has two rotors 1 therein. The two rotors that rotate in opposite directions and are intermeshing are positioned such that their central axes are parallel to each other. The rotors are mounted in bearings and driven by a motor 11 (shown in Figure 2 with a number of injection bees 2 along the length of the rotor) in the example of Figure 1 and circle 2 'these 2' (shown in Figure 3 Solid line) is clamped transversely to the intermeshing region of the rotor on opposite sides of the inner rotor of the pump. However, the turns may also be positioned at any radial position around the stator 5. Some of these positions are dotted Shown in Figure 3. The crucible 2 may be provided with a plurality of nozzles (not shown) for ejecting fluid, preferably distributed along the length of the dice π member 5, so that solvent or vapor is easily sprayed throughout On the rotor 1. Or, the distribution of 埠2 allows the fluid to be easily concentrated to a specific area where problems can occur. To limit the impact on the performance of the pump, it is especially important to spray the solvent during the operation of the gang. For example, if you are helping The use of a single raft at the entrance of the Pu's entrance will have a detrimental effect on the capacity of the by-products that can be transported from the vacuum chamber (not shown) by the pump. By rotating the thread of the rotor ^ a few turns Then make the solvent contact the rotor 1, which can reduce the dissolution. The possibility of contamination is caused by pouring into the machine. 96325.doc In addition, if the solvent is introduced into the inlet area 3 of the pump, the pressure at the inlet increases/the risk of flashing. In the process of maintaining the liquid phase, the solvent must be introduced to the pump discharge region where the pressure will rise. When the solvent is introduced through a plurality of 埠2 distributed along the length of the scorpion 5, the overall effect is gradually Increasing the amount of solvent present is due to the fact that the accumulation of residue on the rotor 1 may increase in the final stage of the exhaust. Another advantage that can be seen in some configurations is that in the rotor, the last few turns of the thread The addition of liquid will help seal the gap between the rotor 丨 and the stator 5 in this area of the pump. This will substantially reduce air leakage and improve the performance of the pump. In some processes, it is not advisable to help The solvent is introduced during the operation of the reactor because the waste product from the vacuum chamber accumulates at the outlet 4 of the pump for a specific purpose and should not be contaminated again. Other applications may not produce the residual amount of solvent that must be injected during operation. The extent of the material. In such cases and if there is a non-planned shutdown of the pump so that it is not possible to carry out standard routine operations such as flushing, the residue from the process will cool as the device cools down. In such cases, Mechanism stagnation occurs when deposits accumulate and become more viscous or solidify. In one of the systems of the present invention, the injection enthalpy 2 can be used to introduce solvent into the stator cavity 6 in a distributed manner without the need for If the solvent acts on the deposit to soften or dissolve it, the motor can be used to rotate the shaft to release the components without the need to apply excessive force to the rotor 1 to cause potential damage to the rotor. When the liquid is dripped through a hole in the casing, the fluid can be transported via a simple crucible 2, or a nozzle through which the fluid can be sprayed can be introduced. The control system can be introduced, and the response can be initiated in response to the range of the pump device. Subject to changing conditions, 96325.doc •10· 1344869 f was sent. For example, in the arrangement shown in Figure 5, a control system 2 provides cleaning fluid, for example, to the pump 21 via the supply conduit 22. As indicated at 24, a flushing gas system may also be provided for supplying a flushing gas such as nitrogen to the pump. If the process material is waxy or fat, a compatible solvent should be introduced to perform the dilution/cleaning function. The solvents can be provided in liquid or vapor form. Any compatible and effective cleaning medium can be used, for example, in the case of hydrocarbon-based/soluble products, xylene can be used, and in the case of water-based/soluble products, water can be used, and the other option is A cleaning agent can be used. If the process material is a by-product of the CVD process, the purge fluid can include a fluorinated gas. Examples of such cleaning fluids include, but are not limited to, cIF3, f2, NF3. The high reactivity of fluorine means that the gases react with the solid by-product m on the pumping mechanism, so that the solid by-product can be subsequently flushed from the pump by the exhaust gas. Come down. In order to prevent the fluorinated gas from corroding the internal components of the pump, carefully select the materials used to form the components in the pump that are in contact with the cleaning gas, such as the component rotor 1 and the component stator 5 and any elastomeric seals. The housing 5 shown in Fig. 4 is constructed as a double skin structure: an inner layer 12 and an outer layer 9. The inner layer 12 serves as a stator for the pump. A cavity 7' is provided between the layer 12 and the layer 9 of the casing 5 to allow a coolant such as water to circulate around the stator to conduct heat from the working portion of the pump. A cavity 7 is provided over the entire length of the rotor, i.e., a cavity 7 is provided throughout the input zone 3 and the exhaust zone 4. The cooling liquid in the cavity 7 of the casing 5 can be heated to raise the temperature of the rotor 1 in the case where the pump is stagnated by the solidification of the rotor between the rotor and the stator due to the cooling of the rotor. This increases the flexibility of the residue and can be provided in the entire cavity 7 of the body 5 by 96325.doc 11 1344869
浦内所形成殘留物程度之真實指 有助於釋放該機構 材料製成之枉8， ，該指示可因幫浦於彼特 而被扭曲。爲獲取關於幫 示’必須考量特定製程及 幫浦條件。會對幫浦條件並因此對監視參數産生影響之實 例性條件係製程室之粗糙化及清洗。 相似地，圖7顯示在幫浦内發生粒狀物質聚集期間於幫浦 之排氣部分内記錄的壓力對照時間之掃迹示波圖。該排氣 壓力對幫浦排氣管内之壓力的增加做出反應。此可用作評 定排氣沈積及阻塞之手段。而此依序又可用於確定何時及 如何將流體引入幫浦内來清除其中所形成之任何沈積物。 欲使用之流體類型的選擇將視正從事之製程/應用及沈積 物可能是固體還是粉末而定。再一次地重申，爲消除對所 聚積沈積物之錯誤暗示，將該資料與來自該工具或與該工 具相關之資料相結合是甚爲有益的。 圖11顯示一通用型唧送佈置。於一欲抽真空之室的下游 設置一幫浦81。該室形成例如用於製造半導體晶圓或平板 式顯示器及類似元件之工具83之一部分。該室與幫浦81之 入口 3成流體連通狀。槔2沿幫浦81之長度設置於不同位 置。該等埠經由導管82而被連接至一流體輸送系統84，該 96325.doc -12- 1344869 輸送系統可被構形成可輸送惰性沖洗氣體或清洗液體或兼 送兩樣者，下文將對此予以更爲詳細之說明。 來自工具83之資料通常沿延伸於該工具與控制器80間之 通訊線86而被提供至該控制器。該資料通常係關於在工具 83内正霄細之製程。該資料之實例係：於任一特定時間向 工具中輸送何種材料、輸送該等材料進入該室之速率、工 具之狀態及製程室内之壓力或溫度。其他指示幫浦81内環 楗之貧料沿通訊線85而被提供至控制器8〇。該幫浦環境資 料了匕括幫庸内或幫浦排氣區域内之壓力、溫度或氣體流 率、幫浦之功率要求或幫浦所産生之振動。然後，使用提 供至控制器8 0之資料來決定欲經由導管8 2及埠2自流體輸 送系統84向幫浦81輸送之流體的類型、數量及持續時間。 然後，控制器80沿通訊線87向流體輸送系統料提供一信號。 圖8顯示一實施<列’其中指示繁浦環境之資料係一關於馬 達電流之資料。該資料與來自製程工具38之資料一起提供 至控制器30。幫浦31由馬達35驅動。如先前各圖所示若 干埠2沿幫浦設置於不同位置處。藉由供應導管雜由閥門 34將來自氣體供應褒置33之氣體供應至該等琿。向控制器 3〇提供-指示馬達電流之信號36及一指*製程資料之信號 37。控制器30結合使用該等資料決定是否應將說化氣體經 由槔2供應至幫浦31以抵制聚積沈積物之形成。該氣化氣體 可由一氟產生器供應，或使用諸如MKS Astr〇n電漿産生器 自諸如NF3、C2F6、SF6或相似氣體流中抽取I化氣體來 産生氟自由基。或者，如此處所示，可簡單地自氣體儲存 96325.doc -13· 1344869 容器33輸送氟。 通常’閥門34之陣列由控制器3〇排序，以根據需要響應 所提供之馬達電流及製程資料使幫浦3丨之相關部分接觸氟 氣體。提供至控制器30之馬達電流及製程資料之詰合不僅 控制每一次氟氣注入之定時且亦控制每一次氟氣注入之持 續時間及數量。 圖9顯示一更爲複雜之實施例。真空幫浦41由馬達45驅 動。再一次重申，埠2設置於幫浦内之不同位置，該等埠藉 由供應導管42及49連接至沖洗氣體模組5〇。供應導管中設 置一三向閥門陣列44 ’以使經由導管42及49供應之兩種氣 體皆能夠或皆不能到達埠2。沖洗氣體模組5〇通常（如此處 所示）具有兩個各用於一種氣體之入口連接51，52。於該實 例中，控制器40設置用以接收來自三個來源之資料。如同 於先則貫施例中’提供一指示馬達電流之信號46，但額外 亦提供一指示真空幫浦41之排氣部分53内壓力之信號48。 如上所述，控制器4〇結合使用該資料與製程資料47來決定 是否應將氟氣或惰性沖洗氣體（諸如氮）或兩種氣體引入幫 浦41。 模組50之控制器40藉由入口連接51及52於兩個氣體供應 裝置43及54之間轉換。一般而言，可向每一閥門44提供任 一種氣體。由於每一閥門44連接至幫浦41内一不同埠2，因 此可向不同位置供應不同氣體。當期望將腐蝕性氟化氣體 集中至某些特定區域而同時保護其他對該等腐蝕性材料更 爲敏感之區域（諸如幫浦41之密封區域）時，此作法甚爲有 96325.doc -14- 1344869 益。於此情況中，可在佶用畜外皮 在使用氣化a體沖洗經受 之區域（通常爲幫浦之工作表面） 物聚積 沖洗幫浦41之密封區域。 體 另一選擇爲，每一埠2可構造用於 構&用於向幫浦41之内表面上注 入腐蝕性氣體達一特定時間，繼而 叉用If性沖洗氣體沖法 幫浦41 一段時間。以此方式，腐 蜗蚀材枓不會存留於幫浦41 内，因此幾乎不會對内部組件造成損壞。 另外’可將氣流量測裝置納入該實例中以確認可在幫浦 内之某-位置達成任一氣體之預期流率。此不僅導致公用 氣體之最佳化並因此降低運作/所有權之成本，且亦減少腐 蝕並因此改良幫浦之可靠性/壽命。 圖H)顯示-於沈積物爲粉末狀殘留物之情況下使用之實 施例。可藉由使用高壓料沖洗氣體切受影㈣域來除 去殘留物。於傳統系統中’豸常避免使用高壓沖洗氣體， 此乃因由於需要使用大量氣體，此氣體之使用極爲昂貴。 藉由實施上述方法，可最佳化沖洗氣體之用量，使其恰好 足以除去幫浦内形成之實際沈積物。 於。亥貫知例中’真空幫浦61具有若干埠2，其經由供應導 管62及閥門60連接至-沖洗氣體供應裝置。此處設置兩個 氣體模組：標準沖洗氣體模組63以標準沖洗壓力提供常例 沖洗氣體，第二沖洗氣體模組係湍流沖洗氣體模組64。湍 流沖洗氣體模組64包括一高壓調節器66，其能夠經閥門65 控制將氣體以兩於2巴之壓力供應至幫浦。控制器67將其所 獲得的指示幫浦61排氣部分69中壓力之信號68與製程資料 96325.doc •15· 丄*344869 ^號70結合使用來支配高壓沖洗氣體之供應。 具體而言，控制器67不僅能夠精確地確定氣體量，且亦 &夠僅將該氣體局部注入問題區域。若該等沈積物形成於 幫浦61之排氣部分69内，則可於幫浦之正常運行期間使用 本發明之該實施例，然而，若沈積物距人口並非如此之遠， 貝』乂須虽幫满脫離製程時且製程室與幫浦61之間之前級管 路中閥門71關停時對幫’浦進行沖洗。於該實施例中，控制 器67亦接收關於前級管路閥⑽狀態之資料，以防止當幫 ’煮61在線k啓動排氣部分69上游之高壓沖洗。 t U體模組6何設置爲幫浦之標準沖洗氣體模 言-晋之/组成部分’或其亦可獨立於標準沖洗氣體模組63 置一門^標準冲洗乳體汁洗系統63與高屋調節器66之間設 Γ ，以在必要時允許高I氣體進人該系統。 不==之控制器皆可根據對幫浦條件之分析達成 尖峰，則「正常/馬f電流資料爲例，若未制到電流 何氣體。若偵測到某些尖峰，：可使且:需：幫浦内注入任 高壓沖洗氣體之潛在·「有==少，體或 測到多個非由作業或哪送條件引起不監視構件正傾 正頻繁出頊明gs 穴峰’此表明幫浦内 頻繁出現明顯之沈積物聚積。此 抑制該等沈積物之聚積極“冑使用上述方法 有效應用該方法，尖峰之皿：監視構件注意到即使 維護J模4，此時於下仍#问’則幫浦進人「需要 夺機需要對幫浦進行進-步干涉， 96325.doc 1344869 以使製程室内之任何製品不處於危險令。 本發明並不僅限於用於螺旋式幫浦中，而亦可容易地應 用於其他類型之幫料，例如N。心y(「爪式」）幫浦或魯 式幫浦。 應理解，上述說明僅代表本發明乏若干實施例，熟悉此 項技術者無疑會構想出本發明之其他實施例且並不脫離本 文隨附專利申請範圍所界定之本發.明之真實範疇。 【圖式簡單說明】 圖1顯示一螺旋式幫浦之示意圖； 圖2顯示一雙端螺旋式幫浦之示意圖； .圖3爲圖1及圖2所示幫浦之端面剖視圖； 圖4爲顯示注入埠之實施方案之一水套部分之詳細視圖； 圖5顯示一向幫浦内供應流體之佈置； 圖6顯示一真空幫浦正經受沈積物聚積之狀況下馬達電 流相對於時間之波形圖； 圖7顯示一取自於正經受沈積物聚積之真空幫浦之排氣 口處壓力相對於時間之波形圖； 圖8顯示一根據本發明之一實施例之唧送佈置； 圖9顯示一根據本發明之第二實施例之唧送佈置； 圖10顯示一根據本發明之第三實施例之唧送佈置；及 圖11顯示圖8至圖1 〇中更詳細繪示之一般u即送佈置。 【主要元件符號說明】 1 轉子 2 埠 96325.doc -17· 1344869 3 入口 4 出口 5 外殼 6 定子空腔 7 空腔 8 柱 9 外層 10 軸承 11 馬達 12 内層 20 控制系統 21 幫浦 22 供應導管 30 控制器 32 供應導管 33 氣體供應裝置 34 閥門 35 馬達 36 馬達電流之信號 37 製程資料之信號 38 處理工具 40 控制器 41 真空幫浦 42 導管The true extent of the residue formed in Pune helps to release the material made of the material, which can be distorted by the pump. In order to obtain help, you must consider specific processes and pump conditions. The actual conditions that affect the pump conditions and therefore the monitoring parameters are the roughening and cleaning of the process chamber. Similarly, Figure 7 shows a oscillographic oscillogram of the pressure versus time recorded in the vent portion of the pump during the accumulation of particulate matter within the pump. This exhaust pressure reacts to an increase in the pressure in the pump exhaust pipe. This can be used as a means of assessing exhaust deposition and clogging. This in turn can be used to determine when and how to introduce fluid into the pump to remove any deposits formed therein. The choice of fluid type to be used will depend on the process/application being used and whether the deposit may be solid or powder. Once again, it is useful to combine this information with information from or related to the tool to eliminate false impressions of accumulated deposits. Figure 11 shows a general purpose delivery arrangement. A pump 81 is placed downstream of the room where the vacuum is to be evacuated. The chamber forms part of a tool 83 such as is used to fabricate semiconductor wafers or flat panel displays and the like. The chamber is in fluid communication with the inlet of the pump 81.槔2 is set at different positions along the length of the pump 81. The crucibles are coupled to a fluid delivery system 84 via a conduit 82 that can be configured to deliver an inert flushing gas or a cleaning fluid or both, as will be described below. For a detailed explanation. Information from tool 83 is typically provided to the controller along a communication line 86 extending between the tool and controller 80. This information is usually about the process that is in the tool 83. Examples of such data are: what materials are delivered to the tool at any given time, the rate at which the materials are delivered into the chamber, the state of the tool, and the pressure or temperature within the process chamber. Other indicators indicating the inner ring of the pump 81 are supplied to the controller 8 along the communication line 85. The pump's environmental information includes the pressure, temperature or gas flow rate in the venting area of the gang or the pump, the power requirements of the pump, or the vibration generated by the pump. The information provided to the controller 80 is then used to determine the type, amount, and duration of fluid to be delivered from the fluid delivery system 84 to the pump 81 via conduits 8 2 and 埠2. Controller 80 then provides a signal to fluid delivery system material along communication line 87. Figure 8 shows an implementation <column' which indicates the data of the ubiquitous environment as a data about the motor current. This information is provided to controller 30 along with information from process tool 38. The pump 31 is driven by a motor 35. As shown in the previous figures, the 埠2 is placed at different positions along the pump. Gas from the gas supply means 33 is supplied to the crucible by a supply conduit valve 34. A signal 37 indicating the motor current and a signal 37 indicating the process data are supplied to the controller 3. The controller 30 uses this information in combination to determine whether the clarified gas should be supplied to the pump 31 via 槔2 to resist the formation of accumulated deposits. The gasification gas may be supplied by a fluorine generator or a fluorine gas may be extracted from a gas stream such as NF3, C2F6, SF6 or the like using a gas generator such as MKS Astr〇n. Alternatively, as shown herein, the fluorine can be delivered simply from the gas storage 96325.doc -13· 1344869 container 33. Typically, the array of valves 34 is ordered by the controller 3 to respond to the supplied motor current and process data as needed to expose the relevant portion of the pump to the fluorine gas. The combination of motor current and process data provided to controller 30 not only controls the timing of each fluorine gas injection but also controls the duration and amount of each fluorine gas injection. Figure 9 shows a more complicated embodiment. The vacuum pump 41 is driven by a motor 45. Again, the 埠2 is placed at different locations within the pump, which are connected to the flushing gas module 5〇 by supply conduits 42 and 49. A three-way valve array 44' is provided in the supply conduit so that both gases supplied via conduits 42 and 49 can or cannot reach 埠2. The flushing gas module 5 is typically (as shown here) having two inlet connections 51, 52 for each gas. In this example, controller 40 is configured to receive data from three sources. A signal 46 indicating the motor current is provided as in the previous embodiment, but additionally a signal 48 indicative of the pressure in the exhaust portion 53 of the vacuum pump 41 is provided. As described above, the controller 4 uses the data and process data 47 in combination to determine whether fluorine gas or an inert purge gas (such as nitrogen) or both gases should be introduced into the pump 41. The controller 40 of the module 50 is switched between the two gas supply devices 43 and 54 by inlet connections 51 and 52. In general, any valve 44 can be supplied to each valve 44. Since each valve 44 is connected to a different 埠2 in the pump 41, different gases can be supplied to different locations. When it is desired to concentrate corrosive fluorinated gases to certain areas while protecting other areas that are more sensitive to such corrosive materials (such as the sealing area of the pump 41), this practice is very much 96325.doc -14 - 1344869 benefits. In this case, the sealing area of the rinsing pump 41 can be accumulated in the area where the rinsing of the sputum is used (usually the working surface of the pump). Alternatively, each crucible 2 can be configured to construct & for injecting corrosive gas onto the inner surface of the pump 41 for a specific period of time, and then forking with a If flushing gas pump for a period of time 41 . In this way, the smoldering material does not remain in the pump 41, so there is almost no damage to internal components. In addition, a gas flow measuring device can be incorporated into the example to confirm that the desired flow rate of any gas can be achieved at a certain location within the pump. This not only leads to the optimization of the utility gas and thus the cost of operation/ownership, but also reduces corrosion and thus improves the reliability/lifetime of the pump. Figure H) shows an embodiment used in the case where the deposit is a powdery residue. The residue can be removed by using a high pressure material to flush the gas into the shadow (4) domain. In conventional systems, high pressure flushing gases are often avoided because of the extremely expensive use of this gas due to the large amount of gas required. By carrying out the above process, the amount of flushing gas can be optimized to just remove the actual deposit formed in the pump. to. In the example, the vacuum pump 61 has a plurality of turns 2 connected to the flushing gas supply via the supply conduit 62 and the valve 60. Two gas modules are provided here: a standard flush gas module 63 provides a conventional flushing gas at a standard flushing pressure, and a second flushing gas module is a trickle flushing gas module 64. The turbulent flushing gas module 64 includes a high pressure regulator 66 that is capable of controlling the supply of gas to the pump at a pressure of two to two bars via valve 65. The controller 67 uses the signal 68 indicating the pressure in the exhaust portion 69 of the pump 61 to be used in conjunction with the process data 96325.doc •15· 丄*344869^70 to govern the supply of high-pressure flushing gas. In particular, the controller 67 is not only capable of accurately determining the amount of gas, but also & only enough to locally inject the gas into the problem area. If the deposits are formed in the venting portion 69 of the pump 61, the embodiment of the invention can be used during normal operation of the pump, however, if the deposit is not so far from the population, When the valve is shut off from the process and the valve 71 in the previous stage between the process chamber and the pump 61 is shut down, the pump is flushed. In this embodiment, the controller 67 also receives information regarding the status of the foreline valve (10) to prevent high pressure flushing upstream of the exhaust portion 69 when the boiler 61 is activated. t U body module 6 is set to the standard flushing gas model of the pump - Jinzhi / component 'or it can also be set independently of the standard flushing gas module 63 ^ standard rinse milk juice washing system 63 and high house adjustment Γ is provided between the devices 66 to allow high I gas to enter the system when necessary. Controllers that do not == can achieve spikes based on the analysis of the pump conditions. For example, "normal/horse current data is used as an example. If no current is generated, if some spikes are detected, then: Need: the potential of injecting any high-pressure flushing gas into the pump. "There are == less, the body or the measured multiple non-operational or which conditions cause the non-monitoring component to be tilted frequently and the gs peaks are frequently seen." There is frequent accumulation of sediment in Puzhong. This inhibits the accumulation of these deposits. “The method is effectively applied by the above method. The sharp dish: the monitoring member notices that even if the J model 4 is maintained, it is still under the ## 'There is a helper to enter the people. "The need to seize the machine requires a step-by-step intervention on the pump, 96325.doc 1344869 so that any product in the process chamber is not in danger. The invention is not limited to use in a spiral pump, and It can also be easily applied to other types of materials, such as N. Heart y ("claw") pump or Lu-style pump. It is to be understood that the foregoing description is only illustrative of the embodiments of the invention, and the embodiments of the present invention are not intended to be limited by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a schematic view of a spiral pump; Figure 2 shows a schematic diagram of a double-ended spiral pump; Figure 3 is a cross-sectional view of the end of the pump shown in Figures 1 and 2; A detailed view of the water jacket portion of one of the embodiments of the injection enthalpy is shown; Figure 5 shows the arrangement of the fluid supply in the vertical pump; Figure 6 shows the waveform of the motor current versus time for a vacuum pump being subjected to deposition of deposits. Figure 7 shows a waveform of pressure versus time at the exhaust port of a vacuum pump that is undergoing deposition of deposits; Figure 8 shows a feed arrangement in accordance with an embodiment of the present invention; FIG. 10 shows a feed arrangement according to a third embodiment of the present invention; and FIG. 11 shows a general drawing of FIG. 8 to FIG. Arrangement. [Main component symbol description] 1 Rotor 2 埠96325.doc -17· 1344869 3 Inlet 4 Outlet 5 Enclosure 6 Stator cavity 7 Cavity 8 Column 9 Outer layer 10 Bearing 11 Motor 12 Inner layer 20 Control system 21 Pump 22 Supply conduit 30 Controller 32 Supply conduit 33 Gas supply 34 Valve 35 Motor 36 Motor current signal 37 Process data signal 38 Processing tool 40 Controller 41 Vacuum pump 42 conduit
96325.doc -18- 1344869 43 氣體供應裝置 44 三向閥門 45 馬達 46 馬達電流之信號 47 製程資料 48 壓力之信號 49 導管 50 氣體模組 51 入口連接 52 入口連接 53 排氣部分 54 氣體供應裝置 60 閥門 61 真空幫浦 62 供應導管 63 標準沖洗氣體模組 64 氣體模組 65 閥門 66 高壓調節器 67 控制器 68 壓力之信號 69 排氣部分 70 製程資料之信號 71 閥門 96325.doc -19- 1344869 80 控制器 81 幫浦 82 導管 83 工具 84 流體輸送系統 85 通訊線 86 通訊線 87 通訊線 96325.doc -20-96325.doc -18- 1344869 43 Gas supply unit 44 Three-way valve 45 Motor 46 Motor current signal 47 Process data 48 Pressure signal 49 Catheter 50 Gas module 51 Inlet connection 52 Inlet connection 53 Exhaust part 54 Gas supply 60 Valve 61 Vacuum pump 62 Supply conduit 63 Standard flushing gas module 64 Gas module 65 Valve 66 High pressure regulator 67 Controller 68 Pressure signal 69 Exhaust part 70 Signal of process data 71 Valve 96325.doc -19- 1344869 80 Controller 81 Pump 82 Catheter 83 Tool 84 Fluid Delivery System 85 Communication Line 86 Communication Line 87 Communication Line 96325.doc -20-