1343770 九、發明說明： 替換私(2, 【發明所屬之技術領域】 本發明係關於一種軟硬板之製造方法，尤指一種適於 製造不規則形狀軟硬板，且無須多道定位對準步驟之軟硬 板製造方法。 【先前技術】 凡電子產品對縮小體積均抱持高度的興趣，而縮小體 積的手段之一即是對有限空間作最大效率的應用，因此， 電子產品内部重要的元件：「電路板」，在形式上亦必須 符合有效運用空間的要求。至於如何縮小電路板佔用空間 ’折疊或捲撓是可以考慮的方向，然而前提是：電路板必 須可撓。以目前的技術，軟式電路板（或稱薄膜電路板）可 以滿足此一要求’但構造及功能上卻無法完全取代硬式電 路板，因而有所謂「軟硬板」的問世。 如第三圖所示’揭露有一軟硬板（80)的示意圖，其中 央厚度較薄的部分為一軟板部（81)，軟板部（81)兩端的較 厚部分則為硬板部（82)，該軟板部（81)與硬板部（82)部分重 曼，並分別形成有線路，其二者的線路透過雷射鑽孔、電 链等技術相互電連接。由於兩硬板部（82)之間為一可撓的 軟板部（81) ’故可利用軟板部（81)的撓曲使兩硬板部（82)得 以相對折疊。 儘管前述軟硬板（8〇)可以滿足市場的需要，但在構造 上則有檢討之餘地，原因在於前述軟硬板（80)的軟板部 1343770 (81)與硬板部（82)大面積地相互重疊，更具體的說，硬板 部（82)中間包含有軟板基材（810)，但軟板材料的特性不同 於硬板材料，若採取該等複合式疊層構造，必須考慮該軟 板基材（810)的影響，重新設計硬板部（82)的特性諸元（例 如線寬、阻抗等）。 為避免重新開發所帶來的成本負擔，市面上遂有另種 軟硬板問世，如第四圖所示，該軟硬板（90)的軟板部（91) 與硬板部（92)重疊部位被限制在一定的寬度以内，如此一 來，軟板部（91)將不再對硬板部（92)產生顯著的影響，有 關硬板部（92)的線路設計可以沿用舊有的經驗，不須重新 開發，因而縮短了導入軟硬板的學習曲線。儘管如此，其 仍然存在製程技術困難繁複的問題》 請參閱第五圖所示，揭露有前述軟硬板（90)的製造方 式，主要係先製作出複數的軟板模組（911 )，再以該等軟板 模組（911)配合一治具（7 0)進行硬板製程。請配合參閱第六 圖所示’該等軟板模組（911)係於一軟板基材（910)上製作 完成，每一軟板模組（911)的相對兩側分別形成有定位孔 (912)，其經裁切後再進行硬板製程。 仍請參閱第五圖所示，該硬板製程係先在具有複數定 位柱（701)(702)的治具（70)上依序覆設下層銅皮（71)、下膠 層（72)、軟板模組（911)、硬板基材（920)、上膠層（73)及上 層銅皮（74);其中： 下、上膠層（72)(73)上分具定位孔（721)(722)(731) (732)，其中位於外圍的定位孔（721 )(731)係對應於治具 1343770 (70)上的定位柱（701) ’内圍的成對定位孔（722)(732)則分 別對應於軟板模組（911)上的定位孔（91 2)及治具（7〇)上内 圍的定位柱（702)。經過定位與疊合後即進行壓合，其後再 經過雷射鑽孔、電鍍等技術使軟板、硬板上的線路構成電 連接。 由上述可明顯看出，該等軟硬板製程係針對每一軟板 模組（911)作定位後進行壓合作業。然而，前述製程應用在 製造規則且固定形狀的軟硬板時問題尚不顯著，然用於製 造如第七圖所示的不規則形狀軟硬板時，其製程即變得繁 瑣複雜··如圖所示之軟硬板（60)具有六個不同形狀的軟板 部（61)〜（66)，相鄰的軟板部（61)〜（66)之間則設為不同形狀 的硬板部（67)，在此狀況下將產生如下問題： 1. 由於每一軟板部（61)~(66)之形狀不同，故必須透 過獨立的軟板製程在不同的軟板基材上完成。 2. 由前述不同軟板基材上裁切取出的軟板模組在進行 硬板製程時’不同的軟板模組必須分別使用治具進行一次 定位對準，因而增加對準時發生誤差的機率。 3·小面積的軟板模組涉及精準的空間安排，對於治具 的設計與使用均是極高難度的挑戰。 【發明内容】 由上述可知，既有軟硬板製程並不適合應用在不規則 形狀軟硬板的製造，故有待進一步檢討，並謀求可行的解 決方案。 6 1343770 因此’本發明主要目的在提供一種軟硬板之製造方法 ’其可在一次叠板作業令完成麼合作業準備，且適用於規 則或不規則形狀軟硬板的製造’有效解決傳統製程製造不 規則形狀軟硬板時遭遇的問題。 為達成前述目的採取的主要技術手段係令前述方法包 括： 提供一軟板基材； 於軟板基材上製作複數的軟板區； 於軟板基材上各軟板區的相鄰位置上開孔，以分別構 成一硬板作業區； 在前述具有軟板區及硬板作業區的軟板基材上進行至 少一道硬板壓合流程，而在硬板作業區内分別構成一硬板 區 ； 對前述軟板基材上各硬板區施以一層間導通手段，而 在硬板區與軟板區之間構成必要的電連接； 裁切前述軟板基材以產生一個以上具有軟板部、硬板 部之軟硬板； 利用前述技術可在同一軟板基材上透過單一疊板步驟 凡成壓合作業之準備，進而完成軟硬板的製作；由於軟硬 板的硬板部除必要重疊部位外未含有軟板，故無須因軟板 而重新開發設計；又因係在同一軟板基材上進行硬板製程 ，即使待製造的軟硬板係為不規則形狀，亦無須透過獨立 製程分別製造不同形狀的軟板模組，再透過複數道的定位 對準步驟方能完成壓合作業的準備，故在製程效率上可以 7 1343770 顯者且大幅的增進；再者，由於係針對同一張軟板基材進 行定位對準，因此對於小面積的軟板區、硬板區均不存在 不易加工的問題。 【實施方式】 有關本發明之一較佳實施例，首先請參閱第一圖所示 ，主要係以整張已製作有複數軟板區（11)的軟板基材（10) 在一治具（20)上進行硬板製程，請參閱第二圖所示，係前 述軟板基材（10)之平面圖，於本實施例中，該軟板基材 (1〇>於四角落處分別形成有一定位孔（101)，該定位孔 (101)係匹配於治具（20)上所形成的定位柱（2〇1)，又軟板 基材（10)經過軟板製程後在其上形成有複數的軟板區（11) ，該軟板區（1 1)可為相同或不同形狀，可作規則或不規則 排列’於本實施例中，各軟板區（彳彳）為規則之形狀，且作 矩陣排列。 與傳統製程不同，本發明在軟板基材（10)上進行軟板 製程而形成軟板區（11)後，並不由軟板基材（10)上裁切分 離’而是隨整張軟板基材（10) 一起進行硬板製程；本發明 在進行硬板製程前，係在軟板基材（1 0)上進行開孔，於本 實施例’係在每一軟板區（彳1)的兩端開孔以分別形成一硬 板作業區（12)，該硬板作業區（彳2)係呈矩形狀且透空，其 内部空間係供製作硬板區之用，而前述軟板區（11)兩端係 延伸至硬板作業區（12)内而局部地與硬板作業區（12)重疊 ’重疊部位的面積以不超過硬板作業區（12)面積的20。/〇為 8 1343770 原則，惟當軟板區（11)與硬板作業區（12>面積相近或軟板 區（11)面積大於硬板作業區（12)，則不受前述原則限制》 又請參閱第一圖所示，該軟板基材（10)製作完成軟板 區（11)及硬板作業區（12)後，即可用以配合治具（20)進行壓 合作業： 前述壓合作業流程為一道以上，以下係以單一壓合作 業流程為例：進行壓合作業前，係在治具（2〇)上依序覆設 一下層銅皮（21)、一下膠層（22)、軟板基材（10)、一上膠層 (23)及一上層銅皮（24);其中： 該下、上膠層（22)(23)的外圍分別形成定位孔（220) (230)，各定位孔（220)(230)同時對應於軟板基材（1〇)上的 定位孔（101)，並同時為治具（20)上的定位柱（2〇1)穿置而 構成定位。又下、上膠層（22)(23)上形成有複數開口 (221)(23Ί) ’該等開口（221)(23Ί)分別對應於軟板基材（1〇) 上各軟板區（11)，亦即該軟板區（11)除兩端與硬板作業區 (12)重疊的部位外’其他部分不上膠層。俟完成前述準備 步驟後’即進行壓合，在壓合時，下、上膠層（22)(23)將 進入軟板基材（10)的硬板作業區（12)内，該下、上層銅皮 (21)(24)亦被壓合在下、上膠層（22)(23)的表底面以形成銅 層’遂在各硬板作業區（12)内分別形成一硬板區，以上所 述者為單一道壓合作業流程之實施步驟，在完成前述步驟 後’可在硬板區的銅層上形成線路，又利用雷射鑽孔、電 鍍等層間導通技術使硬板區上的線路與軟板區（彳彳）上的線 路電連接；如欲增加硬板區的層數，即重複前述步驟，直 9 1343770 至完成預定的層數為止。 最後則經裁切即可產生複數兼具軟板部與硬板部的軟 硬板。 前述實施例係說明本發明應用在規則形狀的軟硬板製 造’而該等製程應用在不規則形狀及/或具有複數軟板部 、硬板部的軟硬板，則其效益更為顯著： 仍請參閱第七圖所示，如前揭所述，該軟硬板（60)具 有六個不同形狀的軟板部（61卜（66)，相鄰的軟板部 (61)〜（66>之間則設為不同形狀的硬板部（67)，若運用本發 明之方法，則該等軟板部（61)〜（66)係在同一軟板基材上進 行軟板製程所構成’無須透過六道獨立的軟板製程分別產 生’再者，連結各軟板部（61)〜（66)的硬板部（67)亦是在同 一軟板基材上進行硬板壓合作業所構成，在製程效率上已 有顯著提升，且硬板部（67)除與軟板部（61)-(66)必要的重 叠部位外均不含軟板’無須為考量軟板因素而重新開發設 計。 由上述可知’本發明一較佳實施例的具體技術内容， 而利用該等技術可在同一軟板基材上透過單一疊板步驟完 成壓合作業之準備，進而完成軟硬板的製作，而該等製程 至少具備下列優點： 1. 由於軟硬板的硬板部除必要重疊部位外未含有軟板 ’故無須因成板而重新開發設計，故可節省開發成本。 2. 由於係在同一軟板基材上分別進行軟板製程及硬板 製程，即使待製造的軟硬板係為不規則形狀，無須透過獨 立製程分別製造不同形狀的k 狀的軟板椟組，亦無須再透過複數 道的定位對準步驟方能$ &蔽X & 哪万此儿成壓合作業的準備，故可顯著地 增進製程效率。 3·在裟中由於係針對同一張軟板基材進行定位對準 因此軟板基材上的軟板區、硬板區不論面積大小，均可 獲得確實的定位。 【圖式簡單說明】 第一圖：係本發明之製程示意圖。 第二圖：係本發明所採用軟板基材之平面圖。 第三圖：係一種既有軟硬板之剖視圖。 第四圖：係又一種既有軟硬板之剖視圖。 第五圖.係又一種既有軟硬板之製程示意圖。 之 第六圖.係又一種既有軟硬板製程所採用軟板基材 平面圖。 第七圖：係再一種軟硬板之平面圖。 【主要元件符號說明】 (10)軟板基材 (1 1)軟板區 (20) 治具 (21) 下層銅皮 (23)上膠層 (220)(230)定位孔 (60)軟硬板 (1 01)定位孔 (12)硬板作業區 (201)定位柱 (22)下膠層 (24)上層銅皮 (221)(231)開口 (61卜（66)軟板部 1343770 (67)硬板部 (701)(702)定位柱 (72)下膠層 (74)上層銅皮 (81) (91)軟板部 (82) (92)硬板部 (912)定位孔 (70) 治具 (71) 下層銅皮 (73)上膠層 (80)(90)軟硬板 (810)(910)軟板基材 (911)軟板模組1343770 IX. INSTRUCTION DESCRIPTION: ALTERNATIVE PRIVATE (2, [Technical Field] [Invention] The present invention relates to a method for manufacturing a soft and hard board, and more particularly to a method for manufacturing irregularly shaped soft and hard boards without multi-directional positioning The method of manufacturing soft and hard boards in steps. [Prior Art] Where electronic products are highly interested in reducing the volume, one of the means of reducing the volume is to apply the maximum efficiency to the limited space. Therefore, the internals of the electronic products are important. Component: "Circuit board" must also meet the requirements for effective use of space in terms of form. As for how to reduce the space occupied by the board 'folding or curling is a direction that can be considered, but the premise is: the board must be flexible. With the current Technology, flexible circuit boards (or thin circuit boards) can meet this requirement 'but the structure and function can not completely replace the hard circuit board, so there is the so-called "soft and hard board". As shown in the third figure 'exposure There is a schematic diagram of a soft and hard plate (80), wherein a thin portion at the center is a soft plate portion (81), and a thick portion at both ends of the soft plate portion (81) is The hard plate portion (82) is partially heavy-weighted with the hard plate portion (82) and is formed with a circuit, and the lines of the two are electrically connected to each other through laser drilling, electric chain, and the like. Since the two hard plate portions (82) are a flexible soft plate portion (81)', the two hard plate portions (82) can be relatively folded by the deflection of the soft plate portion (81). The hard board (8〇) can meet the needs of the market, but there is room for review in the structure, because the soft board part 1343770 (81) and the hard board part (82) of the soft and hard board (80) are mutually large-area. Overlap, more specifically, the soft plate substrate (810) is contained in the middle of the hard plate portion (82), but the characteristics of the soft plate material are different from those of the hard plate material. If such a composite laminated structure is adopted, the soft must be considered. The influence of the board substrate (810), redesigning the characteristics of the hard board part (82) (such as line width, impedance, etc.) In order to avoid the cost burden of redevelopment, there is another kind of soft and hard board on the market. Appeared as shown in the fourth figure, the overlap between the soft plate portion (91) and the hard plate portion (92) of the soft and hard plate (90) is limited to a certain extent. Within the width, the soft plate portion (91) will no longer have a significant impact on the hard plate portion (92), and the circuit design for the hard plate portion (92) can follow the old experience without redevelopment. Therefore, the learning curve of the introduction of the soft and hard board is shortened. However, there are still problems of complicated process technology. Please refer to the fifth figure to disclose the manufacturing method of the aforementioned soft and hard board (90), which is mainly produced first. The plurality of soft board modules (911) are further hard-processed by using the soft board module (911) with a jig (70). Please refer to the figure 6 for the soft board module (see 911) is formed on a soft board substrate (910), and opposite sides of each soft board module (911) are respectively formed with positioning holes (912), which are cut and then subjected to a hard board process. Still referring to the fifth figure, the hard board process firstly lays the lower copper layer (71) and the lower layer (72) on the fixture (70) having a plurality of positioning posts (701) (702). a flexible board module (911), a hard board substrate (920), a glue layer (73) and an upper copper layer (74); wherein: the lower and upper glue layers (72) (73) are provided with positioning holes ( 721) (722) (731) (732), wherein the positioning holes (721) (731) located at the periphery correspond to the pair of positioning holes (722) of the inner circumference of the positioning post (701) on the fixture 1343770 (70) (732) corresponds to the positioning hole (91 2) on the flexible board module (911) and the positioning post (702) on the inner circumference of the fixture (7〇). After positioning and lamination, the film is pressed, and then laser drilling, electroplating and other techniques are used to electrically connect the wires on the soft board and the hard board. It can be clearly seen from the above that the soft and hard board processes are pressed for each soft board module (911). However, the above-mentioned process application is not significant when manufacturing a regular and fixed-shaped soft and hard board, and when it is used to manufacture an irregular-shaped soft and hard board as shown in the seventh figure, the process becomes complicated and complicated. The soft and hard plate (60) shown in the figure has six different shapes of soft plate portions (61) to (66), and adjacent soft plate portions (61) to (66) are provided with hard plates of different shapes. Part (67), in this case, the following problems will occur: 1. Since each of the soft board parts (61) to (66) has a different shape, it must be completed on a different soft board substrate through a separate flexible board process. . 2. When the soft board module is cut out from the different soft board substrates, the different soft board modules must be aligned once using the fixture, thus increasing the probability of errors during alignment. . 3. The small-area soft board module involves precise space arrangement, which is a very difficult challenge for the design and use of the fixture. SUMMARY OF THE INVENTION It can be seen from the above that the soft and hard board process is not suitable for the manufacture of irregular shaped soft and hard boards, so further review is needed and a feasible solution is sought. 6 1343770 Therefore, 'the main purpose of the present invention is to provide a method for manufacturing a soft and hard board' which can be completed in a single stacking operation, and is suitable for the manufacture of regular or irregular shaped soft and hard boards. Problems encountered in making irregularly shaped hard and soft boards. The main technical means for achieving the foregoing objectives are that the method comprises: providing a soft board substrate; forming a plurality of soft board areas on the soft board substrate; and adjacent positions of the soft board areas on the soft board substrate Opening holes to respectively form a hard board working area; performing at least one hard board pressing process on the soft board substrate having the soft board area and the hard board working area, and forming a hard board in the hard board working area Zone; applying a layer of conduction means to each of the hard board regions on the soft board substrate, and forming a necessary electrical connection between the hard board area and the soft board area; cutting the soft board substrate to produce more than one soft The soft and hard board of the board part and the hard board part; the above technology can be used to prepare the soft and hard board through the single stacking step on the same soft board substrate; the hard board of the soft and hard board is completed. The part does not contain a soft board except for the necessary overlapping parts, so it is not necessary to redevelop the design due to the soft board; and because the hard board process is performed on the same soft board substrate, even if the soft and hard board to be manufactured is irregular shape, No need to go through separate processes The manufacture of soft-plate modules of different shapes can be completed through the positioning and alignment steps of the plurality of tracks, so that the process efficiency can be significantly improved by 7 1343770; moreover, because the system is for the same piece Since the flexible board substrate is positioned and aligned, there is no problem that it is difficult to process for a small area of the soft board area and the hard board area. [Embodiment] Referring to a preferred embodiment of the present invention, first, as shown in the first figure, the main part is a whole soft board substrate (10) having a plurality of soft board regions (11). (20) Performing a hard board process, as shown in the second figure, is a plan view of the soft board substrate (10). In the embodiment, the board substrate (1〇> Forming a positioning hole (101), the positioning hole (101) is matched with the positioning post (2〇1) formed on the jig (20), and the soft board substrate (10) is passed through the soft board process. Forming a plurality of soft board areas (11), the soft board areas (11) may be the same or different shapes, and may be arranged in a regular or irregular manner. In this embodiment, each soft board area (彳彳) is a rule. The shape is arranged in a matrix. Unlike the conventional process, the present invention is not cut by the soft board substrate (10) after performing a soft board process on the soft board substrate (10) to form the soft board area (11). Separating 'but a hard board process with the entire soft board substrate (10); the invention is performed on the soft board substrate (10) before the hard board process The holes are respectively opened at both ends of each soft plate region (彳1) to form a hard plate working area (12), and the hard plate working area (彳2) is rectangular and transparent. Empty, the internal space is used for making a hard plate area, and the two ends of the soft board area (11) extend into the hard board working area (12) and partially overlap the hard board working area (12). The area shall not exceed the area of the hard-working area (12) of 20%/〇8 1343770, except when the soft board area (11) is close to the hard board working area (12) or the soft board area (11) is larger than The hard board working area (12) is not subject to the above principles. Please refer to the first figure. After the soft board substrate (10) is finished, the soft board area (11) and the hard board working area (12) are completed. It can be used to cooperate with the fixture (20) for pressure cooperation: The above-mentioned pressure cooperation process is more than one. The following is a single pressure cooperation process: before the pressure cooperation, it is based on the fixture (2〇). The layer is provided with a layer of copper (21), a layer of glue (22), a substrate of soft board (10), a layer of glue (23) and an upper layer of copper (24); wherein: Positioning holes (220) (230) are respectively formed on the outer periphery of the glue layer (22) (23), and each positioning hole (220) (230) simultaneously corresponds to the positioning hole (101) on the soft board substrate (1) At the same time, the positioning post (2〇1) on the jig (20) is placed to form a positioning. Further, the lower and upper rubber layers (22) (23) are formed with a plurality of openings (221) (23Ί). The openings (221) (23Ί) respectively correspond to the soft board regions (11) on the soft board substrate (1〇), that is, the soft board regions (11) except the portions where the two ends overlap the hard board working area (12) The other part is not glued. After the completion of the above preparation steps, the press-fitting is performed. When pressing, the lower and upper rubber layers (22) (23) will enter the hard board of the soft board substrate (10). In the zone (12), the lower and upper copper skins (21) (24) are also pressed against the bottom surface of the lower and upper rubber layers (22) (23) to form a copper layer '遂 in each hard plate working area (12) A hard board area is formed in each of them. The above is the implementation step of the single channel pressure cooperation process. After completing the foregoing steps, the line can be formed on the copper layer of the hard board area, and the laser drilling and plating are utilized. Inter-layer conduction technology makes the hard board area Power line on the road and the soft plate section (left foot left foot) is connected; To increase the number of layers of the rigid board area, i.e., repeating the previous steps until the completion of a straight 91343770 predetermined number of layers. Finally, it can be cut to produce a plurality of soft and hard boards with a soft board and a hard board. The foregoing embodiments are illustrative of the application of the present invention to the manufacture of regular shaped soft and hard boards, and the processes are applied to irregular shapes and/or soft and hard boards having a plurality of soft board portions and hard board portions, the benefits of which are more significant: Still referring to the seventh figure, as described above, the soft and hard board (60) has six different shapes of soft board parts (61b (66), adjacent soft board parts (61)~(66> Between the two, a hard plate portion (67) having a different shape is formed. When the method of the present invention is applied, the soft plate portions (61) to (66) are formed on the same soft board substrate to perform a soft board process. 'It is not necessary to produce separately through six independent soft board processes'. The hard board part (67) connecting the soft board parts (61) to (66) is also a hard board press cooperative on the same soft board substrate. The composition has been significantly improved in process efficiency, and the hard plate portion (67) does not contain a soft plate except for the necessary overlapping portions of the soft plate portions (61)-(66). It is not necessary to redevelop the soft board factor. Design. From the above, the specific technical content of a preferred embodiment of the present invention can be known, and the same soft board base can be utilized by using the technologies. The preparation of the pressure bonding industry is completed through a single lamination step, and the production of the soft and hard boards is completed, and the processes have at least the following advantages: 1. Since the hard board portion of the soft and hard board does not contain the soft board except for the necessary overlapping portions' Therefore, it is not necessary to redevelop the design due to the board, so the development cost can be saved. 2. Since the soft board process and the hard board process are respectively performed on the same soft board substrate, even if the soft and hard board to be manufactured is irregular shape, It is not necessary to separately manufacture k-shaped softboard rafts of different shapes through separate processes, and there is no need to go through the alignment steps of multiple lanes to be able to prepare for the cooperation of the X & Significantly improve the efficiency of the process. 3. In the 裟, because the positioning of the same soft board substrate is aligned, the soft board area and the hard board area on the soft board substrate can be reliably positioned regardless of the area. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic view of the process of the present invention. The second drawing is a plan view of the soft board substrate used in the present invention. The third drawing is a sectional view of a soft and hard board. system A cross-sectional view of a soft and hard board. The fifth figure is a schematic diagram of a process with both soft and hard boards. The sixth figure is a plan view of a soft board substrate used in both soft and hard board processes. : A plan view of another soft and hard board. [Description of main components] (10) Soft board substrate (1 1) Soft board area (20) Fixture (21) Lower layer copper sheet (23) Gluing layer (220) (230) positioning hole (60) soft and hard board (1 01) positioning hole (12) hard board working area (201) positioning column (22) lower layer (24) upper layer copper (221) (231) opening (61 Bu (66) Soft board part 1343770 (67) Hard board part (701) (702) Positioning post (72) Under glue layer (74) Upper layer copper skin (81) (91) Soft board part (82) (92) Hard Plate part (912) positioning hole (70) Fixture (71) Lower layer copper skin (73) Gluing layer (80) (90) Soft and hard plate (810) (910) Soft board substrate (911) Soft board module
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