TWI343232B - - Google Patents

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Publication number
TWI343232B
TWI343232B TW096117721A TW96117721A TWI343232B TW I343232 B TWI343232 B TW I343232B TW 096117721 A TW096117721 A TW 096117721A TW 96117721 A TW96117721 A TW 96117721A TW I343232 B TWI343232 B TW I343232B
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TW
Taiwan
Prior art keywords
water
cooling
cavity
head
working fluid
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TW096117721A
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Chinese (zh)
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TW200847901A (en
Inventor
Chang Hung Peng
Ming Chien Kuo
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Cooler Master Co Ltd
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Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW096117721A priority Critical patent/TW200847901A/en
Priority to US11/834,165 priority patent/US20080283224A1/en
Priority to US11/834,148 priority patent/US20080283225A1/en
Publication of TW200847901A publication Critical patent/TW200847901A/en
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Publication of TWI343232B publication Critical patent/TWI343232B/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00Machines, pumps, or pumping installations having flexible working members
    • F04B43/02Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04Pumps having electric drive
    • F04B43/043Micropumps
    • F04B43/046Micropumps with piezoelectric drive
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08Fluid driving means, e.g. pumps, fans
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)

Description

九、發明說明: 【發明所屬之技術領域】 本發明係有關一種 作為導熱介質之水冷散:二統,尤指-種利用工作流體 Γ 4. w 队…、示統。 【先珂技術】 知著電子元件及复 越大,致使相關系統的用導體所需要的功率越來 控制元件的發埶量 电在又/放增,連帶的也導致電力 卞日]知熟里大為增加,而 過向的溫度,使其工作溫 二—-电子兀件所產生 成為現今科技發展的n ’因此散熱對策無疑 ^ 议知展的—項重要關鍵。 '?尤目$而言,降了黑本、丄 f ^ ^ ”了吊被使用的散熱風扇外,另一種 吊用的散熱對策便是水冷散 卜另種 係主要包括一水冷頭、:翁Ί ^知的水冷散熱系統 構件,且各Φ亜搂姓 帛浦、一水相及一水冷排等主要 诵备 要構件由導管形成連通狀態,以讓工作流- 附,:構水冷頭❹以直接與發熱元件相= °收發熱凡件所產生的熱量’水冷頭再與流通其中 作,體進行熱交換作用後,以帶走發熱元件所產生的 =,歲後流至水冷排,與該水冷排進行熱交換後,將熱 =|除^外界’以保持該發熱元件在正常的工作溫度範圍 =育浦係用以產生推力,驅使工作流體在各構件中流 ,取後,該水箱則是用以儲存額外的工作流體。 戶+不過,由於目前所設計的電子產品功能越來越強大, 要的電子元件也越來越多元,連帶壓縮電子產品内部 的谷置空間,也直接影響到水冷散熱系統的設置;雖然水 13,43232 rsc ^ ΊΤ 尽散热乐鱿的各 • . —· /必升玟罝王间的受限而開婼 壓縮本身的體積,以配合空間上的整合與利用,但就習知 的幫浦結構係利用渴輪增壓方式以產生推力,該渴輪组具 一::結構跟體積’因此使幫浦整體的體積難以嫌, 使整體的水冷散熱系統仍必須佔有一定的空間,;告成水冷 散=統難以應用在更薄型的電子產品上,成為:冷散熱 系統未盡理想之處。 【發明内容】 針對上述之缺失,本發明之主要目的在於提供 有薄型幫浦之水冷散熱系統,藉由設置一以致動^為 =力來源之薄膜幫浦,以大幅塵縮該 ”、、 ^同時亦減少水冷散熱系統所f要佔用之= ,用率外’更可應用於更多薄型結構設= 為=成上述之目的,本發明係主要提供一種 '丁…·充,该系統結構係主要包括—水A “ 水箱及—埶交換哭义 7 、 潯膜絮浦、一 形成連通二:;水;件係利用複數導管彼此 吸收發熱元;胞=用㈣件h U生土心热里而έ亥薄腹暂、-老田,、,十 協助工作流體產生冷卻作用 水^產生推力 之工作流體,最後該熱交換器係二=儲存額外 傳導作用,以將工作流體所吸引之流體進行熱 發熱元件之正常工作溫度範圍。〜肖外排除,以維持 【實施方式】 6 13,43232 茲將本發明之内容配合圖式 往夕門铉 呪明: 。月蒼閱弟一圖及第二圖,係分別 體結構示意圖及薄膜幫浦結構立體八妒“放熱系統之立 串聯型態將各主要構件串接在一起刀,圖。本實施例係以 水冷散熱系統之主要構件係主 :圖所示,本發明之 幫浦2、-水箱3及—熱交換器4,=冷頭卜—薄膜 係利用複數導管5形成連通狀態 =述之各主要構件 主要構件中,其中於本實施例中該水冷動於各 ί機板…該水冷頭1係直接貼附於設於一 未明示),用以直接與發砵元丰 I尤、兀件上(圖 藤1私或,'、'、 、仃熱傳導作用,今次、人 頭ΐί丁、為-中空腔體,内部設有複 。亥“ 數之流道12,同時該水冷頭】之前後端:: 且形成複 及出水通道U,以便於工作流趙流;進:通道 生之熱量吸收至内部所設之複數散敎片U 件所產 作流體進行熱交換作用,以將發熱元件所產:;:?:工 作流體帶離。 產生之熱里由工 、’、>閱第圖及第二圖,而該薄膜 中係與水冷頭1相連通,該薄 肖2於本““列 ^ '桌/南2 h主要以一月允 為主體,該腔體21之左右側分別設有-進水管心rf 出水細2,於該腔體21之内部則設 ; 腔室213係分別與進水管道2…水管道212:1連; 狀態;又,於該腔體i之上 μ 形成連通 係由具高張力之材質所構成=,該膽 該腔體H端面面H二小約略等同於 、I几王復盍该腔至213 ;而於該 7 13.43232 薄膜22上方設有一致動元件23,於本實施例中該致動元件 23係為一壓電片,且對應設置於該腔室2丨3之上方,並平 貼於4薄膜22,其中該致動元件23具有一固定端231及一 ㈣端232 ’該固定端231係與出水管道2】2同側,且該 固定端231並與複數電極導線7連接,以供該致動元件幻 所需要之電力’而該擺動端232係平貼於薄膜以之表面, 在通電之後該擺動端232形成單邊扇形大幅度之擺動方式 作動使付。亥扇形擺動方式能集中將工作流體帶往同— 向流動’同時帶動該薄膜22向腔室213㈣,此外, 動兀:23之擺動頻率可依不同之需要作不同之調整。/ 最後,該腔體2〗亦可與一殼體24對應处人 及致動元件23包覆於其中,該殼體二 : = :241a’係分別對應於該致動她及ί 、.泉4,亚使该致動元件23外露 導 元件23亦同時穿 二間’錢動 幫浦2相連接並形成= ; 水箱3係與該薄膜 最後,該熱交換用以儲存額外之水量; 乂谀-4铋由稷數散熱片 5穿設於該熱交換器”,使工作流::由導管 時,工作流難與該複數散熱片41進行;仏交換器4 散逸至各散熱片4】上, :乍用,將熱量 此外’於本實施例中該導管5广呈:界以元成散熱作用; 受工作流俨a ^ 'τ' “有體積緩衝作用, 又作机肢叉向溫影響而體積膨作用,可承 向外擴張,使舒緩水冷詞二俾使擠屋該導管5而 請參閱第:-部之塵力。 弟四圖’係分別為本發明之第二及第 8 1343232 二:例俯視圖。如第三圖所示 运211及出水管道2]2分 、帛以之進水官 g ,其中第二胪弟—腔體δ及第三腔體 之户、士—具有—第二腔室81,該第二腔體8 工右側則設有—進水管道82及一出才A f Μ 水管道82經由-導管5盘水~ ; ^官迢83,且該進 ,而ψ 1 '之出水通道14形成連通 ,而^道83係㈣㈣浦2之進水管道⑴形成連通 二=二腔室81内壁面設有-闊體1。,且對應於該進: ::位ί上;同樣,第三腔體9内具有-第三腔室9] ’於弟二腔體9之左、士伽八c,曰上 水管道93,右側刀別具有-進水管道92及-出 J -腔體9之進水管道92係與薄膜幫浦2 導管5形成連通狀態’且出水管㈣ # _ 〃、相形成連通,最後於第三腔室91内壁面 :二一閥體⑽且對應於該進水管道犯之位置,·此外,該 弟-腔體8及第三腔體9係相互間隔而不直接相互連通。 …藉此’當設於薄膜幫浦2上之致動元件23開始作動而 ::向下擺動,帶動薄膜22壓縮薄膜幫浦2之腔室213内 4工間,迫使工作流體分別往進水管道211及出水管道 212方向流動,而工作流體因受擠壓而產生之衝力,經由 f水管道212而穿越該閥體1〇a ,並依序流動通過第三腔 至91而到達水箱3,同時衝往進水管道211之工作流體, 則進到第二腔室81内衝壓閥體1〇,以緊閉該第二腔體8之 進水官道82位置,以防止進水管道82外之工作流體進入至 第二腔室81内;而當致動元件4向上擺動後,則使腔室 213恢復原來空間,因外部壓力大於腔室2丨3内之壓力’ 9 !343232 P工作’爪自進水f道82衝過該閥體10,進而流到腔室 ,,内同日才存方:第二腔體g内之工作流體亦產生一衝力 、与壓δ又於第二腔室91内之閥體10a,使該閥體施緊閉 :、欠g迈92之位置’以避免工作流體回流至腔室加内 °玄水々放熱乐統形成單—方向之循環作用;此外, ’ Λ第一腔體8及第二腔體9之位置亦可改變其連接位置, • °第四圖所示,該第二腔體8係設於熱交換器4及水冷頭 鲁 1之間,亦具有同樣之作用。 。。月蒼閱第五圖’係為本發明之第四實施例俯視示意圖 °圖所示,於薄膜幫浦2之腔室213,且對應於進水管 ” U之位置亡設有—閥體1();又,於該薄膜幫浦2及水 :間設有一第二腔體8,該第二腔體8内具有-第二腔 =,且該第二腔體8之左、右側則設有_進水管道似及 水管這83,該進水管道82及出水管道泊分別經由導管 與薄膜幫浦2及水箱3形成連通狀態 •内對應該進水管道82位置上設有一闊體1〇a = ·=獏幫浦2上之致動元件23開始作動而形成向下擺動, :動續壓縮薄膜幫浦2之腔室213内部空間,迫使工 作^體分別往進水管道211及出水管道212方向流動而 工作流體因受擠壓而產生之衝力,經由出水管道批而穿 _越該間體1〇,並依序流動通過第二腔室81而_水箱3, 同時衝往進水管這211方向之工作流體,則衝 進水 管道2U位置之間體10緊閉該第二腔體8之進水管糾位 置’以防止工作流體回流到進水管道82外;而當致動元件 4向上擺動後,則使腔室213 '恢復原來空間,因外部壓力 213内之麼力,迫使工作流體自進水管道⑴衝 内I:1G,進而流到腔室2]3”’同時存於第二腔體8 雕體亦產生—衝力,衝壓設於第二腔室δΐ内之閥 肢1 Oa ,传兮*日曰祕 1 η 时 卜 叫胆1〇a緊閉該進水管道82之位置,以避免 工作流體回流至妒宫91 Q ηπ — l 形成單:方向之内’错此’使得該水冷散熱系統 明參閱第六圖及第七圖,传分 例—圖及响浦分解示意二 五” 冷散熱系統之主要構件俜 "不水 浦2、一水箱3及Μ 包括一水冷頭1、一薄膜幫 利用複數導管5形成漳、s/ °。 , ¥述之各主要構件係 奴数令s b形成連通狀態,使工雕 要構件中,其中於本實施例中該水=可 動於各主 機板6上,該水冷頭丨俜 7 a…、糸統係設於一主 、V、置接貼附於—4α _ , 明示),用以直接與發熱亓杜I —、毛熱凡件上(圖未 1係為一中空腔體,内部設有導作用’該水冷頭 之流道12 ,同時該水冷頭】之二月…、片11,且形成複數 及出水通道14,以便於卫作流=端分_有進水通道13 之熱量吸收至内部所設之複數二机通,使發熱元件所產生 流體進行熱交換作用,以將發埶片〗1 ’再與流過之工作 流體帶離。 ’’、、元件所產生之熱量由工作 而該薄膜幫浦2之結構更 左右側分別設有一進水營 腔體21,該腔體2〗之 21内分別具有一第—腔| 出水官道212 ’該腔體 工主乙!4及_策一 乐一腔室215 ,且兩者 1343232 ’之間設有一通孔216使兩者相互連通,而該進水管道211 及出水管道212分別與第一腔室214及第二腔室215相互 連通,另於該第一腔室214内壁面且對應於進水管道211 之位置上設有一閥體10,係套設於内壁面上所設之穿槽 . 217 ,係用以阻擋工作流體自第一腔室214回流進到^進 水管道211而流出腔體21外,而於第二腔室215内壁面且 .對應於該通孔216位置亦設有一閥體10a ’係用以2擋工 φ作以體自第二腔室215經由該通孔216回流至第—腔室 完全覆蓋該第一腔室214及第二腔室 22上方設有一致動元件23,且對應設置 之上方,並平貼於該薄膜22,該致動元 231及一擺動端232 ,該固定媸乂么 214内,且該閥體10a設置之方式等同於第一腔室214内 之閥體10 ;於該腔體21之上端面上設有一薄膜22,該薄膜 215 ;而於該薄膜IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a water-cooling dispersion as a heat-conducting medium: a second system, in particular, a working fluid Γ 4. w team... [First-hand technology] Knowing that electronic components and complexes are larger, the power required by the conductors of the relevant system is more and more controllable, and the amount of power generated by the components is increased/distributed, and the power is also brought to the next day. Greatly increased, and the temperature of the past, so that the working temperature - the electronic components produced by the current technology development n 'thus cooling countermeasures undoubtedly ^ discussion of the exhibition - the important key. '? Especially in the case of $, the black box, 丄f ^ ^ ” hang the used cooling fan, another type of cooling countermeasures for the use of water cooling, another series mainly includes a water-cooled head, Weng Ί ^ Know the water cooling system components, and each Φ 亜搂 帛 、 、 一 一 一 一 一 一 一 一 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 诵 诵 诵 诵 、 Directly with the heating element = ° heat to send and receive the heat of the parts of the 'water-cooled head and then flow through it, after the body heat exchange, to take away the heat generated by the heating element =, then flow to the water-cooled row, and After the water-cooled row is heat-exchanged, the heat=|except the outside world' is used to keep the heating element in the normal operating temperature range=the Yupu system is used to generate the thrust, and the working fluid is driven to flow in the components. After the water tank is taken, the water tank is It is used to store extra working fluids. However, due to the increasingly powerful functions of the electronic products currently designed, the electronic components are more and more diversified, and the space inside the compressed electronic products directly affects the water cooling. Heat dissipation system Although the water 13,43232 rsc ^ 尽 散热 散热 • • • • • 必 必 必 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝 玟罝The pump structure utilizes a thirsty wheel pressurization method to generate thrust. The thirsty wheel set has a structure: volume and volume. Therefore, the overall volume of the pump is difficult to be suspected, so that the overall water cooling system must still occupy a certain space. The invention is difficult to apply to thinner electronic products, and it becomes: the cold heat dissipation system is not ideal. [Invention] In view of the above-mentioned shortcomings, the main object of the present invention is to provide water cooling for thin pumps. The system, by setting a film pump that activates the ^ source, to greatly reduce the "," and also reduces the water-cooling system to be used. The thin structure is set to = for the above purpose, the present invention mainly provides a 'drinking charge, the system structure mainly includes - water A "water tank and - 埶 exchange crying 7 , 浔 film floc, a formation of connectivity Two: water The parts use a plurality of conduits to absorb the heat elements from each other; the cells = use (four) pieces of h U raw soil heat and the έhai thin belly temporarily, - Laotian,,, 10 assist the working fluid to generate cooling water, generate the working fluid of the thrust, and finally The heat exchanger is configured to store an additional conductive action to carry the fluid attracted by the working fluid to a normal operating temperature range of the heat-generating element. The outer portion of the heat-heating element is removed to maintain [Embodiment] 6 13,43232 The contents match the pattern to the eve of the door: The moon and the younger brothers have a picture and a second picture, which are the schematic diagram of the body structure and the three-dimensional gossip structure of the membrane pump. The vertical series of the exothermic system connects the main components in series. Knife together, figure. In this embodiment, the main components of the water-cooling heat-dissipating system are mainly shown in the figure: the pump 2, the water tank 3, and the heat exchanger 4 of the present invention, the cold-headed film are formed by the plurality of conduits 5 to form a connected state. In the main components of each of the main components, in the embodiment, the water is cooled and moved to each of the plates. The water-cooled head 1 is directly attached to an unspecified one, and is used directly with the hairpin Yuanfeng I. On the 兀 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( Head] before the back end:: and form the recirculation channel U to facilitate the flow of the flow; the heat generated by the passage is absorbed into the fluid produced by the internal bulk U-pieces for heat exchange. The heating element is produced:;:?: the working fluid is taken away. The heat generated by the work, ', > read the figure and the second picture, and the film is connected with the water-cooled head 1, the thin xiao 2 In the "column ^ 'table / South 2 h mainly in January, the left and right sides of the cavity 21 are respectively - enter The tube core rf is thin 2, and is disposed inside the cavity 21; the chamber 213 is connected to the water inlet pipe 2...water pipe 212:1; the state; and, above the cavity i, the communication system is formed. The material of the high tension material is composed of the material, and the surface of the cavity H of the cavity H is slightly equal to that of the cavity H, and the cavity is rectified by the I to the 213; and the movable component 23 is disposed above the film 23.3232 In the embodiment, the actuating element 23 is a piezoelectric piece, and is correspondingly disposed above the chamber 2丨3 and is flatly attached to the 4 film 22, wherein the actuating element 23 has a fixed end 231 and a (four) The end 232 'the fixed end 231 is on the same side as the water outlet pipe 2] 2, and the fixed end 231 is connected to the plurality of electrode wires 7 for the power required by the actuating element to phantom. On the surface of the film, after the energization, the oscillating end 232 forms a single-side fan-shaped large-scale oscillating mode to act. The scalloping mode can concentrate the working fluid to the same-flowing direction while driving the film 22 toward the chamber. 213 (four), in addition, the dynamic swing: 23 swing frequency can be different according to different needs The adjustment can be carried out. / Finally, the cavity 2 can also be covered with a corresponding person and actuating element 23 of a housing 24, the housing 2: = : 241a ' respectively corresponding to the actuating her and ί , spring 4, sub-actuating the actuating element 23, the outer guiding element 23 is also connected through two 'money pumping 2 phases and forming =; the water tank 3 is connected with the film, the heat exchange is used to store additional water乂谀-4铋 is disposed in the heat exchanger by the number of heat sinks 5, so that the working flow: when the conduit is used, the working flow is difficult to be performed with the plurality of heat sinks 41; the 仏 exchanger 4 is dissipated to the heat sinks 4] upper, : use, heat, in addition, in the present embodiment, the catheter 5 is widely distributed: the boundary is formed by heat dissipation; by the working flow 俨a ^ 'τ' "having a volume buffering effect, and also serving as a fork To the effect of temperature and volume expansion, it can be expanded outwards, so that the soothing water-cooling word can be used to squeeze the tube 5 and see the dust of the:-part. The four figures are respectively the second and eighth paragraphs of the present invention: a top view. As shown in the third figure, the 211 and the water outlet pipe 2] 2 points, and the water inlet official g, wherein the second brother-the cavity δ and the third cavity of the household, the sergeant--the second chamber 81 The right side of the second cavity 8 is provided with a water inlet pipe 82 and an outlet A F water pipe 82 via a conduit 5 water; a ^ bureaucrat 83, and the inlet, and the water of the raft 1 ' The passage 14 is formed in communication, and the inlet duct (1) of the (4) (4) Pu 2 is formed to be connected to the inner wall surface of the second chamber 2 and is provided with a wide body 1. And corresponding to the advance: :: bit ί; likewise, the third cavity 9 has a - third chamber 9] 'the left side of the second cavity 9 , the singer eight c, the upper water pipe 93, The right side knife has a water inlet pipe 92 and a water inlet pipe 92 of the J-cavity 9 is in a communication state with the membrane pump 2 conduit 5 and the outlet pipe (four) # _ 〃, the phase is connected, and finally the third The inner wall surface of the chamber 91 is a two-dimensional valve body (10) and corresponds to the position of the water inlet pipe. In addition, the brother-cavity 8 and the third cavity 9 are spaced apart from each other without directly communicating with each other. ...by 'when the actuating element 23 provided on the membrane pump 2 starts to move:: oscillates down, driving the membrane 22 to compress the chamber 4 in the chamber 213 of the membrane pump 2, forcing the working fluid to flow into the water respectively The pipe 211 and the water outlet pipe 212 flow in the direction, and the working fluid is forced by the squeeze, passes through the valve body 1〇a through the f water pipe 212, and sequentially flows through the third cavity to 91 to reach the water tank 3, At the same time, the working fluid flushed to the water inlet pipe 211 is advanced into the second valve chamber 81 to press the valve body 1 〇 to close the position of the water inlet pipe 82 of the second cavity 8 to prevent the water inlet pipe 82 from being outside. The working fluid enters into the second chamber 81; and when the actuating member 4 swings upward, the chamber 213 is restored to the original space, because the external pressure is greater than the pressure in the chamber 2丨3 '9!343232 P' The claws pass through the valve body 10 and flow to the chamber, and then the same day: the working fluid in the second cavity g also generates a momentum, and the pressure δ is in the second chamber. The valve body 10a in the 91, the valve body is tightly closed: the position of the gage 92 is 'to avoid the return of the working fluid to the chamber plus the inside ° Xuan Shui 々 々 热 形成 形成 形成 形成 形成 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The cavity 8 is disposed between the heat exchanger 4 and the water-cooled head 1 and has the same function. . . The fifth figure of the month of the month is a top view of the fourth embodiment of the present invention. The chamber is shown in the chamber 213 of the membrane pump 2, and corresponds to the position of the inlet pipe "U" - the valve body 1 ( And a second cavity 8 is disposed between the film pump 2 and the water: the second cavity 8 has a second cavity=, and the left and right sides of the second cavity 8 are provided. _ Inlet pipe and water pipe 83, the water inlet pipe 82 and the water pipe pipe are respectively connected to the membrane pump 2 and the water tank 3 via the duct. The inner water inlet pipe 82 is provided with a wide body 1〇a. = · = the actuating element 23 on the pump 2 starts to swing downwards, and the inner space of the chamber 213 of the membrane pump 2 is compressed, forcing the working body to the water inlet pipe 211 and the water outlet pipe 212, respectively. The directional flow and the impact of the working fluid due to the squeezing force are passed through the effluent pipe through the effluent pipe, and flow through the second chamber 81 to the water tank 3 while rushing to the water inlet pipe. The working fluid in the direction is flushed into the water pipe 2U position between the body 10 and the inlet pipe of the second cavity 8 is closed to prevent the work The fluid returns to the outside of the water inlet pipe 82; and when the actuating member 4 swings upward, the chamber 213' is restored to the original space, and the working fluid is forced from the water inlet pipe (1) by the force in the external pressure 213. 1G, and then flow to the chamber 2] 3"' at the same time in the second cavity 8 The body also produces a momentum, stamping the valve limb 1 Oa set in the second chamber δΐ, Chuan 兮 *日曰秘1 η When the time is called 胆1〇a close the position of the water inlet pipe 82 to avoid the return of the working fluid to the 妒 91 91 Q ηπ — l form a single: the direction of the wrong 'this' makes the water cooling system see the sixth figure And the seventh picture, the sub-examples - the figure and the sound of the decomposition of the two-fifth" main components of the cooling system 俜 " Shui Shui Pu 2, a water tank 3 and Μ including a water-cooled head 1, a film to help the use of multiple conduits 5 The formation of 漳, s / °., the main components of the description of the slave number sb form a connected state, so that the work is required to be in the component, wherein in the embodiment the water = can be moved on each of the motherboard 6, the water-cooled head丨俜7 a..., the system is set in a main, V, and attached to -4α _ , express) for direct With the hot 亓 Du I —, the hot and hot parts (Fig. 1 is a hollow body, the inside is provided with a guiding effect 'the water cooling head of the flow channel 12, and the water cooling head') in February..., piece 11, And forming a plurality of water passages 14 so that the heat flow of the water inlet passage 13 is absorbed into the plurality of internal passages, so that the fluid generated by the heat generating component is subjected to heat exchange to be emitted.埶片〗 1 'Removed with the working fluid flowing away. '', the heat generated by the component is operated by the membrane pump 2, and the left and right sides of the membrane pump 2 are respectively provided with a water inlet chamber 21, the cavity 2〗 21 has a first cavity - water outlet official road 212 'the cavity master B! 4 and _ 策一乐一室215, and a through hole 216 is provided between the two 1343232' to connect the two, and the water inlet pipe 211 and the water outlet pipe 212 are respectively connected to the first chamber 214 and the second cavity The chambers 215 are connected to each other, and a valve body 10 is disposed on the inner wall surface of the first chamber 214 and corresponding to the water inlet pipe 211, and is sleeved on the inner wall surface. 217 is used to block The working fluid flows back from the first chamber 214 into the water inlet pipe 211 and flows out of the cavity 21, and is disposed on the inner wall surface of the second chamber 215 and is also provided with a valve body 10a corresponding to the position of the through hole 216. The second working chamber 215 is returned from the second chamber 215 through the through hole 216 to the first chamber, and the first chamber 214 and the second chamber 22 are completely covered with the movable member 23, and the corresponding setting is performed. Above, and flatly attached to the film 22, the actuating element 231 and a swinging end 232, the fixing body 214, and the valve body 10a is arranged in the same manner as the valve body 10 in the first chamber 214 Providing a film 22 on the upper end surface of the cavity 21, the film 215; and the film

12 ,續參閱第六圖,而該水箱3俜 ㈣成連通狀態,係用以儲存額膜咖相連接 換益4係由複數散熱片41所構成::取後,该熱交 ㈣器…使工作流體通丄穿設於該熱 與該複數鸯勃μ w A ‘、’、換σ。4 %·,工作流體 斷二;熱ϊ換作用,將熱量散逸至各散熱 月至外"以元成散熱作用。 因此’在該致動元件23之擺動端9<:!9 時帶動之^動〜232向下擺動時,同 迫使工= 一腔室214内部空間以產生壓力, 作^產生衝力衝過該閥體咖而往第二腔室215 3之體朝水箱3方向流動,迫使水冷散熱系統 工作產生流動狀態,雖有少部分之工作流體會 :進水管道211流動,但薄膜22產生之 ‘ =閉該進水管…管口,以防止工作流體回= 水/迢211 ;而當該致動元件23之擺動端232往上擺動時 Λ薄膜22恢復其原狀以釋放第一腔室214内之空間,使 第—腔室214内部之壓力小於外部壓力,而迫使工作流體 自進水管道211衝過該閥體10流進第一腔室214内,而殘 存於出水管道212及第二腔室215内之工作流體亦因壓力 而產生一衝力,以衝壓該閥體1〇a ,反使得閥體1〇a緊閉 έ玄通孔216 ,阻擋出水管道212及第二腔室215中所存有 之工作流體回流至第一腔室2】4中,藉此使薄膜幫浦2内 邛之工作流體形成較大流量且呈單一方向之流動,以使得 整個水冷散熱系統之工作流體不斷流動,同時呈單一方向 之流動。 1343232 請參閱第八圖,传盔+ _ 知為本發明之第六實施例έ 。本發明之水冷散熱系統係可依不同之散埶」::俯視圖 上之串聯或並聯形態變化 :’、、、而'仃組件 例利用串聯方式組成-單_之實施 '同路-士一 ㈣之水冷散熱系統外,如第 八@所不,本貫施例之水 弟 , ^ ^ ^ . …、’丁…充係應用於歿數發熱元 “放熱糸統之主要構件係主要包括複數水Α頭 1及la (於本實施例中,玄太、人 久要文卜~頭 水箱3及一熱交換器 端之一第二腔體8及一第 . 」T 4水冷頭係為兩個)、一薄膜幫浦12, continued to refer to the sixth figure, and the water tank 3俜(4) is connected to the state, which is used to store the frontal film and coffee. The connection is made up of a plurality of heat sinks 41: After taking, the heat exchange (four) device... The working fluid is passed through the heat and the plurality of 鸯 μ w w w ' 、 、 、 、. 4%·, the working fluid is broken; the heat is replaced by heat, and the heat is dissipated to the heat dissipation month to the outside. Therefore, when the swinging end 9<:! 9 of the actuating member 23 is driven to swing downward, the internal space of the chamber 214 is forced to generate pressure, and the impulse is generated to pass through the valve. The body of the second chamber 215 3 flows toward the water tank 3, forcing the water-cooling heat dissipation system to work to generate a flow state, although a small portion of the working fluid will flow: the water inlet pipe 211 flows, but the film 22 produces a '=closed The inlet pipe ... nozzle to prevent the working fluid from returning = water / 迢 211; and when the oscillating end 232 of the actuating member 23 swings upward, the diaphragm 22 returns to its original shape to release the space in the first chamber 214, The pressure inside the first chamber 214 is made smaller than the external pressure, and the working fluid is forced to flow from the water inlet pipe 211 into the first chamber 214 through the valve body 10, and remains in the water outlet pipe 212 and the second chamber 215. The working fluid also generates a momentum due to the pressure to punch the valve body 1〇a, so that the valve body 1〇a closes the έ 通 through hole 216, and blocks the work in the water outlet pipe 212 and the second chamber 215. The fluid is returned to the first chamber 2, 4, thereby causing the membrane pump 2 to be in In fluid form as a single larger volume and direction of flow, so that the working fluid throughout the continuous flow of the liquid cooling system, while the form of the flow in a single direction. 1343232 Please refer to the eighth figure, the helmet + _ is known as the sixth embodiment of the invention. The water-cooling heat-dissipating system of the present invention can be diverged according to different types:: a series or parallel configuration change on the top view: ',, and '仃 component examples are constructed by using a series method - a single _ implementation of the same way - a one (four) Outside the water cooling system, such as the eighth @所不, the water brother of the present example, ^ ^ ^ . ..., '丁...charged for the number of heating elements. The main components of the exothermic system mainly include multiple water. Shantou 1 and la (in this embodiment, Xuantai, people have long-term Wenbu ~ head tank 3 and a heat exchanger end one of the second cavity 8 and a first." T 4 water-cooled head system is two) a film pump

以及設於該薄獏幫浦2兩 其中該水冷頭1及la 腔體9And located in the thin rafter 2 2 where the water-cooled head 1 and the la cavity 9

係以並聯形式貼㈣發熱元件上,再洲複數=;= 與第二腔體8、薄膜幫浦2、第三腔體9、水箱3及_ 換器4形成連通,以利流動於該水冷散㈣統内部之工作 流體可同時通過複數水冷頭丨及1&㈣行熱交換作用,將 複數發熱70件所產生之熱緣同時帶離;此外,該並聯^ 亦可運用在涛膜幫浦2 ±_,同時將複數薄膜幫浦2利用並 聯型態加以組合’增加該水冷散熱系統内之工作流體流量 及流動速度’以提昇水冷散熱系統之散熱效能。 請參閱第九圖’係為本發明之第七實施例結構俯視 圖。本實施例係為另一種型式之並聯型態,如圖所示,該 水冷散熱系統之主要構件係主要包括複數水冷頭丨及比( 於本實施例中該水冷頭係為兩個)、—薄膜幫浦2、一水 箱3及一熱父換4,複數第二腔體8a〜8e.,其中該水冷 頭1及la係以並聯形式貼附於發熱元件上,該水冷頭丨之 進水管道13及出水管道14分別經由導管5連通第二腔體8c 1343232 及8d,該水冷頭la之進水管道13a及出水管道丨知分別滅 由導管5連通第二腔體如及肋,豸水冷頭丨及匕分:由; 二腔體8a ♦内部所設置之閥體10a〜1〇e控制該工^流體= 出;另外,該第二腔體8e則設於薄膜幫浦2與水箱:組k 間,以控制工作流體之回流。 水冷頭〗、一水箱 料閱第十圖,係為本發明之第八實施例結構俯視圖 。於本貫施例中係將該水冷頭與薄膜幫浦相互結合成一體 ;如圖所示,本發明之水冷散熱系統之主要構件:包括二 敛交換哭 ”、、Jt7s χτ〇 -*[> 、人二艺 Λ t . A-A- r-\ 第二腔體8及一 第三腔體9,且前述之各主要構件係利用複數導管5 連通狀態,使工作流體可流動於各主要構件中,发中1火 =之内部設有複數散熱片n,任相鄰之散熱;‘ 4 12 ’另該水冷頭!左、右側分別設有—進水管道 一出水管道14 ’該進水管道13及出水管道14經由導管5八 !與第二腔體8及第三腔體9形成連通,該第二腔體8: 弟二腔體9内部分別設有間體1〇及服:另於該水冷頭1 =上端面設有m2a,該薄膜22a係由具高張力之材 貝所構成,㈣膜22a之大小約略等同於該水冷頭}之上 積3 ;而於該水冷頭】上方設有—致動元件挪, 動元件23a係為一塵電片,且平貼於該 動立山、232中該致動元件撕具有一固定端咖及一撮 ;2而31盘該固定端施係與出水管道Η同側’且該固定 元數電極導線連接(圖未明示),以供該致動 &而要之電力,而該擺動端232a係平貼於薄膜 15 1343232 22a之表面,在通電之後該擺動端2兕形成單 度之擺動方式作動,此外,該致動元件23a = 依不同之需要作不同之調整;而該第三腔體9經由導;5 與水箱3形成連通,該水箱3再經由導管5與: 形成連通’以組成一完整之水冷散熱系統。 …4 藉由。亥水令頭]係貼附於發熱元件,水冷頭1中 自毛熱7L件熱源’再由工作流體將熱源帶離去 由導線導電至該致動元件23a上,致使該致動元== 擺動傷產生單邊扇形擺動作用,在該致動元件22二 擺動端娜向下擺動時,同時帶動該薄膜2 : ,空間以羞生壓力,由扇形擺動方式集中將= 二員 ::同動,迫使工作流體產生衝力往出水= 二二腔體9内部所設之閥體10a,繼續流動 =相3及熱交換器4,同時所產生之衝力亦第一= 體8内部之閱體10 ’以阻擋工作流體繼續進到水 部;而當該致動元件23a之擺動端纖往㈣碩内 膜孤恢復其原狀以釋放水冷頭!内部空間動^_ 1内部之墨力小於外部壓力,而使工作流體衝過::“頭 體8内部瞻後’自進水管道13流進水冷頭J:腔 水冷頭結構同時具有幫浦作用,迫使工體/吏該 冷頭1内部,使工作流體形成較大流量且呈單」^出水 動° 千万向之流 惟以上所述之實施方式,&㈣“ 能以此限定本發明實施範圍,若依二當不 〒巧專利範圍及 16Attached to the (four) heating element in parallel, and then the complex number =; = with the second cavity 8, the membrane pump 2, the third cavity 9, the water tank 3 and the _ exchanger 4 to facilitate flow to the water cooling The working fluid inside the San (4) system can simultaneously carry out the heat exchange generated by 70 pieces of heat by multiple water-cooling heads and 1&(4) heat exchange; in addition, the parallel ^ can also be applied to the Tao membrane pump 2 ± _, at the same time, the complex membrane pump 2 is combined with the parallel type to increase the working fluid flow and flow speed in the water cooling system to improve the heat dissipation performance of the water cooling system. Referring to the ninth drawing, a plan view of a seventh embodiment of the present invention is shown. This embodiment is another type of parallel type. As shown in the figure, the main components of the water-cooling heat dissipation system mainly include a plurality of water-cooled heads and ratios (in the present embodiment, the water-cooled head system is two), The membrane pump 2, a water tank 3 and a hot father change 4, a plurality of second chambers 8a to 8e., wherein the water-cooling heads 1 and 1 are attached to the heating element in parallel, and the water-cooled head is filled with water. The pipe 13 and the water outlet pipe 14 are respectively connected to the second cavity 8c 1343232 and 8d via the conduit 5, and the water inlet pipe 13a and the water outlet pipe of the water-cooling head la are respectively connected to the second cavity such as the rib by the conduit 5, and the water is cooled. Head 丨 and 匕: by; two chambers 8a ♦ internal valve body 10a~1〇e controls the fluid = out; in addition, the second chamber 8e is located in the membrane pump 2 and the water tank: Group k to control the backflow of the working fluid. Water Cooling Head, a water tank The tenth drawing is a top view of the structure of the eighth embodiment of the present invention. In the present embodiment, the water-cooling head and the film pump are integrated into one another; as shown in the figure, the main components of the water-cooling heat dissipation system of the present invention include: two-string exchange crying, and Jt7s χτ〇-*[&gt ; a second geisha t. AA- r-\ second cavity 8 and a third cavity 9, and the above-mentioned main components are connected by a plurality of conduits 5, so that the working fluid can flow in the main components There is a plurality of heat sinks n in the inside of the fire 1 and any adjacent heat sinks; ' 4 12 'the other water-cooled head! The left and right sides are respectively provided with a water inlet pipe and a water outlet pipe 14 'the water inlet pipe 13 and the water outlet The pipe 14 is in communication with the second cavity 8 and the third cavity 9 via the conduit 5, and the second cavity 8: the inside of the cavity 2 is respectively provided with a compartment 1 and a uniform: another water-cooled head 1 = m2a is provided on the upper end surface, the film 22a is composed of a material having a high tension, and (4) the size of the film 22a is approximately equal to the product above the water-cooling head; and is provided above the water-cooling head] The moving component is moved, and the moving component 23a is a dust electric piece, and is flatly attached to the movable mountain, 232, and the actuating element is torn and fixed. 2 and 31 discs of the fixed end are applied to the same side of the water outlet pipe and the fixed number of electrode wires are connected (not shown) for the actuation & The end 232a is affixed to the surface of the film 15 1343232 22a, and the oscillating end 2 兕 is formed in a single degree of swinging manner after being energized, and further, the actuating element 23a = is adjusted differently according to different needs; and the third The cavity 9 is in communication with the water tank 3 via a guide 5, which in turn forms a communication via the conduit 5 to form a complete water-cooling heat dissipation system. 4 is attached to the heating element by means of a water head , in the water-cooled head 1 from the hot 7L heat source 'and then the working fluid takes the heat source away from the wire to the actuating element 23a, causing the actuating element == swinging injury to produce a single-sided fan-shaped swinging action, When the two swinging ends of the actuating element 22 swing downward, the film 2 is driven at the same time: the space is shy pressure, and the fan-shaped swing mode concentrates = two members: the same motion, forcing the working fluid to generate momentum to the water = two two The valve body 10a provided inside the cavity 9 continues to flow = 3 and the heat exchanger 4, at the same time the generated impulse is also the first = the body 10' inside the body 8 to block the working fluid to continue into the water; and when the oscillating end of the actuating element 23a is directed to the (four) endometrium Lonely recovers its original shape to release the water-cooled head! The internal space moves ^_ 1 The internal ink force is smaller than the external pressure, and the working fluid is washed over: "The head 8 is internally viewed and the self-intake water pipe 13 flows into the water-cooled head J: The chamber water-cooling head structure also has a pumping function, forcing the working body/the inside of the cold head 1 to make the working fluid form a large flow rate and is a single-flowing water flow. The flow to the flow is only the embodiment described above, & (4) "This can limit the scope of implementation of the invention, if the scope of patents and the number of patents and 16

5兒明書内交· 0C 下述之 專利涵蓋3作之#效變化或修飾’皆應屬本發明 【圖式簡單說明】 f 圖係為本發明之立體結構示意圖。 ―弟:圖、係為本發明之薄膜幫浦結構立體分解圖。 ^ 一圖、ί糸為本發明之第二實施例俯視圖。 =四®1、#、為本發明之第三實施例俯視圖。 f ^圖、#為本發明之第四實施例俯視示意圖。 f,、圖、係為本發明之第五實施例結構俯視圖。 示意 =七圖、係為本發明之第五實施例之薄膜幫浦分 圖。 ^為本發明之第六實施例結構俯視 仏為本發明之第七實施例結構俯視 、係為本發明之第八實施例結構俯視 第八圖 第九圖 第十圖 【主要元件符號說明 水冷頭1、la 流道12、12a 出水通道14、14a 腔體21 出水管道212 第一腔室214 通孔216 薄膜22、22a 固定端231 、231a 散熱片11、11a 進水通道13、13a 薄膜幫浦2 進水管道211 腔室213 第二腔室215 穿槽217 致動元件23、23a 擺動端232、232a 13,43232 殼體24 水箱3 散熱片41 主機板6 第二腔體8、8a〜8e 進水管道82 第三腔體9 進水管道92 閥體10、10a〜10e 穿孔241 、 熱交換器4 導管5 電極導線7 第二腔室 出水管道83 第三腔室91 出水管道93 241aThe following is a description of the three-dimensional structure of the present invention. The following patents are included in the present invention. ——Di: The figure is an exploded view of the membrane pump structure of the present invention. ^ A diagram, a top view of a second embodiment of the present invention. = four, 1, #, is a top view of a third embodiment of the present invention. f ^ and # are schematic top views of a fourth embodiment of the present invention. f, Fig. is a top view of the structure of the fifth embodiment of the present invention. Fig. 7 is a sectional view of a thin film pump according to a fifth embodiment of the present invention. The structure of the sixth embodiment of the present invention is a plan view of the seventh embodiment of the present invention. The structure is a plan view of the eighth embodiment of the present invention. FIG. 8 is a plan view of the eighth embodiment. 1, la flow channel 12, 12a water outlet channel 14, 14a cavity 21 water outlet pipe 212 first chamber 214 through hole 216 film 22, 22a fixed end 231, 231a heat sink 11, 11a water inlet channel 13, 13a film pump 2 Inlet pipe 211 Chamber 213 Second chamber 215 Through slot 217 Actuating element 23, 23a Swing end 232, 232a 13, 43322 Housing 24 Water tank 3 Heat sink 41 Motherboard 6 Second cavity 8, 8a~8e Inlet pipe 82 Third cavity 9 Inlet pipe 92 Valve body 10, 10a~10e Perforation 241, Heat exchanger 4 Conduit 5 Electrode wire 7 Second chamber outlet pipe 83 Third chamber 91 Water outlet pipe 93 241a

Claims (1)

99.12. 29 修正 十、申請專利範圍: 1· 一種水冷散熱系統,係包括: 一水冷頭,係貼附於該發熱元件上,用以與發熱元件進 行熱傳導作用; /專膜幫浦,係與該水冷頭相連通,用以產生推力使工 作流體進行循環作用; 一第二腔體’係與該薄膜幫浦相連通’用以阻檔工作流 體回流至該薄膜幫浦内; 複數導管,係設於該水冷頭、薄膜幫浦及第一腔體之間 ’以使水冷頭、薄膜幫浦及第一腔體形成連通,以利工 作流體流動;以及 一熱交換器’係穿設於前述之導管上,用以與流通於該 導管中之工作流體進行熱交換。 2.如申請專利範圍第1項所述之水冷散熱系統,其中該薄 膜幫浦更包括: 一腔體’該腔體兩側分別具有一進水管道及一出水管道 一腔室’係設於腔體内’係與該進水管道及出水管道形 成連通; 一閥體,係分別設於該腔室之内壁面上,用以防止工作 流體之回流’其中該閥體係對應於進水管道之位置; 一薄膜,係設於該腔體頂面位置上; 一致動元件,係平貼於該薄膜上,其上具有一固定端及 一擺動端’且該固定端係與前述之出水管道同側邊。 1343232 統,其中該腔 3·如申請專利範圍第2項所述之水冷散熱系 體更對應連接-殼體,該殼體上開設有複數穿孔,且分 別對應於該致動元件之固定端、擺動端及該㈣之位 置。 4.如申請專利範圍第3項所述之水冷散熱系統,其中該固 定端更連接複數電極導線,且穿設於前述穿孔。 5·如申料利範圍第2賴述之水冷散㈣統 Γ近於進水管道之内壁面設有—穿槽,且與閥體相連 6·如申請專利範圍第1 冷頭内設有複數散熱 7·如申請專利範圍第1 交換器係由複數散熱 8.如申請專利範圍第1 二腔體内更具有一第 水管道β 項所述之水冷散熱“,其中該水 片。 項所述之水冷散㈣、統,其中該轨 片所組成。 項所述之水冷散熱系統,其中該第 一腔至’且具有一進水管道及一出 ;申=範圍第8項所述之水冷散熱系統, Η).如;應進水管道之位置設有另一間體。 動元件係為:L2項所述之水冷散熱系統,其中該致 u·=請專利範圍第丨項所述之 :通—第二―二:::成 12·如申請專利範圍第1項所述之水冷㈣統,該水冷散 20 1343232 99.12.1 熱系統更包括另一水冷頭,节 以並聯型態形成連通。 μ 一水冷頭係與該水冷頭 以如申請專利範圍第丨項所述之水 鼽系铋Ρ 4 ^ ?放熱系統’該水冷散 诵,田丨、;冲六a + Α 导巨與该缚膜幫浦相連 逋’用以儲存工作流體。 14.99.12. 29 Amendment 10. Patent application scope: 1. A water-cooling heat dissipation system, comprising: a water-cooling head attached to the heating element for heat conduction with the heating element; The water-cooling head is connected to generate a thrust to circulate the working fluid; a second cavity 'connects with the film pump' to block the return of the working fluid into the film pump; the plurality of conduits Between the water-cooling head, the membrane pump and the first cavity, 'to make the water-cooling head, the membrane pump and the first cavity form a communication to facilitate the flow of the working fluid; and a heat exchanger' is worn in the foregoing The conduit is configured to exchange heat with a working fluid circulating in the conduit. 2. The water-cooling heat dissipating system according to claim 1, wherein the film pump further comprises: a cavity having a water inlet pipe and a water outlet pipe and a chamber respectively on the two sides of the cavity The chamber body is in communication with the water inlet pipe and the water outlet pipe; a valve body is respectively disposed on the inner wall surface of the chamber to prevent backflow of the working fluid, wherein the valve system corresponds to the water inlet pipe Position: a film disposed at a top surface of the cavity; an actuating element flatly attached to the film, having a fixed end and a swing end thereof, and the fixed end is the same as the aforementioned water outlet pipe Side. The water-cooling heat dissipation system according to the second aspect of the patent application is more corresponding to the connection-housing, wherein the housing is provided with a plurality of perforations, and respectively corresponding to the fixed ends of the actuating elements, The swing end and the position of the (four). 4. The water-cooling heat dissipating system of claim 3, wherein the fixing end is further connected to the plurality of electrode wires and is disposed through the through holes. 5. If the scope of the application of the material is the second part of the water cooling system (4), the inner wall of the water inlet pipe is provided with a trough and is connected to the valve body. 6. If the patent application is in the first cold head, there are plural numbers. Heat Dissipation 7. As claimed in the patent scope, the first exchanger is composed of a plurality of heat sinks. 8. As claimed in the patent application, the first chamber has a water-cooling heat dissipation as described in item [beta] of the water conduit, wherein the water piece is described in the item. The water cooling system (four), which is composed of the rail piece, wherein the first cavity to 'and has a water inlet pipe and one out; the water cooling heat dissipation mentioned in item 8 of the scope= System, Η). For example, there should be another body at the position of the water inlet pipe. The moving element is: the water cooling system described in item L2, wherein the u·= please refer to the scope of the patent:通—二二二:::成12·If the water-cooled (four) system mentioned in the first paragraph of the patent application scope, the water-cooled dispersion 20 1343232 99.12.1 The thermal system further includes another water-cooled head, and the section forms a parallel connection. μ a water-cooled head and the water-cooled head are as described in the scope of claim 2 System ^ 4 ^ ? The exothermic system 'The water-cooled 诵, 丨 丨, 冲 六 a + Α 巨 巨 与 与 该 该 该 用以 用以 用以 用以 用以 用以 用以 用以 用以 用以 用以 用以 用以 用以 储存 储存 储存 储存 储存 一種水冷散熱系統,係包括: 用以與發熱元件進 一水冷頭,係貼附於該發熱元件上, 行熱傳導作用,該水冷頭更包括: 一薄膜,係設於該水冷頭頂面位置;以及 -致動元件’係平貼於該薄獏之上表面,該致動元件且 有-固^端及-擺動端,該擺動端係以單邊扇型擺動作 複數㈣,係連接於該水冷頭上,㈣玉作流體流動; -熱交換H ’係穿設於該導f上’用以與流通於該導管 中之工作流體進行熱交換。 • 15.如申請專利範圍第14項所述之水冷散熱线,該水冷散 熱系統更包括: 一第二腔體,係與該水冷頭相連通,該第二腔體内壁面 設有一閥體,用以阻擋工作流體回流至該水冷頭内; 一第三腔體,係與第二腔體對應間隔設置且與水冷頭形 成連通,另該第三腔體内壁面設有另一閥體,用以阻擋 工作流體回流至該水冷頭内。 16.如申請專利範圍第14項所述之水冷散熱系統,其中該水 冷頭内設有複數散熱片。 21 1343232 17. 99.12. 29 修正 如申請專利範圍第14項所述之水冷/ 7政熱系統,:a:中访舳 交換器係由複數散熱片所組成。 …、 18. 如申請專利範圍第14項所述之水冷散熱系統,其中該致 動元件係為一壓電片。 19. 如申請專利範圍第14項所述之水冷散熱系統,其中該水 冷散熱系統更包括一水箱,係與水冷頭經由導管形成連 通’用以儲存工作流體。A water-cooling heat dissipating system, comprising: a water-cooling head for heating a heat-generating component, attached to the heating element for heat conduction, the water-cooling head further comprising: a film disposed at a top surface of the water-cooling head; The actuating element is affixed to the upper surface of the thin raft, and the actuating element has a solid end and a oscillating end, and the oscillating end is connected to the water-cooled head by a single-sided fan-shaped pendulum action (four) (4) Jade fluid flow; - Heat exchange H' is passed through the guide f for heat exchange with the working fluid flowing through the conduit. The water-cooling heat dissipating system of claim 14, wherein the water-cooling heat dissipating system further comprises: a second cavity connected to the water-cooling head, wherein the second cavity body surface is provided with a valve body, The third cavity is disposed at a distance from the second cavity and is in communication with the water-cooling head, and the third cavity is provided with another valve body. The working fluid is blocked from flowing back into the water cooling head. 16. The water-cooling heat dissipating system of claim 14, wherein the water-cooling head is provided with a plurality of fins. 21 1343232 17. 99.12. 29 Amendment If the water-cooled/ 7-government system described in claim 14 is: a: The medium-sized exchange is composed of a plurality of heat sinks. The water-cooling heat dissipation system of claim 14, wherein the actuating element is a piezoelectric sheet. 19. The water-cooling heat dissipating system of claim 14, wherein the water-cooling heat dissipating system further comprises a water tank connected to the water-cooling head via a conduit for storing a working fluid. 22twenty two 1343232 ' 99. 12. 29 修正 十一、圖式:1343232 ' 99. 12. 29 Amendment XI. Schema: 第23頁 1343232 99.12. 29 修正Page 23 1343232 99.12. 29 Correction 第二圖 第24頁 1343232 99. 12. 29 修正Second picture Page 24 1343232 99. 12. 29 Correction 第25頁 1343232 99. 12. 29 修正Page 25 1343232 99. 12. 29 Amendment 第26頁 1343232 99. 12. 29 修正Page 26 1343232 99. 12. 29 Amendment 第27頁 1343232 99.12. 29 修正Page 27 1343232 99.12. 29 Correction 第28頁 1343232 99.12. 29 修正Page 28 1343232 99.12. 29 Correction 第29頁 1343232 99.12. 29 修正Page 29 1343232 99.12. 29 Correction 3 第30頁 1343232 99. 12. 29 修正3 Page 30 1343232 99. 12. 29 Amendment 3 第31頁 1343232 99. 12. 29 修正 M+画3 Page 31 1343232 99. 12. 29 Correction M+ painting 3 第32頁3 page 32
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750670B (en) * 2020-05-22 2021-12-21 奇鋐科技股份有限公司 Water tank sensing device for water cooling system

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4410283B2 (en) * 2008-01-28 2010-02-03 株式会社東芝 Water cooling device
US20110100607A1 (en) * 2009-11-02 2011-05-05 Beijing AVC Technology Research Center Co., Ltd. Heat dissipating cavity of looped heat pipe
US20110186266A1 (en) * 2010-02-01 2011-08-04 Suna Display Co. Heat transfer device with anisotropic thermal conducting structures
CN102856275A (en) * 2011-06-29 2013-01-02 鸿富锦精密工业(深圳)有限公司 Cooling system
US9038407B2 (en) * 2012-10-03 2015-05-26 Hamilton Sundstrand Corporation Electro-hydrodynamic cooling with enhanced heat transfer surfaces
CN103052252B (en) * 2012-12-27 2015-06-17 中国原子能科学研究院 Water-cooling loop of high frequency cavity for small medical circular accelerator
TWI563907B (en) * 2014-05-07 2016-12-21 Asustek Comp Inc Electronic system and docking thereof
FR3027380A1 (en) * 2014-10-17 2016-04-22 Commissariat Energie Atomique COOLANT LIQUID COOLING DEVICE FOR ELECTRONIC COMPONENTS
EP3225925B1 (en) * 2016-03-31 2019-10-30 Mitsubishi Electric Corporation Heat exchanger unit with synthetic jet flow device
TWI616133B (en) * 2016-08-26 2018-02-21 雙鴻科技股份有限公司 Liquid cooler module
CN111512110A (en) * 2017-11-06 2020-08-07 祖达科尔有限公司 System and method for heat exchange
TWI660475B (en) * 2018-03-30 2019-05-21 京威科技有限公司 Water cooling device capable of switching pump circuit
CN109710043B (en) * 2018-12-06 2022-04-26 鹤壁职业技术学院 Computer heat abstractor

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3231785A (en) * 1963-08-12 1966-01-25 Anthony D Calabro Circuit board mounting device
US6074178A (en) * 1997-04-15 2000-06-13 Face International Corp. Piezoelectrically actuated peristaltic pump
US6368079B2 (en) * 1998-12-23 2002-04-09 Battelle Pulmonary Therapeutics, Inc. Piezoelectric micropump
KR20000050679A (en) * 1999-01-13 2000-08-05 윤종용 Heat sinking apparatus for electronic equipment
US7198250B2 (en) * 2000-09-18 2007-04-03 Par Technologies, Llc Piezoelectric actuator and pump using same
WO2002028160A2 (en) * 2000-09-29 2002-04-04 Nanostream, Inc. Microfluidic devices for heat transfer
US20020096094A1 (en) * 2001-01-23 2002-07-25 Lira Martin G. Display table
US6827559B2 (en) * 2002-07-01 2004-12-07 Ventaira Pharmaceuticals, Inc. Piezoelectric micropump with diaphragm and valves
US6749407B2 (en) * 2002-08-22 2004-06-15 Motorola, Inc. Method of installing valves in a micro-pump
US7126822B2 (en) * 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
DE602004003316T2 (en) * 2003-09-12 2007-03-15 Samsung Electronics Co., Ltd., Suwon Diaphragm pump for cooling air
US7284966B2 (en) * 2003-10-01 2007-10-23 Agency For Science, Technology & Research Micro-pump
US7971632B2 (en) * 2003-11-07 2011-07-05 Asetek A/S Cooling system for a computer system
WO2005060593A2 (en) * 2003-12-10 2005-07-07 Purdue Research Foundation Micropump for electronics cooling
JP2005228237A (en) * 2004-02-16 2005-08-25 Hitachi Ltd Liquid cooled system and electronic equipment provided therewith
JP2006207881A (en) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd Cooling device and electronic apparatus comprising the same
US20060207752A1 (en) * 2005-03-15 2006-09-21 Inventec Corporation Micro liquid cooling device
US7417848B2 (en) * 2005-11-11 2008-08-26 Rockwell Automation Technologies, Inc. Multiple height, high density horizontal low voltage motor control center
US7841385B2 (en) * 2006-06-26 2010-11-30 International Business Machines Corporation Dual-chamber fluid pump for a multi-fluid electronics cooling system and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750670B (en) * 2020-05-22 2021-12-21 奇鋐科技股份有限公司 Water tank sensing device for water cooling system

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