TWI341389B - - Google Patents
Info
- Publication number
- TWI341389B TWI341389B TW096124509A TW96124509A TWI341389B TW I341389 B TWI341389 B TW I341389B TW 096124509 A TW096124509 A TW 096124509A TW 96124509 A TW96124509 A TW 96124509A TW I341389 B TWI341389 B TW I341389B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006208123A JP2008032620A (en) | 2006-07-31 | 2006-07-31 | Probe pin |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200819752A TW200819752A (en) | 2008-05-01 |
TWI341389B true TWI341389B (en) | 2011-05-01 |
Family
ID=38997050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96124509A TW200819752A (en) | 2006-07-31 | 2007-07-05 | Probe pin |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2008032620A (en) |
TW (1) | TW200819752A (en) |
WO (1) | WO2008015868A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120043987A1 (en) * | 2010-08-23 | 2012-02-23 | Star Technologies Inc. | Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof |
JP5870762B2 (en) * | 2012-03-01 | 2016-03-01 | 三菱電機株式会社 | Electrical property measurement method, contact probe |
JP2013205191A (en) * | 2012-03-28 | 2013-10-07 | Nidai Seiko:Kk | Spring probe and manufacturing method of spring probe |
JP6337633B2 (en) * | 2014-06-16 | 2018-06-06 | オムロン株式会社 | Probe pin |
JP6737002B2 (en) * | 2016-06-17 | 2020-08-05 | オムロン株式会社 | Probe pin |
JP2020180889A (en) * | 2019-04-25 | 2020-11-05 | オムロン株式会社 | Probe pin, inspection jig, and inspection unit |
DE102022119935A1 (en) * | 2022-08-08 | 2024-02-08 | Ingun Prüfmittelbau Gmbh | Test pin device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3924710B2 (en) * | 1998-08-12 | 2007-06-06 | 東京エレクトロン株式会社 | Contactor |
JP4026281B2 (en) * | 1999-08-06 | 2007-12-26 | 三菱電機株式会社 | Test socket, manufacturing method thereof, and test method using test socket |
-
2006
- 2006-07-31 JP JP2006208123A patent/JP2008032620A/en active Pending
-
2007
- 2007-07-05 WO PCT/JP2007/063475 patent/WO2008015868A1/en active Application Filing
- 2007-07-05 TW TW96124509A patent/TW200819752A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2008032620A (en) | 2008-02-14 |
TW200819752A (en) | 2008-05-01 |
WO2008015868A1 (en) | 2008-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |